KR101068466B1 - Fabrication method of laminating unit board and multi-layer board using the same and its fabrication method - Google Patents

Abstract

In the stacking unit substrate of the present invention, a plurality of grooves are processed on an upper surface of the metal plate, and an insulating photosensitive material is coated on a surface where the plurality of grooves are formed, and the insulating unit is filled in the plurality of grooves to form an insulating portion, and the surface of the metal plate is formed. Coating to form a photosensitive layer, processing a plurality of holes in the photosensitive layer, forming a plurality of metal bumps in contact with the metal plate in the plurality of holes, and flattening the heights of the plurality of metal bumps, And removing some or all of the photosensitive layer to protrude a plurality of metal bumps to the upper surface of the metal plate. In addition, in the multilayer substrate of the present invention, the lamination unit substrates are sequentially stacked on the upper surface of the substrate, and a part of the metal plate is removed in the lamination process, and the laminated circuit board is exposed while the circuit lines are exposed, or the circuit boards are exposed while the circuit lines are exposed. Since manufacturing, there is an advantage of improving the productivity and the degree of flatness of the laminated substrate to improve the accuracy and integration.

Unit Board, Multilayer Board, Via, Metal Bump, Circuit Line

Description

Manufacturing method of lamination unit board | substrate, and multilayer board using the unit board | substrate, and its manufacturing method {FABRICATION METHOD OF LAMINATING UNIT BOARD AND MULTI-LAYER BOARD USING THE SAME AND ITS FABRICATION METHOD}

The present invention relates to a laminated unit substrate constituting a multilayer substrate used in electronic devices and a method of manufacturing the same, and more particularly, to form a plurality of grooves in the upper surface of the conductive metal plate and to fill the insulating material therein to constitute an insulating portion The present invention relates to a lamination unit substrate and a method of manufacturing the same, which are formed by processing a plurality of metal bumps serving as vias on a surface of a metal plate. In addition, the present invention also relates to a multi-layered substrate and a method of manufacturing the same, which are configured to sequentially stack the above-mentioned unit substrates for stacking on a top surface of a substrate, and to form vias through metal bumps.

The multilayer board serves to mount electronic components and electrically connect between the components, and the number of layers constituting the multilayer board is increasing according to the trend of miniaturization and high functionality of electronic products. The via of the multilayer board is a structure filled with a conductive material in a hole penetrating through the board to electrically connect a plurality of stacked substrates.A micro-via having a diameter of 100 μm or less is used to increase the integration density of the multilayer board. It is used.

The process for processing vias, an important component of a multilayer substrate, is described in detail in a research paper (Lau et al., "An Overview of Microvia Technology", Circuit World, 2000, pp. 22-32). Commonly used methods for processing vias of multilayer substrates include laminating substrates processed with circuit lines, processing through holes using a laser or a mechanical drill, and filling conductive materials inside the through holes. I use it a lot. However, the conventional method has a disadvantage in that processing precision and productivity are reduced because the via is processed after the substrate is laminated.

In addition, in order to efficiently process vias, a B ² it (Buried Bump Interconnection Technology) method or a NMBI (Neo-Manhattan Bump Interconnection) method is used. The B ² it method is described in a research paper (Goto et al., "High-Density Printed Circuit Board Using B ² it Technology", IEEE Trans.on Advanced Packaging, 2000, pp. 447-451).

The B ² it method forms a conical conductive paste on a metal substrate and uses it as a via. That is, a multilayer substrate is manufactured by applying an adhesive to the surface of a metal substrate on which conical vias are formed and laminating the same, and processing a circuit line on the lower surface of the exposed metal substrate using lithography and etching processes.

The NMBI method is described in Lau's paper. The NMBI method uses copper lithography and etching processes or plating processes to form copper bumps, stacks substrates using adhesives to form vias, and uses lithography and etching processes on the back of the exposed metal substrates. It is configured to process.

However, since the B ² it method and the NMBI method process the bumps corresponding to the vias in advance, the via processing time can be shortened compared to the method of processing vias after the conventional lamination. There is a disadvantage in that productivity is reduced because it must be processed.

In addition, Korean Patent Application No. 2004-0086721 (name of the invention: a method of manufacturing a high-resolution printed circuit board using the imprint method) has a substrate for processing a hole corresponding to a via in a substrate using a mold using an imprint method. A manufacturing method is disclosed. However, the imprint process used in the above technique has a disadvantage in that it is difficult to apply to the manufacture of a large area substrate.

Therefore, the present invention has been made to solve the problems of the prior art as described above, forming a plurality of grooves on the upper surface of the conductive metal plate and filling the insulating material therein to form an insulating portion and vias on the surface of the metal plate. In the processing of a large number of metal bumps (), which can be easily formed by lithography and etching processes and plating processes, there is provided a lamination unit substrate and a method of manufacturing the same which can improve productivity. There is a purpose.

In addition, the present invention by sequentially laminating the above-mentioned laminated unit substrate on the upper surface of the substrate, by removing a portion of the metal plate in the lamination process by laminating while exposing the circuit line or by laminating in a state in which the circuit line is exposed before lamination Another object of the present invention is to provide a multilayer substrate and a method of manufacturing the same, which improve productivity and improve flatness of the laminated substrate to improve precision and integration.

In the method of manufacturing a unit substrate for lamination according to the present invention, a plurality of grooves are processed on an upper surface of a metal plate, and an insulating photosensitive material is coated on a surface on which a plurality of grooves are formed, and filled in a plurality of grooves to form an insulating portion. Forming a photosensitive layer by coating a surface of the substrate, processing a plurality of holes in the photosensitive layer, and then forming a plurality of metal bumps in contact with the metal plate in the plurality of holes, and planarizing the heights of the plurality of metal bumps. And removing some or all of the photosensitive layer to protrude a plurality of metal bumps to the top surface of the metal plate.

The unit substrate for lamination of this invention is manufactured by the above manufacturing method. It is characterized by the above-mentioned.

In the method for producing a multilayer substrate of the present invention, the first substrate is applied to the upper surface of the substrate or the surface of the unit substrate manufactured by the manufacturing method according to claim 1 on which the plurality of metal bumps are located, and then the upper surface of the substrate. , The first step of bonding the unit substrate to the upper surface of the substrate by applying pressure and applying heat to cure the first adhesive, and cutting along the cutting line of the metal plate of the unit substrate, A second step of exposing the circuit lines to the upper surface of the unit substrate, and applying a second adhesive to the surface of the insulating portion of the unit substrate and the upper part of the circuit line or to a plurality of metal bumps among other unit substrates, and then the other unit substrate. The second bump is cured by applying pressure and applying heat in a state where the metal bumps of the metal bumps are in contact with the circuit line located at the lower portion thereof. In that it comprises a third step of bonding the plate is characterized.

Moreover, in the manufacturing method of the multilayer board | substrate of this invention, after apply | coating an adhesive agent to the upper surface of a base material or the surface of the unit board | substrate manufactured by the manufacturing method of Claim 2, respectively, a base material is located in the bottom and the desired number of layers on the top. It is characterized in that the adhesive is cured by applying pressure and heat in a state in which the unit substrates are sequentially laminated to manufacture at once.

The multilayer substrate of this invention was manufactured by the above manufacturing method, It is characterized by the above-mentioned.

In the present invention, a plurality of grooves are formed on the top surface of a conductive metal plate, and an insulating material is filled in the inside of the conductive metal plate to form an insulation portion, and a lithography and etching process and a plating process are performed in processing a plurality of metal bumps serving as vias on the surface of the metal plate. Since it can be simply formed, there is an advantage to improve the productivity.

In addition, the present invention is sequentially laminated on the upper surface of the substrate, but the stacking while removing the part of the metal plate in the lamination process while the circuit line is exposed or manufactured by laminating in a state in which the circuit line is exposed before lamination, productivity This improves the accuracy and the degree of integration by increasing the flatness of the laminated substrate. In particular, in the case of using the lamination unit substrate in a state where the circuit line is exposed, the multilayer substrate can be produced in a state where the lamination unit substrates having the desired number of layers are laminated at a time, so that the productivity can be further improved.

In addition, in the present invention, in processing a plurality of grooves in the metal plate, by processing a plurality of grooves so as not to penetrate the metal plate has a form that the metal plate is continuously connected, it is possible to minimize the deformation that can occur during the machining and lamination process It can also be applied to large substrates.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of a unit substrate for lamination and a method for manufacturing the same according to the present invention, a multilayer substrate using the unit substrate and a method for manufacturing the same will be described in detail.

1 is a flowchart illustrating a manufacturing process of a unit substrate for stacking according to an exemplary embodiment of the present invention. As shown in FIG. 1, the first step for manufacturing a unit substrate for stacking is processing a plurality of grooves 110 having a predetermined depth in the conductive metal plate 100. Here, the depth of the groove 110 is preferably smaller than the thickness of the metal plate 100. Therefore, a portion between the plurality of grooves 110 is formed integrally with the metal plate 100 to serve as the circuit line 120 by a subsequent process. The groove 110 may be processed using laser or lithography and etching processes.

The second step is to process a plurality of metal bumps 130 serving as vias in the metal plate 100 when the multilayer substrate is configured. First, the photosensitive material 140 having insulation is coated on the surface of the metal plate 100 on which the grooves 110 are formed. Then, the photosensitive material 140 having insulation is not only filled in the groove 110 but also coated with a uniform thickness on the surface of the metal plate 100. In this case, the material 140 filled in the groove 110 serves as an insulating part that electrically insulates the circuit lines 120 during the processing of the circuit lines 120 and prevents deformation of the circuit lines 120. In addition, the material 140 coated on the surface of the metal plate 100 serves as a photosensitive layer for subsequent processing.

Then, after processing a plurality of holes in the photosensitive layer by lithography and etching, metal bumps 130 are formed in the plurality of holes by plating. At this time, by forming holes in the upper portion of the circuit line 120, the metal bumps 130 are formed on the upper surface of the circuit line 120, respectively.

The third step is to planarize the heights of the plurality of metal bumps 130 formed on the metal plate 100. In this step, a plurality of metal bumps 130 are processed to have a uniform height by using a mechanical processing process including a grinding or polishing process. The metal bumps 130 having a uniform height have an advantage of forming uniformly tight vias when the metal plates 100 are stacked up and down to form a multilayer substrate.

The fourth step is a step of protruding the plurality of metal bumps 130 to the upper surface of the photosensitive layer, by removing some or all of the photosensitive layer located on the surface of the metal plate 100 using an etching process, thereby a plurality of metal bumps 130 ) Is projected onto the upper surface of the metal plate 100. At this time, the insulating portion filled in the groove 110 is not removed. By doing so, the primary unit substrate 100A according to this embodiment is formed.

Accordingly, the primary unit substrate 100A according to this embodiment includes an insulating material in the groove formed between the metal plate 100 having a plurality of circuit lines 120 protruding to the surface and the plurality of circuit lines 120. Each of the plurality of insulating parts 160 is filled with a plurality of metal bumps 130 formed to protrude on the upper surface of the circuit line 120, respectively.

The fifth step is to remove to the predetermined thickness from the lower surface of the metal plate (100). At this time, by cutting along the cutting line 150 of the metal plate 100, the photosensitive layer 140 is removed to a thickness that is exposed to the lower surface of the metal plate 100. By doing so, the final unit substrate 100B according to this embodiment having the circuit lines 120 respectively between the photosensitive layers 140 is formed.

Therefore, the final unit substrate 100B according to this embodiment includes a plurality of circuit lines 120 and a plurality of circuits 120 integrated with insulating materials, respectively, to integrate the plurality of circuit lines 120. The insulating portion 160, and a plurality of metal bumps 130 are formed to protrude on the upper surface of the plurality of circuit lines 120, respectively.

FIG. 2 is a flowchart illustrating a process of manufacturing a multilayer substrate using the first stacked unit substrate illustrated in FIG. 1.

1 and 2, in the first step for manufacturing the multilayer substrate 200 using the primary unit substrate for lamination, in the upper surface of the substrate 210 and / or the unit substrate 100A After applying the first adhesive 220 to the surface on which the plurality of metal bumps 130 are located, the first adhesive 220 is applied by applying pressure and heat while the unit substrate 100A is aligned on the upper surface of the substrate 210. By curing 220, the unit substrate 100A is bonded to the upper surface of the substrate 210. In this case, an ultrasonic wave may be further applied to accelerate curing of the first adhesive 220.

In the second step, by cutting along the cutting line 150 of the metal plate 100 of the unit substrate 100A, the insulating portion 160 and the circuit line 120 are exposed to the upper surface of the unit substrate 100A, respectively, to insulate The circuit lines 120 are provided between the units 160, respectively. At this time, the metal plate 100 is cut along the cutting line 150 by using a mechanical processing method such as grinding or polishing is thinner.

In the third step, the second adhesive (on the surface where the plurality of metal bumps 130 are located among the insulation 160 of the unit substrate 100A and the upper portion of the circuit line 120 and / or the other unit substrate 100A ') is formed. After applying the 230, the second bumps 230 may be applied by applying pressure and heating while the metal bumps 130 of the other unit substrates 100A ′ are aligned to contact the circuit lines 120 positioned below. By hardening, the other unit board | substrate 100A 'is bonded to the upper surface of the unit board | substrate 100A. In this case, an ultrasonic wave may be further applied to accelerate curing of the second adhesive 230. Therefore, the upper and lower circuit lines 120 are electrically connected to each other via the metal bumps 130 via the medium, and the other portions are insulated from each other.

In joining the metal bumps 130 to the circuit line 120 disposed below, the joining form varies depending on the material of the metal bumps 130. For example, when the material of the metal bumps 130 is a low melting point metal such as tin or solder, the metal bumps are melted and bonded to the circuit line 120 in a metal bonding form, and the material of the metal bumps 130 is copper. Or in the case of a high melting point metal, such as a copper alloy, it joins by the method of a solid state junction part. In addition, in forming the metal bumps 130, the metal bumps may be made of copper or a copper alloy, which is a high melting point metal, and the joints may be formed at low temperature by coating with tin or solder, which is a low melting point metal. It may be.

In the fourth step, the insulation unit 160 and the circuit line 120 are cut to the upper surface of the other unit substrate 100A 'by cutting along the cutting line 150 of the metal plate 100 of the other unit substrate 100A'. Each of them is exposed to have a circuit line 120 between the insulating portions 160.

By repeating the third and fourth steps as described above, the multilayer substrate 200 having a desired number of layers can be manufactured.

When manufacturing the multilayer substrate 200 through the manufacturing process of FIG. 2, since the circuit line 120 is processed by removing the metal plate 100 in the thickness direction, the process is simple and productivity may be improved. Since flatness of the unit substrates 100A and 100A 'is guaranteed, precise lamination is possible.

FIG. 3 is a flowchart illustrating a process of manufacturing a multilayer substrate using the final unit substrate for lamination shown in FIG. 1.

As shown in FIGS. 1 and 3, in manufacturing the multilayer substrate 300 using the final unit substrate for lamination, the adhesive 320 is disposed on the upper surface of the substrate 310 and / or the upper and lower surfaces of the unit substrate 100B. ), And then apply the pressure and heat to cure the adhesive 320 in a state in which the substrate 310 is placed at the bottom and the unit substrates 100B having the desired number of layers are sequentially stacked on the top. The multi-layered substrate 300 can be manufactured at a time. When the manufacturing method of FIG. 3 is used, since the multilayer substrate 300 having the desired number of layers can be manufactured at a time, there is an advantage of improving productivity.

In the above description of the laminated unit substrate of the present invention and its manufacturing method, and the technical details of the multi-layered substrate using the unit substrate and the method of manufacturing the same with the accompanying drawings, this is illustratively described the best embodiment of the present invention It does not limit this invention.

In addition, it is obvious that any person skilled in the art can make various modifications and imitations within the scope of the appended claims without departing from the scope of the technical idea of the present invention.

1 is a flowchart illustrating a manufacturing process of a unit substrate for stacking according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating a process of manufacturing a multi-layer substrate using the first stacked unit substrate illustrated in FIG. 1.

FIG. 3 is a flowchart illustrating a process of manufacturing a multilayer substrate using the final unit substrate for lamination shown in FIG. 1.

  ♠ Explanation of symbols on the main parts of the drawing ♠

100: metal plate 110: groove

120: circuit line 130: metal bump

140: photosensitive material 150: cutting line

160: insulation

Claims (17)

Processing a plurality of grooves on the upper surface of the metal plate, Applying an insulating photosensitive material to the surface on which the plurality of grooves are formed, filling the plurality of grooves to form an insulating portion, and coating a surface of the metal plate to form a photosensitive layer; After processing a plurality of holes in the photosensitive layer, forming a plurality of metal bumps in contact with the metal plate in the plurality of holes; Planarizing a height of the plurality of metal bumps, and Removing the part or the entirety of the photosensitive layer to protrude the plurality of metal bumps to an upper surface of the metal plate. The method according to claim 1, Removing the bottom surface of the metal plate to a predetermined thickness and exposing a circuit line positioned between the insulating portion and the insulating portion to the outside. The method according to claim 2, The depth of the groove is less than the thickness of the metal plate manufacturing method of the unit board for lamination. The method of claim 3, Wherein the plurality of grooves are processed by laser or lithography and etching process. The method according to claim 2, And the plurality of metal bumps are formed in the plurality of holes, respectively, by a plating process. The method according to claim 5, The plurality of metal bumps are planarized to have a uniform height using a mechanical grinding or polishing process. The method according to claim 2, And removing a predetermined thickness from a lower surface of the metal plate by a mechanical grinding or polishing process to expose the insulation and the circuit line to the outside. delete After applying the first adhesive to the upper surface of the substrate or the surface of the plurality of metal bumps in the unit substrate manufactured by the manufacturing method according to claim 1, the pressure is applied while the unit substrate is aligned on the upper surface of the substrate A first step of applying heat to cure the first adhesive and bonding the unit substrate to an upper surface of the substrate; A second step of cutting along the cutting line of the metal plate of the unit substrate to expose the circuit lines between the insulation portion and the insulation portion to the upper surface of the unit substrate, respectively; After applying a second adhesive to the surface of the plurality of metal bumps in the insulating portion and the circuit line of the unit substrate or other unit substrates, the metal bumps of the other unit substrate is aligned so as to contact the circuit lines located below And a third step of bonding the other unit substrate to the upper surface of the unit substrate by applying pressure and applying heat in one state to cure the second adhesive. The method according to claim 9, And repeating the second and third steps repeatedly. The method according to claim 10, Ultrasonic wave is further added in hardening the said 1st, 2nd adhesive agent, The manufacturing method of the multilayer substrate characterized by the above-mentioned. After applying an adhesive to the upper surface of the substrate or the surface of the unit substrate produced by the manufacturing method according to claim 2, the substrate is placed at the bottom and the unit substrate of the desired number of layers is sequentially stacked on the top. A method of manufacturing a multilayer substrate, wherein the adhesive is cured by applying pressure and heat to produce the adhesive at one time. The method according to claim 12, Ultrasonic wave is further applied to harden the adhesive. The multilayer board | substrate manufactured by the manufacturing method in any one of Claims 9-13. The method according to claim 14, The material of the metal plate and the metal bump is a multilayer substrate, characterized in that the copper or copper alloy. The method according to claim 14, The material of the metal bump is a multilayer substrate, characterized in that the tin or solder. The method according to claim 14, The material of the metal bump is copper or a copper alloy, the multilayer substrate, characterized in that the tin or solder is further coated on the end of the metal bump.

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