KR100999506B1 - 인쇄회로기판 및 그 제조 방법 - Google Patents
인쇄회로기판 및 그 제조 방법 Download PDFInfo
- Publication number
- KR100999506B1 KR100999506B1 KR1020080088845A KR20080088845A KR100999506B1 KR 100999506 B1 KR100999506 B1 KR 100999506B1 KR 1020080088845 A KR1020080088845 A KR 1020080088845A KR 20080088845 A KR20080088845 A KR 20080088845A KR 100999506 B1 KR100999506 B1 KR 100999506B1
- Authority
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- South Korea
- Prior art keywords
- thermoplastic resin
- resin layer
- circuit pattern
- base substrate
- printed circuit
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 132
- 238000000034 method Methods 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000005245 sintering Methods 0.000 claims abstract description 16
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims abstract description 5
- 230000002209 hydrophobic effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 abstract description 3
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000002105 nanoparticle Substances 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (11)
- 베이스 기판과 회로 패턴 사이의 접착력이 향상된 인쇄회로기판을 제조하는 방법으로서,반경화 상태의 절연재로 이루어지는 베이스 기판의 일면에 열가소성 수지층을 형성하는 단계; - 이 때, 상기 베이스 기판의 일면에는 회로 패턴이 형성되어 있지 않음 -상기 열가소성 수지층에 잉크젯(ink jet) 방식으로 전도성 잉크를 토출하여 회로 패턴(circuit pattern)을 형성하는 단계;상기 회로 패턴을 상기 열가소성 수지층의 용융점보다 낮은 온도로 가열하여 건조하는 단계;상기 회로 패턴을 가열하여 소결하는 단계; 및상기 열가소성 수지층을 가열하고 상기 회로 패턴을 상기 열가소성 수지층으로 가압하여, 상기 열가소성 수지층에 상기 회로 패턴의 적어도 일부를 매립하는 단계; - 이 때, 상기 반경화 상태의 베이스 기판은 경화되며, 상기 베이스 기판과 상기 열가소성 수지층의 일부가 서로 혼화됨 -를 포함하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 회로 패턴을 소결하는 단계는,상기 회로 패턴을 상기 열가소성 수지층의 용융점보다 낮은 온도로 가열하여 수행되는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 회로 패턴을 매립하는 단계는,상기 열가소성 수지층을 용융점보다 높은 온도로 가열하여 수행되는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 베이스 기판을 제공하는 단계와 상기 회로 패턴을 형성하는 단계 사이에,상기 열가소성 수지층의 표면이 소수성을 가지도록, 상기 열가소성 수지층을 표면 처리(surface treatment)하는 단계를 더 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제4항에 있어서,상기 열가소성 수지층을 표면 처리하는 단계는,상기 열가소성 수지층의 표면을 플라즈마(plasma) 처리하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제4항에 있어서,상기 열가소성 수지층을 표면 처리하는 단계는,상기 열가소성 수지층에 소수성 물질층을 형성하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제6항에 있어서,상기 소수성 물질층은, 불소계 수지를 포함하여 이루어지는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 제1항에 있어서,상기 열가소성 수지층은 필름(film)이며,상기 베이스 기판을 제공하는 단계는,상기 열가소성 수지층을 상기 베이스 기판에 적층하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 제조 방법.
- 베이스 기판;상기 베이스 기판의 일면에 코팅되며, 상기 베이스 기판보다 얇은 두께를 갖는 열가소성 수지층; - 여기서, 상기 베이스 기판과 상기 열가소성 수지층의 일부는 서로 혼화되어 있으며, 상기 베이스 기판의 일면에는 회로 패턴이 형성되어 있지 않음 -상기 열가소성 수지층에 적어도 일부가 매립되며, 상기 열가소성 수지층에 잉크젯 방식으로 전도성 잉크를 토출하여 형성되는 회로 패턴을 포함하는 인쇄회로기판.
- 제9항에 있어서,상기 회로 패턴은, 소결 온도가 상기 열가소성 수지층의 용융점보다 낮은 것을 특징으로 하는 인쇄회로기판.
- 제9항에 있어서,상기 열가소성 수지층은 필름인 것을 특징으로 하는 인쇄회로기판.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080088845A KR100999506B1 (ko) | 2008-09-09 | 2008-09-09 | 인쇄회로기판 및 그 제조 방법 |
US12/432,449 US20100059251A1 (en) | 2008-09-09 | 2009-04-29 | Printed circuit board and manufacturing method |
JP2009114950A JP2010067947A (ja) | 2008-09-09 | 2009-05-11 | 印刷回路基板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080088845A KR100999506B1 (ko) | 2008-09-09 | 2008-09-09 | 인쇄회로기판 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100030071A KR20100030071A (ko) | 2010-03-18 |
KR100999506B1 true KR100999506B1 (ko) | 2010-12-09 |
Family
ID=41798221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080088845A KR100999506B1 (ko) | 2008-09-09 | 2008-09-09 | 인쇄회로기판 및 그 제조 방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100059251A1 (ko) |
JP (1) | JP2010067947A (ko) |
KR (1) | KR100999506B1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5207163B2 (ja) * | 2007-03-30 | 2013-06-12 | Nltテクノロジー株式会社 | 埋込配線の形成方法、表示装置用基板及び当該基板を有する表示装置 |
JP5405339B2 (ja) * | 2010-02-03 | 2014-02-05 | 日本メクトロン株式会社 | 配線回路基板及びその製造方法 |
JP5406991B2 (ja) * | 2010-07-22 | 2014-02-05 | パナソニック株式会社 | 導電性フィルムの製造方法 |
KR101775428B1 (ko) | 2010-12-28 | 2017-09-06 | 삼성전자 주식회사 | 발광 소자 패키지 및 그 제조 방법 |
JP5257558B1 (ja) | 2011-10-03 | 2013-08-07 | 日立化成株式会社 | 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ |
CN104797419B (zh) * | 2012-06-05 | 2018-02-23 | 昭和电工株式会社 | 基材膜和烧结方法 |
US8816513B2 (en) | 2012-08-22 | 2014-08-26 | Texas Instruments Incorporated | Electronic assembly with three dimensional inkjet printed traces |
US9899339B2 (en) | 2012-11-05 | 2018-02-20 | Texas Instruments Incorporated | Discrete device mounted on substrate |
US8847349B2 (en) | 2012-12-21 | 2014-09-30 | Texas Instruments Incorporated | Integrated circuit package with printed circuit layer |
EP2952072A1 (en) * | 2013-01-31 | 2015-12-09 | Yissum Research Development Company of The Hebrew University of Jerusalem Ltd. | Three-dimensional conductive patterns and inks for making same |
JP2014231217A (ja) * | 2013-04-30 | 2014-12-11 | 宇部興産株式会社 | 導電部材、射出成型品、フィルム、繊維、チューブ、中空状成形物、及び導電部材の製造方法 |
KR101357284B1 (ko) * | 2013-05-21 | 2014-01-29 | 한국기계연구원 | 투명전도필름 제조 방법, 그 장치 및 그 투명전도필름 |
JP5924609B2 (ja) * | 2013-12-03 | 2016-05-25 | 国立大学法人山形大学 | 金属薄膜の製造方法及び導電構造の製造方法 |
CN104735917B (zh) * | 2015-03-30 | 2018-02-02 | 中国科学院化学研究所 | 一种柱状嵌入式柔性电路的制备方法及应用 |
US20190040554A1 (en) * | 2018-01-02 | 2019-02-07 | Intel Corporation | Heat spreading cloths |
WO2019146991A1 (ko) | 2018-01-23 | 2019-08-01 | 엘지이노텍 주식회사 | 열전 모듈 |
KR102095243B1 (ko) * | 2018-04-04 | 2020-04-01 | 엘지이노텍 주식회사 | 열전소자 |
KR20210008671A (ko) * | 2019-07-15 | 2021-01-25 | 엘지이노텍 주식회사 | 인쇄회로기판 및 이의 제조 방법 |
JP2023110689A (ja) * | 2022-01-28 | 2023-08-09 | 株式会社オートネットワーク技術研究所 | 電装品、及び電装品の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10313172A (ja) | 1997-05-13 | 1998-11-24 | Elna Co Ltd | 多層プリント基板およびその製造方法 |
JP2004349366A (ja) * | 2003-05-21 | 2004-12-09 | Mitsubishi Plastics Ind Ltd | 多層配線基板及びその製造方法 |
KR100761706B1 (ko) * | 2006-09-06 | 2007-09-28 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR100850757B1 (ko) * | 2007-06-14 | 2008-08-06 | 삼성전기주식회사 | 기판의 표면처리방법 및 미세배선 형성방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4186756B2 (ja) * | 2003-08-29 | 2008-11-26 | 松下電器産業株式会社 | 回路基板及びその製造方法 |
TW591095B (en) * | 2000-10-25 | 2004-06-11 | Harima Chemical Inc | Electro-conductive metal paste and method for production thereof |
TW569653B (en) * | 2001-07-10 | 2004-01-01 | Fujikura Ltd | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
JP4192554B2 (ja) * | 2002-10-25 | 2008-12-10 | 株式会社デンソー | 多層回路基板の製造方法 |
JP4695360B2 (ja) * | 2004-08-05 | 2011-06-08 | 株式会社リコー | 電子素子の製造方法 |
JP2006196542A (ja) * | 2005-01-11 | 2006-07-27 | Japan Aviation Electronics Industry Ltd | 配線パターンの描画形成方法及びその方法を用いて作製した回路基板 |
JP4780602B2 (ja) * | 2005-02-10 | 2011-09-28 | ブラザー工業株式会社 | 超微細配線基板の製造方法 |
JP2007335558A (ja) * | 2006-06-14 | 2007-12-27 | Konica Minolta Holdings Inc | 導電性パターン及び導電性パターンの作製方法 |
JP4840132B2 (ja) * | 2006-12-26 | 2011-12-21 | 株式会社デンソー | 多層基板の製造方法 |
JP4748108B2 (ja) * | 2007-05-25 | 2011-08-17 | セイコーエプソン株式会社 | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体 |
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2008
- 2008-09-09 KR KR1020080088845A patent/KR100999506B1/ko not_active IP Right Cessation
-
2009
- 2009-04-29 US US12/432,449 patent/US20100059251A1/en not_active Abandoned
- 2009-05-11 JP JP2009114950A patent/JP2010067947A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10313172A (ja) | 1997-05-13 | 1998-11-24 | Elna Co Ltd | 多層プリント基板およびその製造方法 |
JP2004349366A (ja) * | 2003-05-21 | 2004-12-09 | Mitsubishi Plastics Ind Ltd | 多層配線基板及びその製造方法 |
KR100761706B1 (ko) * | 2006-09-06 | 2007-09-28 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR100850757B1 (ko) * | 2007-06-14 | 2008-08-06 | 삼성전기주식회사 | 기판의 표면처리방법 및 미세배선 형성방법 |
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JP2010067947A (ja) | 2010-03-25 |
US20100059251A1 (en) | 2010-03-11 |
KR20100030071A (ko) | 2010-03-18 |
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