KR100921433B1 - The method for manufacturing micromirror having sloping electrode using electrolysis plating - Google Patents

Abstract

PURPOSE: A method for manufacturing a micromirror having an inclined electrode using electrolysis plating is provided to reduce a driving voltage and increase a driving angle which is available by forming electrode to be sloped by using electroplating. CONSTITUTION: A method for manufacturing a micromirror having a inclined electrode using electrolysis plating is comprised of the steps: forming an electroplating frame on a first substrate to determine separation between the bottom electrodes and the size of it(S130); forming the inclined bottom electrode on the first substrate using a electroplating(S140); and removing the electroplating frame from the first substrate(S150).

Description

Method for manufacturing micromirror with inclined bottom electrode using electroplating {THE METHOD FOR MANUFACTURING MICROMIRROR HAVING SLOPING ELECTRODE USING ELECTROLYSIS PLATING}

The present invention relates to a method of manufacturing a micromirror, and more particularly, to a method of manufacturing a micromirror having an inclined bottom electrode using electroplating.

The design of a constant power drive micromirror using a plate electrode takes into account the drive voltage and drive angle from the balance of the electrostatic torque between the electrodes and the mechanical torque of the spring supporting the mirror. In the case of a micromirror using a torsion spring, the torsion spring constant is expressed by Equation 1 below, and when the mirror rotates, the mechanical recovery torque of the spring is proportional to Equation 2 below.

Here, k is a constant depending on the shape of the spring cross section, which depends on the width and thickness of the spring, and the thicker the thickness, the closer to 1/3. In addition, E represents Young's modulus, and V represents Poisson's ratio.

Here, θ is the rotation angle of the mirror, α is the normal rotation angle (the ratio of the actual rotation angle of the mirror to the maximum rotation angle), Z ₀ represents the initial distance between the mirror plate and the bottom electrode. In addition, L means the length from the center of the rotation axis to the end of the mirror.

1 is a schematic diagram for calculating torque by constant power of a bidirectional driving micromirror using constant power. Let the size of the micromirror plate a in FIG. When the distance between the two electrodes is Z ₀ and the displacement of the mirror tip portion is Z _T , the force due to the electrostatic force can be expressed by Equation 3 below.

Here, A is the area of the mirror, permittivity ε ₀ is 8.85 pF / m, V _a is the applied bias voltage, Z (x) means the distance between the electrodes at each x position.

When voltage is applied to the micromirror having the structure as shown in FIG. 1, the torque due to the electrostatic force is summarized as in Equation 4 using constants defined as α, β, as follows.

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The mechanical restoring torque given by the torsion spring is the same as Equation 2 described above. The driving angle of the mirror is determined at the point where the mechanical restoring force by the spring and the electric torque by the electrostatic force represented by Equation 4 are in equilibrium. Therefore, if Equation 2 and Equation 4 are arranged on both sides, the equations can be expressed by the driving voltage and the driving angle. When the micromirror has a size of 210 μm x 210 μm and the spring is axially positioned at the center of the micromirror with a size of 1.2 μm x 8 μm x 42 μm, a graph of the driving angle versus the driving voltage as shown in FIG. 2 can be obtained. As can be seen in FIG. 2, the driving angle of the mirror increases as the applied voltage increases, but when a certain threshold voltage or more is applied, the mirror suddenly sticks to the bottom electrode. This is called pull-in phenomenon, and the applied voltage at which pull-in occurs is called pull-in voltage and the rotation angle at the time of pull-in phenomenon is called pull-in critical angle.

2 is a diagram illustrating a rotation angle of a micromirror according to an applied voltage. 2 (a) shows the increase in driving angle and the pull-in voltage as the applied voltage increases. Gradually decreasing the applied voltage of the pulled-in mirror returns the mirror back to its original state, but at the pull-in voltage, the mirror does not fall from the bottom electrode but at a lower applied voltage. 2 (b) shows the state of the mirror as the applied voltage of the pull-in mirror is decreased. At lower voltages than the pull-in voltage, the mirror separates from the floor. Using this principle, the driving voltage, rotation angle, pull-in voltage, pull-in critical angle, and the like of the micromirror driven with constant power can be designed. In the micromirror driving with constant power according to the voltage difference between the two plates, the plate bottom electrode making the bottom electrode in parallel with the mirror plate has been a common method in the fabrication of the existing constant power driving micromirror and is suitable for various applications. Has been applied.

However, when the micromirror is manufactured using the flat electrode as described above, there is a problem that the driving angle of the mirror plate that can be controlled is limited due to the pull-in phenomenon. That is, when the distance between the mirror plate and the bottom electrode is fixed, the rotation angle of the mirror plate can be controlled only within the pull-threshold angle, which is generally used in applications requiring continuous drive angle control. The use of driving micromirrors is an important cause of limitation. In general, in order to increase the controllable driving angle of the micromirror using the plate electrode, the distance between the mirror plate and the plate bottom electrode should be increased. In this case, however, the driving voltage of the mirror is increased due to the increased spacing between the electrodes. Even in applications that do not require continuous drive angle control, there are two rotations: the initial state where the mirror does not rotate and the pull-in state where the mirror plate is attached to the bottom electrode, as in the case of a digital micromirror developed by TI. Even in the case of the digital method using only the angle, there is a need to reduce the driving voltage for pulling in the mirror according to the circuit conditions.

In addition, after the micromirror adheres to the bottom electrode, adhesion between the mirror plate and the bottom electrode surface may easily occur due to contamination, moisture, and forces acting between the molecules, which causes the mirror to adhere to the bottom electrode. In this case, even after the applied voltage is removed, the mirror is not restored to its original state, and thus the normal operation of the device is impossible. Therefore, in order to reduce the adhesion phenomenon, it is necessary to increase the restoring force of the spring to increase the restoring force of the spring, and at the same time, there is a problem that a new structure is required to prevent the driving voltage from increasing despite the increased strength of the spring. .

The present invention has been proposed to solve the above problems of the conventionally proposed methods, by reducing the driving voltage and driving the distance from the bottom electrode by forming the bottom electrode in an inclined structure using electroplating. An object of the present invention is to provide a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating which can increase the range of controllable driving angles by increasing the voltage without increasing the voltage. In addition, by increasing the strength of the micromirror spring without increasing the driving voltage, it is possible to increase the resilience, thereby significantly reducing the phenomenon that the micromirror adheres to the floor and realizing the micromirror more resistant to external shock and vibration. Another object is to provide a method for fabricating a micromirror having an inclined bottom electrode using an electroplating. In addition, the shape of the inclined bottom electrode can be suitably manufactured not only for the single-axis driving micromirror but also for the two-axis driving micromirror, thereby increasing the controllable driving angle as compared to the constant power driving micromirror using the flat plate electrode. Another object of the present invention is to provide a method of manufacturing a micromirror having an inclined bottom electrode using electroplating, which can reduce an applied voltage required for driving a mirror.

Micromirror manufacturing method having an inclined bottom electrode using an electroplating according to a feature of the present invention for achieving the above object, in the micromirror manufacturing method,

(1) forming a plating mold for separating the bottom electrode and determining the size of the electrode on the first substrate;

(2) forming an inclined bottom electrode on the first substrate through electroplating;

(3) removing the plating mold from the first substrate;

(4) combining and processing a second substrate for forming a constant power according to a voltage difference with the first substrate at a position spaced upwardly from the first substrate;

(5) depositing aluminum on the processed second substrate and patterning the aluminum to conform to the shape of the micromirror; And

And (6) etching the second substrate using the patterned aluminum as a mask.

Preferably, prior to the step (1), an addressing line for applying a voltage to the inclined bottom electrode when driving the micromirror is formed on the first substrate, and an insulating film and a plating base layer are formed on the first substrate. Patterning may be further included on the substrate.

More preferably, the step of forming an addressing line on the first substrate may deposit and pattern a nickel thin film or aluminum on the first substrate to form an addressing line.

More preferably, the step of patterning the insulating film and the plating base layer on the first substrate, patterning the insulating film on the first substrate using a silicon oxide film (SiO ₂ ); And patterning a plating-based layer on the first substrate using gold.

Preferably, in the step (1) of forming a plating mold for separating the bottom electrode and determining the size of the electrode on the first substrate, the plating mold may be formed by using a thick photoresist.

Preferably, the step (4) of combining and processing the second substrate for forming a constant power according to the voltage difference with the first substrate at a position spaced upwardly from the first substrate,

Processing the second substrate by an anisotropic etching process at a predetermined interval between the micromirror plate and the inclined bottom electrode;

Bonding the processed second substrate to the first substrate on which the inclined bottom electrode is formed by a wafer bonding process; And

And thinly processing the second substrate according to a thickness of a predetermined micromirror.

More preferably, the step of thinly processing the second substrate according to a predetermined thickness of the micromirror may use a chemical mechanical polishing (CMP) process.

According to the method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method, the bottom electrode is formed into an inclined structure using an electroplating method, thereby reducing driving voltage and spacing the bottom electrode with a driving voltage. The micromirror can be manufactured to increase the range of the controllable driving angle by allowing it to be increased without increasing. In addition, by increasing the strength of the micromirror spring without increasing the driving voltage to increase the resilience, the micromirror can significantly reduce the adhesion of the micromirror to the floor, and at the same time, the micromirror can be more resistant to external shock and vibration. . In addition, the shape of the inclined bottom electrode can be suitably manufactured not only for the single-axis driving micromirror but also for the two-axis driving micromirror. The voltage applied for driving the mirror can be reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 and 5 is a step-by-step view showing a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating according to an embodiment of the present invention, Figure 4 is using an electroplating according to an embodiment of the present invention In the method of manufacturing a micromirror having an inclined bottom electrode, FIG. As shown in FIG. 3, in 3 (a) of the method of manufacturing a micromirror having an inclined bottom electrode using electroplating according to an embodiment of the present invention, each of the micromirrors is driven to the first substrate 100. In order to form an addressing line 110 for applying a voltage to the electrode, a thin nickel film is deposited and patterned, and a silicon oxide film (SiO ₂ ), which is an insulating film 120, is patterned, thereby electroplating the inclined bottom electrode. It is used for insulation between plating electrodes used for manufacturing. In this case, aluminum other than nickel may be used as the addressing line. In (b), after patterning gold using a plating layer 130 as a seed layer 130 to fabricate the bottom electrode inclined to the first substrate on which the addressing line and the insulating film are patterned, an electroplating process, The plating frame 140 is formed using a thick photoresist. The plating mold used here separates the electrodes, and serves to determine the overall size of the electrodes. Thereafter, in 3 (c), the inclined bottom electrode 150 is formed through electroplating based on the plating frame 140. At this time, the process of forming the inclined bottom electrode 150 while being electroplated is as shown in FIG.

As shown in Figure 4, in the method of manufacturing a micromirror including an inclined bottom electrode using an electroplating according to an embodiment of the present invention, the inclined bottom electrode has a single one as shown in 4 (a) when plating is started. The current is applied only to the plating electrode 160, and as the plating proceeds as shown in 4 (b), the metal is isotropically grown in the vertical direction and the horizontal direction and connected to the adjacent plating electrode. In this way, as the plating time elapses, the remaining electrodes are connected in sequence. Thus, as shown in 4 (c), the bottom electrode having the inclined shape is formed with the highest plating of the first electrode portion and the lowest plating of the last electrode portion as shown in 4 (c). Will complete. At this time, the inclination and the final height of the inclined bottom electrode is determined by the width of the plating electrode 160 and the distance between the electrodes, and by appropriately adjusting it, an inclined bottom electrode having a desired height and inclination may be manufactured. After the inclined bottom electrode is formed, a process of manufacturing the micromirror is as shown in FIG. 5.

As shown in FIG. 5, the method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention is a bottom electrode 150 inclined through an electroplating based on a plating frame in FIG. 3. ) (3 (c)), the plating mold is removed from the first substrate as in 5 (d). Subsequently, the second substrate 200 is processed using an anisotropic etching process in accordance with the design distance between the micromirror plate and the bottom electrode to be manufactured as shown in 5 (e). Is formed. In this case, the processed second substrate 200 is bonded to the first substrate 100 having the bottom electrode formed thereon through a wafer bonding process, and then the other surface of the second substrate 200 is formed as much as the micromirror thickness to be manufactured. It is processed thinly using chemical mechanical polishing (CMP) process. At this time, a silicon wafer is mainly used as the second substrate. The aluminum 205 is deposited on the thinly processed second substrate as shown in 5 (f), and the aluminum is patterned according to the shape of the micromirror to be manufactured, and then the patterned aluminum 205 is used as a mask. Etching the second substrate in shape will complete the final micromirror.

6 is a flowchart illustrating a method of manufacturing a micromirror having an inclined bottom electrode using electroplating according to an embodiment of the present invention. As shown in FIG. 6, the method of manufacturing a micromirror including an inclined bottom electrode using an electroplating method according to an embodiment of the present invention includes forming an addressing line on a first substrate (S110) and addressing at step S110. Patterning the insulating film and the plating base layer on the first substrate on which the lines are formed (S120), forming a plating mold on the first substrate (S130), and forming an inclined bottom electrode on the first substrate on which the plating mold is formed. (S140), removing the plating mold from the first substrate (S150), combining and processing the second substrate on the upper side of the first substrate (S160), and depositing and patterning aluminum on the second substrate (S170). ), Etching the second substrate using the aluminum patterned in step S170 as a mask (S180).

Step S110 serves to form the addressing line 110 on the first substrate 100. This is a step of forming an addressing line for applying a voltage to the inclined bottom electrode when the micromirror is driven, in which a nickel thin film or aluminum is deposited and patterned on the first substrate to form the addressing line.

Step S120 serves to pattern the insulating layer 120 and the plating base layer 130 on the first substrate 100 on which the addressing line is formed in step S110. In this case, first, the silicon oxide layer (SiO ₂ ) is patterned using the insulating layer 120, and then patterned using gold as the plating base layer 130.

Step S130 serves to form the plating mold 140 on the first substrate 100. Here, the plating frame 140 serves to separate the bottom electrodes, and the size of the bottom electrode is determined according to the size of the plating frame. The plating mold is formed using a thick film photoresist.

Step S140 serves to form the inclined bottom electrode 150 on the first substrate on which the plating frame is formed. The inclined bottom electrode 150 is made of a metal plated by electroplating, and as described above with reference to FIGS. 3 (c) and 4, one plating electrode 160 is formed around the plating frame 140. Only the current is applied, and as the plating proceeds, the metal grows isotropically in the vertical and horizontal directions and is connected to the adjacent plating electrodes, thereby forming a bottom electrode having an inclined shape.

Step S150 serves to remove the plating mold 140 from the first substrate 100. This is a process of removing the plating mold required to form the size and shape of the bottom electrode after the bottom electrode of the desired size is formed by electroplating in step S140.

Step S160 serves to couple and process the second substrate 200 on the upper side of the first substrate 100. This is a process of combining and processing a second substrate for forming a constant power according to the voltage difference with the first substrate at a position spaced upwardly from the first substrate, through which the driving space of the micromirror is formed. . Step S160 may be divided into the following detailed processes. First, a process of processing a second substrate by an anisotropic etching process according to a predetermined interval between the micromirror plate and the inclined bottom electrode to be manufactured, the first substrate and the wafer on which the bottom electrode inclined the processed second substrate is formed The bonding process may be divided into a process of thinning the second substrate according to a predetermined thickness of the micromirror, and the process of thinning the second substrate may be performed by a CMP process.

In step S170, aluminum 205 is deposited and patterned on the second substrate 200. That is, this step is a process of depositing aluminum on the second substrate processed in step S160, and patterning the aluminum to match the shape of the micromirror to be manufactured.

In operation S180, the second substrate is etched in the shape of the micromirror to be manufactured using the aluminum patterned in operation S170 as a mask. After the etching process, the micromirror with the final inclined bottom electrode is completed.

7 is a schematic view of a micromirror fabricated by a micromirror manufacturing method having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention. As shown in FIG. 7, a micromirror having an inclined bottom electrode according to an embodiment of the present invention is a mirror plate and a support structure in a micromirror driven at a constant power according to a voltage difference between two plates. And a second substrate 200 having a bottom plate 150 formed in an inclined form with a mirror plate and a first substrate 100 having an addressing line (not shown) formed thereon.

The first substrate 100 includes a bottom electrode 150 formed in an inclined form with a mirror plate, and an addressing line, and the second substrate 200 supports the mirror plate and the mirror plate formed by patterning a silicon wafer. It includes a support structure for, the first substrate 100 and the second substrate 200 is coupled by a wafer bonding process to form a micromirror.

The mirror plate formed on the second substrate 200 has a shape surrounding the outside of the inner mirror plate 210 and the inner mirror plate driven based on one drive shaft, and is perpendicular to the drive shaft of the inner mirror plate. It comprises an outer frame 220 having a drive shaft. The mirror plate is composed of an inner mirror plate 210 and an outer frame 220 having a drive shaft in a direction perpendicular to the mirror plate, and each is driven by an inclined bottom electrode corresponding to the drive shaft, thereby enabling a two-axis drive micromirror structure. do.

The bottom electrode 150 includes a first electrode 152 for driving the inner mirror plate 210 and a second electrode 154 for driving the outer frame 220. It is possible to increase the range of the controllable driving angle by reducing the driving voltage and increasing the distance from the bottom electrode without increasing the driving voltage by replacing the inclined structure instead of the flat plate shape.

The first electrode 152 is for forming the inclined bottom electrode with the inner mirror plate 210, and may be configured in a conical shape to form the inclined bottom electrode with the inner mirror plate 210. The electrode 154 may be formed in a wedge type to form an inclined bottom electrode with the outer frame 220. The second electrode, which is the bottom electrode for driving the outer frame, and the first electrode, which is the bottom electrode for driving the inner mirror plate, are independently separated to enable two-axis driving. In this case, the inclination and the final height of the inclined bottom electrode are determined by the width of the plating electrode 160 and the distance between the electrodes, and by appropriately adjusting the inclined bottom electrode 150, a desired height and inclination may be manufactured. The inclination and height of the inclined bottom electrode which is changed in accordance with the width and spacing of the plating electrode are shown in FIG. 8.

8 is a view showing the results of measuring the shape of the bottom electrode inclined in a cone shape produced by the electroplating method according to an embodiment of the present invention using a non-contact laser displacement meter. 8 is a case in which the width of the plated electrode manufactured by the electroplating method according to the embodiment of the present invention is 80 μm wide and the space between the plated electrodes is changed in the inclined bottom electrode having a space of 10 μm between the plated electrodes (8 The inclination of the inclined bottom electrode in the case of (a)) and the width | variety of the plating electrode (8 (b)) is shown. In both cases, it can be seen that the bottom electrode is inclined at different inclinations according to the width and spacing of the plating electrode.

9 is a rotation of a micromirror according to a voltage applied to a micromirror manufactured by a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention and a micromirror having a conventional flat bottom electrode. It is a figure which shows the angle d. As shown in FIG. 9, the micromirrors having the inclined bottom electrode and the micromirror having the flat bottom electrode according to an embodiment of the present invention are applied to each micromirror according to Equations 1 to 4 described above. The angle of rotation can be calculated. 9 (a) shows a conventional flat electrode in which the bottom electrode is made parallel to the mirror plate, 9 (b) shows a micromirror having an inclined bottom electrode, and 9 (c) shows an area of the inclined bottom electrode having a micro Each case is shown smaller than the mirror plate. As shown in 9 (b) and 9 (c), the inclined bottom electrode has the effect of reducing the effective distance between the micromirror plate and the bottom electrode, thereby increasing the electrostatic power for the same applied voltage. Therefore, by inclining the bottom electrode, the applied voltage is changed to the electrostatic power more efficiently than the flat electrode. As can be seen from the calculation result shown in FIG. 9, the driving voltage of the micromirror is greatly reduced in the case of 9 (b) compared to the case of 9 (a). In other words, the voltage and the pull-in voltage for moving the same angle is reduced, and as a result, when the inclined bottom electrode is increased, the distance between the micromirror plate and the first substrate is increased, compared to the micromirror using the flat electrode. The drive voltage can be designed to be smaller or equal, which means that the range of controllable angle of rotation can be greatly increased. In addition, through the above-described equations (1) to (4), while maintaining the same driving voltage, the strength of the spring is increased to reduce the adhesion phenomenon and the effect of producing a more robust micromirror even in an external environment such as shock or vibration. Can be. 9, if the area of the bottom electrode is designed to be smaller than that of the micromirror plate as in the structure of 9 (c), when the distance between the micromirror plate and the first substrate is the same, a larger driving angle control range is obtained. It can be confirmed. That is, there is an advantage that the pull-in critical angle can be largely increased for the same initial interval, so that it can be used for applications requiring a larger control driving angle range. In addition, by forming the bottom electrode in a conical shape, the bottom electrode serves as an inclined bottom electrode, and at the same time, an adhesion phenomenon can be prevented from occurring until the micromirror plate reaches the bottom at any rotation angle.

The present invention described above may be variously modified or applied by those skilled in the art, and the scope of the technical idea according to the present invention should be defined by the following claims.

1 is a schematic diagram for calculating torque by constant power of a bidirectional drive micromirror using constant power;

2 is a view illustrating a rotation angle of a micromirror according to an applied voltage.

3 is a step-by-step view showing a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention.

4 is a view showing a process of forming the bottom electrode of the inclined shape through the electroplating according to an embodiment of the present invention.

5 is a step-by-step view showing a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating according to an embodiment of the present invention.

6 is a flow chart of a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention.

7 is a schematic view of a micromirror fabricated by a micromirror fabrication method having an inclined bottom electrode using electroplating according to an embodiment of the present invention.

8 is a view showing the results of measuring the shape of the bottom electrode inclined in a cone shape produced by the electroplating method according to an embodiment of the present invention using a non-contact laser displacement meter.

9 is a rotation of a micromirror according to a voltage applied to a micromirror manufactured by a method of manufacturing a micromirror having an inclined bottom electrode using an electroplating method according to an embodiment of the present invention and a micromirror having a conventional flat bottom electrode. Figure showing angles.

<Explanation of symbols for main parts of the drawings>

100: first substrate

130: plating base layer

150: inclined bottom electrode

152: first electrode

154: second electrode

160: plating electrode

200: second substrate

210: internal mirror plate

220: outer frame

Claims (7)

In the micromirror manufacturing method, (1) forming a plating mold for separating the bottom electrode and determining the size of the electrode on the first substrate; (2) forming an inclined bottom electrode on the first substrate through electroplating; (3) removing the plating mold from the first substrate; (4) combining and processing a second substrate for forming a constant power according to a voltage difference with the first substrate at a position spaced upwardly from the first substrate; (5) depositing aluminum on the processed second substrate and patterning the aluminum to conform to the shape of the micromirror; And (6) etching the second substrate using the patterned aluminum as a mask, In the step (1), the plating frame is formed of three, each forming at least two plating electrodes in the direction of the outer plating frame relative to the center plating frame, In the step (2), the inclined bottom electrode is formed by applying current in the order of the plating electrodes adjacent to the center plating frame among the at least two plating electrodes, by adjusting the width between the width of the plating electrode and the spacing between the plating electrodes. A method of manufacturing a micromirror having an inclined bottom electrode using electroplating, the height and inclination of the inclined bottom electrode are controlled. The method of claim 1, wherein prior to step (1), And forming an addressing line on the first substrate for applying a voltage to the inclined bottom electrode when the micromirror is driven, and patterning an insulating film and a plating base layer on the first substrate. Micromirror manufacturing method having an inclined bottom electrode using an electroplating. The method of claim 2, The step of forming the addressing line on the first substrate, A method of fabricating a micromirror having an inclined bottom electrode using electroplating, characterized by depositing and patterning a thin nickel film or aluminum on the first substrate to form an addressing line. The method of claim 2, The step of patterning an insulating film and a plating base layer on the first substrate, Patterning an insulating film on the first substrate using a silicon oxide film (SiO ₂ ); And And patterning a plating-based layer on the first substrate using gold. 10. The method of claim 1, further comprising patterning a plating-based layer on the first substrate. The method of claim 1, The step (1) of forming a plating mold for separating the bottom electrode and determining the size of the electrode on the first substrate, A method of fabricating a micromirror having inclined bottom electrodes using electroplating, wherein the plating frame is formed using a thick photoresist. The method of claim 1, The step (4) of combining and processing the second substrate for forming a constant power according to the voltage difference with the first substrate at a position spaced upwardly from the first substrate, Processing the second substrate by an anisotropic etching process at a predetermined interval between the micromirror plate and the inclined bottom electrode; Bonding the processed second substrate to the first substrate on which the inclined bottom electrode is formed by a wafer bonding process; And And manufacturing the second substrate thinly according to a thickness of a predetermined micromirror. The method of claim 6, The step of thinly processing the second substrate according to the thickness of the preset micromirror, A method of fabricating a micromirror having an inclined bottom electrode using electroplating, characterized by using a chemical mechanical polishing (CMP) process.

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