KR100903052B1 - Method and structure for conducting electricity between layers inside touch screen - Google Patents

Abstract

The present invention relates to a method and a structure of electrical communication between layers in a touch screen. In the touch screen including an upper layer, an upper silver pattern, an adhesive layer, a lower silver pattern, and a lower layer from above, holes are formed in the adhesive layer, the lower silver pattern, and the lower layer. Or a hole is formed in an upper layer, an upper silver pattern, and an adhesive layer, and a conductor is filled in the hole.

Touch Screen, Electric Communication, Challenge

Description

Method and structure for conducting electricity between layers inside touch screen}

In particular, in the case of a resistive touch screen, a method of conducting a current supplied to one side of a lower layer or an upper layer to another layer is more stable, resistant to external impact, and improved to prevent the appearance of protruding signs. It relates to a method and structure of electrical communication between layers.

In resistive touch screens, silver (Ag) patterns are printed on two layers coated with indium tin oxide (ITO) or another conductive material, and the coated surfaces are bonded to each other. The base material of the two layers is polyethylene terephthalate (PET), polycarbonate (PC), glass (glass) and the like. In addition, a flexible printed circuit board (FPCB) is bonded to one of the two layers and connected to the system.

As shown in FIGS. 1 and 2, when the layer to which the FPCB 7 is bonded is referred to as the lower layer 5, and the opposite layer is referred to as the upper layer 1, the lower layer 5 directly connected to the FPCB 7. The electricity is supplied from the system through the FPCB 7, but no electricity is supplied to the upper layer 1 that is not. Therefore, in general, a resistive touch screen is formed by injecting a conductor 8 in the adhesive layer 3 between the lower layer 5 and the upper layer 1 to inject a conductor into the upper layer 1 from the lower layer 5. Let the conduction.

The upper layer 1 and the lower layer 5 to which the FPCB 7 is attached are bonded by an adhesive layer 3 composed of an adhesive or an adhesive tape with the conductive material coated side facing each other, and printed on the lower layer 5. The spacer 6 keeps the space such that the upper layer 1 and the lower layer 5 can be touched only by touch.

In the conventional resistive touch screen, an adhesive layer having two layers adhered to each other as illustrated in FIG. 2 to flow electricity from the Ag pattern 4 of the lower layer 5 to the Ag pattern 2 of the upper layer 1. One or more conductive holes 8 were drilled into 3) to inject a conductor.

When challenged in the above way, there are the following problems.

First, it may be vulnerable when a physical or environmental impact is applied to the conductive hole 8 portion. In other words, when the region of the conductive hole 8 is hardly rubbed or pressed, damage to the conductor filled in the conductive hole 8 may occur, such as cracking, and the like may not be stably conducted.

Second, the process of injecting the conductor is unstable. In order to fill the conductor in the conductive hole 8 and to conduct a stable conduction, the amount of the conductor must be injected at least a certain amount. However, when injecting too many conductors, the conductive holes 8 become bulging in appearance from the front, and not only in appearance, but also because the height of the holes 8 is limited to the thickness of the adhesive layer 3. There is a possibility of overflow and electrical short.

Third, after the conductor is injected, the entire upper layer 1 and the entire lower layer 5 are bonded to each other, so that the adhesive layer 3 attached to the upper layer 1 or the lower layer 5 at the time of bonding is one release paper of the adhesive tape. In the removal process, the injected conductor may be affected, and some or all may be removed together with the release paper.

Due to the basic fragile structure of the conductive holes 8, the number of conductive holes 8 may be increased so that one conductive hole 8 may be challenged through another conductive hole 8 even if one conductive hole 8 is destroyed by an impact. Additional time and raw materials are consumed, and this is not a fundamental solution.

Therefore, it is an object of the present invention to prevent damage to the conductive holes and conductors, and to stabilize the injection process of the conductors, thereby making the method of conducting the current supplied to one of the lower or upper layers to the other layer more stable and to external impact. It is to provide an electric communication method and structure between the inner layer of the touch screen improved to prevent strong and protruding markings.

In order to achieve the above object, the present invention provides a touch screen including an upper layer, an upper silver pattern, an adhesive layer, a lower silver pattern, and a lower layer from above, wherein holes are formed in the adhesive layer, the lower silver pattern, and the lower layer, or an upper layer and an upper silver. A hole is formed in the pattern and the adhesive layer, and a conductor is filled in the hole, and the hole is formed in two or more adjacently, and provides an interlayer intercommunication structure in which the adjacent holes are connected. .

According to another embodiment of the present invention, two or more holes may be formed adjacent to each other, and adjacent holes may be connected to each other.

In the present invention, the diameter of the hole is preferably 50 µm to 2.5 mm, particularly 0.5 to 1.5 mm.

The present invention also provides a method for forming a hole in a lower layer on which a lower silver pattern is printed, or forming a hole in an upper layer on which an upper silver pattern is printed; Forming holes in the adhesive layer; Bonding the lower and upper layers using an adhesive layer; And injecting a conductor into the hole, and forming two or more holes so as to be adjacent to each other in the forming of the hole, and injecting the conductor into one hole while injecting the conductor into another hole. It provides a method of interlayer intercommunication within the touch screen, characterized in that the injection while watching the filling in the side hole.

In the present invention, the hole of the adhesive layer may be formed by processing the hole on the adhesive tape or printing except for the hole part using an adhesive.

In the present invention, if the conductor is a liquid, it is preferable to dry rapidly after injection.

In the present invention, after forming two or more holes so as to be adjacent to each other, the conductor may be injected into one hole while seeing that the other hole is filled.

According to the present invention, in particular, in the case of a resistive touch screen, a method of conducting a current supplied to one side of a lower layer or an upper layer to another layer may be improved so that a display that is more stable, resistant to external impact, and protruding in appearance does not appear. Can be.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 illustrate an interlayer electrical communication structure inside the touch screen according to an embodiment of the present invention, in which FIG. 3 is a cross-sectional view before conductor injection and FIG. 4 after a conductor injection.

In the touch screen inner interlayer communication structure according to the present invention is a touch screen composed of an upper layer 11, an upper silver pattern 12, an adhesive layer 13, a lower silver pattern 14 and a lower layer 15 from above, A hole 17 is formed in the adhesive layer 13, the lower silver pattern 14, and the lower layer 15, and a conductor 18 is filled in the hole 17.

In contrast to the lower hole forming structure, holes 17 may be formed in the upper layer 11, the upper silver pattern 12, and the adhesive layer 13, and the conductors 18 may be filled in the holes 17. Since the upper hole forming structure is a symmetrical structure with the lower hole forming structure described above, a separate drawing and description of the upper hole forming structure will be omitted, and the description will be given mainly on the lower hole forming structure.

The upper layer 11 and the lower layer 15 are made of an ITO film or the like, and the thickness is 0.1 to 0.2 mm. ITO film is coated with ITO on a base material such as polyethylene terephthalate (PET), polycarbonate (PC), glass.

The upper silver pattern 12 and the lower silver pattern 14 are printed on the upper layer 11 and the lower layer 15 in the pattern shown in FIG. 2 or the like, respectively.

The adhesive layer 13 serves to bond the upper layer 11 and the lower layer 15 and is formed of an adhesive tape or an adhesive.

In the method of forming the hole 17 in the adhesive layer 13, the adhesive tape may be formed by processing the adhesive tape, or may be formed by printing on a necessary portion (except for the hole) using an adhesive.

The hole 17 is drilled in a circular shape in the lower layer 15, and the adhesive layer 13 in the hole 17 portion is processed into a circle or a square around the hole so as to be larger than the hole in the lower layer 15, and its cross section is formed in a T shape. Be sure to The reason for this is to allow the electric conductors between the two layers to be filled between the lower layer 15 and the upper layer 11 by the conductor 18 administered alone in the lower layer 15. There is also a purpose to prevent the separation of the filled conductor (18).

It is preferable that the size of the hole 17 is 50 micrometers-2.5 mm in diameter, and 0.5-1.5 mm is especially preferable. If the size of the hole 17 is too small, it is difficult to process the hole 17 or inject the conductor 18. On the contrary, if the size of the hole 17 is too large, the amount of the conductor 18 is larger than necessary. May be used, which causes the conductor 18 to flow down.

As the conductor 18, liquid silver (Ag), a conductive polymer, or the like, which can be easily administered and fills an internal space to facilitate electrical communication, may be used.

As the support lower plate 16, materials that can be easily processed may be considered. PCs, synthetic resins such as polymethyl methacrylate (PMMA), and other plastics and glass may be used depending on the application.

In addition, in the case of the lower layer, as shown in the figure, the support lower plate 16 and the lower layer 15 are not bonded to each other by two layers, but the hole is formed by using a single ITO coated layer by integrating the support lower plate and the ITO film into one. (17) can also be processed.

According to an embodiment of the present invention, there is provided a method of inter-layer electrical communication in a touch screen, including forming a hole in a lower layer 15 on which a lower silver pattern 14 is printed; Forming holes in the adhesive layer (13); Bonding the upper layer 11 to which the lower layer 15 and the upper silver pattern 12 are printed using the adhesive layer 13; And injecting the conductor 18 into the hole 17.

In contrast to the lower hole forming method as described above, forming a hole in the upper layer 11 on which the upper silver pattern 12 is printed; Forming holes in the adhesive layer (13); Bonding the lower layer 15 on which the upper layer 11 and the lower silver pattern 14 are printed using the adhesive layer 13; And injecting the conductor 18 into the hole 17. Since the upper hole forming method has a symmetrical structure with the lower hole forming method described above, a separate description of the upper hole forming method will be omitted, and the description will be mainly focused on the lower hole forming method.

Specifically, first, the hole 17 shown in the drawing is processed to a diameter of 0.5 to 2 mm in a state in which the lower layer 15 on which the silver pattern 14 is printed is bonded to the support lower plate 16. Then, the adhesive layer 13 is attached to the upper layer 11 on which the silver pattern 12 is printed, in a state where the portion in contact with the hole 17 is removed. The entire upper layer 11 and the entire lower layer 15, which are divided into two as described above, are bonded using an adhesive layer 13 such as an adhesive tape.

Then, after all the layers are bonded, the conductor 18 is injected from the bottom to fill the empty space so that electricity is communicated between the lower silver pattern 14 and the upper silver pattern 12 at the same time. If the conductor 18 to be injected is a liquid, a step of forcibly drying faster may be added to prevent it from flowing down.

As a method of forcibly drying, for example, at a temperature of 40 to 60 ° C. for 30 minutes to 2 hours in a box oven in a dry rack so as to prevent the filled conductor from flowing down. There exist a method of performing drying, and the said dry conditions did not have a special problem.

FIG. 5 is a cross-sectional view illustrating an interlayer intercommunication structure within a touch screen according to another embodiment of the present invention, which improves the problems of the embodiments shown in FIGS. 3 and 4.

3 and 4, one side of the hole 17 is blocked. Therefore, when the conductor 18 is injected while the hole 17 is blocked, the injection may not be performed smoothly due to the air pressure inside the hole 17. In order to check how much the conductor 18 has been injected, there is an inconvenience of observing the hole 17 after stopping the injection.

Therefore, as shown in FIG. 5, the hole 17a and 17b are drilled one more time to facilitate the injection of the conductor, and at the same time, the area that the conductor touches increases to allow the electricity to communicate more stably.

That is, after the holes 17a and 17b are formed in pairs so as to be adjacently connected in a U-shape, the conductor may be injected into one hole 17a while the other hole 17b is filled. The structure and the size of the holes 17a and 17b are the same as those of the embodiment of FIGS. 3 and 4.

In the description of the implantation process, when the conductor is injected into one hole 17a and the conductor is filled into the other hole 17b, the conductor injection is terminated. As a result, both problems of the embodiments of FIGS. 3 and 4 can be solved.

Although FIG. 5 illustrates that two holes 17a and 17b are formed, the number of holes is not limited thereto, and three or more holes may be adjacent to each other, and each hole may be connected to each other.

Before and after the change to the current-carrying structure according to the present invention by making each product applied to the process was compared and stored in a harsh environment. The experimental environment was left to stand at a temperature of 80 ° C. and a humidity of 80% for 24 hours. As a result of the experiment, before changing to the electricity supply structure according to the present invention, a poor electrical conduction of one product out of ten products occurred, but after the change to the electricity supply structure according to the present invention, there was no electricity supply failure among the ten products. Did not occur.

1 is a cross-sectional view showing the basic structure of a conventional resistive touch screen.

Figure 2 is an exploded perspective view showing a conventional interlayer electrical communication structure.

3 and 4 illustrate an interlayer electrical communication structure inside the touch screen according to an embodiment of the present invention, in which FIG. 3 is a cross-sectional view before conductor injection and FIG. 4 after a conductor injection.

5 is a cross-sectional view showing an interlayer electrical communication structure inside the touch screen according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1, 11: upper layer

2, 12: upper silver pattern

3, 13: adhesive layer

4, 14: lower silver pattern

5, 15: lower layer

6: spacer

7: FPCB

8, 17: hall

16: support bottom plate

18: Conductor

Claims (7)

In the touch screen composed of an upper layer, an upper silver pattern, an adhesive layer, a lower silver pattern and a lower layer from above, A hole is formed in the adhesive layer, the lower silver pattern and the lower layer, or a hole is formed in the upper layer, the upper silver pattern and the adhesive layer, characterized in that the hole is filled with a conductor, Holes are formed in two or more adjacent to each other inter-electric communication structure of the touch screen, characterized in that the adjacent holes are connected. delete The interlayer electrical communication structure of claim 1, wherein the hole has a diameter of 50 µm to 2.5 mm. Forming holes in the lower layer on which the lower silver pattern is printed, or forming holes in the upper layer on which the upper silver pattern is printed; Forming holes in the adhesive layer; Bonding the lower and upper layers using an adhesive layer; And Injecting a conductor into the hole, Forming two or more holes to be adjacently connected in the step of forming the hole, and injecting the conductor in the step of injecting the conductor, characterized in that the injection while watching the filling in the other hole How to communicate between floors inside the touch screen. 5. The method of claim 4, wherein the holes of the adhesive layer are formed by processing the holes on the adhesive tape or by using the adhesive to remove the holes. 5. The method of claim 4 wherein the conductor is a liquid and then rapidly dried after injection. delete

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