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KR100902330B1 - 반도체공정장치 - Google Patents

반도체공정장치 Download PDF

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Publication number
KR100902330B1
KR100902330B1 KR1020070050222A KR20070050222A KR100902330B1 KR 100902330 B1 KR100902330 B1 KR 100902330B1 KR 1020070050222 A KR1020070050222 A KR 1020070050222A KR 20070050222 A KR20070050222 A KR 20070050222A KR 100902330 B1 KR100902330 B1 KR 100902330B1
Authority
KR
South Korea
Prior art keywords
substrate
processing space
unit
semiconductor
cylinder valve
Prior art date
Application number
KR1020070050222A
Other languages
English (en)
Korean (ko)
Other versions
KR20080002633A (ko
Inventor
박상준
이호영
이춘우
Original Assignee
주식회사 아이피에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이피에스 filed Critical 주식회사 아이피에스
Priority to TW096123251A priority Critical patent/TWI407494B/zh
Priority to US11/770,117 priority patent/US8741096B2/en
Priority to CN2007101230744A priority patent/CN101097844B/zh
Publication of KR20080002633A publication Critical patent/KR20080002633A/ko
Application granted granted Critical
Publication of KR100902330B1 publication Critical patent/KR100902330B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020070050222A 2006-06-29 2007-05-23 반도체공정장치 KR100902330B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW096123251A TWI407494B (zh) 2006-06-29 2007-06-27 半導體處理裝置
US11/770,117 US8741096B2 (en) 2006-06-29 2007-06-28 Apparatus for semiconductor processing
CN2007101230744A CN101097844B (zh) 2006-06-29 2007-06-28 半导体处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060059670 2006-06-29
KR20060059670 2006-06-29

Publications (2)

Publication Number Publication Date
KR20080002633A KR20080002633A (ko) 2008-01-04
KR100902330B1 true KR100902330B1 (ko) 2009-06-12

Family

ID=39011545

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070050222A KR100902330B1 (ko) 2006-06-29 2007-05-23 반도체공정장치

Country Status (3)

Country Link
KR (1) KR100902330B1 (zh)
CN (1) CN101097844B (zh)
TW (1) TWI407494B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2933813B1 (fr) * 2008-07-11 2010-12-24 Alcatel Lucent Dispositif de purge et procede.
CN102251228B (zh) * 2011-03-25 2015-12-16 中微半导体设备(上海)有限公司 清洁气体输送装置的方法、生长薄膜的方法及反应装置
TWI689004B (zh) 2012-11-26 2020-03-21 美商應用材料股份有限公司 用於高深寬比半導體元件結構具有污染物去除之無黏附乾燥處理
CN104752289B (zh) * 2013-12-31 2018-05-08 北京北方华创微电子装备有限公司 传输系统及半导体加工设备
CN103711937B (zh) * 2014-01-09 2016-06-01 北京七星华创电子股份有限公司 一种半导体设备的微环境排气控制装置
US10283344B2 (en) 2014-07-11 2019-05-07 Applied Materials, Inc. Supercritical carbon dioxide process for low-k thin films
JP6644881B2 (ja) 2015-10-04 2020-02-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高アスペクト比フィーチャ向けの乾燥プロセス
CN115527897A (zh) 2015-10-04 2022-12-27 应用材料公司 小热质量的加压腔室
WO2017062136A1 (en) 2015-10-04 2017-04-13 Applied Materials, Inc. Reduced volume processing chamber
WO2017062141A1 (en) 2015-10-04 2017-04-13 Applied Materials, Inc. Substrate support and baffle apparatus
WO2019134058A1 (zh) * 2018-01-05 2019-07-11 辉能科技股份有限公司 真空装置
CN111926306B (zh) * 2020-09-22 2020-12-22 上海陛通半导体能源科技股份有限公司 基于多工艺腔传送的沉积设备及晶圆沉积方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980011811A (ko) * 1996-07-29 1998-04-30 김광호 화학 기상 증착 장치의 웨이퍼 체결 장치
KR19980051973A (ko) * 1996-12-24 1998-09-25 김광호 반도체장치 제조용 식각 장치
KR20040048618A (ko) * 2002-12-04 2004-06-10 삼성전자주식회사 원자층 증착 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus
US7682454B2 (en) * 2003-08-07 2010-03-23 Sundew Technologies, Llc Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980011811A (ko) * 1996-07-29 1998-04-30 김광호 화학 기상 증착 장치의 웨이퍼 체결 장치
KR19980051973A (ko) * 1996-12-24 1998-09-25 김광호 반도체장치 제조용 식각 장치
KR20040048618A (ko) * 2002-12-04 2004-06-10 삼성전자주식회사 원자층 증착 장치

Also Published As

Publication number Publication date
CN101097844A (zh) 2008-01-02
TW200805461A (en) 2008-01-16
TWI407494B (zh) 2013-09-01
KR20080002633A (ko) 2008-01-04
CN101097844B (zh) 2010-12-15

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