KR100905173B1 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor device Download PDFInfo
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- KR100905173B1 KR100905173B1 KR1020070098475A KR20070098475A KR100905173B1 KR 100905173 B1 KR100905173 B1 KR 100905173B1 KR 1020070098475 A KR1020070098475 A KR 1020070098475A KR 20070098475 A KR20070098475 A KR 20070098475A KR 100905173 B1 KR100905173 B1 KR 100905173B1
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 claims abstract description 34
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 18
- 229920005591 polysilicon Polymers 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- 238000002955 isolation Methods 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
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Abstract
본 발명은 플로우팅 질화막을 사용하여 게이트 패턴을 연결함으로써 캡핑 질화막을 형성하기 위한 열처리 공정에 의해 발생하는 게이트 기울어짐 현상을 방지할 수 있는 기술을 개시한다.The present invention discloses a technique capable of preventing a gate tilt caused by a heat treatment process for forming a capping nitride film by connecting a gate pattern using a floating nitride film.
게이트, 플로우팅 질화막, 캡핑 질화막, 열처리 공정, SOD Gate, Floating Nitride, Capping Nitride, Heat Treatment Process, SOD
Description
본 발명은 반도체 소자 형성 방법에 관한 것으로, 더욱 상세하게는 플로우팅 질화막을 사용하여 게이트 패턴을 연결함으로써 캡핑 질화막을 형성하기 위한 열처리 공정에 의해 발생하는 게이트 기울어짐 현상을 방지할 수 있는 반도체 소자 형성 방법에 관한 것이다.The present invention relates to a method of forming a semiconductor device, and more particularly, to forming a semiconductor device capable of preventing a gate tilt caused by a heat treatment process for forming a capping nitride film by connecting a gate pattern using a floating nitride film. It is about a method.
반도체 소자가 고집적화됨에 따라 게이트의 선폭(Critical Dimension; 이하 CD)이 좁아지면서 채널 길이가 감소하여 전계 효과 트랜지스터(Field Effect Transistor; 이하 FET)의 전기적 특성이 저하되는 단 채널 효과(Short Channel Effect; 이하 SCE)가 발생하였다. As semiconductor devices become more integrated, shorter channel widths (CDs) become narrower and channel lengths decrease, resulting in a decrease in the electrical characteristics of field effect transistors (FETs). SCE) occurred.
이를 극복하기 위하여 리세스 게이트(Recessed Gate)와 같은 멀티 채널(Multi-channel) FET를 사용하게 되었다. To overcome this, a multi-channel FET such as a recessed gate has been used.
여기서, 리세스 게이트(Recessed Gate)는 게이트 예정 영역의 활성영역(active area)을 설정된 깊이만큼 식각하여 채널 길이를 증가시키는 게이트 구조이다.Here, the recessed gate is a gate structure in which the channel length is increased by etching an active area of the gate predetermined area by a predetermined depth.
그러나 리세스 게이트 구조는 게이트 스페이서(gate spacer) 및 게이트 캡핑 질화막(gate capping nitride)을 형성하기 위한 열처리(thermal treatment) 공정 시 게이트 텅스텐층의 열 팽창 계수에 의해 리세스된 방향으로 경사(tilt)가 발생하여 게이트 기울어짐(gate leaning)이 발생하고, 후속 게이트 폴리 실리콘에 대한 선택 산화 공정(selective oxidation)에 의해 게이트 기울어짐이 더욱 악화하는 문제점이 있다.However, the recess gate structure is tilted in the recessed direction by the thermal expansion coefficient of the gate tungsten layer during a thermal treatment process for forming a gate spacer and a gate capping nitride. Occurs, resulting in gate tilt, and the gate tilt is further deteriorated by a selective oxidation process for subsequent gate polysilicon.
본 발명은 플로우팅 질화막을 사용하여 게이트 패턴을 연결함으로써 캡핑 질화막을 형성하기 위한 열처리 공정에 의해 발생하는 게이트 기울어짐 현상을 방지할 수 있는 반도체 소자 형성 방법을 제공하는 것을 목적으로 한다.An object of the present invention is to provide a method of forming a semiconductor device capable of preventing a gate tilt phenomenon caused by a heat treatment process for forming a capping nitride film by connecting a gate pattern using a floating nitride film.
본 발명에 따른 반도체 소자 형성 방법은 The method of forming a semiconductor device according to the present invention
반도체 기판에 활성영역을 정의하는 소자 분리막을 형성하는 단계;Forming an isolation layer defining an active region on the semiconductor substrate;
상기 반도체 기판 상부에 게이트 산화막을 형성하고, 상기 게이트 산화막 상부에 게이트 폴리 실리콘을 증착하는 단계;Forming a gate oxide layer on the semiconductor substrate and depositing gate polysilicon on the gate oxide layer;
상기 게이트 폴리 실리콘 상부에 게이트 전극 금속 및 게이트 하드 마스크를 순차적으로 증착하고, 게이트 마스크를 이용하여 상기 게이트 하드 마스크 및 상기 게이트 전극 금속을 식각하는 단계;Sequentially depositing a gate electrode metal and a gate hard mask on the gate polysilicon, and etching the gate hard mask and the gate electrode metal using a gate mask;
상기 소자 분리막 상부에 형성된 인접한 게이트 하드 마스크들을 서로 연결하는 플로우팅 지지층을 형성하는 단계;Forming a floating support layer interconnecting adjacent gate hard masks formed on the device isolation layer;
상기 반도체 기판 상부에 캡핑 질화막을 증착하는 단계; 및Depositing a capping nitride film on the semiconductor substrate; And
상기 플로우팅 지지층을 제거하는 단계를 포함하는 것을 특징으로 한다.Removing the floating support layer.
또한, 상기 게이트 폴리 실리콘과 상기 게이트 전극 금속 사이에 베리어 메탈을 형성하는 단계를 더 포함하고,The method may further include forming a barrier metal between the gate polysilicon and the gate electrode metal.
상기 플로우팅 지지층을 형성하는 단계는 Forming the floating support layer
상기 반도체 기판 상부에 제 1 산화막을 증착하는 단계;Depositing a first oxide film on the semiconductor substrate;
상기 게이트 하드 마스크가 노출될 때까지 상기 제 1 산화막에 대해 평탄화 공정을 수행하는 단계;Performing a planarization process on the first oxide layer until the gate hard mask is exposed;
상기 반도체 기판 상부에 제 1 질화막을 증착하는 단계; 및Depositing a first nitride film on the semiconductor substrate; And
상기 제 1 질화막에 대한 식각 공정을 통해 상기 플로우팅 지지층을 형성하는 단계를 포함하고,Forming the floating support layer through an etching process on the first nitride film,
상기 플로우팅 지지층을 제거하는 단계는Removing the floating support layer
상기 반도체 기판 상부에 제 2 산화막을 갭 필(gap fill)하는 단계; 및Gap filling a second oxide layer over the semiconductor substrate; And
상기 게이트 하드 마스크가 노출될 때까지 상기 제 2 산화막에 대해 평탄화 공정을 수행하는 단계를 포함하고,Performing a planarization process on the second oxide layer until the gate hard mask is exposed,
상기 제 2 산화막은 SOD(Spin On Dielectric)으로 형성하고,The second oxide film is formed of SOD (Spin On Dielectric),
상기 게이트 하드 마스크를 식각 마스크로 상기 게이트 폴리 실리콘을 식각하여 게이트 폴리 실리콘 패턴을 형성하는 단계; 및Etching the gate polysilicon using the gate hard mask as an etch mask to form a gate polysilicon pattern; And
노출된 상기 게이트 폴리 실리콘 패턴의 측벽에 대해 열산화 공정을 통해 선택 산화막을 형성하는 단계를 더 포함하고,Forming a selective oxide film on the exposed sidewall of the gate polysilicon pattern through a thermal oxidation process,
게이트 예정영역과 중첩하는 상기 활성영역을 식각하여 리세스 영역을 형성하는 단계를 더 포함하는 것을 특징으로 한다.And etching the active region overlapping the gate predetermined region to form a recess region.
본 발명은 플로우팅 질화막을 사용하여 게이트 패턴을 연결함으로써 캡핑 질화막을 형성하기 위한 열처리 공정에 의해 발생하는 게이트 기울어짐 현상을 방지 할 수 있는 효과가 있다.The present invention has the effect of preventing the gate tilt caused by the heat treatment process for forming the capping nitride film by connecting the gate pattern using a floating nitride film.
이하, 첨부된 도면들을 참조하여 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 그러나, 본 발명은 여기서 설명되는 실시예에 한정되지 않고 다른 형태로 구체화될 수 있다. 오히려, 여기서 소개되는 실시예는 본 발명의 기술적 사상이 철저하고 완전하게 개시되고 당업자에게 본 발명의 사상이 충분히 전달되기 위해 제공되는 것이다. 또한, 명세서 전체에 걸쳐서 동일한 참조 번호들은 동일한 구성요소를 나타낸다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the spirit of the present invention is thoroughly and completely disclosed, and the spirit of the present invention to those skilled in the art will be fully delivered. Also, like reference numerals denote like elements throughout the specification.
도 1a 내지 도 1l은 본 발명에 따른 반도체 소자 형성 방법을 나타낸 도면들이다. 여기서, (i)은 평면도이고, (ii)는 (i)의 평면도에서 A-A'를 따라 절단한 단면도이다.1A to 1L are diagrams illustrating a method of forming a semiconductor device according to the present invention. Here, (i) is a top view, (ii) is sectional drawing cut along A-A 'in the top view of (i).
도 1a를 참조하면, 반도체 기판(10) 내에 활성영역(12)을 정의하는 소자 분리막(14)을 형성한다.Referring to FIG. 1A, an
활성영역의 게이트 예정영역의 활성영역(12)을 설정된 깊이로 식각하여 리세스 영역을 형성한다.The
이어서, 리세스 영역을 포함하는 전면 상부에 게이트 산화막(16)을 형성하고, 리세스 영역을 포함하는 전면 상부에 게이트 폴리 실리콘(18)을 증착하고, 게이트 폴리 실리콘(18) 상부에 베리어 메탈(20), 게이트 텅스텐(22) 및 게이트 하드 마스크 질화막(24)을 순차적으로 증착한다.Subsequently, the
도 1b를 참조하면, 게이트 마스크를 이용하여 게이트 하드 마스크 질화 막(24), 게이트 텅스텐(22) 및 베리어 메탈(20)을 순차적으로 식각하여 게이트 스택(gate stack)을 형성한다.Referring to FIG. 1B, the gate hard
도 1c를 참조하면, 전면 상부에 캡핑 산화막(capping oxide)(26)을 증착하고, 게이트 하드 마스크 질화막(24)이 노출하도록 평탄화 공정을 수행한다. Referring to FIG. 1C, a
도 1d 및 도 1e를 참조하면, 전면 상부에 질화막(28)을 증착하고, 소자 분리막(14) 상부에 형성된 인접한 게이트 라인들을 서로 연결하기 위해 마스크를 이용하여 질화막(28)에 대한 사진 및 식각 공정을 통해 플로우팅 질화막(floating nitride)(28a)을 형성한다.Referring to FIGS. 1D and 1E, a
도 1f를 참조하면, 캡핑 산화막(26)을 딥 아웃(dip out)으로 제거한다.Referring to FIG. 1F, the
도 1g를 참조하면, 전면 상부에 캡핑 질화막(capping nitride)(30)을 증착한다. 이때, 플로우팅 질화막(28a)에 의해 열처리 공정에 의한 게이트 기울어짐 현상을 방지할 수 있다.Referring to FIG. 1G, a
도 1h를 참조하면, 갭 필(gap fill) 능력이 우수한 SOD(Spin On Dielectric)(32)를 게이트들 사이에 갭 필(gap fill)하고, 플로우팅 질화막(28a)을 제거하기 위한 평탄화 공정을 수행한다.Referring to FIG. 1H, a planarization process for gap fill between the gates of a spin on dielectric (SOD) 32 having excellent gap fill capability and removal of the floating
도 1j 및 도 1k를 참조하면, SOD(32)를 딥 아웃(dip out)하고, 게이트 하드 마스크 질화막(24)을 식각 마스크로 게이트 폴리 실리콘(18)을 식각한다. 1J and 1K, the
도 1l을 참조하면, 노출된 게이트 폴리 실리콘(18)의 측벽에 대해 열산화공정에 의해 선택 산화막(selective oxide)(34)을 형성한다.Referring to FIG. 1L, a
상기한 바와 같이 본 발명은 플로우팅 질화막을 사용하여 게이트 패턴을 연 결함으로써 캡핑 질화막을 형성할 때 발생하는 게이트 기울어짐 현상을 방지할 수 있는 기술을 개시한다.As described above, the present invention discloses a technique capable of preventing the gate tilt phenomenon occurring when the capping nitride film is formed by connecting the gate pattern using the floating nitride film.
아울러 본 발명의 바람직한 실시예는 예시의 목적을 위한 것으로, 당업자라면 첨부된 특허청구범위의 기술적 사상과 범위를 통해 다양한 수정, 변경, 대체 및 부가가 가능할 것이며, 이러한 수정 변경 등은 이하의 특허청구범위에 속하는 것으로 보아야 할 것이다. In addition, a preferred embodiment of the present invention is for the purpose of illustration, those skilled in the art will be able to various modifications, changes, substitutions and additions through the spirit and scope of the appended claims, such modifications and changes are the following claims It should be seen as belonging to a range.
도 1a 내지 도 1l은 본 발명에 따른 반도체 소자 형성 방법을 나타낸 단면도들이다. 1A to 1L are cross-sectional views illustrating a method of forming a semiconductor device in accordance with the present invention.
<도면의 주요 부분에 대한 부호 설명><Description of the symbols for the main parts of the drawings>
10: 반도체 기판 12: 활성영역10: semiconductor substrate 12: active region
14: 소자 분리막 16: 게이트 산화막14: device isolation layer 16: gate oxide film
18: 게이트 폴리 실리콘 20: 베리어 메탈18: gate polysilicon 20: barrier metal
22: 게이트 텅스텐 24: 게이트 하드 마스크 질화막22: gate tungsten 24: gate hard mask nitride film
26: 캡핑 산화막 28: 질화막26: capping oxide film 28: nitride film
28a: 플로우팅 질화막 30: 캡핑 질화막28a: floating nitride film 30: capping nitride film
32: SOD 34: 선택 산화막32: SOD 34: Selective oxide film
Claims (7)
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| US11139197B2 (en) | 2019-11-11 | 2021-10-05 | Samsung Electronics Co., Ltd. | Method of fabricating semiconductor device |
| US11239311B2 (en) | 2019-10-24 | 2022-02-01 | Samsung Electronics Co., Ltd. | Semiconductor device and method of manufacturing the semiconductor device |
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| KR20040105038A (en) * | 2003-06-04 | 2004-12-14 | 삼성전자주식회사 | Local Interconnection structure for use in semiconductor device and method therefore |
| KR20050116490A (en) * | 2004-06-07 | 2005-12-13 | 주식회사 하이닉스반도체 | Forming method of contact plug in semiconductor device |
| KR20060010894A (en) * | 2004-07-29 | 2006-02-03 | 주식회사 하이닉스반도체 | Forming method of contact plug in semiconductor device |
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| KR20040105038A (en) * | 2003-06-04 | 2004-12-14 | 삼성전자주식회사 | Local Interconnection structure for use in semiconductor device and method therefore |
| KR20050116490A (en) * | 2004-06-07 | 2005-12-13 | 주식회사 하이닉스반도체 | Forming method of contact plug in semiconductor device |
| KR20060010894A (en) * | 2004-07-29 | 2006-02-03 | 주식회사 하이닉스반도체 | Forming method of contact plug in semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11239311B2 (en) | 2019-10-24 | 2022-02-01 | Samsung Electronics Co., Ltd. | Semiconductor device and method of manufacturing the semiconductor device |
| US11715760B2 (en) | 2019-10-24 | 2023-08-01 | Samsung Electronics Co., Ltd. | Semiconductor device |
| US11139197B2 (en) | 2019-11-11 | 2021-10-05 | Samsung Electronics Co., Ltd. | Method of fabricating semiconductor device |
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