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KR100856662B1 - method for forming metallic coating on plastic substrate - Google Patents

method for forming metallic coating on plastic substrate Download PDF

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KR100856662B1
KR100856662B1 KR1020050037738A KR20050037738A KR100856662B1 KR 100856662 B1 KR100856662 B1 KR 100856662B1 KR 1020050037738 A KR1020050037738 A KR 1020050037738A KR 20050037738 A KR20050037738 A KR 20050037738A KR 100856662 B1 KR100856662 B1 KR 100856662B1
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metal
coating layer
metal film
substrate
alloy
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KR1020050037738A
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Korean (ko)
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KR20060115270A (en
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우종구
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우종구
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06Metallic material
    • C23C4/08Metallic material containing only metal elements
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134Plasma spraying

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

본 발명은 플라스틱 기재상의 금속피막 형성방법에 관한 것으로, 성형된 플라스틱 기재(1)의 표면을 엠보싱 또는 블라스팅을 통하여 활성화처리하여 요철면(5)을 형성하고, 열피로강도와 젖음성이 큰 동(Cu) 합금, 알루미늄(Al) 합금 또는 니켈(Ni) 합금의 금속 분말을 상기 요철면(5)이 형성된 기재(1) 위에 용사하여 상기 금속 분말이 상기 요철면(5) 주위의 상기 기재(1) 내부로 침투하면서 금속 피막층(2)을 형성하며, 경우에 따라 상기 금속 피막층(2)위에 플라스틱 부품의 용도에 따라서 상부 피막층(4), 또는 상기 금속 피막층(2)과 상기 상부 피막층(4)사이에 본드 코팅층(3)이 부가 적층되는 것을 특징으로 한다.The present invention relates to a method for forming a metal film on a plastic substrate, wherein the surface of the molded plastic substrate (1) is activated through embossing or blasting to form the uneven surface (5), and the copper has high thermal fatigue strength and wettability. The metal powder of Cu) alloy, aluminum (Al) alloy or nickel (Ni) alloy was sprayed on the base material 1 on which the uneven surface 5 was formed so that the metal powder was formed on the base 1 around the uneven surface 5. The metal coating layer 2 is formed while penetrating into the inside, and in some cases, the upper coating layer 4, or the metal coating layer 2 and the upper coating layer 4, depending on the use of plastic parts on the metal coating layer 2). It is characterized in that the bond coating layer 3 is additionally laminated therebetween.

이러한 본 발명의 플라스틱 기재상의 금속피막 형성방법에 의하면 플라스틱 기재상의 금속 피막이 외력에 의하여서도 균열이나 박리되지 않아 내구도가 뛰어나며, 경량이면서도 금속부품보다 더 뛰어난 물성을 지닌 플라스틱 부품을 제조할 수 있다. According to the method for forming a metal film on the plastic substrate of the present invention, the metal film on the plastic substrate is not cracked or peeled off even by an external force, thereby providing excellent durability, and it is possible to produce a plastic part having a lighter weight and superior physical properties than a metal part.

플라스틱부품, thermal spraying, metal coating, 龜裂, 剝離 Plastic parts, thermal spraying, metal coating, 龜 裂, 剝離

Description

플라스틱 기재상의 금속피막 형성방법{method for forming metallic coating on plastic substrate}Method for forming metallic coating on plastic substrate

도 1은 본 발명에 의한 플라스틱 기재상의 금속피막 형성방법의 제1 구체례에 따라 제조된 플라스틱부재의 단면도,1 is a cross-sectional view of a plastic member manufactured according to the first embodiment of the method for forming a metal film on a plastic substrate according to the present invention;

도 2는 본 발명에 의한 플라스틱 기재상의 금속피막 형성방법의 제2 구체례에 따라 제조된 플라스틱부재의 단면도,2 is a cross-sectional view of a plastic member manufactured according to the second embodiment of the method for forming a metal film on the plastic substrate according to the present invention;

도 3은 본 발명에 의한 플라스틱 기재상의 금속피막 형성방법의 제3 구체례에 따라 제조된 플라스틱부재의 단면도,3 is a cross-sectional view of a plastic member manufactured according to the third embodiment of the method for forming a metal film on the plastic substrate according to the present invention;

도 4는 본 발명에 의한 플라스틱 기재상의 금속피막 형성방법의 제조과정을 나타내는 공정도.Figure 4 is a process chart showing the manufacturing process of the metal film forming method on a plastic substrate according to the present invention.

※도면의 주요부분에 대한 부호의 설명※ Explanation of symbols for main parts of drawing

1 : 기재(基材) 2 : 금속 피막층DESCRIPTION OF SYMBOLS 1 Base material 2 Metal film layer

3 : 본드 코팅층(bond coating layer)3: bond coating layer

4 : 상부 피막층 5 : 요철면(凹凸面)4: upper coating layer 5: uneven surface

본 발명은 플라스틱 기재상의 금속피막 형성방법에 관한 것으로, 보다 상세히 말하면 자동차, 조선 또는 전자 부품 및 기타 각종 용도의 부품과 건축 내·외장재용으로 적용될 수 있는 플라스틱제 부품의 물성을 보강하기 위하여 그 표면에 금속피막을 형성하는 방법에 대한 것이다.The present invention relates to a method of forming a metal film on a plastic substrate, and more particularly, to reinforce the physical properties of plastic parts that can be applied for automobile, shipbuilding or electronic parts and other various applications and building interior and exterior materials. It is about a method of forming a metal film in a.

최근에는 고 성능 플라스틱이 개발됨에 따라 기존의 금속으로 제조되고 있던 많은 기계부품들이 저 중량의 플라스틱제품으로 대체되고 있다. 그 일례로, 요즈음 전 세계적으로 집중적인 관심을 받고 있는 하이브리드 차량의 경우 자동차 전체의 무게를 줄여야 하므로 엔진 밸브의 커버 등 관련 부품은 일반 차량과는 달리 경량의 플라스틱제 부품이 주로 적용되고 있다.Recently, with the development of high-performance plastics, many mechanical parts that have been made of existing metals have been replaced by low-weight plastic products. For example, in the case of a hybrid vehicle that has received a lot of attention around the world these days, the weight of the entire vehicle needs to be reduced, so that related parts such as the engine valve cover are mainly made of lightweight plastic parts, unlike general vehicles.

플라스틱제 부품은 금속제 부품보다 경량이고 표면이 미려하며 저렴한 큰 장점은 있으나, 아직까지는 기계적 강도, 내마모성, 경도, 내한성 및 내열성에 있어 금속제 부품보다 취약하며 경시변화에 의한 후변형(後變形)이 발생하고 있어서 적어도 금속과 대등하거나 그를 능가하는 물성은 얻을 수 없었다.Plastic parts are lighter, more beautiful and cheaper than metal parts, but are still weaker than metal parts in mechanical strength, abrasion resistance, hardness, cold resistance and heat resistance, resulting in post-deformation due to changes over time. At least the physical properties equivalent to or surpassing those of the metal could not be obtained.

플라스틱제 부품의 물성을 보완하기 위한 한 수단으로서, 플라스틱 성형체의 표면에 금속피막 또는 세라믹피막을 형성하여 제품의 질과 내구성을 높이고자 하는 방안이 제시되고 있다. As a means for compensating the physical properties of plastic parts, a method of improving the quality and durability of a product by forming a metal film or ceramic film on the surface of the plastic molded body has been proposed.

지금까지 개발된 플라스틱 성형체의 표면 처리방법으로는 도금이나 물리진공증착, 화학진공증착, 이온투입법 등과 같은 표면 개질 또는 표면 기능화 방법에 의하여 금속 피막을 입히고 있다.As a surface treatment method of the plastic molded body developed so far, metal coating is applied by surface modification or surface functionalization methods such as plating, physical vacuum deposition, chemical vacuum deposition, ion implantation, and the like.

이들 방법에 의하면 플라스틱제 부품의 취약점을 상당히 보강할 수 있었다. 그러나 금속피막은 플라스틱표면에 대한 밀착력이 매우 저조하고 외력에 의해 쉽게 박리되는 단점이 있고, 또 피착물의 선택폭이 좁고 다양한 용도에 맞추어 피막의 두께를 자유자재로 형성할 수는 없었다.According to these methods, the weaknesses of plastic parts can be greatly strengthened. However, the metal film has a disadvantage in that the adhesion to the plastic surface is very low and easily peeled off by external force, and the choice of the deposit is narrow and the thickness of the film cannot be freely formed for various applications.

그래서 플라스틱 기재의 표면에 대한 금속피막의 밀착도를 높이기 위하여 기재표면의 조면화(組面化), 부식화(腐食)화 또는 활성화를 통하여 사전에 기재 표면을 처리한 다음 세라믹분말을 합성수지접착제에 혼입한 재료를 도포하여 중간층을 형성하고 그 위에 금속분말을 용사(熔射)하여 피막층을 형성하는 방안이 제시되고 있다. 이런 방법은 기재와 용사피막과의 밀착력은 향상되지만 용사피막 내에 잔류 응력이 생기고 피막내부에 산화물층이 존재하므로 용사피막 자체의 강도 등의 물성이 저하되어서 내마모성 등 표면개질 효과가 오히려 떨어지는 문제가 있었으며, 또 세라믹분말과 수지 접착제와의 혼합재료를 도포하여 중간층을 형성하는 경우 그 혼합재료의 점도는 대단히 높으므로 기재의 표면에 균일하며 얇게 도포하는 것이 곤란하고, 산업화할 경우 설비 투자비용이 너무 큰 단점이 있었고, 도포작업은 대부분의 경우 수작업에 의존하게 되므로 작업자의 숙련도에 따라 제품의 오차가 크고 작업능률이 저조하였으며, 게다가 피용사재료가 고온으로 되어 혼합재료 중 수지 접착제가 열분해하기 때문에 목적으로 하는 재료의 용사층 형성이 어려웠다. Therefore, in order to increase the adhesion of the metal film to the surface of the plastic substrate, the surface of the substrate is treated in advance by roughening, corroding, or activating the surface of the substrate, and then mixing the ceramic powder into the synthetic resin adhesive. A method of applying an material to form an intermediate layer and spraying metal powder thereon to form a coating layer has been proposed. In this method, adhesion between the substrate and the thermal spray coating is improved, but residual stress is generated in the thermal spray coating and an oxide layer exists in the coating, so that physical properties such as strength of the thermal spray coating itself are lowered, resulting in a decrease in surface modification effects such as wear resistance. In addition, when the intermediate layer is formed by applying the mixed material of the ceramic powder and the resin adhesive, the viscosity of the mixed material is very high, so that it is difficult to apply it uniformly and thinly on the surface of the substrate. In most cases, the coating work is dependent on manual work, so the error of the product is large and the work efficiency is low according to the skill of the operator. In addition, the resin adhesive is thermally decomposed in the mixed material due to the high temperature of the sprayed material. It was difficult to form the sprayed layer of the material.

이러한 문제점을 해결하기 위하여 일본 특개평 4-47932호에 의하면 금속피막의 밀착도를 높이고 균일한 피막층을 얻기 위하여 기재인 합성수지 성형품의 표면에 저 융점의 연성(延性)이 풍부한 금속, 동(銅), 철, 알루미늄 또는 이들의 합금 을 먼저 용사한 후 그 위에 원하는 금속분말을 재차 용사하여 금속피막을 형성하는 방법이 제안되었다.In order to solve this problem, Japanese Patent Laid-Open No. 4-47932 discloses metals, copper, and metals having low melting point ductility on the surface of a synthetic resin molded article as a base material in order to increase the adhesion of the metal film and to obtain a uniform film layer. A method of forming a metal film by spraying iron, aluminum, or an alloy thereof first and then spraying the desired metal powder on it has been proposed.

그러나 이 방법에 의하더라도 플라스틱 제품의 표면 개질은 가능하나 플라스틱과 금속간의 접합력이 상당히 낮고 사용도중 균열이 발생하며, 또 두꺼운 피복층 형성은 불가능하므로 두껍게 피복되어야 하는 용도로는 적용할 수 없었고 또 금속피막의 형성 공정이 매우 복잡하고 제품단가가 고가로 되는 문제가 있었다. However, even with this method, it is possible to modify the surface of plastic products, but the bonding strength between plastic and metal is very low, cracks occur during use, and thick coating layer cannot be formed. There was a problem that the formation process of is very complicated and the product cost is expensive.

본 발명은 단가가 저렴하고 경량인 플라스틱 부품의 고유 물성을 최대한 발휘하되 금속에 비해 취약한 물성을 보강하여 고 중량의 금속 부품을 대체할 수 있는 금속 피막의 플라스틱 제품을 제공하고자 의도된 것으로, 본 발명에서는 이러한 목적을 달성하기 위하여 플라스틱 기재의 표면과 금속피막층사이의 접합력을 강화시키고 용융시 표면장력이 작아서 기재의 표면에 고르게 퍼질 수 있는 특수 합금을 사용하여 고온의 열원으로 용융시키면서 플라스틱 기재의 표면에 고속 분사함으로써 금속 분말이 플라스틱 기재에 충돌되면서 기재의 표면을 파고 들어가서 피막을 형성하므로 밀착도가 매우 우수하여 금속과 플라스틱이라는 재질의 상이에 따른 수축률의 차이에도 불구하고 박리현상이 없는 금속 피막을 형성할 수 있어서 금속의 물성을 능가하는 플라스틱부품을 제조할 수 있게 되었다. The present invention is intended to provide a plastic film of a metal film that can replace the high-weight metal parts by exhibiting the inherent physical properties of the plastic parts inexpensive and lightweight, but reinforces the weak physical properties compared to the metal, In order to achieve this purpose, in order to achieve the above purpose, it is possible to strengthen the bonding force between the surface of the plastic substrate and the metal film layer and to melt the surface of the plastic substrate by using a special alloy that has a small surface tension at the time of melting so that it can be spread evenly on the surface of the substrate. By spraying at high speed, the metal powder collides with the plastic substrate to dig into the surface of the substrate to form a coating. Therefore, the adhesion is very good, so that a metal coating without peeling phenomenon can be formed in spite of the difference in shrinkage rate due to the difference between the metal and plastic materials. Can surpass the properties of metals Has been able to manufacture plastic parts.

본 발명에 따른 플라스틱 기재상의 금속피막 형성방법은, Method for forming a metal film on a plastic substrate according to the present invention,

성형된 플라스틱 기재의 표면을 엠보싱(embossing) 또는 블라스팅(blasting) 을 통하여 활성화처리하여 요철면을 형성하고, 열피로강도와 젖음성이 큰 동(Cu) 합금, 알루미늄(Al) 합금 또는 니켈(Ni) 합금을 상기 요철면이 구비된 기재위에 용사하여 상기 합금의 용융금속분말이 기재에 침투하면서 금속 피막층을 형성하는 것을 특징으로 한다.The surface of the molded plastic substrate is activated by embossing or blasting to form an uneven surface, and a copper alloy, aluminum alloy, or nickel (Ni) having high thermal fatigue strength and wettability. The alloy is sprayed on a substrate provided with the uneven surface to form a metal coating layer while the molten metal powder of the alloy penetrates into the substrate.

또한 플라스틱 부품의 용도에 따라서 상기 금속 피막층위에 상부 피막층이 더 이루어질 수 있으며, 상기 금속 피막층과 상부 피막층 사이에 이들 양 층의 접합력을 향상시킬 수 있는 재료의 본드 코팅층이 추가적으로 부가될 수 있다. In addition, an upper coating layer may be further formed on the metal coating layer according to the use of the plastic part, and a bond coating layer of a material capable of improving the bonding strength between the metal coating layer and the upper coating layer may be additionally added.

상기 금속 피막층은 50~100m/sec 유속으로 분출되는 2500~3500K의 가스열원 하에서 또는 150~300m/sec 유속으로 분출되는 10000~15000K의 플라즈마 열원 하에서, 열피로강도와 젖음성이 큰 동(Cu) 합금, 니켈(Ni) 합금 또는 알루미늄(Al) 합금분말이 용사되어 형성된 다음, 통상의 저온 열처리되는 어닐링공정(annealing)을 거친 후 마무리 연마공정을 통하여 완성된다. The metal coating layer is a copper alloy having high thermal fatigue strength and high wettability under a gas heat source of 2500 to 3500K sprayed at a flow rate of 50 to 100 m / sec or a plasma heat source of 10000 to 15000K sprayed at a flow rate of 150 to 300 m / sec. After the nickel (Ni) alloy or aluminum (Al) alloy powder is formed by thermal spraying, and then subjected to a general annealing process (annealing) to a low temperature heat treatment is completed through a finish polishing process.

상기 활성화공정에서의 블라스팅은 SiC 또는 Al2O3의 미소한 입자를 고속으로 기재표면에 충돌시켜 그 표면에 요철면을 형성하는 것으로, 상기 블라스팅재의 입자직경이 #60미만이면 블라스팅 효과는 크게 되나 표면 요철의 간격이 커지고 국소적으로 깊게 패어지는 경향이 있어서, 금속 피막층에 효과적인 응력을 부여할 수 없고 또 #120을 상회하면 미세한 요철을 형성하고 단위시간당 보다 큰 면적을 거칠게 할 수 있으나, 요철이 균일하지 않고 전체적인 미세한 요철로 인하여 다음 금속 용사 재료와의 접합력이 저하되어 박리되는 경향이 있다.The blasting in the activation process is to form a concave-convex surface on the surface by colliding the fine particles of SiC or Al 2 O 3 to the substrate surface at high speed, the blasting effect is large if the particle diameter of the blasting material is less than # 60 The gap between the surface irregularities tends to be large and localized deeply, so that an effective stress cannot be imparted to the metal coating layer, and when it exceeds # 120, fine irregularities can be formed and a larger area per unit time can be obtained. Due to the non-uniformity and overall fine irregularities, the bonding force with the next metal-spray material is lowered and tends to peel off.

상기 큰 열피로강도와 큰 젖음성의 동(Cu) 합금으로는 Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn, Cu-Ti 등을 들 수 있으며, 니켈(Ni) 합금으로는 Ni-Cr 을, 또 알루미늄(Al) 합금으로는 Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, Al-Zr 등을 각각 들 수 있다. 이들 합금 분말은 용융시 표면장력이 작아서 플라스틱의 기재 상에 취부(吹付)될 경우 고르게 퍼져 균일한 피막을 형성하므로 마무리 완성된 후 피막의 균열은 없다.Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn, Cu-Ti, etc. may be used as the copper alloy having a high thermal fatigue strength and a large wettability. Ni-Cr as nickel (Ni) alloy, Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, Al-Zr Can be. These alloy powders have a small surface tension at the time of melting, so that when they are mounted on a plastic substrate, they spread evenly to form a uniform coating, so there is no cracking of the coating after finishing.

즉, 본 발명에 따르는 플라스틱 기재상의 금속피막 형성방법을 첨부된 도면을 참조하여 기술하면 다음과 같다.That is, with reference to the accompanying drawings, a metal film forming method on a plastic substrate according to the present invention will be described.

도 1 및 도 4에 나타난 바와 같이, 플라스틱 부품의 기재(1)를 성형하고(a 공정), 그 성형된 기재(1)의 표면에 먼저 엠보싱공정 또는 #60-120의 SiC 또는 Al2O3의 미소한 입자를 공기 분사하여 상기 기재의 표면에 충돌시켜 요철을 주는 블라스팅 공정을 통하여 평균 조도(粗度) 2.5-13㎛의 요철면(5)을 형성한다(b 공정). 이러한 활성화공정을 통하여 다수의 요철이 있는 요철면(5)을 형성함으로써 이들이 앵커(anchor) 작용을 하여 후속 금속 피막층(2)과 기재(1)와의 결속력을 강화시킨다. 상기 평균 조도가 2.5㎛미만이면 요철이 너무 미세하여 금속 피막층(2)과의 접합력이 떨어지며, 13㎛를 넘으면 국소적으로 요철이 깊게 형성되므로 기재(1)에 효과적인 응력을 부여할 수 없다.1 and 4, the substrate 1 of the plastic part is molded (step a), and the surface of the molded substrate 1 is first embossed or SiC or Al 2 O 3 of # 60-120. Air is blown through the fine particles to form the uneven surface 5 having an average roughness of 2.5-13 μm through a blasting process of imparting unevenness (step b). By forming the uneven surface 5 with a plurality of irregularities through this activation process, they act as anchors to strengthen the binding force between the subsequent metal film layer 2 and the substrate 1. If the average roughness is less than 2.5 mu m, the unevenness is too fine, and the bonding strength with the metal film layer 2 falls, and if the average roughness exceeds 13 mu m, the unevenness is deeply formed locally, so that the stress on the substrate 1 cannot be effectively applied.

그런 다음, 상기 요철면(5) 위에 열피로강도와 젖음성이 큰 동 합금, 알루미늄 합금 또는 니켈 합금을 용사하여 금속 피막층(2)을 형성한다(c 공정). 상기 금속 피막층(2)은 50~100m/sec 유속으로 분출되는 2500~3500K의 가스열원 하에서 또는 150~300m/sec 유속으로 분출되는 10000~15000K의 플라즈마 열원 하에서, 상기한 열피로강도와 젖음성이 큰 동(Cu) 합금, 니켈(Ni) 합금 또는 알루미늄(Al) 합금의 금속분말을 대기 플라즈마 용사법 또는 화염 용사법에 의하여 용사시킴으로써 상기 금속분말이 상기 요철면(5) 주위에 침투되면서 적층되고, 용사피막두께는 100-1000㎛정도로 형성된다. Then, the metal coating layer 2 is formed by thermally spraying copper alloy, aluminum alloy or nickel alloy having high thermal fatigue strength and wettability on the uneven surface 5 (step c). The metal film layer 2 has a high thermal fatigue strength and wettability under a gas heat source of 2500 to 3500K sprayed at a flow rate of 50 to 100m / sec or a plasma heat source of 10000 to 15000K sprayed at a flow rate of 150 to 300m / sec. By spraying a metal powder of a copper (Cu) alloy, a nickel (Ni) alloy or an aluminum (Al) alloy by an atmospheric plasma spray method or a flame spray method, the metal powder is laminated while being infiltrated around the uneven surface 5, and a thermal spray coating The thickness is formed to about 100-1000㎛.

또한 본 발명에 의한 플라스틱 기재상의 금속 피막 형성방법에 따르면 도 2에서와 같이 플라스틱 부재의 용도에 따라 특수 성능을 갖는 재료, 예컨대 금속 합금 또는 세라믹 분말을 대기 플라즈마 용사법에 의하여 100-1000㎛ 두께의 상부 피막층(4)을 형성하며(e 공정), 이 때 경우에 따라 도 3에서와 같이 상기 c공정에서의 1차적인 금속 피막층(2)과 e공정의 상부 피막층(4) 사이에 이들을 결합강도를 보다 높여주기 위한 본드 코팅층(3)이 100-200㎛정도의 두께로 상기 상부 피막층(4)의 형성 전에 형성될 수도 있다(d 공정). 본드 코팅층(3)은 상기 금속 피막층(2)과 후속의 상부 피막층(4)을 고려하여 이들 간에 접합강도가 큰 재료를 플라즈마 용사법으로 용사함으로써 형성된다. In addition, according to the method for forming a metal film on a plastic substrate according to the present invention, as shown in FIG. 2, a material having a special performance, for example, a metal alloy or a ceramic powder, may be 100-1000 μm thick by atmospheric plasma spraying as shown in FIG. 2. The coating layer 4 is formed (step e), and in some cases, as shown in FIG. 3, the bonding strength is formed between the primary metal coating layer 2 in the step c and the upper coating layer 4 in the step e. Bond coating layer 3 to further increase may be formed before the formation of the upper coating layer 4 to a thickness of about 100-200㎛ (d process). The bond coating layer 3 is formed by thermally spraying a material having a large bonding strength therebetween in consideration of the metal coating layer 2 and the subsequent upper coating layer 4.

이후 금속 피막층(2)단독 또는 금속 피막층(2)과 상부피막층(4), 또는 이들 모두와 함께 본드코팅층(3)이 형성된 상기 플라스틱 기재(1)는 저온 열처리공정을 통하여 냉각되며 그런 다음 원하는 형상으로 연마됨으로써 완성된다(f 공정). After that, the plastic substrate 1 having the metal coating layer 2 alone or the metal coating layer 2 and the upper coating layer 4, or both, together with the bond coating layer 3 formed thereon, is cooled through a low temperature heat treatment process and then a desired shape. It is completed by grinding | polishing by (f process).

이와 같은 공정을 통하여 형성된 본 발명에 의한 플라스틱 기재상의 금속피막은 화염 상태의 금속 분말이 플라스틱 기재(1) 표면의 요철면(5) 주위에 충돌되어 부착되고 적층됨으로써 금속 피막층(2)을 형성하므로 금속 피막층(2)의 박리나 균열은 없으며, 나아가 상부 피막층(4) 역시 금속 피막층(2)에 확고하게 결착되어 있으므로 외력을 가하더라도 박리나 균열은 생기지 않는다. The metal film on the plastic base material according to the present invention formed through such a process forms a metal film layer 2 by the metal powder in the state of flame collided and deposited around the uneven surface 5 on the surface of the plastic base material 1. There is no peeling or cracking of the metal film layer 2, and furthermore, since the upper film layer 4 is also firmly bound to the metal film layer 2, no peeling or cracking occurs even when an external force is applied.

본 발명에 의한 플라스틱 기재상의 금속 피막 형성방법의 특징을 보다 용이 하게 이해할 수 있도록 다음에 실시례를 들어 설명하나, 이 실시례들은 단지 본 발명의 이해를 돕기 위한 것일 뿐 본 발명의 정신 및 특허청구의 범위에 기재된 범위 내에서 그 변형 및 정정이 가능함은 당업계에 숙지된 자라면 금방 이해할 수 있을 것이다. In order to more easily understand the characteristics of the method for forming a metal film on the plastic substrate according to the present invention will be described by the following examples, these examples are only for the understanding of the present invention and the claims of the present invention It will be readily understood by those skilled in the art that modifications and variations are possible within the scope of the present invention.

실시례 1Example 1

자동차 엔진 밸브 커버를 플라스틱으로 성형하고, 이 플라스틱 부품 기재의 표면에 먼저 엠보싱공정을 통하여 평균 조도 3.5㎛의 요철면을 형성하고, 그 표면위에 볼밀(ball mill)법을 통하여 기계적 합금화된 Cu-Mn-Sn합금을 50m/sec 유속으로 분출되는 3500K의 가스열원 하에서 용사하여 800㎛ 두께의 금속 피막층을 형성하였다. 그 후 낮은 온도에서 열처리하고 필요한 연마처리를 완료하였다.Automobile engine valve cover is molded from plastic, and the surface of this plastic part base is first formed with an uneven surface having an average roughness of 3.5 μm through an embossing process, and then mechanically alloyed Cu-Mn on the surface by a ball mill method. The -Sn alloy was thermally sprayed under a 3500 K gas heat source ejected at a flow rate of 50 m / sec to form an 800 µm thick metal film layer. It was then heat treated at low temperature to complete the required polishing treatment.

이와 같은 처리에 의하여 형성된 자동차 엔진 밸브 커버는 경량이면서도 표면 경도, 강도, 내식성 등 그 부품에 요구되는 물성이 우수하였으며, 외력을 가하여도 그 표면의 금속 피막층이 균열됨이 없이 내구도가 뛰어났다.The automobile engine valve cover formed by such a treatment was lightweight and had excellent physical properties required for the parts such as surface hardness, strength and corrosion resistance, and excellent durability without cracking the metal coating layer on the surface even when external force was applied.

실시례 2Example 2

실시례 1에서와 동일하게 기재의 표면에 금속 피막층을 형성한 다음, 또 세라믹 분말을 볼밀법을 통하여 미세하게 균일하게 혼합하여 대기 플라즈마 용사법에 의하여 500㎛ 두께의 상부 피막층 A를 형성하였다. A metal coating layer was formed on the surface of the substrate as in Example 1, and then ceramic powder was finely and uniformly mixed through a ball mill method to form an upper coating layer A having a thickness of 500 μm by atmospheric plasma spraying.

한편, 상기와는 달리 금속 피막층을 형성한 후, 상부 피막층을 형성하기 앞서, 상기 금속 피막층위에 플라즈마 용사법에 의하여 200㎛ 두께의 알루미늄금속을 피복하여 본드 코팅층을 먼저 형성하였다. 그런 다음 상기 상부 피막층 A와 동일한 상부 피막층 B를 형성하였다. On the other hand, unlike the above, after forming the metal coating layer, prior to forming the upper coating layer, by coating the aluminum metal having a thickness of 200㎛ on the metal coating layer by a plasma spray method, a bond coating layer was first formed. Then, the same upper coating layer B as the upper coating layer A was formed.

상부 피막층 A와 상부 피막층 B가 각기 형성된 플라스틱 기재를 상기 실시례 1에서와 동일하게 열처리 및 연마처리를 하여 자동차 엔진 밸브 커버를 형성하였다.The plastic substrate on which the upper coating layer A and the upper coating layer B were formed, respectively, was heat treated and polished in the same manner as in Example 1 to form an automobile engine valve cover.

상부 피막층 A와 상부 피막층 B의 완성된 플라스틱 부품은 상기 실시례1에서와 동일한 조건하에서 물성을 측정하였으며 그 결과 실시례 1에서와 거의 같은 물성을 나타내었다. 플라스틱 기재 상의 피막층의 결착력은 둘 다 상당히 우수하였고, 특히 상부 피막층 B의 경우 보다 더 우수한 결착력을 보였다. 그리고 강도 및 열변형에 있어서도 둘 다 실시례 1에서 보다 더 우수한 결과를 나타내었다.The finished plastic parts of the upper coating layer A and the upper coating layer B were measured for physical properties under the same conditions as in Example 1, and as a result, they showed almost the same physical properties as in Example 1. The binding of the coating layer on the plastic substrate was both quite good, in particular better than that of the upper coating layer B. And both in strength and heat deformation showed better results than in Example 1.

그리고 상부 피막층 A와 상부 피막층 B를 구비하는 플라스틱 부품 각각은 실시례 1에서와는 달리 상부 피막층이 더 적층되었는데도 불구하고 외력에 의한 상부 피막층의 균열이나 박리현상을 볼 수 없었다. In addition, in each of the plastic parts having the upper coating layer A and the upper coating layer B, although the upper coating layer was further laminated, unlike in Example 1, no cracking or peeling of the upper coating layer due to external force was observed.

이상과 같은 구성의 본 발명에 의한 플라스틱 기재상의 금속피막 형성방법에 의하면 금속피막과 기재와의 밀착력 및 금속피막의 두께를 자유 자재로이 적절히 형성할 수 있고 또 금속 피막 자체의 특성이 우수하여 충분한 표면개질효과를 발휘할 수 있다. According to the method for forming a metal film on a plastic substrate according to the present invention having the above-described configuration, the adhesion between the metal film and the substrate and the thickness of the metal film can be freely formed appropriately and the surface of the metal film itself is excellent. Modification effect can be exerted.

즉 본 발명에 의하면 플라스틱 기재의 표면에 용융 금속분말이 침투하면서 고르게 퍼져 금속 피막이 형성되므로 밀착도가 매우 우수하고 금속과 플라스틱이라는 재질의 상이함에도 불구하고 박리현상이 없는 금속 피막을 형성할 수 있어서, 간단한 투자 설비에 의하여서도 기계적 강도, 내마모성, 경도, 내한성 및 내열성이 뛰어나서 금속의 물성을 능가하는 플라스틱부품을 제조할 수 있다. That is, according to the present invention, since the molten metal powder penetrates into the surface of the plastic substrate and spreads evenly to form a metal film, it is possible to form a metal film having excellent adhesion and no peeling phenomenon in spite of the difference between metal and plastic. Even investment facilities can produce plastic parts that have excellent mechanical strength, abrasion resistance, hardness, cold resistance and heat resistance, which surpass the properties of metals.

따라서, 본 발명의 플라스틱 기재상의 금속피막 형성방법에 의하면 제품단가가 저렴하게 되며 자동화가 가능하여 품질적으로 안정되고, 작업능률도 우수하여 다용도의 플라스틱 부품을 제조할 수 있다. Therefore, according to the method for forming a metal film on the plastic substrate of the present invention, the product cost is low, the automation is possible, the quality is stable, and the work efficiency is excellent, thereby making it possible to manufacture a multipurpose plastic part.

Claims (8)

성형된 플라스틱 기재(1)의 표면을 엠보싱 또는 블라스팅을 통하여 활성화처리하여 상기 기재(1)의 표면에 요철면(5)을 형성하고, 열피로강도와 젖음성이 큰 동(Cu) 합금, 알루미늄(Al) 합금 또는 니켈(Ni) 합금의 금속 분말을 상기 요철면(5)이 형성된 기재(1) 위에 용사하여 상기 금속 분말이 용융되어 상기 요철면(5) 주위의 상기 기재(1) 내부로 침투하면서 상기 기재(1)상에 금속 피막층(2)을 형성하는 플라스틱 기재상의 금속 피막 형성방법에 있어서,The surface of the molded plastic substrate 1 is activated by embossing or blasting to form the uneven surface 5 on the surface of the substrate 1, and has a high thermal fatigue strength and wettability. Metal powder of Al) alloy or nickel (Ni) alloy is sprayed on the base 1 having the uneven surface 5 to melt the metal powder and penetrate into the base 1 around the uneven surface 5. In the metal film forming method on a plastic substrate while forming a metal film layer (2) on the substrate 1, 상기 큰 열피로강도와 큰 젖음성의 동(Cu), 니켈(Ni) 또는 알루미늄(Al) 합금이 Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn, Cu-Ti, Ni-Cr, Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, 또는 Al-Zr 중 어느 하나이며;The large thermal fatigue strength and high wettability of copper (Cu), nickel (Ni) or aluminum (Al) alloys are Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn , Cu-Ti, Ni-Cr, Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, or Al-Zr; 상기 기재(1)상의 요철면(5)의 평균 조도가 2.5-13㎛가 되며; The average roughness of the uneven surface 5 on the base material 1 is 2.5-13 µm; 상기 금속 피막층(2) 위에 플라스틱 부품의 용도에 맞추어 상부 피막층(4)이 더 적층되며;An upper coating layer 4 is further laminated on the metal coating layer 2 in accordance with the use of plastic parts; 상기 기재(1)의 활성화처리에서의 블라스팅이 SiC 또는 Al2O3의 #60-120굵기의 미소한 입자에 의해 이루어지며;Blasting in the activation treatment of the substrate (1) is made of microparticles having a thickness of 60-120 of SiC or Al 2 O 3 ; 상기 금속 피막층(2)을 형성하는 상기 합금의 금속분말이 50~100m/sec 유속으로 분출되는 2500~3500K의 가스열원하에서 용사되는 것을 특징으로 하는 플라스틱 기재상의 금속피막 형성방법.A method of forming a metal film on a plastic substrate, characterized in that the metal powder of the alloy forming the metal film layer (2) is sprayed under a gas heat source of 2500 to 3500 K which is ejected at a flow rate of 50 to 100 m / sec. 삭제delete 삭제delete 삭제delete 삭제delete 성형된 플라스틱 기재(1)의 표면을 엠보싱 또는 블라스팅을 통하여 활성화처리하여 상기 기재(1)의 표면에 요철면(5)을 형성하고, 열피로강도와 젖음성이 큰 동(Cu) 합금, 알루미늄(Al) 합금 또는 니켈(Ni) 합금의 금속 분말을 상기 요철면(5)이 형성된 기재(1) 위에 용사하여 상기 금속 분말이 용융되어 상기 요철면(5) 주위의 상기 기재(1) 내부로 침투하면서 상기 기재(1)상에 금속 피막층(2)을 형성하는 플라스틱 기재상의 금속 피막 형성방법에 있어서,The surface of the molded plastic substrate 1 is activated by embossing or blasting to form the uneven surface 5 on the surface of the substrate 1, and has a high thermal fatigue strength and wettability. Metal powder of Al) alloy or nickel (Ni) alloy is sprayed on the base 1 having the uneven surface 5 to melt the metal powder and penetrate into the base 1 around the uneven surface 5. In the metal film forming method on a plastic substrate while forming a metal film layer (2) on the substrate 1, 상기 큰 열피로강도와 큰 젖음성의 동(Cu), 니켈(Ni) 또는 알루미늄(Al) 합금이 Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn, Cu-Ti, Ni-Cr, Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, 또는 Al-Zr 중 어느 하나이며;The large thermal fatigue strength and high wettability of copper (Cu), nickel (Ni) or aluminum (Al) alloys are Cu-Zn, Cu-Sn, Cu-Zn-Sn, Cu-Zn-Ni, Cu-Mn-Sn , Cu-Ti, Ni-Cr, Al-Cu-Si, Al-Cr-Ti, Al-Si, Al-Mn-Zn, or Al-Zr; 상기 기재(1)상의 요철면(5)의 평균 조도가 2.5-13㎛가 되며; The average roughness of the uneven surface 5 on the base material 1 is 2.5-13 µm; 상기 금속 피막층(2) 위에 플라스틱 부품의 용도에 맞추어 상부 피막층(4)이 더 적층되며;An upper coating layer 4 is further laminated on the metal coating layer 2 in accordance with the use of plastic parts; 상기 기재(1)의 활성화처리에서의 블라스팅이 SiC 또는 Al2O3의 #60-120굵기의 미소한 입자에 의해 이루어지며;Blasting in the activation treatment of the substrate (1) is made of microparticles having a thickness of 60-120 of SiC or Al 2 O 3 ; 상기 금속 피막층(2)을 형성하는 상기 합금의 금속분말이 50~100m/sec 유속으로 분출되는 10000~15000K의 플라즈마 열원 하에서 용사되는 것을 특징으로 하는 플라스틱 기재상의 금속피막 형성방법.A method of forming a metal film on a plastic substrate, characterized in that the metal powder of the alloy forming the metal film layer (2) is sprayed under a plasma heat source of 10000 to 15000 K which is ejected at a flow rate of 50 to 100 m / sec. 삭제delete 삭제delete
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JPH02294484A (en) * 1989-05-10 1990-12-05 Dai Ichi High Frequency Co Ltd Metallic coating method for organic material
JPH0447932A (en) * 1990-06-15 1992-02-18 Nippon Steel Corp Production of thermal spraying member based on synthetic resin material
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KR19990018898A (en) * 1997-08-28 1999-03-15 신현준 Electromagnetic shielding coating method
KR20000000794A (en) * 1998-06-03 2000-01-15 황해웅 Plastic dry plating method of improved adhesion between metal and ceramic thin film
JP2004143573A (en) 2002-10-25 2004-05-20 Masakatsu Yanagida Method for treating thermally sprayed metallic film on surface of non-metal formed body

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JPS59199725A (en) * 1983-04-28 1984-11-12 Dainippon Ink & Chem Inc Production of composite molded article
JPH02294484A (en) * 1989-05-10 1990-12-05 Dai Ichi High Frequency Co Ltd Metallic coating method for organic material
JPH0447932A (en) * 1990-06-15 1992-02-18 Nippon Steel Corp Production of thermal spraying member based on synthetic resin material
JPH07197276A (en) * 1993-12-28 1995-08-01 Fujikura Ltd Wear resistant lightweight member and its production
KR19990018898A (en) * 1997-08-28 1999-03-15 신현준 Electromagnetic shielding coating method
KR20000000794A (en) * 1998-06-03 2000-01-15 황해웅 Plastic dry plating method of improved adhesion between metal and ceramic thin film
JP2004143573A (en) 2002-10-25 2004-05-20 Masakatsu Yanagida Method for treating thermally sprayed metallic film on surface of non-metal formed body

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018124738A1 (en) * 2015-12-28 2018-07-05 아이원스 주식회사 Composite structure, and method for forming same

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