KR100805477B1 - Liquid crystal device, electro-optical device, projector and micro device - Google Patents

Abstract

The present invention provides a liquid crystal device, comprising: a first substrate, a second substrate facing the first substrate, a liquid crystal layer interposed between the first substrate and the second substrate, and the first substrate and the second substrate. A sealing material for sealing the liquid crystal layer, a molding material covering the outer circumferential side of the sealing material and provided between the first substrate and the second substrate, and the at least one substrate of the first substrate and the second substrate. It has a 1st uneven part formed in the whole area | region where a molding material is arrange | positioned, and the said molding material is provided on the said 1st uneven part.

Description

Liquid crystal devices, electro-optical devices, projectors and microdevices {LIQUID CRYSTAL DEVICE, ELECTRO-OPTICAL DEVICE, PROJECTOR AND MICRO DEVICE}

1 (a) is a plan view of the liquid crystal device of Example 1, and FIG. 1 (b) is a sectional side view of the liquid crystal device of Example 1,

2 is an equivalent circuit diagram of the liquid crystal device of Example 1;

3 is a view for explaining the planar structure of the liquid crystal device of Example 1;

4 is a cross-sectional view of the liquid crystal device according to the arrow C-C in FIG.

5 is a side cross-sectional view of an opposing substrate on which an inorganic alignment film is formed;

6 is an enlarged explanatory diagram of a molding structure;

7 (a) and 7 (b) are diagrams showing a modification 1 of the liquid crystal device in Example 1,

8 (a) is a diagram showing a modification 2 of the liquid crystal device in Example 1, and FIG. 8 (b) is a diagram showing a modification 3 of the liquid crystal device in Example 1;

9 is a diagram showing a liquid crystal device in Example 2,

10 is a diagram illustrating a modification of the liquid crystal device in Example 2;

11 shows an embodiment of an electrophoretic device,

12 is a diagram showing an embodiment of an organic EL device;

13 is a diagram showing an embodiment of a projector;

14 illustrates an embodiment of a micro device,

FIG. 15 is a diagram showing a schematic cross-sectional structure of the optical modulation device shown in FIG. 14.

Explanation of symbols for the main parts of the drawings

10 TFT array substrate (first substrate) 14 sealing material

19: connecting terminal 20: opposing substrate (second substrate)

30: molding material 40, 41: uneven portion

50: liquid crystal layer 60: liquid crystal device

The present invention relates to a liquid crystal device, an electro-optical device, a projector and a micro device.

Background Art Conventionally, liquid crystal devices have been used as light modulation means of projection display devices such as liquid crystal projectors.

In a liquid crystal device, a sealing material is arrange | positioned at the outer peripheral edge part of a board | substrate between a pair of board | substrates, and a liquid crystal layer is injected-sealed at the center part, and is comprised.

An electrode for applying a voltage to the liquid crystal layer is formed inside the pair of substrates, and an alignment film for controlling the orientation of the liquid crystal molecules when an unselected voltage is applied is formed inside the electrode.

The light from the light source is modulated on the basis of the change in the orientation of the liquid crystal molecules at the time of application of the non-selection voltage and the application of the selection voltage, thereby producing image light.

As disclosed in Japanese Laid-Open Patent Publication No. 2001-221998, for example, an adhesive layer (molding material) made of epoxy is formed so as to cover the circumference of the sealing material, and the bonding layer increases the bonding between the pair of substrates, Liquid crystal devices for improving mechanical strength are known.

By the way, generally, when moisture mixes inside a liquid crystal device, display characteristics will fall and reliability as a liquid crystal device will fall.

For this reason, high waterproof and moisture proof properties are desired for the sealing material and the adhesive layer which bond between a pair of substrates.

However, since the adhesive layer (molding material) is a member for improving the mechanical strength of the liquid crystal device as described above, it is not provided with moisture proof enough to prevent the intrusion of moisture from outside the substrate.

Therefore, there exists a possibility that the water mixed between a pair of board | substrates may mix in a liquid crystal layer from the interface of a sealing material and a board | substrate, for example, and to degrade display characteristics, and to impair the reliability of a liquid crystal device.

This invention is made | formed in view of the said situation, Comprising: It aims at providing the liquid crystal device which has a stable display characteristic by improving moisture resistance, and the projector provided with the said liquid crystal device as an optical modulation means.

Moreover, it is providing the electro-optical device and microdevice of high reliability by improving moisture resistance.

The liquid crystal device of the present invention includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, and the first substrate and the second substrate. A sealing material for sealing the liquid crystal layer, a molding material covering an outer circumferential side of the sealing material and provided between the first substrate and the second substrate, and the molding on at least one substrate of the first substrate and the second substrate. It has the 1st uneven part formed in the whole area | region where an ash is arrange | positioned, and the said molding material is provided on the said 1st uneven part.

According to the liquid crystal device of the present invention, the molding material is provided on the first uneven portion formed on at least one substrate of the first substrate and the second substrate, so that the interface distance between the molding material and the substrate is lower than that of the flat surface. It extends by a part corresponding to the surface shape of the first uneven portion.

Therefore, since the interface distance between the molding material and the substrate is long, for example, when moisture invades between the first substrate and the second substrate from the outside of the liquid crystal device, the possibility of reaching the liquid crystal layer can be reduced. . That is, the moisture proof property of a liquid crystal device can be improved.

According to such a structure, the fall of the display characteristic by mixing water into a liquid crystal layer can be reduced, it can have a stable display characteristic, and can implement a highly reliable liquid crystal device.

In the liquid crystal device of the present invention, it is preferable that a second uneven portion is formed on at least one of the first substrate and the second substrate, and the sealing material is provided on the second uneven portion.

In this way, the interface distance between the sealing material and the substrate is extended by the second uneven portion. Thus, for example, when moisture invades between the first substrate and the second substrate from the outside of the liquid crystal device, it is possible to reduce the likelihood of the moisture reaching the liquid crystal layer through the interface between the sealing material and the substrate. That is, the moisture proof property of a liquid crystal device can be improved.

The liquid crystal device of the present invention includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, and the first substrate and the second substrate. A sealing material for sealing the liquid crystal layer and a molding material covering the outer circumferential side of the sealing material and provided between the first substrate and the second substrate, wherein the gap between the first substrate and the second substrate on which the molding material is disposed Is smaller than an interval between the first substrate and the second substrate on which the liquid crystal layer is disposed.

According to the liquid crystal device of the present invention, an interval between the molding material disposed between the first substrate and the second substrate is narrower than an interval between the liquid crystal layer disposed between the first substrate and the second substrate. Therefore, the volume of the space | interval of a 1st board | substrate and a 2nd board | substrate decreases, and the quantity of the molding material interposed in the space | interval becomes small.

Here, for example, when moisture penetrates between the first substrate and the second substrate from the outside of the liquid crystal device, since the amount of the molding material interposed between the first substrate and the second substrate is small, the molding material itself at the interval is The amount of water that penetrates is limited. Therefore, the possibility of mixing moisture in the liquid crystal layer can be reduced. That is, the moisture proof property of a liquid crystal device can be improved.

According to such a structure, the fall of the display characteristic by the mixing of moisture into a liquid crystal layer can be reduced, it can have a stable display characteristic, and can implement a highly reliable liquid crystal device.

In the liquid crystal device of the present invention, the first holding surface on which the molding material is held on the first substrate and the second holding surface on which the molding material is held on the second substrate are provided. It is preferable that a 2nd holding surface inclines with respect to the board | substrate surface of the said 1st board | substrate and the said 2nd board | substrate in which the said liquid crystal layer is arrange | positioned.

According to this structure, compared with the case where the 1st holding surface and the 2nd holding surface are not inclined, 1st holding | maintenance is carried out without changing the magnitude | size of the 1st holding surface and 2nd holding surface when a liquid crystal device is seen from a perpendicular direction. The surface area of the face and the second holding face can be widened.

Therefore, the interval which extends to the exterior of a 1st board | substrate and a 2nd board | substrate becomes large, the path | route of the moisture which invades from the exterior of a liquid crystal device becomes long, and the moisture proof property of a liquid crystal device can be improved.

An electro-optical device of the present invention includes a first substrate, a second substrate facing the first substrate, an electro-optical layer disposed between the first substrate and the second substrate, the first substrate and the second substrate. And a molding material provided to surround the electro-optical layer, and an uneven portion formed in an entire region of the region where the molding material is disposed in at least one of the first and second substrates, and on the uneven portion, the molding Ash is provided.

According to the electro-optical device of the present invention, the molding material is provided on the uneven portion formed on at least one substrate of the first substrate and the second substrate, so that the molding material and the surface of the first substrate and the second substrate are flat. The interface distance of the board | substrate is extended by the part according to the surface shape of an uneven part.

Thus, for example, when moisture enters between the first substrate and the second substrate from the outside of the electro-optical device, the interface distance between the molding material and the substrate is long, thereby reducing the possibility of water reaching the electro-optical layer. Can be. That is, the moisture proof property of an electro-optical device can be improved.

According to such a structure, the fall of the display characteristic by mixing moisture in an electro-optic layer can be reduced, and it can realize an electro-optical device which has stable display characteristics and high reliability.

The projector of the present invention includes a light source, light modulating means for modulating light of the light source, and projection means for projecting light modulated by the light modulating means, the light modulating means comprising: a first substrate; A second substrate facing the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, a sealing material for sealing the liquid crystal layer between the first substrate and the second substrate, A liquid crystal covering an outer circumference and having a molding material provided between the first substrate and the second substrate, and an uneven portion formed in an entire region of the region in which the molding material is disposed on at least one of the first and second substrates; As the apparatus, the molding material is provided on the uneven portion.

According to the projector of the present invention, since a molding material is disposed on the uneven portion and a liquid crystal device in which the deterioration of display characteristics due to mixing of moisture in the liquid crystal layer is reduced as a light modulation means, a projector having high display characteristics. Can be realized.

The microdevice of the present invention includes a first substrate, a second substrate facing the first substrate, an apparatus portion disposed between the first substrate and the second substrate, and the first substrate and the second substrate. A molding material provided to surround the device portion, and an uneven portion formed in an entire region of the region where the molding material is disposed in at least one of the first and second substrates, and the molding material is provided on the uneven portion.

According to the micro apparatus of the present invention, since the molding material is provided on the uneven portion formed on at least one of the first and second substrates, the molding material and the substrate are formed in comparison with the case where the surfaces of the first and second substrates are flat surfaces. The interface distance is extended by a portion corresponding to the surface shape of the uneven portion.

Thus, for example, when moisture enters between the first substrate and the second substrate from the outside of the micro device, since the interface distance between the molding material and the substrate is long, the possibility of water reaching the device portion can be reduced. . That is, the moisture proof property of a microdevice can be improved and the improvement of reliability can be implement | achieved.

Example 1

First, the liquid crystal device according to Embodiment 1 of the present invention will be described with reference to FIGS. 1A to 7B.

In this embodiment, an active matrix transmissive liquid crystal device using a thin film transistor (hereinafter referred to as TFT) element as the switching element will be described as an example.

(Liquid crystal device)

FIG. 1 (a) is a planar configuration diagram of an active matrix liquid crystal device according to an embodiment of the present invention, and FIG. 1 (b) is a side cross-sectional configuration diagram of AA lines in FIG. 1 (a), and FIG. And reference numeral 60 in FIG. 1B denotes a liquid crystal device.

As shown in FIGS. 1A and 1B, the liquid crystal device 60 includes a TFT array substrate (first substrate) 10 and an opposing substrate disposed opposite to the TFT array substrate 10. 2 substrate) 20, the liquid crystal layer 50 held between the TFT array substrate 10 and the counter substrate 20, and the liquid crystal layer 50 between the TFT array substrate 10 and the counter substrate 20. It has the sealing material 14 which seals.

Here, the liquid crystal layer 50 is provided along the inner surface side of the outer periphery of the TFT array substrate 10 and the opposing substrate 20, and the liquid crystal device 60 is viewed in a substantially frame-shaped sealing material 14 from the vertical direction. It is sealed by.

The size of the counter substrate 20 is slightly smaller than that of the TFT array substrate 10.

As the opposing substrate 20, a substrate having substantially the same contour as the sealing material 14 provided on the TFT array substrate 10 is used.

By the sealing material 14, the TFT array substrate 10 and the counter substrate 20 are fixed.

Inside the sealing material 14, a light shielding film as a frame is provided along the inside of the sealing material 14.

The area surrounded by the light shielding film is a display area where an image of the liquid crystal device 60 is made.

As shown in FIG. 1A, a plurality of connection terminals 19 are formed in the TFT array substrate 10.

The metal wiring connected to the connection terminal 19 is connected to the pixel electrode formed in the display area.

In the area | region outside the sealing material 14 in the opposing board | substrate 20, you may provide the drive circuit for controlling the drive of a pixel electrode. In this case, this drive circuit and the pixel electrode are electrically connected, and the connection terminal 19 and the drive circuit are connected.

Moreover, the molding material 30 which covers the sealing material 14 is formed in the outer peripheral side of the sealing material 14.

As a material of the molding material 30, acrylic, an epoxy resin, etc. are used.

The molding material 30 adheres the TFT array substrate 10 and the opposing substrate 20. By the molding material 30, the mechanical strength of the liquid crystal device 60 is improved.

In the side cross-sectional view shown in FIG. 1B, the molding material 30 includes the upper surface 10a of the TFT array substrate 10, the outer circumferential surface of the sealing material 14, and the side cross-section 25a of the opposing substrate 20. It is formed to cover a part of from the outside. Thus, the TFT array substrate 10 is provided between the counter substrate 20.

In addition, inorganic alignment films are formed on the inner surface (facing surface) sides of the TFT array substrate 10 and the opposing substrate 20, respectively.

As shown in FIG. 6, the substantially serrated uneven part 40 is formed in the side end surface 25a of the opposing board | substrate 20. As shown in FIG.

In addition, a substantially serrated uneven portion 41 is formed in a part of the TFT array substrate 10 facing the opposing substrate 20.

By providing the molding material 30 on the uneven parts 40 and 41, the interface distance between the molding material 30 and the TFT array substrate 10 and the interface distance between the molding material 30 and the counter substrate 20 are provided. Is long.

(Equivalent circuit)

2 is a diagram illustrating an equivalent circuit of a liquid crystal device.

In order to form the display area of the transmissive liquid crystal device 60, a pixel electrode 9 is formed in each of the plurality of dots arranged in a matrix (array shape).

On the edge side of the pixel electrode 9, a TFT element 27 is formed as a switching element for conducting power supply control to the pixel electrode 9.

The data line 6a is connected to the source of the TFT element 27.

Each data line 6a includes image signals S1, S2,... From the data line driving element. Sn is supplied.

The scanning line 3a is connected to the gate of the TFT element 27.

The scan lines 3a are pulsed at a predetermined timing from the scan line driver element and scan signals G1, G2,... , Gm is supplied.

On the other hand, the pixel electrode 9 is connected to the drain of the TFT element 27.

In such a TFT element 27, the scan signals G1, G2,... Supplied from the scan line 3a are provided. , When the TFT element 27 is turned on for a predetermined period by Gm, the image signals S1, S2,..., Supplied from the data line 6a. Sn is written into the liquid crystal of each dot through the pixel electrode 9 at a predetermined timing.

Predetermined level image signals S1, S2,... , Sn is held for a certain period by the liquid crystal capacitance formed between the pixel electrode 9 and the common electrode (to be described later).

Moreover, image signals S1, S2, ... held by the liquid crystal capacitor. In order to prevent the leakage of Sn, the storage capacitor 17 is formed between the pixel electrode 9 and the capacitor line 3b.

The storage capacitor 17 is arranged in parallel with the liquid crystal capacitor.

As such, when a voltage signal is applied to the liquid crystal, the alignment state of the liquid crystal molecules is changed by the applied voltage level.

As a result, the light of the light source incident on the liquid crystal is modulated to produce image light.

(Planar structure)

3 is an explanatory diagram of a planar structure of a liquid crystal device.

In the liquid crystal device of this embodiment, a rectangular pixel electrode 9 made of a transparent conductive material such as ITO (Indium Tin 0xide) is arranged and arranged in a matrix (array shape) on the TFT array substrate 10. .

The broken line 9a of FIG. 3 shows the outline of the pixel electrode 9.

A data line 6a, a scanning line 3a and a capacitor line 3b are provided along the longitudinal and horizontal directions of the pixel electrode 9.

In the liquid crystal device 60 of the present embodiment, the rectangular region where each pixel electrode 9 is formed is a dot, and display can be performed for each dot arranged in a matrix.

The TFT element 27 is formed centering on the semiconductor layer 1a made of a polysilicon film or the like.

The data line 6a is connected to the source region (to be described later) of the semiconductor layer 1a through the contact hole 5.

In addition, the pixel electrode 9 is connected to the drain region (to be described later) of the semiconductor layer 1a through the contact hole 8.

On the other hand, the channel region 1a is formed in the opposing part of the semiconductor layer 1a with the scanning line 3a.

(Section structure of liquid crystal device)

FIG. 4 is an explanatory diagram of a cross-sectional structure of the liquid crystal device 60 and corresponds to the side cross section of the C-C line arrow in FIG. 3.

As shown in FIG. 4, the liquid crystal device 60 of the present embodiment includes a TFT array substrate 10, an opposing substrate 20 disposed to oppose the TFT array substrate 10, a TFT array substrate 10, and an opposition. The liquid crystal layer 50 held between the substrates 20 is mainly configured.

Here, the TFT array substrate 10 includes a substrate main body 10A made of a light transmissive material such as glass or quartz, a TFT element 27 formed inside the substrate main body 10A, a pixel electrode 9, an inorganic alignment film 16, or the like. It consists mainly of

On the other hand, the opposing substrate 20 is mainly composed of a substrate main body 20A made of a light-transmissive material such as glass or quartz, a common electrode 21 formed inside the substrate main body 20A, an inorganic alignment film 22 and the like. .

On the surface of the TFT array substrate 10, a first light shielding film 11a and a first interlayer insulating film 12 described later are formed.

The semiconductor layer 1a is formed in the surface of the 1st interlayer insulation film 12, and the TFT element 27 centering on the semiconductor layer 1a is formed.

In the semiconductor layer 1a, the channel region 1a 'is formed in the portion facing the scanning line 3a, and the source region and the drain region are formed on both sides of the channel region 1a'.

This TFT element 27 adopts an LDD (Lightly Doped Drain) structure. In each of the source region and the drain region, a high concentration region having a relatively high impurity concentration and a low concentration region (LDD region) having a relatively low concentration are formed.

That is, the low concentration source region 1b and the high concentration source region 1d are formed in the source region, and the low concentration drain region 1c and the high concentration drain region 1e are formed in the drain region.

The gate insulating film 2 is formed on the surface of the semiconductor layer 1a.

The scanning line 3a is formed on the surface of the gate insulating film 2, and the part facing the channel region 1a 'constitutes the gate electrode.

A second interlayer insulating film 4 is formed on the surfaces of the gate insulating film 2 and the scanning line 3a.

The data line 6a is formed on the surface of the second interlayer insulating film 4. The data line 6a is connected to the high concentration source region 1d via the contact hole 5 formed in the second interlayer insulating film 4.

A third interlayer insulating film 7 is formed on the surfaces of the second interlayer insulating film 4 and the data line 6a.

The pixel electrode 9 is formed on the surface of the third interlayer insulating film 7, and the pixel electrode 9 is formed through the contact holes 8 formed in the second interlayer insulating film 4 and the third interlayer insulating film 7. 9) is connected to the high concentration drain region 1e.

In addition, an inorganic alignment layer 16 is formed to cover the pixel electrode 9.

The inorganic alignment film 16 regulates the orientation of the liquid crystal molecules at the time of non-selection voltage application.

In this embodiment, the first storage capacitor electrode 1f is formed by extending the semiconductor layer 1a.

In addition, a dielectric film is formed by extending the gate insulating film 2.

The capacitor line 3b is arranged on the surface of the dielectric film to form a second storage capacitor electrode.

The storage capacitor 17 is formed of the first storage capacitor electrode 1f, the dielectric film, and the second storage capacitor electrode.

The first light shielding film 11a is formed on the surface of the substrate main body 10A corresponding to the formation region of the TFT element 27.

The first light shielding film 11a prevents light incident on the liquid crystal device from being irradiated to the channel region 1a ', the low concentration source region 1b, and the low concentration drain region 1c of the semiconductor layer 1a.

On the other hand, the second light shielding film 23 is formed on the surface of the substrate main body 20A in the counter substrate 20.

The second light shielding film 23 prevents light incident on the liquid crystal device from being irradiated to the channel region 1a ', the low concentration source region 1b, the low concentration drain region 1c, and the like of the semiconductor layer 1a.

The second light shielding film 23 is provided in a region overlapping with the semiconductor layer 1a by viewing the liquid crystal device 60 in the vertical direction.

On the surface of the counter substrate 20, a common electrode 21 made of a conductor such as ITO is formed over the entire surface.

In addition, an inorganic alignment film 22 is formed on the surface of the common electrode 21.

The inorganic alignment film 22 regulates the orientation of liquid crystal molecules at the time of non-selection voltage application.

Between the TFT array substrate 10 and the counter substrate 20, a liquid crystal layer 50 made of a nematic liquid crystal or the like is held.

The nematic liquid crystal molecules have positive dielectric anisotropy, are horizontally aligned along the substrate when an unselected voltage is applied, and are vertically aligned along the electric field direction when a selective voltage is applied.

The nematic liquid crystal molecules have positive refractive anisotropy, and the product (retardation) Δnd between the birefringence and the thickness of the liquid crystal layer is, for example, about 0.40 m (60 ° C).

In addition, the orientation regulation direction by the inorganic alignment film 16 of the TFT array substrate 10 and the orientation regulation direction by the inorganic alignment film 22 of the opposing substrate 20 are set in a twisted state of about 90 °.

Accordingly, the liquid crystal device 60 of the present embodiment operates in twisted nematic mode.

Further, polarizing plates 18 and 28 made of a material doped with polyvinyl alcohol (PVA) or the like are disposed outside the TFT array substrate 10 and the counter substrate 20.

Moreover, it is preferable to mount each polarizing plate 18 and 28 on the support substrate which consists of high thermal conductivity materials, such as sapphire glass and crystal | crystallization, and arrange | position it apart from the liquid crystal device 60. FIG.

Each polarizing plate 18 and 28 has a function of absorbing linearly polarized light in the absorption axis direction and transmitting linearly polarized light in the transmission axis direction.

The polarizing plate 18 on the side of the TFT array substrate 10 is arranged such that the transmission axis substantially coincides with the orientation regulation direction of the inorganic alignment film 16.

The polarizing plate 28 on the opposite substrate 20 side is disposed so that the transmission axis is substantially coincident with the orientation regulation direction of the inorganic alignment film 22.

In the liquid crystal device 60, the opposing substrate 20 is disposed toward the light source.

Of the light source light, only linearly polarized light coinciding with the transmission axis of the polarizing plate 28 is transmitted through the polarizing plate 28 and is incident on the liquid crystal device 60.

In the liquid crystal device 60 at the time of non-selection voltage application, the liquid crystal molecules oriented horizontally with respect to the substrate are stacked and arranged in a spiral shape twisted approximately 90 degrees in the thickness direction of the liquid crystal layer 50.

Therefore, the linearly polarized light incident on the liquid crystal device 60 is linearized by approximately 90 degrees, and is emitted from the liquid crystal device 60.

Since this linearly polarized light coincides with the transmission axis of the polarizing plate 18, it passes through the polarizing plate 18. Therefore, the white display is performed in the liquid crystal device 60 when the non-selection voltage is applied (normally white mode).

On the other hand, in the liquid crystal device 60 at the time of applying the selection voltage, the liquid crystal molecules are vertically aligned with respect to the substrate.

Therefore, the linearly polarized light incident on the liquid crystal device 60 is emitted from the liquid crystal device 60 without being linearized.

Since this linearly polarized light is orthogonal to the transmission axis of the polarizing plate 18, it does not transmit through the polarizing plate 18.

Therefore, black display is performed in the liquid crystal device 60 at the time of applying the selection voltage.

(Inorganic alignment film)

As described above, the inorganic alignment films 16 and 22 are formed inside the TFT array substrate 10 and the counter substrate 20.

Hereinafter, although the inorganic alignment film 22 provided in the counter substrate 20 side is demonstrated as an example, the same structure is employ | adopted also about the inorganic alignment film 16 provided in the TFT array substrate 10 side.

The inorganic alignment films 16 and 22 are made of silicon oxide such as SiO ₂ or SiO, or metal oxides such as Al ₂ O ₃ , ZnO, MgO, ITO, or the like, with a thickness of 0.02 to 0.3 μm (preferably 0.02 to 0.08 μm). It is formed to a degree.

In order to manufacture the inorganic alignment films 16 and 22, for example, a sputtering method such as an ion beam sputtering method or a magnetron sputtering method, a vapor deposition method, a sol-gel method, a self-organization method, or the like can be used.

Here, for example, when the inorganic alignment films 16 and 22 are formed by using an ion beam sputtering device, sputter particles serving as a material for forming an inorganic alignment film are radiated from a target by ion beams irradiated from an ion source, thereby sputtering particles onto a substrate. By depositing in, an inorganic alignment film can be formed on the substrate.

5 is a side cross-sectional view of the opposing substrate 20 on which the inorganic alignment film 22 is formed.

As described above, by using the ion beam sputtering device, sputter particles are continuously incident to the substrate main body 20A constituting the opposing substrate 20 at an approximately constant incidence angle.

As a result, sputter particles are deposited in an inclined columnar shape, and columnar structures 22a made of an inorganic material are formed on the substrate main body 20A.

The columnar structure 22a is formed innumerably on the surface of the substrate main body 20A, thereby forming the inorganic alignment film 22.

Moreover, by adjusting the angle of the target and the board | substrate main body 20A in an ion beam sputtering apparatus, sputter | spatter particle is incident on the board | substrate main body 20A at predetermined incidence angle, and as shown in FIG. 5, columnar structure 22a Can be given a predetermined inclination angle.

In the liquid crystal device 60, since the liquid crystal molecules are aligned along the columnar structure 22a, the liquid crystal molecules at the time of applying the non-selective voltage can be regulated in a predetermined direction by the inorganic alignment film 22.

In addition, pretilt can be imparted to the liquid crystal molecules.

The inorganic alignment film 16 provided on the TFT array substrate 10 has the same configuration as that of the inorganic alignment film 22, and can be formed in the same manner by the above-described method, and has the same function.

As another method of forming the inorganic alignment film, for example, a plurality of inclined surfaces are formed in advance on the surface of the base film of the inorganic alignment film, and an inorganic alignment film is formed on the surface of the inclined surface by the sputtering method, and the shapes of the plurality of inclined surfaces. May be employed to transfer the resin to the surface of the inorganic alignment film.

In addition, after forming an inorganic alignment film by the said sputtering method, you may perform ion milling which injects an ion beam at a predetermined angle, and may form the recessed part which has predetermined orientation on the surface of an inorganic alignment film.

In addition, ion milling may be performed on the surface of the base film of the inorganic alignment film in advance, and then an inorganic alignment film may be formed by the sputtering method, and ion milling may be performed on the surface again to form a recess on the surface of the inorganic alignment film.

In any case, the inorganic alignment film which can reliably provide a desired pretilt angle with respect to a liquid crystal molecule can be provided.

As described above, the liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20.

The sealing material 14 which seals the liquid crystal layer 50 and sticks between the TFT array substrate 10 and the counter substrate 20 is provided (see FIG. 1).

The sealing material 14 contains a gap material, for example.

By the gap material, a predetermined liquid crystal layer thickness (cell gap) in the liquid crystal device 60 is realized.

Moreover, the molding material 30 which consists of an acryl, an epoxy, etc. is arrange | positioned covering the outer peripheral side of the sealing material 14, and is arrange | positioned.

In the liquid crystal device 60 of the present embodiment, the molding material provided between the TFT array substrate 10 and the counter substrate 20 covering the sealing material 14 in the liquid crystal device 60 and the outer circumferential side of the sealing material 14. The molding structure which consists of 30 is employ | adopted.

This molding structure will be described in detail with reference to FIG. 6.

6 is a figure which shows the side cross section of the liquid crystal device 60 in the B-B line | wire of FIG. 1, and is the figure which expanded the molding structure part especially.

(Molding structure)

As shown in FIG. 6, the molding material 30 is provided in the side end surface 25a of the opposing board | substrate 20, the outer peripheral surface of the sealing material 14, and a part of the upper surface of the TFT array substrate 10. As shown in FIG.

The molding material 30 covers the outer circumferential side of the sealing material 14 that seals the liquid crystal layer 50.

Here, uneven portions (first uneven portions) 40 and 41 are formed in each of the TFT array substrate 10 and the counter substrate 20 on which the molding material 30 is disposed.

The uneven parts 40 and 41 are continuously formed over the whole periphery of the molding area | region, and are formed in substantially saw tooth shape as shown in FIG.

6, the uneven part 40 is formed in the side surface 25a which is the molding area | region of 20 A of base bodies of the opposing board | substrate 20. As shown in FIG.

The uneven portion 41 is formed in the molding region in the TFT array substrate 10.

The uneven parts 40 and 41 formed in each of the TFT array substrate 10 and the counter substrate 20 have a molding material 30 and a TFT array as compared with a conventional configuration in which the surface of the substrate is a flat surface without providing uneven parts. The interface distance of the board | substrate 10 is long by the quantity according to the surface shape of the uneven part 41, and the interface distance of the molding material 30 and the opposing board | substrate 20 according to the surface shape of the uneven part 40 As long as it is.

Next, the method of forming the uneven parts 40 and 41 is demonstrated.

First, for example, a resist layer is formed on the substrate surface.

Next, photolithography is performed using a gray mask to form a desired groove shape in the resist layer.

Next, by etching the substrate using the resist layer having the groove shape as a mask, an uneven portion having a substantially serrated cross section can be formed.

The concave-convex portion is not limited to the method of forming by using photolithography. For example, a method of forming the concave-convex shape by pressing the transfer die against the substrate main bodies 10A and 20A may be adopted.

In addition, inorganic alignment films 16 and 22 are provided on the surface where the TFT array substrate 10 and the counter substrate 20 face each other.

Therefore, the inorganic alignment film 16 is arrange | positioned by the substantially constant thickness in the uneven part 41 formed in the surface of the board | substrate main body 10A of the TFT array substrate 10 along the surface.

As a result, a recess having a depth of several micrometers corresponding to the surface shape of the uneven portion 41 is formed on the surface of the inorganic alignment film 16.

That is, in the liquid crystal device 60, a molding material 30 is provided on the uneven portion 41 of the TFT array substrate 10 and the uneven portion 40 of the opposing substrate 20, and is formed by the molding material 30. The TFT array substrate 10 and the opposing substrate 20 are supported.

By the way, when the liquid crystal device 60 penetrates the liquid crystal layer 50 interposed by the TFT array substrate 10 and the counter substrate 20, various functions of the liquid crystal device 60 are impaired. In particular, when water, which is a polarizable molecule, penetrates into a liquid crystal having a polarized structure, poor alignment of the liquid crystal occurs, and there is a concern that the display characteristics may decrease.

Therefore, in order to obtain the highly reliable liquid crystal device 60 which has stable display characteristics, it is preferable to realize high moisture proof property with respect to the moisture which invades from the exterior of the liquid crystal device 60. FIG.

On the other hand, in the molding structure of the present embodiment, as described above, the uneven parts 40 and 41 are formed in the molding regions in the TFT array substrate 10 and the counter substrate 20, and the uneven parts 40, The molding material 30 is arrange | positioned on 41).

According to this structure, since the molding material 30 is provided in the uneven parts 40 and 41 formed in the TFT array substrate 10 and the counter substrate 20, the uneven part is not provided and the surface of the substrate is flat. The interface distance between the molding material 30 and the TFT array substrate 10 is extended by the area in contact with the surface shape of the uneven parts 40 and 41, and the interface distance between the opposing substrate 20 is extended.

Therefore, when moisture enters between the TFT array substrate 10 and the counter substrate 20 from the outside of the liquid crystal device 60, for example, the interface distance between the molding material 30 and the TFT array substrate 10, and the molding Since the interface distance between the ash 30 and the counter substrate 20 is long, the possibility of water reaching the liquid crystal layer 50 can be reduced.

Here, in the liquid crystal device 60 in the present embodiment, the inorganic alignment film 16 is formed on the surface of the TFT array substrate 10 on which the molding material 30 is provided.

As shown in FIG. 5, the inorganic alignment film 16 is made of porous material composed of columnar structures.

Therefore, there exists a possibility that a clearance gap may arise especially between the molding material 30 and the opposing board | substrate 20. FIG.

In addition, a large gap may be formed at the interface between the molding material 30 and the inorganic alignment film 16.

Therefore, moisture, impurities, and the like penetrate into the liquid crystal layer 50 from the outside of the liquid crystal device 60 through these gaps, and there is a possibility that the defect described above may occur.

However, according to the molding structure of the present embodiment described above, since the uneven shape is provided to the inorganic alignment film 16 provided on the TFT array substrate 10, the interface distance between the inorganic alignment film 16 and the molding material 30 is adjusted. It can lengthen and can prevent the invasion of moisture from the exterior suitably.

Thus, according to the liquid crystal device 60 of this embodiment, the fall of the display characteristic by the mixing of the moisture into the liquid crystal layer 50 can be reduced, and the highly reliable liquid crystal device 60 with stable display characteristics can be implemented. Can be.

In addition, the higher the height of the uneven parts 40 and 41 formed on the surfaces of the TFT array substrate 10 and the counter substrate 20, the longer the interface distance between the molding material 30 and the inorganic alignment films 16 and 22 is. can do.

Moreover, as mentioned later, by employing this liquid crystal device as the light modulation means, a highly reliable liquid crystal projector can be provided.

Moreover, in the said Example 1, although the uneven part was formed in both the TFT array board | substrate 10 and the opposing board | substrate 20, by providing an uneven part in either one of the TFT array board | substrate 10 and the opposing board | substrate 20, By increasing the interface distance between the molding material 30 and the substrate, it is possible to improve the moisture resistance of the liquid crystal device 60.

In addition, the shape of the uneven parts 40 and 41 provided in the TFT array substrate 10 and the opposing board | substrate 20 is not limited to the said Example.

For example, in the present embodiment, the uneven portion 41 formed in the TFT array substrate 10 is a concave-convex portion formed in a concave shape on the surface (flat surface) of the substrate main body 10A, but on the flat surface of the substrate main body 10A. The concave-convex portion formed in the convex shape may be used.

In addition, the substrate main body 10A may remain flat, and the uneven portions 41 may be uneven portions having protrusions or grooves formed on the inorganic alignment layer 16.

In addition, protrusions or grooves may be formed on both of the substrate main body 10A and the inorganic alignment film 16, and the concave-convex portions may be formed by combining both.

In addition, in the liquid crystal device 60 of the present embodiment, the inorganic alignment films 16 and 22 are formed on the entire surface of the opposing surfaces where the TFT array substrate 10 and the opposing substrate 20 oppose each other, but the liquid crystal layer The inorganic alignment film 1622 may be formed only in the region holding the 50.

In this case, since the inorganic alignment films 16 and 22 are not formed in the molding region, the gap between the inorganic alignment film and the molding material 30 can be prevented from being formed.

Specifically, in the case where an alignment film made of an organic material is employed or when the inorganic alignment film is not selectively formed only on the substrate serving as the molding region, the interface between the molding material 30 and the TFT array substrate 10, At the interface between the molding material and the counter substrate 20, the possibility of forming a large gap becomes low.

Thereby, it can prevent that the clearance gap which invades moisture from the exterior of the liquid crystal device 60 is formed.

In such a configuration, by further forming an uneven portion on the surface of the molding region and applying the molding material 30 to the surface of the uneven portion, the interface distance between the molding material 30 and the TFT array substrate 10 or the molding material 30 is obtained. And the interface distance of the opposing substrate 20 may be lengthened.

Thus, moisture or the like penetrates into the liquid crystal layer 50 by passing through the gap between the molding material 30 and the TFT array substrate 10 and the gap between the molding material 30 and the counter substrate 20. The possibility of doing so can be made very small, and the reliability of the liquid crystal device 60 can be improved.

(Modification 1 of Example 1)

Next, Modified Example 1 of the liquid crystal device in Example 1 will be described.

7 (a) and 7 (b) are explanatory diagrams of Modification Example 1 of Example 1. FIG.

FIG. 7A is a diagram showing a plan view of the liquid crystal device 60 'of the modification 1, and FIG. 7B is a side cross-sectional view taken along the line E-E in FIG. 7A.

As shown to Fig.7 (a) and FIG.7 (b), in the liquid crystal apparatus 60 ', the groove | channel 91 is formed in the surface of the board | substrate main body 20A of the opposing board | substrate 20, and the groove | channel (the 91 constitutes a part of the molding region in which the molding material 30 is disposed.

Here, in the liquid crystal device 60 ', unlike the liquid crystal device 60 shown in FIG. 6, the size of the TFT array substrate 10 and the counter substrate 20 which are arranged to face each other is the size of the liquid crystal device 60'. It is about the same in the vertical direction.

As shown in FIG. 7A, the groove 91 is formed continuously over the entire edge of the molding region.

The cross section of the groove | channel 91 is rectangular shape as shown to FIG. 7 (b).

Similar to the surface of the groove 91, the inorganic alignment film 22 is disposed at a substantially constant thickness.

As a result, a concave portion (first uneven portion) 92 having a depth of several micrometers is formed on the surface of the inorganic alignment film 22.

As shown in FIG. 7A, the recess 92 is continuously formed over the entire edge of the molding region.

The cross section of the recessed part 92 is rectangular shape as shown to FIG. 7 (b).

In addition, a plurality of through holes 93 are provided in the substrate main body 20A.

In addition, the inorganic alignment film 22 is not provided in the part in which the through-hole 93 was provided in 20A of the board | substrate main body.

The through hole 93 is connected to the molding region.

In the liquid crystal device 60 ', the groove 81 is formed in the surface of the substrate main body 10A of the TFT array substrate 10, and the molding in which the molding material 30 is disposed by the groove 81 is formed. Part of the area is constructed.

The groove 81 has the same configuration as the groove 91 described above, and is similar to the surface of the groove 81, and the inorganic alignment film 16 is disposed at a substantially constant thickness.

Thereby, the recessed part (1st uneven part) 82 is continuously formed in the surface of the inorganic alignment film 16 over the whole edge of a molding area | region.

The cross section of the recessed part 82 is rectangular shape, as shown to FIG. 7 (b).

The concave portion 82 of the TFT array substrate 10 and the concave portion 92 of the opposing substrate 20 are aligned, and the concave portion of the TFT array substrate 10 and the opposing substrate 20 adhere to each other. The molding regions are formed by the portions 82 and 92.

In addition, the sealing material 14 is provided inside the molding region similarly to the first embodiment.

By the sealing material 14, the liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20.

As a method of arranging the molding material 30 in the molding region, for example, a method of injecting the molding material from the through hole 93 can be adopted.

At this time, bubbles such as air contained in the molding material 30 are discharged to the outside by the through hole 93.

Thereby, the molding material 30 can be arrange | positioned suitably between the TFT array substrate 10 and the opposing board | substrate 20. FIG.

In addition, since many molding materials 30 are arrange | positioned in the molding area comprised along the recessed part 82 provided in the TFT array substrate 10 and the recessed part 92 provided in the opposing board | substrate 20 in this way, TFT array The board | substrate 10 and the opposing board | substrate 20 can be stuck more reliably.

That is, the mechanical strength of the liquid crystal device 60 'can be made high.

By the way, since the inorganic alignment films 16 and 22 are porous as a columnar structure, as shown in FIG. 5, as mentioned above, especially the interface of the molding material 30 and the inorganic alignment film 16, and a molding material ( There exists a possibility that a big gap may be formed in the interface of 30 and the inorganic alignment film 22. As shown in FIG.

Thereby, there exists a possibility that moisture, an impurity, etc. may invade a liquid crystal layer through the clearance gap from the exterior of the liquid crystal device 60 ', and may reduce the display characteristic of a liquid crystal device.

On the other hand, in the liquid crystal device 60 'of the modification 1 shown to FIG.7 (a) and FIG.7 (b), the recessed part 82 is formed in the surface of the inorganic alignment film 16, and the inorganic alignment film 22 The recessed part 92 is formed in the surface of the recessed part, and the structure by which the molding material 30 was arrange | positioned at the surface of the recessed part 82 and 92 is employ | adopted.

According to this structure, since the interface distance of the molding material 30 and the inorganic alignment film 16 and the interface distance of the molding material 30 and the inorganic alignment film 22 are extended compared with the case where the uneven part is not formed, moisture The length of the penetration path of the lamps and the like can be lengthened, so that the likelihood of intrusion of moisture or the like into the liquid crystal layer 50 can be reduced.

Therefore, highly reliable liquid crystal device 60 having stable display characteristics can be realized.

(Modification 2 of Example 1)

Next, Modified Example 2 of the liquid crystal device in Example 1 will be described with reference to Fig. 8A.

In the modification 2, as shown to FIG. 8 (a), the uneven part 40 ', 41' (2nd uneven part) is formed in the position where the sealing material 14 is arrange | positioned.

That is, the uneven parts 40 'and 41' are formed between the TFT array substrate 10 and the counter substrate 20 at the position where the sealing material 14 is arrange | positioned.

According to such a structure, compared with the case where the surface of the board | substrate holding the sealing material 14 is flat, the area | region of the sealing material 14 and the TFT array substrate 10 is formed in the area | region where the uneven parts 40 'and 41' are formed. The interface distance and the interface distance between the sealing material 14 and the opposing substrate 20 can be increased.

Thus, for example, when moisture penetrates between the TFT array substrate 10 and the counter substrate 20 from the outside of the liquid crystal device, the interface between the sealing material 14 and the TFT array substrate 10 and the sealing material 14 and Through the interface of the opposing substrate 20, the possibility of water reaching the liquid crystal layer 50 is reduced, so that the moisture resistance of the liquid crystal device can be further improved.

(Modification 3 of Example 1)

Next, Modified Example 3 of the liquid crystal device in Example 1 will be described with reference to FIG. 8 (b).

In the third modification, as shown in FIG. 8B, instead of the recessed portion 82 illustrated in FIG. 7, the convex portion 82 ′ is provided in the TFT array substrate 10 as an uneven portion.

In this configuration, it is preferable that the width of the concave portion 92 formed in the opposing substrate 20 is wider than the width of the convex portion 82 '.

At this time, as shown in FIG. 8B, the convex portion 82 ′ of the TFT array substrate 10 and the concave portion 92 of the opposing substrate 20 are fitted through the molding material 30. .

In this manner, in the state where the convex portion 82 'and the concave portion 92 are fitted, for example, the side surface of the convex portion 82' and the side surface of the concave portion 92 are brought into contact with each other to form the TFT array substrate 10. The horizontal alignment of the opposing substrate 20 can be ensured.

At this time, the concave portion 92 and the convex portion 82 'are formed so that the interface distance between the molding material 30 and the TFT array substrate 10, the molding material 30 and the opposing substrate 20 The interface distance of can be extended.

Therefore, similarly to Example 1, Modification 1, and Modification 2 described above, the effect of improving the moisture resistance of the liquid crystal device can be obtained.

Moreover, you may form the coupling structure which consists of the convex part 82 'and the recessed part 92, for example between the TFT array substrate 10 in which the sealing material 14 is arrange | positioned, and the opposing board | substrate 20. As shown in FIG.

(Example 2)

Next, Example 2 which concerns on the liquid crystal device of this invention is demonstrated with reference to FIG.

9 is a diagram showing a side cross section of the liquid crystal device 160 according to the second embodiment.

In the liquid crystal device of the present embodiment, the same components as in the first embodiment will be described with the same reference numerals, and the components similar to those in the first embodiment will be simplified.

In addition, in the present embodiment, the sizes of the TFT array substrate 10 and the opposing substrate 20 which are disposed to face each other are substantially the same when the liquid crystal device is viewed in the vertical direction.

In Example 1, since the uneven part is formed in the molding area | region in the TFT array substrate 10 and the counter substrate 20, the interface distance of the molding material 30 and TFT array substrate 10, and molding are carried out. The moisture barrier property of the liquid crystal device 60 was improved by increasing the interface distance of the ash 30 and the opposing board | substrate 20. FIG.

In contrast, in the liquid crystal device 160 according to the present embodiment, the gap between the TFT array substrate 10 and the opposing substrate 20 on which the molding material 30 is disposed is maintained between the liquid crystal layers 50. The structure which makes it narrower than the space | interval (henceforth liquid crystal layer thickness (cell gap)) between the TFT array board | substrate 10 and the opposing board | substrate 20 which are made is employ | adopted.

The liquid crystal device 160 of this embodiment is sealed by a sealing material 14 between the TFT array substrate 10 and the opposing substrate 20 disposed to face each other, and the TFT array substrate 10 and the opposing substrate 20. And a molding material 30 provided between the TFT array substrate 10 and the counter substrate 20 to cover the outer circumference of the sealing material 14 and the sealing material 14.

As shown in FIG. 9, in the liquid crystal device 160, the convex portion 192 is formed on the surface of the inorganic alignment layer 16 of the TFT array substrate 10, and the inorganic alignment layer 22 of the opposing substrate 20 is formed. The convex part 182 is formed in the surface of ().

The convex portions 192 and 182 are continuously formed over the entire edge of the molding region, and the molding material 30 is disposed on the convex portions 192 and 182.

The sealing material 14 is filled in the inside of the convex portion 192 of the TFT array substrate 10 and the inside of the convex portion 182 of the opposing substrate 20, similarly to the liquid crystal device 60, and the liquid crystal layer 50 is sealed.

Moreover, the spacer not shown is interposed in the sealing material 14, and the desired liquid-crystal layer thickness (cell gap) d is ensured.

The gap D between the TFT array substrate 10 and the counter substrate 20 in the molding region is narrower than the liquid crystal layer thickness d due to the formation of the convex portions 192 and 182.

Therefore, the volume constituting the space | interval D reduces compared with the case where the TFT array board | substrate 10 with which the molding material 30 is arrange | positioned, and the opposing board | substrate 20 is equal to liquid crystal layer thickness (in the case of d = D). Therefore, the amount of the molding material 30 interposed in the interval D is reduced.

Here, when moisture penetrates between the TFT array substrate 10 and the counter substrate 20 from the outside of the liquid crystal device 160, the molding material 30 at interval D is small, and thus the molding material at interval D is small. The moisture permeate | transmitted inside (30) becomes small.

Therefore, the possibility of mixing moisture in the liquid crystal layer 50 can be reduced, and the moisture resistance of the liquid crystal device 160 can be improved.

According to such a structure, the fall of the display characteristic of the liquid crystal device by mixing water into the liquid crystal layer 50 can be reduced, and the highly reliable liquid crystal device 160 which has stable display characteristics can be implement | achieved.

(Modification of Example 2)

Next, the modification of the liquid crystal device 160 in Example 2 is demonstrated with reference to FIG.

As shown in FIG. 10, in the liquid crystal device 160 'which is a modification of the liquid crystal device 160, each board | substrate surface which forms the space | interval D inclines with respect to the board | substrate surface in which the liquid crystal layer 50 is arrange | positioned.

Here, the substrate surface on which the liquid crystal layer 50 is disposed is the TFT array substrate 10 and the opposing substrate holding the sealing material 14 and the liquid crystal layer 50 shown in FIG. 10 in this modification. 20) means the inner side.

The substrate surface forming the gap D is a first holding surface 10B on which the molding material 30 is disposed on the TFT array substrate 10, and a molding material on which the molding material 30 is disposed on the opposing substrate 20. 2 means the holding surface 20B.

And a molding area is comprised along the 1st holding surface 10B and the 2nd holding surface 20B.

The first holding surface 10B and the second holding surface 20B are formed with respect to the substrate surface of the TFT array substrate 10 and the substrate surface of the opposing substrate 20, with the liquid crystal layer 50 held therebetween. It is inclined.

In other words, as shown in FIG. 10, the substrate main body 10A in the TFT array substrate 10 includes a liquid crystal holding unit constituting a substrate surface holding the liquid crystal layer 50 and the sealing material 14 therebetween ( 10R) and the molding holding part 10M which inclines with respect to the board | substrate surface in liquid crystal holding part 10R, and has the substrate surface (1st holding surface 10B) in which the molding material 30 is arrange | positioned It is composed.

In addition, 20 A of board | substrate main bodies in the opposing board | substrate 20 are inclined with respect to the liquid crystal holding part 20R and the board | substrate surface in 20 R of liquid crystal holding parts, and the molding material 30 is arrange | positioned. The molding holding part 20M which has a board | substrate surface (2nd holding surface 20B) is comprised combining.

Therefore, each of the molding holding portions 10M and 20M and the liquid crystal holding portions 10R and 20R are provided to face each other.

By this structure, each surface of the 1st holding surface 10B and the 2nd holding surface 20B which comprise the space | interval D mentioned above inclines with respect to the surface of the board | substrate which arrange | positions the liquid crystal layer 50. As shown in FIG.

Here, the magnitude | size of the space | interval of the TFT array board | substrate 10 and the opposing board | substrate 20 which comprise the liquid crystal holding | maintenance part 10R, 20R is set to liquid crystal layer thickness (cell gap) d which is the film thickness of the liquid crystal layer 50. FIG. It is.

In addition, the magnitude | size of the space | interval D of 1st holding surface 10B and 2nd holding surface 20B is thinner than liquid crystal layer thickness d as shown in FIG.

And the molding material 30 which bonds between the TFT array substrate 10 and the opposing board | substrate 20 is provided in the 1st holding surface 10B and the 2nd holding surface 20B.

In the liquid crystal device 160 ′ in the present modification, each TFT array substrate 10 and the opposing substrate 20 (the first holding surface 10B and the second holding surface 20B on which the molding material 30 is disposed) are disposed. Since the space | interval D between)) is narrower than liquid-crystal layer thickness d, the quantity of the molding material 30 interposed in the space | interval D can be made small similarly to the liquid crystal device 160 of Example 2 above.

Therefore, when moisture invades between the TFT array substrate 10 and the counter substrate 20 from the outside, the amount of the molding material 30 interposed in the gap D is small, so that the molding material in the gap D ( 30) It is possible to limit the amount of water penetrating through.

In addition, the interface distance of the external appearance which looked at the molding area from the perpendicular direction of the liquid crystal device 160 'can be represented by distance X1 shown in FIG.

In the present modification, as described above, the first holding surface 10B of the molding holding portion 10M on which the molding material 30 is disposed and the second holding surface 20B of the molding holding portion 20M hold liquid crystals. Since it is inclined with respect to the substrate surfaces of the portions 10R and 20R, the interface distance between the molding material 30 and the TFT array substrate 10 or the interface distance between the molding material 30 and the counter substrate 20 is X2. Is represented.

Therefore, the interface distance which forms the space | interval D in a molding area | region can be made long compared with the interface distance X1 of an external shape.

By lengthening the interface distance of the molding region in which the molding material 30 is formed in this way, the path | route which moisture intrudes from the exterior of the liquid crystal device 160 'can lengthen, and the moisture proof property of the liquid crystal device 160' Can be improved.

According to such a structure, the possibility that moisture mixes in the liquid crystal layer 50 can be reduced, and the moisture proof property of the liquid crystal device 160 'can be improved.

Therefore, the fall of the display characteristic which arises by mixing water into the liquid crystal layer 50 can be alleviated, ie, the highly reliable liquid crystal device 160 'can be realized.

As mentioned above, although the Example of a liquid crystal device was described, this invention can also be applied to electro-optical devices other than a liquid crystal device, for example, an organic electroluminescent device, an electrophoretic device, etc.

First, an embodiment in which the present invention is applied to the electrophoretic apparatus 100 will be described.

As shown in FIG. 11, the electrophoretic apparatus 100 of the present embodiment includes an electrophoretic layer (electro-optical layer) 111 between the first substrate 101 and the second substrate 108 disposed to face each other. It is composed.

In addition, the first substrate 101 and the second substrate 108 are joined by the sealing member 127, and are kept in a state of being regularly spaced apart by a spacer (not shown).

The sealing member 127 is formed in a frame shape so as to surround the display area.

The molding member 130 is disposed outside the sealing member 127 so as to surround the electrophoretic layer 111.

In the electrophoretic apparatus 100 according to the present exemplary embodiment, as in the exemplary embodiment of the liquid crystal device described with reference to FIG. 6, roughly serrated uneven portions 140 are formed on side cross-sections of the first substrate 101 when viewed in cross section. A part of the second substrate 108 is formed with a substantially serrated uneven portion 141 as seen in cross section.

And the molding material 130 is provided on the uneven parts 140 and 141.

That is, the uneven parts 140 and 141 are formed over the entire region where the molding material 130 is disposed.

The 1st board | substrate 101 consists of a board | substrate which has transparency, such as a transparent glass and a transparent film, for example.

On the inner surface (electrophoretic layer 11) side of the first substrate 101, a common electrode 102 made of a transparent conductive material such as indium tin oxide (ITO) is formed.

The outer surface of the first substrate 10l is the display surface of the electrophoretic device 100.

In addition, the 2nd board | substrate 108 does not necessarily need to be transparent, For example, the board | substrate etc. which formed the insulating layer in the surface of metal plates, such as a stainless steel plate other than a glass substrate and a resin film substrate, can be used.

On the second substrate 108, pixel regions are divided and formed in a matrix (array shape), and pixel electrodes 107 corresponding to the respective pixel regions are provided.

Although not shown, the pixel electrode 107 is provided with a TFT element (switching element) for conducting power supply control.

In the electrophoretic apparatus 100 of the present embodiment, the electrophoretic dispersion 105 is used as the electrophoretic layer 111 in the closed space formed by the first substrate 101 and the second substrate 108 and the sealing member. And a microcapsule 161 in which the electrophoretic particles 106 are covered with a capsule-shaped resin film.

In addition, the electrophoretic layer 111 is not limited to the microcapsules, and an electrophoretic dispersion liquid having a dispersion medium, electrophoretic particles, or the like is injected between the first substrate 101 and the second substrate 108. By sealing, the electrophoretic layer may be comprised.

By applying a voltage between the electrodes 102 and 107, the electrophoretic particles 106 in the microcapsules 161 are quickly moved toward the common electrode 2 by the coulomb force and adhered to the electrode surface, thereby providing an image display. Is done.

According to the above configuration, since the molding member 130 is provided on the uneven portions 140 and 141 formed on the first substrate 101 and the second substrate 108, the uneven portions are not provided and thus the surface of the substrate is a flat surface. In comparison, the interface distance between the molding material 130 and the first substrate 101 or the interface distance between the molding material 130 and the second substrate 108 are as much as the area in contact with the surface shape of the uneven parts 140 and 141. Elongate.

Thus, for example, when moisture penetrates between the first substrate 101 and the second substrate 108 from the outside of the electrophoretic apparatus 100, the interface distance between the molding material 130 and the first substrate 101 Since the interface distance between the molding material 130 and the second substrate 108 is long, the possibility of moisture reaching the electrophoretic layer 111 can be reduced.

Moreover, you may make it employ | adopt the aspect of FIG. 7 (a)-FIG. 10 applied to the liquid crystal device to the electrophoretic apparatus of this invention.

Next, an embodiment in which the present invention is applied to the organic EL device 200 will be described with reference to FIG. 12.

As shown in FIG. 12, in the organic EL device 200 of the present embodiment, a circuit portion (not shown) including a driving TFT for driving the pixel electrode 231 on the substrate (first substrate) 211. ) Is formed.

On the circuit portion, a light emitting element (organic EL element) 244 as an electro-optical layer is provided in each of the plurality of regions partitioned by the partition wall 241.

The light emitting element 244 includes a pixel electrode 231 functioning as an anode, a hole transport layer 252 for injecting / transporting holes from the pixel electrode 231, and an organic EL material which is one of electro-optic materials. The light emitting layer 251 and the cathode 261 are formed in order.

In the light emitting device having such a configuration, the light emitting layer 251 emits light by combining holes injected from the hole transport layer 252 and electrons of the cathode 261.

A sealing substrate (second substrate) 210 is provided to cover the substrate 211.

In the case where the organic EL device 200 is a so-called bottom emission type, the light emitting light is taken out, so that a transparent or translucent substrate is employed as the substrate 211.

In addition, when the organic EL device 200 is a so-called top emission type, a transparent or translucent substrate is employed as the sealing substrate 210.

And the molding material 230 is arrange | positioned so that the organic electroluminescent element may be enclosed.

The molding material 230 protects the organic EL element 244 vulnerable to moisture by preventing moisture from entering the interior of the organic EL device 200.

In the organic EL device 200 according to the present embodiment, similarly to the embodiment of the liquid crystal device described with reference to FIG. 6, roughly sawtooth-shaped uneven portions 240 are formed on the side cross-section of the sealing substrate 210 in cross section. The board | substrate 211 is formed also in the part of board | substrate 211, and the substantially serrated uneven part 242 is formed in cross section.

On the uneven parts 240 and 242, the molding material 230 is provided.

That is, the uneven parts 240 and 242 are formed over the entire region where the molding material 230 is disposed.

According to the above structure, since the molding material 230 is provided with respect to the uneven portion 242 formed on the substrate 211 and the uneven portion 240 formed on the sealing substrate 210, the surface of the substrate is not provided without the uneven portion. Compared to the case of the flat surface, the interface distance between the molding member 230 and the substrate 211 is extended by the area in contact with the surface shape of the uneven portions 240 and 242, so that the molding member 230 and the sealing substrate 210 The interface distance of e) is extended.

Therefore, even when moisture enters between the sealing substrate 210 and the substrate 211 from the outside of the organic EL device 200, for example, the interface distance between the molding material 230 and the sealing substrate 210 or the molding material ( Since the interface distance between the 230 and the substrate 211 is long, the possibility of moisture reaching the organic EL element including the light emitting layer 251 can be reduced.

Moreover, you may employ | adopt the aspect of FIGS. 7A-10 applied to the liquid crystal device in the organic electroluminescent apparatus 200 of this invention.

(Projector)

Next, the projector of the present invention will be described with reference to FIG.

13 is a schematic block diagram showing the main parts of the projector 800.

The projector 800 is equipped with the liquid crystal device which concerns on each above-mentioned embodiment as light modulation means.

In Fig. 13, reference numeral 810 denotes a light source, reference numeral 813 and 814 denote a dichroic mirror, reference numeral 815, reference numeral 816, and reference numeral 817 a reflection mirror, reference numeral 818 an incident lens, reference numeral 819 A relay lens, reference numeral 820 denotes an output lens, reference numeral 822, reference numeral 823, and reference numeral 824 denote optical modulation means comprising the liquid crystal device of the present invention, reference numeral 825 denotes a cross dichroic prism, and reference numeral 826 denotes projection It is a lens (projection means).

The light source 810 includes a lamp 811 such as a metal halide and a reflector 812 that reflects light of the lamp 811.

The dichroic mirror 813 transmits red light included in the white light emitted from the light source 810 and reflects blue light and green light.

The red light transmitted through the dichroic mirror 813 is reflected by the reflection mirror 817 and is incident on the light modulation means 822 for red light.

The green light reflected by the dichroic mirror 813 is reflected by the dichroic mirror 814 and is incident on the light modulating means 823 for green light.

The blue light reflected by the dichroic mirror 813 passes through the dichroic mirror 814.

The light path of blue light is longer than red light or green light.

Therefore, in order to prevent the light loss of blue light, the projector 800 is provided with the light guide means 821 which consists of the relay lens system containing the entrance lens 818, the relay lens 819, and the exit lens 820. .

The blue light is incident on the light modulating means 824 for blue light through the light guiding means 821.

Three color lights modulated by the respective light modulating means 822, 823, 824 are incident on the cross dichroic prism 825.

The cross dichroic prism 825 is formed by joining four rectangular prisms. A dielectric multilayer film reflecting red light and a dielectric multilayer film reflecting blue light are formed in an X-shape at the interface.

Three color lights are synthesized by these dielectric multilayer films, and light representing a color image is formed.

The synthesized light is projected onto the screen 827 by the projection lens 826, which is a projection optical system, so that the image is enlarged and displayed.

The projector 800 described above includes any one of the liquid crystal devices 60, 60 ', 160, 160' in each of the above-described embodiments or modified examples as the light modulation means.

As described above, in the liquid crystal device of each embodiment or each modification, the possibility of moisture or the like penetrating into the liquid crystal layer from the outside of the liquid crystal device is reduced, high moisture resistance, stable display characteristics, and high reliability are realized. have.

Therefore, in the projector 800 of this invention, since the said liquid crystal device is provided as a light modulation means, the orientation control function of the liquid crystal molecule in a liquid crystal device can be maintained, and the display characteristic which is high in reliability and excellent is implement | achieved. .

The technical scope of the present invention is not limited to the above-described embodiments, but includes various modifications to the above-described embodiments without departing from the spirit of the present invention.

For example, in the above embodiment, a liquid crystal device having a TFT as a switching element has been described as an example, but the present invention is also applied to a liquid crystal device having a two-terminal element such as a thin film diode as a switching element. It is possible.

In the above embodiment, the transmissive liquid crystal device has been described as an example, but the present invention can be applied to the reflective liquid crystal device.

In the above embodiment, the liquid crystal device functioning in the twisted nematic (TN) mode has been described as an example, but the present invention can be applied to the liquid crystal device functioning in the vertical alignment mode (VA).

In the above embodiment, a three-plate type projector (projection type display device) has been described as an example, but the present invention can also be applied to a single-plate type projection display device or a direct-view display device.

It is also possible to apply the liquid crystal device of the present invention to electronic devices other than a projector.

As a specific example, a mobile telephone can be mentioned.

The mobile telephone includes a liquid crystal device according to each of the above-described embodiments or modifications thereof, on the display unit.

Other electronic devices include, for example, an IC card, a video camera, a personal computer, a head mounted display, a facsimile device with a display function, a finder of a digital camera, a portable TV, a DSP device, a PDA, an electronic notebook, an electronic bulletin board, and a publicity. Announcement display etc. are mentioned.

Next, as an embodiment of the micro device, an example applied to a digital micromirror device (DMD) will be described with reference to the drawings.

DMD can be used, for example, as a reflection type optical modulation device in the projector described above.

14 is an exploded perspective view showing the main components of the optical modulation device 500.

In FIG. 14, the optical modulation device 500 is broadly divided into a mirror substrate (first substrate) 400 and a cover glass substrate (second substrate) 300.

A plurality of minute mirrors (device parts) 302 are provided between the mirror substrate 400 and the cover glass substrate 300.

Specifically, the concave portion 402 is formed in the mirror substrate 400, and a plurality of micro mirrors (device portions) 302 arranged in a matrix shape (array shape) are provided in the concave portion 402.

Of the plurality of micromirrors 302, the micromirrors 302 arranged along one direction, for example, the X direction of FIG. 14, are connected by a torsion bar 304.

The reflective layer 302a is formed on the surface of the micromirror 302.

As the micromirror 302 is driven to be inclined, the reflection direction of light incident on the micromirror 302 is changed.

Then, the light is modulated by controlling the time for reflecting light toward the predetermined reflection direction.

In the concave portion 402, a support portion 410 protruding from the concave portion 402 is formed at a position facing the torsion bar 304 between two micromirrors 302 adjacent from the X direction. A plurality is provided.

As the torsion bar 304 and the support portion 410 are anodic-bonded, the micromirror 302 is disposed in the recess 202.

In addition, the wiring pattern portion 412 is formed in the recess 402.

The wiring pattern portion 412 has a first address electrode 414 and a second address electrode 416 at positions opposing the rear surfaces of both micromirrors 302 with the torsion bar 304 interposed therebetween. .

Each of the plurality of first address electrodes 414 arranged along the Y direction is connected to the first common wiring 418.

Similarly, each of the plurality of second address electrodes 416 arranged along the Y direction is connected to the second common wiring 420.

When the ON-mirror driving of the micromirror 302 is performed, the plurality of micromirrors 302 arranged along the X-direction of FIG. 14 are simultaneously energized through the torsion bar 304.

At the same time as energizing the micromirror 302, the first address electrode 414 and the second address electrode 416 are driven in a sequential order or in a linear order.

By sequentially selecting and energizing the torsion bar 304 toward the Y direction in FIG. 14, the ON tilt driving of the micromirrors 302 arranged in a matrix can be executed by a predetermined cycle.

On the other hand, when the OFF tilt drive of the micromirror 302 is performed, the polarity of the voltage applied to the first address electrode 414 and the second address electrode 416 may be reversed from that of the ON tilt drive.

As a result, the micromirror 302 is inclinedly driven in the reverse direction as in the ON tilt driving.

By changing the inclination of the micromirror 302 in this manner, the optical modulation device is driven.

The molding material is arrange | positioned on the frame top surface 404 of the mirror substrate 400 so that the area | region (the recessed part 402 shown in FIG. 14) provided with the micromirror 302 may be provided.

As shown in FIG. 15, the mirror substrate 400 and the cover glass substrate 300 are bonded together through the molding material.

15 is a diagram illustrating a schematic side cross-sectional structure of the optical modulation device 500.

As shown in FIG. 15, the mirror substrate 400 and the cover glass substrate 300 can be bonded through the molding material 430.

The molding material 430 prevents moisture from entering the interior of the optical modulation device 500 and protects the micromirror 302, the wiring pattern part 412, and the like.

In the optical modulation device 500 according to the present embodiment, similarly to the embodiment of the liquid crystal device described with reference to FIG. 6, an uneven portion 340 having a substantially sawtooth shape in cross section is formed on the lower surface side of the cover glass substrate 300. The upper surface 404 of the mirror substrate 400 which is formed to face the uneven portion 340 is also formed with a substantially serrated uneven portion 440 as seen in cross section.

And the molding material 430 is provided on the uneven parts 340 and 440.

That is, the uneven parts 340 and 440 are formed over the entire region (the recessed part 402) in which the molding material 430 is disposed.

In the above-described optical modulation device 500, since the molding member 430 is disposed on the uneven portions 340 and 440, the uneven portions 340, as compared with the case where the uneven portions are not provided and the substrate surface is a flat surface. The interface distance between the molding material 430 and the cover glass substrate 300 and the interface distance between the molding material 430 and the mirror substrate 400 are extended by the area in contact with the surface shape of the 440.

Therefore, even when moisture enters the inside of the light modulation device 500 from the outside, the interface distance between the molding material 430 and the cover glass substrate 300 and the molding material 430 and the mirror substrate 400 may be reduced. Since the interface distances are each long, the possibility of moisture reaching the micromirror 302 and the wiring pattern portion 412 can be reduced.

Moreover, you may make it adopt the aspect of FIG.7 (a)-10 adapted to the liquid crystal device to the optical modulation device 500 of this invention.

ADVANTAGE OF THE INVENTION According to this invention, the liquid crystal device which has a stable display characteristic by improving moistureproof property, and the projector provided with the said liquid crystal device as an optical modulation means can be provided, and the electro-optical device and microcomputer of high reliability by improving moistureproof property A device can be provided.

Claims (7)

A first substrate, A second substrate facing the first substrate, A liquid crystal layer disposed between the first substrate and the second substrate; A sealing material for sealing the liquid crystal layer between the first substrate and the second substrate; A molding material provided between the first substrate and the second substrate so as to cover an outer circumferential side of the sealing material; First concave-convex portions formed in the entire region of the region where the molding material is disposed in at least one substrate of the first substrate and the second substrate Has, A liquid crystal device in which the molding material is provided on the first uneven portion. The method of claim 1, A second uneven portion is formed in a region where the sealing material is disposed in at least one of the first substrate and the second substrate, The sealing material is provided on the second uneven portion. Liquid crystal device. A first substrate, A second substrate facing the first substrate, A liquid crystal layer disposed between the first substrate and the second substrate; An inorganic alignment film formed on opposite surfaces of the first substrate and the second substrate, A sealing material for sealing the liquid crystal layer between the first substrate and the second substrate; A molding material provided between the first substrate and the second substrate so as to cover an outer circumferential side of the sealing material; Has, The distance between the first substrate and the second substrate on which the molding material is disposed is narrower than the distance between the first substrate and the second substrate on which the liquid crystal layer is disposed. The method of claim 3, wherein A first holding surface on which the molding material is held on the first substrate; A second holding surface on which the molding material is held on the second substrate; With more The first holding surface and the second holding surface are inclined with respect to the substrate surface of the first substrate and the second substrate on which the liquid crystal layer is disposed. Liquid crystal device. A first substrate, A second substrate facing the first substrate, An electro-optical layer disposed between the first substrate and the second substrate; A molding material provided to surround the electro-optical layer between the first substrate and the second substrate; Concave-convex portions formed in the entire region of the region where the molding material is disposed in at least one of the first substrate and the second substrate Has, The electro-optical device provided with the said molding material on the said uneven part. Light source, Light modulation means for modulating the light of the light source; Projection means for projecting light modulated by the light modulating means Including, The light modulation means, Sealing the liquid crystal layer between a first substrate, a second substrate facing the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, and the first substrate and the second substrate And a molding material provided between the first substrate and the second substrate so as to cover an outer circumferential side of the sealing material, and a region in which the molding material is disposed on at least one substrate of the first substrate and the second substrate. It is a liquid crystal device having an uneven portion formed in the whole area of, The molding material is provided on the uneven portion Projector. A first substrate, A second substrate facing the first substrate, A device portion disposed between the first substrate and the second substrate; A molding material provided to surround the device portion between the first substrate and the second substrate; Uneven parts formed in the whole region of the area | region where the said molding material is arrange | positioned in at least one board | substrate of a said 1st board | substrate and a said 2nd board | substrate Has, The micro device in which the said molding material is provided in the said uneven part.

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