KR100761254B1 - Top plate structure of plasma display panel device and fabricating method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a top plate structure of a plasma display panel device and a method of manufacturing the same. In the related art, as the MgO protective film is formed by electron beam deposition or sputtering, the film structure is not dense and crystallinity is formed to be low. And secondary electron emission characteristics are deteriorated, and there is a problem that cracks may occur due to mismatch of thermal characteristics with the dielectric. Therefore, in the present invention, a transparent electrode patterned on the substrate; A bus electrode patterned on the transparent electrode to lower the resistance of the transparent electrode; A dielectric formed of a fluoride glass material on a front surface of the substrate including the transparent electrode and the bus electrode; By providing a top plate structure of a plasma display panel element composed of a protective film formed by deforming the surface of the dielectric by temperature, pressure and atmosphere control, and a method of manufacturing the dielectric and the surface treatment thereof, the MgO protective film has a molecular scale. As it has a dense film characteristic, the protection characteristics and secondary electron emission characteristics of the dielectric layer are improved, and a separate thin film deposition is not required to form the MgO protective film, thereby reducing the number of processes and reducing the manufacturing cost. Conditions such as the coefficient of thermal expansion, softening point, and dielectric constant required for the dielectric layer due to the formation of the MgO protective film can be alleviated, so that the protective film can be prevented from cracking when the upper and lower plates of the plasma display panel device are bonded together. There is an effect that the progress is easy.

Description

Top plate structure of plasma display panel device and its manufacturing method {TOP PLATE STRUCTURE OF PLASMA DISPLAY PANEL DEVICE AND FABRICATING METHOD THEREOF}

1 is a cross-sectional view showing a typical plasma display panel device.

Figure 2 is a cross-sectional view showing a top plate structure of the plasma display panel device according to the present invention.

Figure 3 is a flow chart of the dielectric thick film production process of fluoride glass according to the present invention.

*** Explanation of symbols for main parts of drawing ***

21: upper glass substrate 22: transparent electrode

23: bus electrode 24: dielectric

25: Shield

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a top plate structure of a plasma display panel element and a method of manufacturing the same, and more particularly, to a top plate structure of a plasma display panel element and a method of manufacturing the same, which are suitable for densely forming a top protective film to improve discharge characteristics.

In general, the plasma display panel device is a surface discharge device capable of realizing a full color matrix using phosphors, and is attracting attention as a thin display device that can replace a cathode ray tube (CRT) in the future. have. In addition, high definition and large screens are being promoted to expand the use in the field of high quality image.

As described above, a plasma display panel element used for a thin large-scale color display or the like faces a space surrounded by a partition wall separating fine discharge display cells, a back plate bonded to the bottom surface of the partition wall, and a front plate on which an image is displayed. To form a gas-tight structure by discharging a dischargeable gas such as rare gas in each space, and generating plasma through discharge in the space between the opposing electrodes, The generated vacuum ultraviolet rays emit phosphors to display an image on the front panel. However, the plasma display panel device has a low luminous efficiency, and the structure and manufacturing process are not optimized compared to the conventional cathode ray tube display device. In order to improve the plasma display panel device, a discharge method, a cell structure, a driving method, a phosphor or a protective film material and Diverse studies on dielectric materials and the like are in progress. Such a plasma display panel device will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a typical plasma display panel device, in which a lower plate of the plasma display panel device is deposited on a front surface of a lower glass substrate 1 to prevent penetration of alkali ions included in the substrate 1; ; An address electrode (3) of a discharge cell patterned in a stripe shape on the blocking film (2); A lower plate dielectric 4 formed on the entire surface of the blocking film 2 including the address electrode 3; Barrier ribs 5 formed on the lower plate dielectric 4 to isolate discharge cells; It is composed of phosphors 6 of R, G, and B colors which are separated from each other by the partition walls 5 so as to cover the side surface of the partition walls 5 and the upper surface of the lower plate dielectric 4.

On the other hand, the upper plate of the plasma display panel element is a transparent electrode 12 and a resistance value of the transparent electrode patterned on the upper glass substrate 11 in a stripe form perpendicular to the address electrode (3) Bus electrode 13 to lower the; A lower dielectric layer 14 and an upper dielectric layer 15 sequentially formed on the upper glass substrate 11 including the transparent electrode 12 and the bus electrode 13; The upper dielectric layer 15 is formed on the upper dielectric layer 15 to protect the upper dielectric layer 15 due to the plasma discharge, the upper plate is formed so that the protective film 16 is spaced apart slightly facing the lower plate. .

In the structure of the plasma display panel device as described above, the lower and upper dielectrics 14 and 15 of the upper plate affect the image quality of the displayed image and cover the transparent electrode 12 and the bus electrode 13 of the upper plate. This is of great importance as it stabilizes the plasma discharge and transmits visible light emitted from the phosphor 6. Therefore, the lower and upper dielectrics 14 and 15 of the upper plate are required to have high transmittance, high breakdown voltage, and thermal expansion coefficient matching with the upper glass substrate 11.

Therefore, conventionally, the lower dielectric 14 prevents the reaction between the transparent electrode 12 and the bus electrode 13 by applying a dielectric layer having no R ₂ O (alkali) component, and the upper portion of the lower dielectric 14 The upper dielectric 15 is a PbO-based glass powder mixed with an organic vehicle so as to have excellent smoothness and surface roughness, printed on the upper portion of the lower dielectric 14 in a paste state, and then fired as a dielectric layer. By forming, the subsequent protective film 16 can be formed uniformly.

As the lower and upper dielectrics 14 and 15 satisfying the above conditions are to be formed, the lower and upper layers are formed by forming the MgO protective film 16 by E-beam deposition or sputtering. Although the dielectrics 14 and 15 were protected from plasma, the electron-beam deposition or sputtering method for forming the MgO protective layer 16 has been performed in a vacuum apparatus, and is different from the thick film process, which is an advantage of plasma display panel device manufacturing. Inevitably, a disadvantageous process may be applied, and the MgO protective layer 16 formed as described above may have a poor structure and low crystallinity, resulting in a lower layer due to the secondary electron emission coefficient falling short of the theoretical value. And deterioration in the protection characteristics and the secondary electron emission characteristics of the upper dielectrics 14 and 15.

In addition, when the MgO passivation layer 16 is bonded to the upper plate and the lower plate of the plasma display panel device, cracking may occur due to a mismatch in thermal characteristics (thermal deformation temperature and thermal expansion coefficient) with the lower and upper dielectrics 14 and 15. have.

That is, the lower and upper dielectrics 14 and 15 are advantageous as the softening point is lower as high visible light transmittance is required. However, when the upper and lower plates of the plasma display panel element are bonded, the softening point is too low. As cracks occur, the thermal deformation temperature and thermal expansion coefficient of the lower and upper dielectrics 14 and 15 are limited to a predetermined temperature or more.

SUMMARY OF THE INVENTION The present invention has been made to solve the conventional problems as described above, and an object of the present invention is to provide a top plate structure of a plasma display panel element and a method of manufacturing the same, which can improve discharge characteristics by forming a protective film of the top plate densely. To provide.

First, the upper plate structure of the plasma display panel device for achieving the object of the present invention as described above comprises a transparent electrode patterned on the substrate; A bus electrode patterned on the transparent electrode to lower the resistance of the transparent electrode; A dielectric formed of a fluoride glass material on a front surface of the substrate including the transparent electrode and the bus electrode; The dielectric surface is characterized by comprising a protective film formed by deforming by surface treatment by temperature, pressure and atmosphere control.

In addition, a method of manufacturing a top plate of a plasma display panel device for achieving the object of the present invention as described above comprises the steps of patterning a transparent electrode on a substrate and then patterning a bus electrode on top of the transparent electrode; Making a fluoride glass containing MgO as a main component in the form of a paste or a dry film to form a dielectric thick film on the entire surface of the substrate including the bus electrode and the transparent electrode and then firing it; And transforming the surface of the dielectric thick film into an MgO protective film by controlling temperature, pressure, and atmosphere.

The upper plate structure of the plasma display panel device as described above will be described in detail with reference to the accompanying drawings.

First, FIG. 2 is a cross-sectional view illustrating a structure of an upper plate of a plasma display panel device according to the present invention. As shown in FIG. 2, a patterning pattern is formed on the upper glass substrate 21 in a stripe shape perpendicular to the address electrode (not shown) of the lower plate. The transparent electrode 22; A bus electrode 23 patterned on the transparent electrode 22 to lower the resistance of the transparent electrode 22; A dielectric 24 formed of a fluoride glass material on an entire surface of the upper glass substrate 21 including the transparent electrode 22 and the bus electrode 23; The surface of the dielectric 24 is composed of a protective film 25 formed by deformation by surface treatment.

In this case, a fluoride glass is made of, not the oxide of the general oxide glass mesh forming materials (SiO _2, B ₂ O _3, etc.), fluorides (such as _{MgF 2, CaF 2, BaF 2} , LaF 3, AlF 3, ZrF 4). Such fluoride glass is largely BeF _{2 type} , ZrF _{4 type} , AlF _{3 type} , the composition system of which Mg is a component is typically BeF ₂ -MF ₂ (M = Mg, Ca, Sr) and HF-MF ₂ (M = Mg, Ca, Sr, Ba, Pb).

In the method of manufacturing a top plate of the plasma display panel device having the structure as described above, the transparent electrode 22 is patterned on the upper glass substrate 21 and the bus electrode 23 is patterned on the transparent electrode 22. To process; MgO-based fluoride glass is formed in the form of a paste or dry film to form a dielectric film thick film on the entire surface of the upper glass substrate 21 including the bus electrode 22 and the transparent electrode 23 and then fired. Process; The surface of the thick film of the dielectric 24 is modified to the MgO protective film 25 through temperature, pressure and atmosphere control.

At this time, in order to form the thick film of the dielectric 24, as shown in the manufacturing process flow chart of Figure 3 by designing the composition for the MgO component of the fluoride glass to prepare a batch (batch) and then melted and pulverized, mixed with the vehicle Next, a paste or a dry film is formed to form a thick dielectric film 24 on the entire surface of the upper glass substrate 21 including the bus electrode 22 and the transparent electrode 23.

Then, the surface of the thick film of the dielectric 24 is transformed into the MgO protective film 25 through surface treatment for controlling process conditions such as temperature, pressure and atmosphere on the surface of the fluoride glass of the thick film of the dielectric 24 formed as described above.

That is, the fluoride glass of the thick film of the dielectric 24 maintains strong bonding by crosslinking of Mg and F, but relatively weak bonding on the surface. Therefore, when the fluoride glass surface is activated through a vacuum state and then subjected to heat treatment in a strong oxidation atmosphere, the Mg-F bond on the fluoride glass surface can be transformed into Mg-O bond.

In addition, by applying the glass to the dielectric 24, it is possible to easily implement the required physical properties such as coefficient of thermal expansion, softening point and dielectric constant by appropriate combination of the components as the composition is free to change.

As described above, the top plate structure of the plasma display panel device and the method of manufacturing the same according to the present invention form the MgO protective film by surface-treating the fluoride glass of the dense dielectric layer without pores, so that the MgO protective film has dense film characteristics on a molecular scale. The protection characteristics and the secondary electron emission characteristics of the dielectric layer are improved, and thus, the discharge characteristics are improved, and a separate thin film deposition for forming the MgO protective layer is not required, thereby reducing the number of processes and reducing the manufacturing cost. The MgO protective film can be formed to mitigate conditions such as thermal expansion coefficient, softening point, and dielectric constant required for the dielectric layer, thereby preventing cracks in the protective film when the upper and lower plates of the plasma display panel are bonded together. The overall manufacturing process is easy to proceed.

Claims (5)

A transparent electrode patterned on the substrate; A bus electrode patterned on the transparent electrode to lower the resistance of the transparent electrode; A dielectric formed of a fluoride glass material on a front surface of the substrate including the transparent electrode and the bus electrode; And a protective film formed by deforming the surface of the dielectric by temperature, pressure, and atmosphere control. The method of claim 1 wherein said fluoride glass is a mesh form material is _{MgF 2, CaF 2, BaF 2} , LaF 3, AlF 3, upper panel structure of a plasma display panel device, characterized in that any one of a ZrF ₄ fluoride. 3. The fluoride glass of claim 1 or 2, wherein the fluoride glass comprises BeF ₂ -MF ₂ (M = Mg, Ca, Sr) and HF-MF ₂ (M = Mg, Ca, Sr, Ba, Pb) A top plate structure of a plasma display panel element, characterized in that one selected from among the composition system. Patterning the transparent electrode on the substrate and then patterning the bus electrode on top of the transparent electrode; Manufacturing a fluoride glass containing MgO as a main component in the form of a paste or a dry film to form a dielectric thick film on the entire surface of the substrate including the bus electrode and the transparent electrode, and then baking it; And forming a surface of the dielectric thick film into a MgO protective film by controlling temperature, pressure, and atmosphere. The method of claim 4, wherein the MgO protective film is formed by activating the fluoride glass surface of the dielectric thick film through a vacuum state and then performing heat treatment in an oxidizing atmosphere to transform the Mg-F bond of the fluoride glass surface into Mg-O bond. A top plate manufacturing method of a plasma display panel device, characterized in that.

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