KR100741828B1 - Camera module package and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a camera module package and a method of manufacturing the same, which can prevent optical axis distortion and reduce defects related to high resolution and resolution, and can achieve miniaturization by reducing the size of the module itself, as well as the image sensor module. There is an advantage that the quality can be improved by facilitating the coupling with the housing.

According to an aspect of the present invention, there is provided a method of manufacturing a camera module package, comprising: forming an image sensor module by flip-chip bonding an image sensor to a lower portion of an FPCB having a window window and having substantially the same size as the image sensor; Attaching a fixing bracket on the FPCB of the image sensor module; Coupling an outer circumferential surface of the fixing bracket to the housing as a coupling guide, coupling the housing on which the lens is mounted with the image sensor module to which the fixing bracket is attached; And sealing a side portion of the image sensor exposed to the outside while the housing and the image sensor module are coupled to each other.

Camera module package, image sensor module, COF, housing, fixing bracket, sensor protection member

Description

Camera module package and manufacturing method {CAMERA MODULE PACKAGE AND MANUFACTURING METHOD THEREOF}

1 is a diagram of a camera module package according to a conventional COF packaging method,

FIG. 1A is a view for explaining a process by a COF packaging method and a tolerance generated when performing the process, FIG. 1B is a front view of a camera module package according to the above method, and FIG. 1C is generated by the tolerance according to the above method. A diagram showing an optical axis skew phenomenon.

2 is a front view of a camera module package according to an embodiment of the present invention.

3a and 3b is a front view and a plan view of a fixing bracket applied to the camera module package of FIG.

4 is a front view of a camera module package according to another embodiment of the present invention.

5A and 5B are a plan view and a cross-sectional view of a sensor protecting member used in the camera module package of FIG.

6 is a front view of a camera module package according to another embodiment of the present invention.

7A and 7B are a plan view and a cross-sectional view of a sensor protecting member used in the camera module package of FIG.

8 is a process cross-sectional view of the camera module package according to an embodiment of the present invention.

9 is a process cross-sectional view of a camera module package according to another embodiment of the present invention.

10 is a process cross-sectional view of a camera module package according to another embodiment of the present invention.

<Description of Major Symbols in Drawing>

10: Lens Barrel 20: Housing

30: image sensor module 31: FPCB (Flexible Printed Circuit Board)

32: Window 33: Image sensor

34: Multi Layer Ceramic Capacitor (MLCC) or Electronic Component

40: IR cut filter

50: fixing bracket 60, 70: sensor protection member

61 base 62, 72 extension

63, 73: contact portion 80: sealing resin

90: bonding means

The present invention relates to a camera module package including an image sensor module used in a digital camera, a mobile device or various monitoring apparatuses, and a method of manufacturing the same. More specifically, the optical axis is minimized by minimizing a process tolerance generated by a conventional packaging method. The present invention relates to a camera module package having a size of an image sensor and a method of manufacturing the same, which can prevent distortion, tilting and rotation, and facilitate the coupling of the image sensor module and the housing to improve quality.

Recently, due to the rapid development of information and communication technology, the improvement of data communication speed and the increase of data communication amount are realized, and the imaging devices such as CCD image sensor and CMOS image sensor are mounted on mobile electronic devices such as mobile phones and laptops. It is spread | distributing and these can transmit the image data image | photographed by the camera module besides the text data by real-time process.

In general, the packaging method of an image sensor for a camera includes a flip-chip (Chip On Flim) method, a wire bonding method of a chip on board (COB) method, and a chip scale package (CSP) method. Among them, a COF packaging method and a COB packaging method are widely used.

In particular, the bump-based COF method, which has an external projecting joint, does not require a space for attaching the wire, as compared to the COB method, which reduces the package area and reduces the height of the barrel. have. In addition, since a thin film or flexible printed circuit board (FPCB) is used, a reliable package that can withstand external shocks is possible, and the process is relatively simple. In addition, the COF system meets the trend of high-speed processing, high density, and multipinning of signals due to miniaturization and resistance reduction.

However, the COF method is concentrated in the smallest and lightest chip size wafer level package, but the process cost is high and the delivery time is unstable, and thus there is a limitation for the image sensor. In addition, the module miniaturization, which is an advantage of the COF method, cannot be used in a module that uses a mega-level or higher sensor, in which a variety of functions are added due to the single-layer structure. There was no. Currently, a double-sided flexible printed circuit board (FPCB) can be used to have a size similar to that of the COB method, but since it is less than the miniaturization of the above-described COF method, the COB method is gradually used. Design and process technology development is required to take advantage of the miniaturization of the advantage.

On the other hand, in the camera module, the light receiving surface of the image sensor mounted on the lens and the wiring board needs to be assembled so that the optical axis of the lens is accurately positioned at the center of the image sensor. However, the packaging method of the existing camera module including the COF method described above, the optical axis distortion, tilting and rotating phenomena affecting the most important image quality in the camera module through various packaging processes It is included. This adds the tolerances generated in each process and the tolerances of the components constituting the module itself, and as a result, the optical axis is greatly distorted.

Various methods have been proposed to prevent such optical axis distortion, and related arts have been disclosed, for example, in Japanese Patent Application Laid-Open No. 2004-55574, but these also have a high design difficulty and difficult management in a process of 20 μm. The situation can not be managed below.

Then, a conventional camera module using a COF method will be described with reference to the accompanying drawings and the problems thereof will be described.

1 is a view of a camera module according to a conventional COF packaging method, Figure 1a is a view for explaining a process generated by the COF packaging method and the tolerance generated during the process, Figure 1b is a camera module according to the method FIG. 1C is a front view of the package, and FIG. 1C is a view showing optical axis distortion, tilting, and rotation phenomenon caused by the tolerance according to the above scheme.

As shown in FIG. 1A, in the COF packaging method, the image sensor 320 is attached to one surface (lower surface) of the FPCB 300 having a window window through which light passing through the lens portion can pass. Next, the IR filter 330 processed to a predetermined size is attached to an opposite surface (upper surface) of one surface of the FPCB 300 to which the image sensor 320 is attached. After that, the outer circumferential surface of the IR filter 330 attached to the FPCB 300 is used as a guide surface so that the inner circumferential surfaces of the lower opening of the housing 200 including the lens unit 100 adhere to the outer circumferential surface to be in close contact with each other. .

In the COF packaging method, as shown in FIG. 1B, a side filling bonding process is required to protect the image sensor and the passive element, and in addition to the problem of increasing the overall module size, two tolerances are largely generated. There is a problem that the optical axis passing through the part is not accurately positioned on the light receiving part of the image sensor. That is, the IR filter 330 size tolerance generated when the outer circumferential surface of the IR filter 330 guiding the housing 200 and the processed IR filter 330 are attached to the FPCB 300 when the IR filter 330 is attached. IR filter position tolerance is generated because 330 is twisted and attached.

Similarly, due to the accumulation of tolerances caused by the aforementioned factors, as shown in FIG. 1C, an optical axis shifting and tilting and rotation phenomena occur in which the optical axis passing through the lens unit is spaced a predetermined distance from the pixel center of the image sensor.

Further, in the above-described conventional COF packaging method, that is, the outer peripheral surface of the IR filter attached to the FPCB as a guide surface, the inner peripheral surface of the lower opening of the housing including the lens unit is coupled to and adhered to each other in close contact with each other. Due to the IR filter attached to the FPCB, devices such as multilayer ceramic capacitors (MLCCs) cannot be mounted to be located inside the housing of the camera module, and must be mounted on the same side as the image sensor attached or outside the housing. As a result, the required size of the FPCB increases, resulting in an increase in the size of the entire image sensor module.

In addition, in the above-described conventional COF packaging method image sensor module, if the size of the camera module is limited to a certain size at the request of the user (User), it is inevitable to design the product within the size of the limited camera module In some cases, it is necessary to remove an active or passive element including a multilayer ceramic capacitor (MLCC) from the image sensor module. In this case, when the multilayer ceramic capacitor (MLCC) is removed from the image sensor module, a screen noise problem occurs, but in order to reduce the overall size of the camera module including the housing, this problem has to be taken.

Accordingly, the present invention was devised to solve the above-described problems, and can prevent optical axis distortion, thereby reducing a high resolution and resolution-related defect rate, and reducing the size of the module itself to achieve miniaturization, as well as an image sensor. It is an object of the present invention to provide a camera module package and a method of manufacturing the same, which can facilitate the coupling of the module and the housing to improve the quality.

Camera module package according to an embodiment of the present invention to achieve the above object, a plurality of lenses are mounted, the lower opening is formed housing; An image sensor for converting light passing through the lens into an image, and an FPCB formed by flip chip bonding by the image sensor and an adhesive means, substantially the same size as the image sensor, and having a window inside module; A fixing bracket attached to the FPCB of the image sensor module to couple to an inner circumferential surface of the lower opening of the housing; And an encapsulation resin applied to a side portion of the image sensor module in a state in which the housing and the image sensor module are coupled to each other.

In addition, the camera module package according to another embodiment of the present invention to achieve the above object, a plurality of lenses are mounted, the lower opening is formed housing; An image sensor for converting light passing through the lens into an image, and an FPCB formed by flip chip bonding by the image sensor and an adhesive means, substantially the same size as the image sensor, and having a window inside module; A fixing bracket attached to the FPCB of the image sensor module to couple to an inner circumferential surface of the lower opening of the housing; And a sensor protection member coupled to a combination of the housing and the image sensor module, the portion corresponding to the position of the bonding means of the image sensor module being coupled to the outer circumferential surface of the image sensor module.

Here, the FPCB is a flexible printed circuit board (RFPCB) or a double-sided flexible printed circuit board (TWO LAYERED FPCB), and includes at least one electronic component mounted on the opposite surface of the FPCB surface to which the image sensor is attached. It features.

In addition, the housing is characterized in that the infrared cut filter (IR CUT FILTER) mounted therein.

And, an infrared cut filter is attached on the opposite side of the FPCB surface to which the image sensor is attached.

In addition, the outer circumferential surface of the fixing bracket is preferably made of a shape and size corresponding to the inner circumferential surface of the lower opening of the housing to serve as a coupling guide when the housing and the image sensor module are coupled.

The sensor protecting member has a lower end that is the same as the position of the end of the image sensor, contacts the side surface of the image sensor, and has a hollow shape in which the inner surface of the upper end corresponding to the position of the bonding means is partially chamfered. Base; And a contact part extending upwardly from the base part to contact the housing.

In addition, the sensor protection member, the hollow base portion (BASE PLATE) in contact with a portion of the bottom surface of the image sensor; An extension part extending upward from the base part to be in contact with a part of the side surface of the image sensor, and having an inner side surface of the upper end part corresponding to the position of the bonding means; And a contact portion extending upwardly from the extension portion and contacting the housing.

In addition, the part where the sensor protection member and the image sensor are in contact, and the part where the sensor protection member and the housing are in contact, are preferably attached to each other and sealed at the same time by separate bonding means.

On the other hand, the camera module package manufacturing method according to an embodiment of the present invention in order to achieve the above object, the image sensor module by flip-chip bonding the image sensor, the bottom of the FPCB having a window window and substantially the same size as the image sensor module Forming a; Attaching a fixing bracket on the FPCB of the image sensor module; Coupling an outer circumferential surface of the fixing bracket to the housing as a coupling guide, coupling the housing on which the lens is mounted with the image sensor module to which the fixing bracket is attached; And sealing a side portion of the image sensor exposed to the outside while the housing and the image sensor module are coupled to each other.

In addition, the step of attaching the fixing bracket on the FPCB of the image sensor module, it is preferable to perform the alignment by the recognition mark applied on the FPCB surface.

Here, the step of sealing the side of the image sensor, it is preferable to perform by applying a sealing resin.

The sealing of the side surface of the image sensor may be performed by installing a sensor protection member, and the sensor protection member may correspond to a position of an adhesive means of the image sensor module to be coupled to an outer circumferential surface of the image sensor module. It is preferable that this part is chamfered.

Image sensor module

First, before describing the camera module package and its manufacturing method which can facilitate the coupling of the image sensor module and the housing to improve the quality, it will be described with respect to the image sensor module that can be applied to the present invention.

2 is a front view of an image sensor module and a camera module package including the same according to the present invention.

In general, the image sensor module 30 coupled to the lower opening of the housing includes an FPCB 31 having a window window 32 through which light passing through the lens part passes, and a window window 32 passing through the window window 32. And an image sensor 33 attached to the FPCB 31 for receiving and processing light. In addition, one end of the FPCB 31 is connected to a connector (not shown).

As an example of the FPCB 31, a resin substrate such as polyimide having flexibility can be used. As will be described later, when a two-layered FPCB or a flexible printed circuit board (RFPCB) is used as the FPCB 31, one surface (lower surface) of the FPCB 31 to which the image sensor 33 is attached is used. At least one electronic component 34 may be mounted on the opposite side (upper surface) of H, thereby reducing the size of the entire image sensor module.

The image sensor 33 is formed to be substantially the same size as the width of the FPCB 31 (the width of the FPCB 31 is in the range of 0 to 50㎛ larger than the width of the image sensor 33) A pixel area attached to one surface of the FPCB 31 for receiving light received from the condensing lens of the lens unit 10 and performing photoelectric conversion; and transmitting signals generated by the light receiving unit as image data, and the like. Signal processing unit (ISP). A plurality of electrode pads (not shown) are formed on one surface of the FPCB 31, and bumps are formed on the electrode pads. In this case, when the image sensor 33 is attached to the COF flip chip method, bumps and anisotropic conductive films (ACFs) or non-conductive pastes (NCPs) or protrusions protruding from the outer surface of the electrode pads may be used. It adheres using a non-conductive film (NCF). The bump may be configured of any one of a stud type bump, an electroless bump, and an electrolytic bump. Since the stud type bump may reduce the height of the bump during flip chip pressurization, the step between ceramic leads may be improved. It is also advantageous in terms of improving the reliability of the product.

On the other hand, in the image sensor module according to the present invention as described above, since the size of the image sensor 33 is generally determined according to the number of pixels, the image sensor 33 is adapted to the size of the image sensor 33 of the predetermined size. The same size of the FPCB 31 is made and attached to each other. That is, in the image sensor module applied to the present invention, the size of the FPCB is substantially the same as that of the image sensor. In this way, if the size of the FPCB 31 is formed to be the same as the size of the image sensor 33, and the cut surface of the image sensor 33 is used as a direct or indirect guide when the housing is combined, the conventional COF packaging method Two tolerances, namely the IR filter size tolerance generated when machining the outer circumferential surface of the IR filter guiding the housing, and the IR filter position generated when the processed IR filter is attached to the FPCB by twisting the attached IR filter. Due to the tolerance, it is possible to prevent the optical axis distortion, tilting and rotation phenomenon in which the optical axis passing through the lens portion is spaced a predetermined distance from the pixel center of the image sensor.

In addition, since the size of the FPCB is substantially the same as that of the image sensor, the image sensor module applicable to the present invention can reduce the size of the image sensor module and eventually reduce the size of the entire camera module package. Can be.

Furthermore, in the prior art, the outer circumferential surface of the IR filter attached to the FPCB is used as a guide surface so that the inner circumferential surfaces of the lower opening of the housing including the lens portion adhere to each other so as to be in close contact with each other. The image sensor module uses the outer circumferential surface of the image sensor itself as a guide surface for housing coupling, so that the IR filter can be mounted inside the housing or manufactured and attached to a size substantially the same as the size of the window formed on the FPCB, thereby securing design space. It is advantageous from the side. In the case of using a two-layered FPCB or a flexible printed circuit board (RFPCB) as the FPCB, a multilayer ceramic capacitor is formed on the opposite side (upper surface) of one side (lower surface) of the FPCB to which the image sensor is attached. At least one electronic component 34 such as (MLCC) may be mounted to be included in the housing, thereby reducing the size of the entire image sensor module as compared with the related art.

The electronic component 34 that may be mounted on the image sensor module 30 may include at least one multilayer ceramic capacitor (MLCC), and may further include other electronic components such as resistors, diodes, and transistors. have. Here, the multilayer ceramic capacitor (MLCC) serves to eliminate a screen noise problem occurring in the camera module, and other electronic components used elsewhere may be used for quality improvement other than the screen noise problem. In addition, as the multilayer ceramic capacitor (MLCC) has recently developed in the direction of high performance, high integration, and high speed, a thin and small package may be realized by combining a multi-chip package and a multi-layered three-dimensional stack structure rather than a single chip package.

On the other hand, in the image sensor module 30, the specific relationship between the electronic component 34 and the image sensor 33 disposed and mounted on the FPCB 31 is shown in Figure 2, the FPCB 31 An electronic component 34 including a multilayer ceramic capacitor is mounted on an upper surface of the window window 32 formed on the upper surface thereof, and an image sensor 33 is attached to the lower surface thereof. At this time, the electronic component 34 is mounted inside the surface on which the image sensor 33 is attached, that is, between the window window 32 and the outer circumferential surface of the image sensor 33 to be coupled to the housing. Preferably, the electronic component 34 is included in the housing.

Camera Module Package

Hereinafter, a description will be given of a camera module package that can facilitate the coupling of the above-described image sensor module and the housing to improve the quality.

2 is a front view of the camera module package according to an embodiment of the present invention, Figures 3a and 3b is a front view and a plan view of a fixing bracket applied to the camera module package of Figure 2, Figure 4 is another embodiment of the present invention 5A and 5B are a front view and a plan view of a sensor protecting member used in the camera module package of FIG. 4, and FIG. 6 is a view of a camera module package according to another embodiment of the present invention. 7A and 7B show a front view and a plan view of a sensor protecting member used in the camera module package of FIG. 6.

Example  One

As shown in FIG. 2, the camera module package includes a housing in which a plurality of lenses are mounted, the image sensor module described above, a fixing bracket attached to the FPCB of the image sensor module, and the housing and the image. It includes a sealing resin (sealing resin) applied to the side portion of the image sensor module in the state in which the sensor module is coupled.

In the camera module package according to the present invention, a plurality of lenses may be mounted directly inside the housing, or a lens barrel equipped with a plurality of lenses may be combined with the housing. Hereinafter, a case in which a lens barrel equipped with a plurality of lenses is combined with a housing will be described.

The lens barrel 10 functions as a lens holder and is typically formed of a resin such as polycarbonate, and has apertures and condensing on the bottom side inserted into the housing 20. A lens or the like is installed. The aperture defines a passage of light passing through the condenser lens, and the condenser lens receives light passing through the aperture to the light receiving portion of the image sensor element described later. IR coated glass is adhered to the upper surface of the lens barrel 10 to prevent foreign matter from penetrating into the aperture or the condenser lens.

The housing 20 has upper and lower openings formed therein, and the fixing bracket 50 and the image sensor module 30 combined with the lens barrel 10 in the upper opening and described later in the lower opening. Combine with An infrared cut filter (IR CUT FILTER) may be mounted inside the housing 20. Alternatively, as described above, an infrared cut filter may be attached on the opposite side of the FPCB surface to which the image sensor is attached. On the other hand, the groove may be formed on the outer peripheral surface of the lower end of the housing 20, by this groove can be engaged with the contact portion (61, 71) of the sensor protection member (60, 70) to be described later.

Since the image sensor module 30 is as described above, a detailed description thereof will be omitted.

The fixing bracket 50 is attached and fixed on the FPCB 31 of the image sensor module 30, and the image sensor module 30 to which the fixing bracket 50 is attached is the fixing bracket 50. It is inserted into the inner peripheral surface of the lower opening of the housing 20 as a coupling guide. That is, the outer circumferential surface of the fixing bracket 50 has the same shape and size as the inner circumferential surface of the lower opening of the housing 20, and when coupled, the outer circumferential surface of the fixing bracket 50 and the lower opening of the housing 20 are combined. It comes into contact with the inner circumference. The bonding may be interference fit, and preferably an adhesive may be applied to the bonding interface.

In the manufacture of the image sensor module, the image sensor 33 and the rear surface of the FPCB 31 having the same size as the image sensor is attached by pressing the adhesive means in a state of interposing the adhesive means. The image sensor 33 and the outer peripheral surface of the FPCB 31 is protruded by a predetermined length. When the image sensor module 30 including the protrusion is directly coupled and mounted to the housing 20, the coupling is impossible due to the protrusion of the adhesive means or it may cause a failure of the camera module package when it is forcibly coupled and reliability. Problems will arise. That is, the fixing bracket 50 corresponds to a means for solving the problem that may occur when the housing and the image sensor module are combined.

3A and 3B show a front view and a plan view of the fixing bracket 50 applied to the camera module package of the present embodiment, and have a frame shape formed inside thereof in a hollow shape. However, the fixing bracket 50 is not necessarily limited to a specific shape, but the outer peripheral surface of the fixing bracket 50 is coupled when the housing 20 and the image sensor module 30 are coupled to each other. In order to serve as a guide, it is sufficient that the shape and size correspond to the inner circumferential surface of the lower opening of the housing.

The encapsulating resin 80 protects a portion exposed to the outside in a state where the housing 20 and the image sensor module 30 are coupled, that is, a side surface of the image sensor module 30 from an external environment such as impact and moisture. It is a sealing material of the paste state apply | coated for that.

Example  2, 3

This embodiment includes the same configuration as in the above-described embodiment 1, except that in the first embodiment used a sealing resin 80 in a paste state to protect the side of the image sensor module 30 from the external environment. In this embodiment, there is a difference in that it uses a separate sensor protection member (60, 70).

4 is a front view of the camera module package according to the second embodiment, FIGS. 5A and 5B are plan views and cross-sectional views of the sensor protecting member used in the camera module package of FIG. 4. As shown in the figure, the sensor protection member (60, 70) is formed in a shape surrounding the side of the image sensor module 30 is coupled to the housing (20).

As shown in FIGS. 5A and 5B, the sensor protection member 60 includes a hollow base plate 61 in contact with a portion of the bottom surface of the image sensor and an upward direction from the base 61. An extension formed in contact with a part of the side surface of the image sensor 33, the inner surface of the upper end of which is partially chamfered corresponding to the position of the bonding means used for bonding the image sensor 33 to the FPCB 31; And a contact portion 63 extending upwardly from the extension portion 62 and joined to the housing 20.

Here, the base 61 serves to protect the image sensor inside the package when the package is impacted by an external drop.

FIG. 6 is a front view of the camera module package according to Embodiment 3, and FIGS. 7A and 7B show a plan view and a cross-sectional view of a sensor protecting member used in the camera module package of FIG. Similarly, as shown in the figure, the sensor protection member (60, 70) is formed in a shape surrounding the side of the image sensor module 30 is coupled to the housing (20).

As shown in Figure 7a and 7b, the sensor protection member 70 is made of a configuration in which the part serving as the shock absorber included in the first embodiment is omitted. That is, the sensor protection member 70 has a lower end portion that is the same as the end position of the image sensor 33, contacts the side surface of the image sensor 33, and has an upper end portion corresponding to the position of the bonding means. A hollow extension portion 72 having a side surface is chamfered, and a contact portion 73 extending upwardly from the extension portion 72 and bonded to the housing 20.

That is, since the portion supporting the image sensor module is the image sensor itself rather than the outer portion of the FPCB as in the prior art, there is an advantage of minimizing optical axis shift.

In addition, in the manufacture of the image sensor module, the back of the image sensor 33 and the FPCB (31) having substantially the same size as the image sensor, by pressing through the adhesive means to attach, the adhesive inserted in this process The means protrudes from the outer circumferential surface of the image sensor 33 and the FPCB 31 by a predetermined length. In the case of forcibly coupling the image sensor module 30 and the sensor protection members 60 and 70 including such protrusions, the camera module package may be defective and a reliability problem may occur. Accordingly, by forming a chamfer on the inner circumferential surface of the mounting portion, which is a corresponding position, to allow the resin component, which is a protrusion of the bonding means, to restrain the occurrence of foreign matters during assembly of the housing, and to prevent the failure of the camera module package. It is possible to manufacture a package of high reliability.

On the other hand, a portion where the sensor protection member (60, 70) and the image sensor module 30 is in contact, and a portion where the sensor protection member (60, 70) and the housing 20 are in contact with each other by separate bonding means It is sealed at the same time, it is possible to increase the package reliability.

Manufacturing Method of Camera Module Package

Hereinafter, a method of manufacturing the camera module package according to the present invention will be described with reference to FIGS. 8 to 10. 8 is a process cross-sectional view of a camera module package according to Embodiment 1 of the present invention, FIG. 9 is a process cross-sectional view of a camera module package according to Embodiment 2 of the present invention, and FIG. 10 is a camera according to Embodiment 3 of the present invention. The process cross section of a module package is shown.

8 to 10, the camera module package according to the present invention includes an image sensor module manufacturing step, an attachment step of the manufactured image sensor module and a fixing bracket, and an image to which the fixing bracket is attached. The sensor module may be divided into a coupling step between the housing and a sealing step of the image sensor module-housing assembly.

First, as shown in Figure 8 (a), as an image sensor module manufacturing step, by cutting the image sensor wafer to prepare a unit image sensor 33 of a predetermined size. At this time, the cutting tolerance of the unit image sensor 33 is cut to be 20㎛ or less in both width directions. Thereafter, an FPCB 31 having a width substantially the same as that of the image sensor 33 is prepared. The FPCB 31 is provided with a window window 32 having a predetermined size so that light received from the condenser lens of the lens barrel 10 can pass therethrough. Then, the back surface of the image sensor 33 and the FPCB 31 is attached by pressing the adhesive means through the bonding means, between the back surface of the FPCB 31 and the image sensor 33 As one of the group consisting of anisotropic conductive film (ACF), non-conductive film (NCF) and non-conductive paste (NCP) can be inserted and pressed.

On the other hand, if the IR blocking filter for blocking the infrared rays from the incident light passing through the lens unit 10 inside the housing 20, the back of the FPCB 31 of the completed image sensor module 30 An IR blocking filter may be attached to the opposite side (upper surface) of the size to cover the window window 32. The IR blocking filter is for injecting only visible light from the incident light passing through the lens unit, and unlike the prior art, the filter for blocking the IR does not serve as a guide for coupling with the housing. It does not need to be the same, so the degree of freedom in device placement is high.

In addition, if a flexible printed circuit board or a double-sided flexible printed circuit board is used as the FPCB 31, the opposite side of the rear surface of the FPCB 31 of the image sensor module, preferably the window window 32 and the image Mounting at least one or more electronic components 34 such as a multilayer ceramic capacitor may be added at a position between the outer circumferential surface of the sensor 33 and the like. As an example, a method of attaching the multilayer ceramic capacitor 34 to an opposite surface of the rear surface of the FPCB 31 may be performed by applying a solder cream to an attachment portion of the multilayer ceramic capacitor 34 and then curing it. It can be used to attach through, it is preferable to attach using a solder cream, which is less expensive to manufacture than other methods.

Next, as shown in FIG. 8 (b), the fixing bracket 50 is attached to the FPCB 31 of the image sensor module 30. A recognition mark is applied on the surface of the FPCB so that the fixing bracket 50 can be seated at the correct position.

Then, as shown in FIG. 8 (c), the image sensor module 30 and the housing 20 to which the fixing bracket 50 is attached are coupled to each other. Here, the coupling is performed by coupling the outer circumferential surface of the fixing bracket 50 to the housing 20 as a coupling guide.

Finally, as shown in FIG. 8 (d), the side surface of the image sensor exposed to the outside in the state in which the housing 20 and the image sensor module 30 is coupled.

Here, the sealing step is performed by applying the sealing resin 80 as a paste material as shown in Figure 8 (d), or solid as shown in Figure 9 and 10 It is possible to carry out by installing the sensor protection members 60, 70 as the substance in the state.

Here, in the case of using the sensor protection member (60, 70), corresponding to the position of the bonding means of the image sensor module 30 of the sensor protection member (60, 70) in order to be coupled to the outer peripheral surface of the image sensor module (30) It is preferable to chamfer a part to be done.

In addition, by sufficiently applying a separate adhesive means 90 on the side of the image sensor module 30, the adhesive means 90 is sufficiently penetrated between the sensor protection member (60, 70) and the image sensor module 30. It is preferable to seal by lifting.

As such, as a result of performing the coupling between the image sensor module 30 and the housing 20 by the fixing bracket 50 using the outer circumferential surface of the image sensor 33 as an indirect guide, the lens unit passes through the lens unit. It is possible to prevent the optical axis distortion, tilting and rotation phenomenon in which the optical axis is spaced a predetermined distance from the pixel center of the image sensor. In addition, since the housing is coupled to the outer circumferential surface of the fixing bracket 50 by using the outer circumferential surface of the image sensor 33 as an indirect guide, a camera module width larger than about 300 μm may be realized. Furthermore, the IR filter attaching step is not an essential constitution, and the number of manufacturing steps can be shortened by that, and the productivity can be improved.

On the other hand, when assembling the image sensor module 30 and the housing 20, a lens barrel 10 in which an aperture, a condenser lens, or the like is assembled from the upper opening of the housing 20 may be mounted in advance. 30) and the housing 20, after assembling the lens barrel 10 may be mounted.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, according to the camera module package and the manufacturing method thereof according to the present invention, it is possible to prevent the optical axis distortion phenomenon to reduce the high resolution and resolution-related defect rate and to reduce the size of the module itself to achieve miniaturization In addition, by facilitating the combination of the image sensor module and the housing to create an effect that can improve the quality.

Claims (13)

A housing in which a plurality of lenses are mounted and a lower opening is formed; An image sensor for converting light passing through the lens into an image, and an FPCB formed by flip chip bonding by the image sensor and an adhesive means, substantially the same size as the image sensor, and having a window inside module; A fixing bracket attached to the FPCB of the image sensor module to couple to an inner circumferential surface of the lower opening of the housing; And An encapsulation resin applied to a side portion of the image sensor module in a state in which the housing and the image sensor module are coupled; Camera module package comprising a. A housing in which a plurality of lenses are mounted and a lower opening is formed; An image sensor for converting light passing through the lens into an image, and an FPCB formed by flip chip bonding by the image sensor and an adhesive means, substantially the same size as the image sensor, and having a window inside module; A fixing bracket attached to the FPCB of the image sensor module to couple to an inner circumferential surface of the lower opening of the housing; And A sensor protection member coupled to the combination of the housing and the image sensor module, the portion corresponding to the position of the bonding means of the image sensor module being partially chamfered to couple to the outer circumferential surface of the image sensor module; Camera module package comprising a. The method according to claim 1 or 2, The FPCB is a flexible printed circuit board (RFPCB) or a double-sided flexible printed circuit board (TWO LAYERED FPCB), and comprises at least one electronic component mounted on an opposite surface of the FPCB surface to which the image sensor is attached. Camera module package. The method according to claim 1 or 2, The housing is a camera module package, characterized in that equipped with an infrared cut filter (IR CUT FILTER) therein. The method according to claim 1 or 2, Camera module package, characterized in that the infrared filter is attached on the opposite side of the FPCB surface attached to the image sensor. The method according to claim 1 or 2, The outer peripheral surface of the fixing bracket, the camera module package, characterized in that made of a shape and size corresponding to the inner peripheral surface of the lower opening of the housing to serve as a coupling guide when the housing and the image sensor module is coupled. The method of claim 2, The sensor protection member, A hollow base having the same lower end as that of the end of the image sensor, contacting a side surface of the image sensor, and having an inner surface of the upper end corresponding to the position of the bonding means; And A contact portion extending upwardly from the base portion to contact the housing; Camera module package comprising a. The method of claim 2, The sensor protection member, A hollow base portion in contact with a portion of the bottom surface of the image sensor; An extension part extending upward from the base part to be in contact with a part of the side surface of the image sensor, and having an inner side surface of the upper end part corresponding to the position of the bonding means; And A contact portion extending upwardly from the extension portion to contact the housing; Camera module package comprising a. The method according to claim 7 or 8, A portion of the sensor protection member and the image sensor contacting, and a portion of the sensor protection member and the housing contacting each other is attached to each other by a separate adhesive means and sealed at the same time. Forming an image sensor module by flip-chip bonding an image sensor to a lower portion of an FPCB having a window window and having substantially the same size as the image sensor by an adhesive means; Attaching a fixing bracket on the FPCB of the image sensor module; Coupling an outer circumferential surface of the fixing bracket to the housing as a coupling guide, coupling the housing on which the lens is mounted with the image sensor module to which the fixing bracket is attached; And Sealing a side portion of the image sensor exposed to the outside while the housing and the image sensor module are coupled; Camera module package manufacturing method comprising a. The method of claim 10, Attaching the fixing bracket on the FPCB of the image sensor module, characterized in that the camera module package manufacturing method characterized in that the alignment performed by the recognition mark applied on the surface of the FPCB. The method of claim 10, Sealing the side of the image sensor, the camera module package manufacturing method, characterized in that performed by applying a sealing resin. The method of claim 10, Sealing the side surface of the image sensor is performed by installing a sensor protection member, the sensor protection member is a portion corresponding to the position of the bonding means of the image sensor module to couple to the outer peripheral surface of the image sensor module Camera module package manufacturing method characterized in that chamfered.

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