KR100749609B1 - Photosensitive resin composition having conductive polymer - Google Patents

Abstract

A photosensitive resin composition is provided to promote discharge of static electricity and subsequently prevent damage to a thick film composition by using conductive polymers. A photosensitive resin composition comprises (A) 1-50 parts by weight of an organic binder, (B) 1-10 parts by weight of an inorganic binder, (C) 0.1-10 parts by weight of a photopolymerization initiator, (D) 1-20 parts by weight of a photopolymerizable monomer, (E) 30-90 parts by weight of conductive inorganic fillers, and (F) 0.1-30 parts by weight of conductive polymers, based on 100 parts by weight of the total photosensitive resin composition, wherein the conductive polymers is at least one selected from group consisting of Ag, Au, Cu, Al, Pt, and Ni.

Description

Photosensitive Resin Composition Having Conductive Polymer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition containing a conductive polymer, and more particularly, to promoting the discharge of static electricity by incorporating the conductive polymer in a thick film composition used in the manufacture of plasma display panels (hereinafter referred to as PDPs). The present invention relates to a photosensitive resin composition capable of preventing damage to a thick film composition caused by an electrostatic discharge phenomenon.

PDP is a device that displays characters or graphics by using light emitted from the plasma generated during gas discharge. PDP has the most suitable advantage for large-scale display among various flat panel displays such as liquid crystal display (LCD), field emission display (FED), and electroluminescence display (ELD), which are being actively studied.

The PDP can be enlarged to 40 inches or more, and CRT level colorization is possible because the ultraviolet light generated by the discharge uses a photoluminescence mechanism that stimulates the fluorescent film to emit visible light. As a self-emissive display, it has many unique advantages that cannot be found in other flat devices such as a wide viewing angle of 160 ° or more. It is a large display device for multimedia that combines the functions of next-generation high-definition wall-mounted TV, TV, and PC. Recently, interest in this has been increasing.

 The structure of the PDP is, for example, AC-type PDP. A cell structure composed of a glass substrate called a front plate composed of a transparent electrode (holding electrode) and a bus electrode, and a dielectric layer surrounding the same, and an address electrode, a dielectric layer, a partition wall, and a phosphor. The glass substrate called the back plate which has is arrange | positioned so that the electrodes of both surfaces may orthogonally cross.

PDP formed by the above method has been widely used in the multi-faceted method of manufacturing a large number of panels at once by increasing the area of one glass substrate in order to improve productivity and panel cost reduction.

As a result, the amount of charge generated during the manufacturing process increases in proportion to the size of the panel. Therefore, the static electricity removing device such as the ionizer used in the prior art reaches a limit and cannot completely remove the static electricity. Damage to the thick film composition layer has a problem that cannot be ignored as a cause of an increase in the defective rate.

Therefore, there is a need for an effort to have the photosensitive resin composition itself used for the PDP thick film composition to have a physical property capable of removing the static electricity by promoting the discharge of static electricity.

The present invention is to overcome the problems of the prior art described above, an object of the present invention is to provide a photosensitive resin composition for producing a PDP thick film that can prevent the damage of the thick film composition by promoting the discharge of static electricity.

One aspect of the present invention for solving the above technical problem, with respect to 100 parts by weight of the total photosensitive resin composition,

(A) 1 to 50 parts by weight of the organic binder;

(B) 1 to 10 parts by weight of the inorganic binder;

(C) 0.1 to 10 parts by weight of the photopolymerization initiator;

(D) 1 to 20 parts by weight of the photopolymerizable monomer;

(E) 30 to 90 parts by weight of the conductive inorganic filler;

(F) 0.1-30 weight part of electroconductive polymers, It is related with the photosensitive resin composition characterized by the above-mentioned.

Hereinafter, the present invention will be described in more detail.

     (A) organic binder

The organic binder according to the present invention serves as a structure for imparting pattern selectivity at the time of development of a monomer which is polymerized by applying ultraviolet light after applying the photosensitive resin composition to a substrate.

As the organic binder according to the present invention, a copolymer of an ethylenically unsaturated monomer having one or more carboxyl groups and another ethylenically unsaturated monomer copolymerizable with the ethylenically unsaturated monomer having the carboxyl group may be used.

 1-50 weight part of said organic binder is preferable with respect to 100 weight part of total resin compositions, More preferably, it is 5-40 weight part.

In addition, it is preferable to use the molecular weight (Mw) of the said organic binder that is 3,000-100,000, More preferably, it is 8,000-50,000.

Examples of the carboxyl group-containing ethylenically unsaturated monomers include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, and the like, and the binder resin used in the present invention includes one or more of these monomers.

As another ethylenically unsaturated monomer copolymerizable with the said carboxyl group-containing ethylenically unsaturated monomer, For example, styrene, (alpha) -methyl styrene, vinyltoluene, vinyl benzyl methyl ether, methyl acrylate, methyl methacrylate, ethyl acrylate, Ethyl methacrylate, butyl acrylate, and the like, and the carboxyl group-containing acrylic binder resin used in the present invention contains at least one of these monomers.

At this time, the weight ratio of the carboxyl group-containing ethylenically unsaturated monomer is preferably 5 to 50%, more preferably 10 to 40% of the total copolymer.

(B) inorganic binder

The inorganic binder according to the present invention, when the photosensitive resin composition is electrically conductive, promotes the sintering of the conductive component to serve to provide adhesion to the substrate.

Examples of the inorganic binder include Pb oxides, Bi oxides, and Zn oxides, and preferably 1 to 10 parts by weight, more preferably 2 to 6 parts by weight, based on 100 parts by weight of the total photosensitive resin.

(C) photopolymerization initiator

As the photopolymerization initiator according to the present invention, an acetophenone compound, a benzophenone compound, a thioxanthone compound, a benzoin compound, a triazine compound, or the like may be used to impart photosensitivity to ultraviolet rays to the resin composition.

Specific examples of the acetophenone-based compound include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylproriophenone and pt-butyltrichloroacetophenone and pt-butyldichloroacetophenone.

The benzophenone compounds include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, and acrylated benzophenone.

Examples of the thioxanthone compound include thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, and 2,4-diethyl thioxanthone.

The benzoin-based compound includes benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and the like.

Examples of the triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, and 2- (3 ', 4'-dimeth Methoxy styryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxy naphthyl) -4,6-bis (trichloromethyl) -s-triazine and the like have.

As the photopolymerization initiator according to the present invention, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, biimidazole compounds, and the like may also be used.

It is preferable that the usage-amount of the said photoinitiator is 0.1-10 weight part with respect to 100 weight part of all resin compositions.

(D) photopolymerizable monomer

The photopolymerizable monomer according to the present invention is polymerized by free radicals generated from the photopolymerization initiator to impart selectivity during development, and monomers generally used in the photosensitive resin composition are used.

As said monomer, for example, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol di Acrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, and the like.

It is preferable that the usage-amount of the said photopolymerizable monomer is 1-20 weight part with respect to 100 weight part of all resin compositions.

(E) Conductive Inorganic Filler

The conductive inorganic filler according to the present invention serves as an electrode after firing, and in general, Ag, Au, Cu, Al, Pt, Ni, and the like may be used, and 30 to 90 weight parts based on 100 parts by weight of the total resin composition. It is preferable that it is denier, More preferably, it is 40-80 weight part.

(F) conductive polymer

As the conductive polymer according to the present invention, one or more selected from the group consisting of polyaniline-based, polythiophene-based, polyisothianaputene-based, polyacene-based, and polypyrrole-based polymers may be used.

By adding the conductive polymer, the static electricity generated during printing, exposure, and development of the thick film composition is mobilized by a discharge method such as ionizer, earth, and the like to make it easy to discharge.

It is preferable that the usage-amount of the said conductive polymer is 0.1-30 weight part with respect to 100 weight part of all resin compositions. If the amount is less than 0.1 part by weight, the above effect is difficult to expect, and when used in excess of 30 parts by weight, the formation of a pattern may be difficult or the conductivity of the formed electrode may be degraded.

A certain amount of other additives such as surfactants, antioxidants, stabilizers, etc. may be added to the composition of the present invention within a range that does not impair the physical properties of the composition.

Hereinafter, the present invention will be further illustrated by the following examples, but the following examples are only specific examples of the present invention and are not intended to limit or limit the protection scope of the present invention.

EXAMPLE

In the embodiment of the present invention, the specifications of each of the compositions used to prepare the photosensitive resin composition are as follows.

* Binder resin

2,2,4-trimethyl-1,3-pentadiol monoisobutylate solution of a copolymer of methyl methacrylate and methacrylic acid and a copolymer of butyl methacrylate and methacrylic acid (molecular weight: 10,000, amount used: 24 g)

* Inorganic binder

 Borosilicate frit fine powder (softening temperature: 431 ° C, average particle diameter: 1.2 micrometers, consumption: 3 g)

* Photopolymerization initiator

0.5 g of 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropion 1-one

* Photopolymerization monomer

7 g of trimethylpropane trialkylate

* Conductive element

-Ag powder: spherical type, specific surface area 0.44 m2 / g, tap density 5 g / ml, average particle size 1.8 micrometer, 65 g

0.3 g conductive polymer

<Example 1>

After mixing and stirring the composition ratios as shown in Table 1 above, the mixture is kneaded by a roll mill. The resin composition prepared as mentioned above is apply | coated with a fixed film thickness on a glass substrate with a 325 mesh screen using a screen printer (after drying: about 11 micrometers). The paste-coated glass substrate is dried on a hot plate at 80 ° C or 90 ° C for 10 minutes to obtain a dry film.

The half-life of the charge voltage and the voltage after the start of discharge with respect to the glass substrate on which the dry film was formed is shown in Table 1 below.

<Example 2>

Except that the kind of the conductive polymer was changed, the half life of the charge voltage and the voltage after the discharge start were measured by the same method as in Example 1, and the results are shown in Table 1 below.

<Comparative Example 1>

Except that the conductive polymer was not added, the half life of the charging voltage and the voltage after the start of discharge were measured by the same method as in Example 1, and the results are shown in Table 1 below.

TABLE 1

* Property measurement method

-Charge amount: Measured using static electricity meter (Shishido Electro Static.Ltd, S-5109).

Initial charge potential half-life: measured using an electrostatic meter (Shishido Electro Static.Ltd, S-5109)

The photosensitive resin composition according to the present invention can significantly improve the discharge rate after charging of the static electricity formed in the PDP thick film layer by containing the conductive polymer in the resin composition, thereby producing a PDP with a large area of the glass substrate. It can bring about an effect of greatly reducing the defective rate associated with the charging of the phase.

Claims (4)

Based on 100 parts by weight of the total photosensitive resin composition, (A) 1 to 50 parts by weight of the organic binder; (B) 1 to 10 parts by weight of the inorganic binder; (C) 0.1 to 10 parts by weight of the photopolymerization initiator; (D) 1 to 20 parts by weight of the photopolymerizable monomer; (E) 30 to 90 parts by weight of the conductive inorganic filler; (F) 0.1-30 weight part of conductive polymers, The photosensitive resin composition characterized by the above-mentioned. The photosensitive resin composition of claim 1, wherein the conductive polymer is at least one selected from the group consisting of polyaniline-based, polythiophene-based, polyisothianaputene-based, polyacene-based, and polypyrrole-based polymers. The photosensitive resin composition according to claim 1, wherein the conductive inorganic filler is at least one selected from a group of Ag, Au, Cu, Al, Pt, and Ni. The thick film for plasma displays manufactured using the photosensitive resin composition of any one of Claims 1-3.