KR100723882B1 - 실리콘 나노점 박막을 이용한 실리콘 나노와이어 제조 방법 - Google Patents
실리콘 나노점 박막을 이용한 실리콘 나노와이어 제조 방법 Download PDFInfo
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- KR100723882B1 KR100723882B1 KR1020060053896A KR20060053896A KR100723882B1 KR 100723882 B1 KR100723882 B1 KR 100723882B1 KR 1020060053896 A KR1020060053896 A KR 1020060053896A KR 20060053896 A KR20060053896 A KR 20060053896A KR 100723882 B1 KR100723882 B1 KR 100723882B1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 183
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 176
- 239000010703 silicon Substances 0.000 title claims abstract description 176
- 239000002070 nanowire Substances 0.000 title claims abstract description 66
- 239000002096 quantum dot Substances 0.000 title claims abstract description 55
- 239000010409 thin film Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 22
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000006911 nucleation Effects 0.000 claims abstract description 14
- 238000010899 nucleation Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000007740 vapor deposition Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract description 21
- 229910052751 metal Inorganic materials 0.000 abstract description 21
- 239000003054 catalyst Substances 0.000 abstract description 20
- 239000007789 gas Substances 0.000 description 24
- 239000011863 silicon-based powder Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000002114 nanocomposite Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- -1 silicon ions Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- C—CHEMISTRY; METALLURGY
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
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- H—ELECTRICITY
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- Y10S977/00—Nanotechnology
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Abstract
Description
Claims (9)
- 기판 상에 실리콘 나노점을 갖는 실리콘 나노점 박막을 형성하고; 및상기 실리콘 나노점을 핵생성층으로 하여 상기 실리콘 나노점 박막 상에서 실리콘 나노 와이어를 성장시키는 것을 포함하여 이루어지는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제1항에 있어서, 상기 실리콘 나노점 박막은 실리콘 질화물 기저체 내에 형성된 실리콘 나노점을 포함하여 형성되는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제1항에 있어서, 상기 실리콘 나노점은 결정 또는 비정질인 것을 특징으로 하는 실리콘 나노와이어 제조 방법.
- 제1항에 있어서, 상기 실리콘 나노와이어는 열화학기상증착법에 의하여 성장시키는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 기판 상에 복수개의 실리콘 나노점들의 표면을 노출하면서 실리콘 나노점 박막을 형성하고; 및상기 노출된 실리콘 나노점들을 핵생성층으로 하여 상기 실리콘 나노점들마 다 하나씩 실리콘 나노와이어를 성장시키는 것을 포함하여 이루어지는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제5항에 있어서, 상기 실리콘 나노점 박막은 실리콘 질화물 기저체 내에 형성된 실리콘 나노점을 포함하여 형성되는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제5항에 있어서, 상기 실리콘 나노점 박막은 상기 기판 상에 5nm 이하의 직경 및 1012 개수cm-2 이상의 면밀도로 형성하고, 상기 실리콘 나노와이어는 상기 실리콘 나노점들마다 10nm 이하의 직경을 갖게 성장시키는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제5항에 있어서, 상기 실리콘 나노와이어는 외벽에 산화층이 형성되더라도 직경이 10nm 이하로 형성하는 것을 특징으로 하는 실리콘 나노와이어의 제조 방법.
- 제5항에 있어서, 상기 실리콘 나노점 박막은 상기 기판 상의 실리콘 질화물 기저체 내에 형성된 실리콘 나노점을 포함하여 형성하고, 상기 실리콘 나노와이어는 상기 실리콘 질화물 기저체 내의 실리콘 나노점을 핵생성층으로 하여 상기 실리콘 질화물 기저체를 제외한 상기 실리콘 나노점 박막 상에서만 성장시키는 것을 특 징으로 하는 실리콘 나노와이어의 제조 방법.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060053896A KR100723882B1 (ko) | 2006-06-15 | 2006-06-15 | 실리콘 나노점 박막을 이용한 실리콘 나노와이어 제조 방법 |
EP06824015A EP2036117A4 (en) | 2006-06-15 | 2006-12-08 | METHOD FOR MANUFACTURING SILICON NANOWIRES USING QUINTIC SILICON POINT THIN FILM |
US12/304,737 US7985666B2 (en) | 2006-06-15 | 2006-12-08 | Method of manufacturing silicon nanowires using silicon nanodot thin film |
PCT/KR2006/005309 WO2007145407A1 (en) | 2006-06-15 | 2006-12-08 | Method of manufacturing silicon nanowires using silicon nanodot thin film |
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KR1020060053896A KR100723882B1 (ko) | 2006-06-15 | 2006-06-15 | 실리콘 나노점 박막을 이용한 실리콘 나노와이어 제조 방법 |
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KR100723882B1 true KR100723882B1 (ko) | 2007-05-31 |
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KR1020060053896A KR100723882B1 (ko) | 2006-06-15 | 2006-06-15 | 실리콘 나노점 박막을 이용한 실리콘 나노와이어 제조 방법 |
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US (1) | US7985666B2 (ko) |
EP (1) | EP2036117A4 (ko) |
KR (1) | KR100723882B1 (ko) |
WO (1) | WO2007145407A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8513101B2 (en) | 2009-02-25 | 2013-08-20 | Samsung Electronics Co., Ltd. | Method of synthesizing nanowires |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100698014B1 (ko) * | 2004-11-04 | 2007-03-23 | 한국전자통신연구원 | 발광 소자용 실리콘 질화막, 이를 이용한 발광 소자 및발광 소자용 실리콘 질화막의 제조방법 |
KR101345432B1 (ko) * | 2007-12-13 | 2013-12-27 | 성균관대학교산학협력단 | 무촉매 단결정 실리콘 나노와이어의 제조방법, 그에 의해형성된 나노와이어 및 이를 포함하는 나노소자 |
FR2945891B1 (fr) * | 2009-05-19 | 2011-07-15 | Commissariat Energie Atomique | Structure semiconductrice et procede de realisation d'une structure semiconductrice. |
US8895844B2 (en) | 2009-10-23 | 2014-11-25 | The Board Of Trustees Of The Leland Stanford Junior University | Solar cell comprising a plasmonic back reflector and method therefor |
WO2011050179A2 (en) * | 2009-10-23 | 2011-04-28 | The Board Of Trustees Of The Leland Stanford Junior University | Optoelectronic semiconductor device and method of fabrication |
US8318604B2 (en) * | 2009-11-23 | 2012-11-27 | The Board Of Trustees Of The Leland Stanford Junior University | Substrate comprising a nanometer-scale projection array |
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---|---|
EP2036117A4 (en) | 2012-09-19 |
EP2036117A1 (en) | 2009-03-18 |
WO2007145407A1 (en) | 2007-12-21 |
US7985666B2 (en) | 2011-07-26 |
US20090325365A1 (en) | 2009-12-31 |
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