KR100709339B1 - lower plate structure of display panel for discharge, method for manufacturing the same and structure of display panel for discharge - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0002] The present invention relates to a display panel using a discharge, and more particularly, to a display panel for a discharge which is simple in manufacturing and capable of achieving a highly efficient discharge effect. To this end, the present invention has a structure in which a substrate is first etched to form a barrier rib, and then an electrode is formed between the barrier rib and the barrier rib. Therefore, at the time of manufacturing the display panel using the discharge according to the present invention, it is possible to lower the firing temperature for forming the electrode and the dielectric layer, and it is also possible to easily manufacture the panel according to the previously designed pattern, There is an advantage.

Plasma display panel

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a lower panel structure of a display panel using a discharge, a manufacturing method thereof, and a structure of a display panel using discharge,             

1 is a structural view of a display panel using general discharge,

2 is a structural view of a display panel using discharge according to the first embodiment of the present invention;

3 is a structural view of a display panel using a discharge according to a second embodiment of the present invention.

4 is a process diagram illustrating a process of manufacturing a lower substrate of a display panel using a discharge according to the present invention.

Description of the Related Art [0002]

10, 100, 300: lower substrate 15, 110, 310:

20, 40, 115, 130, 315, 330: dielectric layer 25, 120, 320:

30, 105, 305: barrier ribs 35, 125, 325:

45, 135, 340: upper electrode 50, 140, 345:

The present invention relates to a display panel using a discharge, and more particularly, to a display panel using a discharge capable of achieving a simple and easy-to-discharge effect.

Plasma display panels are the most common display panel for discharge. In the following description, a plasma display panel will be described as an example of the discharge panel for the discharge.

The plasma display panel is a flat panel display device in which a sustain electrode and an address electrode are formed in a matrix form between an upper plate and a lower plate to drive a pixel, and an image is realized using ultraviolet rays generated by discharging between the electrodes.

Recently, plasma display panels are attracting attention as new players in the display market. This is because the plasma display panel is suitable for a large-size screen, and can be used as a wall-hanging display due to its thin thickness. Particularly, it is a display device having a memory function and is a unique display device capable of displaying moving images by self- Because.

Next, a structure of a display panel for a conventional discharge will be described.

1, a pair of sustain electrodes 45 having a predetermined width and height are formed on the same surface of the upper substrate 50, and the sustain electrodes 45 ) Is formed on the dielectric layer 40 for preserving excited charges at the time of discharging so that the discharge can be performed even at a low voltage of the liquid crystal display device. A protective layer 35 is formed on the dielectric layer 40.

As shown in FIG. 1, the lower substrate structure of the conventional plasma display panel is formed by selectively selecting each unit cell on the lower substrate 10 and forming an address electrode 15 for inducing an initial discharge A dielectric layer 20 for insulation is formed on the address electrode 15 and a discharge space is formed on the dielectric layer 20 to prevent crosstalk between adjacent cells. A phosphor layer 30 of R, G, and B fluorescent material for generating visible light by ultraviolet rays generated by discharge on the sidewalls of the barrier rib 30 and the dielectric layer 20, 25 are formed.

A discharge space 55 for discharging is formed between the lower substrate and the upper substrate. A gas for discharge such as neon gas, xenon gas, and helium gas is injected into the discharge space 55. A lower surface of the upper substrate is closely adhered to an upper surface of the lower substrate to form a final unit cell of the plasma display panel.

In the conventional plasma display panel constructed as described above, surface discharge occurs and an image is displayed as follows.

When an initial discharge voltage is applied to the sustain electrode 45 and the address electrode 15 so as to generate a potential difference, an initial discharge occurs in the discharge space 55, Ultraviolet rays are generated as discharge occurs. At this time, the fluorescent material of the surrounding fluorescent layer 25 is excited by ultraviolet rays to perform color display.

That is, electrons existing in the discharge cell are accelerated by the applied voltage, collide with an inert mixed gas filled in the discharge cell at a pressure of about 400 to 600 Torr to generate ultraviolet rays, 25, thereby generating visible light. With this process, it is possible to display a desired image by combining a cell in which a discharge occurs and a cell in which no discharge occurs.

However, the conventional plasma display panel thus configured has the following problems.

A lower substrate of a conventional plasma display panel includes address electrodes 15 formed vertically in a stripe shape for selectively selecting cells on a lower substrate 10 made of glass, In order to protect and insulate the electrode 15, the entire surface of the electrode is coated with a dielectric layer 20. A barrier rib (30) for forming discharge spaces (55) of each cell is formed on the dielectric layer (20) at the time of discharge.

Therefore, the lower substrate of the conventional plasma display panel must have the address electrode 15 and the dielectric layer 20 formed before the barrier ribs 30 are formed on the lower substrate 10. In order to form the barrier ribs 30, the processes of printing, drying, exposure, developing, sand blasting, peeling, and firing are sequentially performed. In the firing process for forming the partition walls, The temperature had to be maintained.

On the other hand, the lower substrate 10 on which the barrier ribs 30 are formed is generally made of a transparent glass material, and in the case of the glass, there is a high possibility that deformation will occur from about 510 degrees or higher. However, since the sintering process should be performed at a temperature higher than the temperature at which the deformation of the grid occurs, the barrier ribs are formed such that warpage of the lower substrate 10 made of the glass occurs during the high temperature firing process for forming the barrier ribs 30 It can not be prevented.

Such a distortion of the substrate causes a problem that the position of the address electrode 15 already formed on the substrate before the formation of the barrier rib is deformed in the previously designed pattern.

In order to uniformly discharge the discharge space between the cells, the plasma display panel must align the center of the barrier ribs and the address electrodes formed on the panel as precisely as possible. However, due to the deformation of the position of the address electrode as described above, there arises a problem in alignment, which causes a problem that the process yield is lowered and the manufacturing cost is increased.

Also, since the substrate is warped due to the high firing process, there arises a problem that the structure of all the functions such as the barrier rib, the address electrode, and the dielectric layer is deviated from the designed pattern. Therefore, it is very difficult to adjust the alignment of the fluorescent layer to be formed by adjusting the alignment of the address electrode and the alignment layer on the upper part of the barrier rib.                         

Particularly, in a plasma display panel having a very high resolution, the space between the barrier ribs is very accurately patterned. If the electrode is not formed to meet the patterning, it is impossible to obtain a uniform discharge space between the cells There arises a problem that high resolution to be obtained can not be obtained.

In addition, the formation of the address electrodes 15 and the dielectric layer 20 on the lower substrate 10 is generally possible at about 500 degrees or less. However, since the address electrodes 15 and the dielectric layer 20 are formed on the lower substrate 10 before the barrier ribs 30 are formed, There has arisen a problem that a high temperature (about 550 deg.

Accordingly, an object of the present invention is to provide a structure of a lower substrate of a display panel and a method of manufacturing the same using a discharge capable of preventing a change in position of elements (layers) constituting each discharge cell due to warpage of warp and solving an unnecessary high temperature process have.

It is another object of the present invention to provide a structure of a display panel using a discharge capable of preventing a change in position of elements (layers) constituting each discharge cell due to warping of a grid and solving an unnecessary high temperature process.

According to an aspect of the present invention, there is provided a lower substrate structure of a display panel using a discharge, comprising: a barrier rib formed integrally with a substrate; address electrodes formed on a discharge space surface between the barrier ribs; And a fluorescent layer which is applied while leaving a part of the upper portion of the inner wall of the dielectric layer. The address electrode is formed of Au / Al and then converted into AL203 using an anodic oxidation technique to selectively provide the dielectric layer .
According to another aspect of the present invention, there is provided a plasma display panel comprising: a lower plate of the display panel of claim 1; and an upper plate closely attached to the upper surface of the lower plate and having a pair of sustain electrodes for inducing surface discharge.
According to another aspect of the present invention, there is provided a plasma display panel comprising: a lower plate of the display panel of claim 1; and an upper plate closely attached to the upper surface of the lower plate and having discharge electrodes for guiding opposite discharge on the lower surface.

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According to another aspect of the present invention, there is provided a method of manufacturing a lower substrate of a display panel using a discharge, comprising: forming a plurality of barrier ribs integrally with a substrate; forming an address electrode between the barrier ribs; And applying a fluorescent layer to a portion of the upper portion of the inner wall of the dielectric layer, wherein the dielectric layer is formed of Au / Al and then changed to AL203 by anodic oxidation.

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Hereinafter, a display panel using a discharge according to the present invention will be described in detail with reference to the accompanying drawings.

2 illustrates a structure of a display panel using a discharge according to the first embodiment of the present invention.

The display panel using the discharge shown in the first embodiment of the present invention includes a pair of sustain electrodes 135 on the upper substrate 140 to perform surface discharge.

A pair of sustain electrodes 135 having a predetermined width and height are formed on the same surface of the upper substrate 140 and a dielectric layer 130 for insulating the sustain electrodes 135 is formed. The upper panel plasma display panel is formed as a protective layer 125 for protecting the panel 130 and prolonging the life of the panel.

The sustain electrode 135 is formed to maintain sustained discharge after the initial discharge. The dielectric layer 130 is formed so as to conserve charges excited during discharging so as to cause a redischarge even at a low voltage in sustain discharge. The protective layer 125 is formed to prevent damage to the electrodes and the like due to strong discharge and to release secondary electrons.

The lower panel structure of the plasma display panel according to the first embodiment of the present invention is formed by etching a lower substrate 100 made of a transparent glass material to secure a uniform discharge space and prevent cross- 105 are formed first. In other words, the barrier ribs 105 may be directly etched on the lower substrate 100 to be integrated with the substrate.

The address electrodes 110 are formed by coating a predetermined number of the inner walls between the barrier ribs and the barrier ribs. A dielectric layer 115 is formed on the address electrode 110 to cover the address electrode 110 as a whole.

In addition, a fluorescent layer 120 is formed on the dielectric layer 115. The fluorescent layer 120 is applied in a state in which a part of the upper portion of the inner wall of the dielectric layer 115 is left without applying the dielectric layer 115 as a whole. Accordingly, discharge is induced between the address electrode 110 opened from the upper fluorescent layer 120 of the barrier ribs 105 and the sustain electrode 135 on the upper substrate.

The address electrodes 110 are formed to selectively select each unit cell and to induce an initial discharge. The fluorescent layer 120 is formed of R, G, and B fluorescent materials to emit visible light by ultraviolet rays generated by a discharge.

Particularly, in applying the address electrodes 110, the dielectric layer 115, and the fluorescent layer 120 between the barrier ribs 105 and the barrier ribs, the lower substrate 100 according to the first embodiment of the present invention may be formed as a single- About 80% from the top, and the remaining space is allocated to the discharge space. Therefore, in the lower panel structure of the present invention, the address electrodes 100 and the dielectric layer 115 formed between the barrier ribs 105 and the barrier ribs 105 are preferably concave as shown in FIG.                     

A method of manufacturing the plasma display panel according to the first embodiment of the present invention will now be described.

4 is a manufacturing process diagram for manufacturing a lower plate of a plasma display panel according to the present invention.

A transparent glass material is processed / cleaned to produce a lower substrate 100 having a desired size (operation 500). The barrier ribs 105 are formed by etching the lower substrate 100 formed in operation 500 (operation 510). The barrier ribs 105 may be formed by forming barrier ribs on the substrate 100 and then etching the barrier ribs to a desired size to form partition walls or directly etching the substrate 100 to form integral barrier ribs Do.

When the barrier ribs 105 are formed on the lower substrate 100 in step 510, a cell unit of the plasma display panel is formed. When the barrier ribs 105 are formed in step 510, the address electrodes are formed to a predetermined height from the upper portion of the substrate between the barrier ribs and the barrier ribs in step 515.

That is, in the present invention, the barrier ribs 105 are first formed on the substrate 100, and then the address electrodes 110 are formed. Therefore, in forming the address electrode 110 by using the photosensitive paste method or the pattern printing method, the firing process can be performed at about 500 degrees or less since the influence of the firing temperature of the barrier rib is eliminated.

 In addition, since the address electrodes 110 are formed after the barrier ribs 105 are formed first, the substrate is not warped in the post-electrode formation process, and no problems are caused in the alignment process of the upper and lower substrates. After the barrier ribs 105 are formed, an electrode is formed between the barrier ribs to facilitate the process of forming the electrodes.

Next, a dielectric layer for applying the address electrode as a whole is formed on the address electrode 110 (operation 520). At this time, the address electrode 110 may be formed of Au / Al and then converted into Al 2 O 3 by anodic oxidation to be used as a dielectric layer. Also, during the firing process for forming the dielectric layer 115, it is possible to perform the process at about 400 degrees, unlike the conventional method. This is because the process of forming the dielectric layer 115 is performed after the barrier ribs are formed, so that they are not affected by the temperature at the time of forming the barrier ribs.

As a final step of manufacturing the lower substrate, a fluorescent layer 120 is formed on the dielectric layer 115 (operation 525). At this time, a uniform thickness is applied to the inner side of the barrier rib to maximize the luminance and luminous efficiency. The fluorescent layer is formed by a screen printing method, a photosensitive paste method, a dry film method, or the like.

As shown in FIG. 2, it is preferable that the fluorescent layer 120 is applied in a state in which a part of the upper part of the partition is left so that the electrode section opened at the upper end of the partition can be held. This is for the purpose of inducing a discharge between the electrode portion where the fluorescent layer 120 is not applied and the electrode of the upper substrate.

The following describes the manufacturing process of the top plate for surface discharge.

A pair of sustain electrodes 135 having a predetermined width and height are formed on the same surface of the upper substrate 140 and a dielectric layer 130 functioning as an electrical capacitor is printed while protecting the sustain electrodes 135 A protective layer 125 for protecting the sustain electrode 135 and the dielectric layer 130 to prolong the life of the panel, and finally, an upper plasma display panel is formed.

At this time, it is also possible to form Au / Al2O3 / MgO or Au / MgO using an anodic oxidation technique after the Au / Al / Mg or Au / Mg is formed as the sustain electrode 135 to simultaneously form the dielectric layer and the protective layer will be.

When an initial discharge voltage is applied to the sustain electrode 135 and the address electrode 110 of the plasma display panel having such a structure so that a potential difference can be generated, an initial discharge occurs, and then a surface discharge Ultraviolet rays are generated. At this time, R, G, and B phosphors of the fluorescent layer 120 are excited / emitted by ultraviolet rays to perform full color display, and the desired images are displayed while these color displays are combined.

Next, FIG. 3 shows a structure of a plasma display panel according to a second embodiment of the present invention.

The plasma display panel according to the second embodiment of the present invention is a structure for facing discharge.

The lower plate structure of the plasma display panel according to the second embodiment of the present invention is the same as the structure of the first embodiment of the present invention except that a transparent ITO electrode 340 and a metal electrode The opposite discharge is performed.

In the counter discharge structure, a highly conductive bus electrode may be further formed on the ITO electrode 340 to increase the conductivity of the ITO electrode.

As described above, the display panel for discharging according to the present invention first forms barrier ribs on the lower substrate. A panel is formed by forming a discharge space between the barrier ribs and the address electrodes and the dielectric layer. Accordingly, the present invention can lower the temperature of the firing process due to the formation of the address electrodes and the dielectric layer without being affected by the firing temperature for forming barrier ribs as in the conventional art. Therefore, the present invention is advantageous in that it is possible to prevent the lower substrate from being warped by a predetermined process at a high temperature, to solve the alignment problem, and to lower the temperature during the firing process of the address electrode and the dielectric layer.

Claims (7)

A partition wall formed integrally with the substrate, An address electrode formed on a surface of the discharge space between the barrier ribs, A dielectric layer formed on the upper surface of the address electrode, And a fluorescent layer which is applied while leaving a part of the upper portion of the inner wall of the dielectric layer, Wherein the address electrode is formed of Au / Al and then converted into AL203 using an anodic oxidation technique to selectively provide the dielectric layer to the dielectric layer. delete delete A display device comprising: a lower panel of a display panel according to claim 1; And a top plate having a pair of sustain electrodes closely attached to the upper surface of the lower plate and guiding a surface discharge to the lower surface of the lower panel. A display device comprising: a lower panel of a display panel according to claim 1; And a top plate having an upper surface closely contacted with an upper surface of the lower plate and having discharge electrodes for guiding opposite discharge on the lower surface. Forming a plurality of partition walls integrally on the substrate, Forming an address electrode between the barrier ribs, Forming a dielectric layer on the address electrode, And applying a fluorescent layer to leave a portion of the upper portion of the inner wall of the dielectric layer, Wherein the dielectric layer is formed by forming the address electrode to Au / Al and then changing to AL203 by an anodic oxidation technique. delete

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