KR100705451B1 - Silver-compound paste for plasma display panel electrode - Google Patents

Abstract

The present invention relates to a silver compound paste comprising a silver salt, an amine compound, an organic silver composition composed of an organic solvent, and a mixture with an inorganic binder. The electrode obtained by forming is excellent in conductivity and has only a very simple printing and firing process without the need for a complicated exposure process such as conventional exposure and development.

Silver compound, paste, plasma display panel, electrode

Description

Silver compound paste for plasma display panel electrode

1 is a cross-sectional view showing the discharge cell structure of a conventional plasma display panel

<Description of Symbols for Main Parts of Drawings>

 1: top (front) substrate

 2: transparent electrode

 3: black layer (bus electrode)

 4: conductive layer (bus electrode)

 5: upper dielectric layer

 6: protective layer

 7: bulkhead

 8: phosphor layer

 9: lower dielectric layer

10: address electrode

11: bottom (back) substrate

The present invention relates to a silver compound paste and a plasma display panel manufactured by using the same. More specifically, the present invention relates to a silver compound paste and a PDP manufactured by using the same, which is excellent in economic efficiency because the electrode for PDP can be manufactured with excellent conductivity and simple printing method.

In short, PDP is a flat panel display device that utilizes a phenomenon in which vacuum ultraviolet rays emitted from plasma generated during discharge of an inert gas collide with phosphors and change into red, green, and blue light in the visible region, and display capacity, brightness, contrast, and afterimage. In addition, it has been widely spotlighted as a display device such as a high-definition television (HDTV) in terms of excellent display ability such as viewing angle and easy implementation of a large display device.

In general, a PDP is a structure in which a pair of electrodes regularly arranged are placed on two opposing mainly glass upper (front) and lower (back) substrates, and an inert gas such as neon, helium, and xenon is sandwiched between both substrates. Each cell is made to emit light by applying a voltage between these electrodes and discharging it in a fine cell around the electrode.

Referring to the cross-sectional view (Fig. 1) showing a discharge cell structure of a conventional PDP as follows. Looking at the upper (front) substrate 1 side, a transparent electrode 2 usually made of indium tin oxide (ITO) is attached to the upper substrate, and a bus that complements the conductivity of the transparent electrode so that the current flows smoothly. There are bus electrodes 3 and 4. The bus electrode is composed of a black layer 3 for suppressing external light reflection and improving contrast, and a conductive layer 4 made of a metal having high electrical conductivity. Above the bus electrode there is an upper dielectric layer 5 which serves to insulate the bus electrode and to accumulate wall charges on the upper substrate, and mainly magnesium oxide, which withstands the etching of the dielectric layer and induces secondary electron emission to reduce the discharge voltage. There is a protective layer 6 made of (MgO). Looking at the lower (back) substrate 11, there is an address electrode 10 that determines whether the cell is discharged by applying an addressing pulse to the corresponding cell on the lower substrate. Above the address electrode is a lower dielectric layer 5 which serves to insulate the address electrode and to accumulate wall charges of the lower substrate, and there is a partition 7 and a phosphor layer 8 thereon. The partition wall is a structure that secures the discharge space between the upper substrate and the lower substrate and prevents the red, green, and blue phosphors from mixing with each other, and the phosphors are made of red, green, blue by using vacuum ultraviolet rays generated by an inert gas as excitation sources. By emitting visible light, color-PDP is realized.

PDP electrode (bus electrode and address electrode) manufacturing method that is most widely used at present is Korea Patent Registration No. 2002-0351230, Registration No. 2006-0581971, Publication No. 2004-0030236, Publication No. 2006-0024321, Publication As disclosed in 2006-0045846 and the like, it is a photolithography method using a so-called photosensitive silver particle paste composed of silver particles, glass frit, photosensitive resins, organic solvents, and other additives. This method is most widely used because it has the advantage of precisely forming electrodes such as extremely fine lines having a width of 20 to 200 μm.

According to this method, however, the entire surface is coated with a photosensitive silver particle paste on the substrate, which consumes a lot of energy and undergoes many subsequent processes such as exposure, development, and firing. Thus, the defect rate is very high and the cost is extremely high. Due to environmental pollution, there has been an urgent need for the emergence of new technologies for forming fine PDP electrodes using very simple coating methods such as screen and offset printing.

That is, there is an urgent need for the emergence of a breakthrough technology with excellent economical efficiency by simple process and amazing material cost reduction by forming a precise PDP conductive electrode using only a very simple printing and firing process without the need for complicated processes such as exposure and development.

In order to solve the above problems, the present inventors have led to the present invention as a result of intensive studies.

In other words, the present invention provides a novel silver compound paste having excellent economical efficiency for forming a precise PDP electrode using a very simple printing and baking process without the need for complicated processes such as exposure and development.

In another aspect, the present invention is to provide a PDP electrode characterized in that the electrode is formed by coating and firing the silver compound paste on a substrate in a predetermined pattern.

In order to solve the above problems, the present invention is to provide a silver compound paste comprising a mixture of an organic silver composition and an inorganic binder composed of a silver salt, an amine compound, an organic solvent.

In addition, the present invention may optionally add 0.5 to 10 parts by weight of the resin binder with respect to 100 parts by weight of the organic silver composition optionally.

In addition, the present invention may optionally add 0.5 to 20 parts by weight of the metal powder, optionally 100 parts by weight of the organic silver composition.

In addition, the present invention may further add a black pigment 5 to 100 parts by weight based on 100 parts by weight of the inorganic binder, if necessary.

In addition, the present invention optionally has a hydroxyl group in the middle or the end of the molecular chain with respect to 100 parts by weight of the organic silver composition, carboxylic acid group, salt of carboxylic acid, sulfonic acid group, salt of sulfonic acid, phosphoric acid group, salt of phosphoric acid and amino group One or more polymers selected from vinyl chloride-based copolymers, polyesters or polyurethanes containing one or more functional groups selected from the group consisting of 0.1 to 5 parts by weight may be further added.

In another aspect, the present invention is to provide a PDP characterized in that the electrode is simply formed as compared to the conventional methods by coating the silver compound paste on a substrate in a predetermined pattern, and then calcined or directly calcined after heat treatment.

The present inventors apply a simple printing method by mixing a small amount of inorganic binder with an organic silver composition composed of silver salt, an amine compound, and an organic solvent, and serve as a binder of the inorganic binder by only firing without exposure and development processes and organic silver composition. The formation of a conductive thin film silver layer by pyrolysis of the present invention has led to the discovery that it is possible to secure excellent conductivity and excellent economic efficiency as an electrode for PDP, thereby completing the present invention. Therefore, the present invention is not a method of forming an electrode by photolithography, which has many processes such as front surface coating, exposure, development, firing, etc. of a photosensitive silver particle paste on a glass substrate, as in the conventional invention, It is characterized by the formation of a conductive electrode only by firing to ensure excellent conductivity and excellent economic efficiency.

Examples of the silver salt in the organic silver composition according to the present invention include silver oxide, silver carbonate, silver nitrate, silver carboxylated silver and lactated silver. These may be used alone or in combination of two or more thereof.

Examples of the amine compound in the organic silver composition according to the present invention include linear amines having 1 to 30 carbon atoms, alicyclic amines, heterocyclic amines, arylamines, aralkylamines, and the like, and more specifically, ammonia. , Methylamine, ethylamine, propylamine, isopropylamine, butylamine, isobutylamine, amylamine, hexylamine, heptylamine, octylamine, 2-ethylhexylamine, nonylamine, decylamine, oleylamine, di Butylamine, diamylamine, dihexylamine, diheptylamine, dioctylamine, dinonylamine, didecylamine, dioleylamine, tributylamine, triamylamine, trihexylamine, triheptylamine, trioctylamine , Trinonylamine, tridecylamine, trioleylamine, pyridine, piperidine, morpholine, aniline, benzylamine, 1-naphthylamine, N-methylbenzylamine, ethylenediamine, N-dimethylbenzylamine, N Methylethylenediamine, N-propylethylenedia , N, N-dimethylethylenediamine, and the like, and a boiling point of 10 to 150 ° C., more preferably 40 to 120 ° C., which can be easily released during heat treatment without evaporating too easily at room temperature after application, You may use these 1 type or in combination or 2 or more types.

The organic solvents in the organic silver composition according to the present invention include alcohols such as methanol, ethanol and propanol, acetones such as acetone, methyl ethyl ketone and methyl butyl ketone, cellosolves such as methyl cellosolve and ethyl cellosolve, and ethyl. Carbitols such as carbitol and propyl carbitol; acetates such as ethyl acetate and butyl acetate; lactates such as lactic acid and n-propyl lactate; hydrocarbons such as cyclohexane and toluene; and the like It is good that it is 50-300 degreeC, More preferably, it is 150-250 degreeC, You may use these 1 type or in combination or 2 or more types.

The organic silver composition in the present invention is composed of 10 to 60% by weight silver salt, 20 to 70% by weight amine compound, 20 to 70% by weight organic solvent, and the required viscosity varies depending on the coating method, Adjust

The inorganic binder in the present invention is SiO ₂ , ZnO, B ₂ O ₃ , PbO, Bi ₂ O ₃ , BaO, Al ₂ O ₃ , TiO ₂ , K ₂ O, Na ₂ O, Li ₂ O, CaO, It is composed of one or more components selected from SrO, MgO, P ₂ O ₅ , specifically, PbO-SiO _{2 type} , ZnO-SiO _{2 type} , PbO-SiO ₂ -B ₂ O _{3 type} , PbO-SiO _2- B ₂ O ₃ -ZnO-based, PbO-SiO ₂ -B ₂ O ₃ -BaO-based, PbO-SiO ₂ -BaO-ZnO-based, Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -based, Bi ₂ O _3- B ₂ O ₃ -SiO ₂ -BaO-ZnO and the like, and more specifically, 1100, 1100B, Japanese frit BR10, etc., which are glass frits containing environmentally friendly lead, are not mentioned. It is preferable that such an inorganic binder has a softening temperature of 400-600 degreeC. If the softening temperature is less than 400 ℃ flows around the electrode during firing or hinder the decomposition of the organic silver composition, if it exceeds 600 ℃ there is a possibility that the glass substrate is bent, it is not preferable. In addition, although the particle shape of an inorganic binder is not specifically limited, spherical shape is preferable and it is preferable that average particle diameter is 0.01-5.0 micrometers, Preferably it is 0.05-1.0 micrometer. If the particle size exceeds 5.0 μm, the linear silver layer after the firing may be nonuniform and the straightness may deteriorate. Such an inorganic binder newly introduced into the organic silver composition according to the present invention melts upon firing and acts as a binder of the conductive silver layer and the glass substrate to exert a role of significantly giving the silver layer an adhesion force to the glass substrate.

It is preferable to manufacture the silver compound paste in this invention by mixing 0.01-10 weight part of inorganic binders, Preferably 0.05-5 weight part with respect to 100 weight part of said organic silver compositions. If the inorganic binder content is less than 0.01 parts by weight, there is a fear that the adhesion of the conductive silver layer to the glass substrate to be formed is insufficient, and if more than 10 parts by weight, the adhesion is excellent but the conductivity may be weakened by the interference action of the inorganic binder.

In addition, the present invention may optionally add 0.5 to 10 parts by weight of the resin binder with respect to 100 parts by weight of the organic silver composition optionally. Examples of such resin binders include urethane resins, acrylic resins, epoxy resins, polyester resins, and the like, and these may be used alone or in combination. Specifically, Avecia water-soluble ester urethane resins (trade name NeoRez) and Noveon water-soluble esters may be used. And urethane resin (trade name Sancure), water-soluble ester urethane resin (Spensol L512) from DIC Corporation, and HY-570 from Airproduct, which is a hybrid type resin in which urethane and acrylic resin are mixed. Such a resin binder acts as a kind of thickener to prevent spreading during the coating of fine lines and may help adhesion to the glass substrate before firing, but when added in a large amount, the resin binder may be roughened after firing and the pinhole may be increased to impair conductivity.

In addition, the present invention optionally has a hydroxyl group in the middle or the end of the molecular chain with respect to 100 parts by weight of the organic silver composition, carboxylic acid group, salt of carboxylic acid, sulfonic acid group, salt of sulfonic acid, phosphoric acid group, salt of phosphoric acid and amino group It is also possible to further use at least one polymer selected from vinyl chloride-based copolymers, polyesters or polyurethanes containing at least one functional group selected from the group consisting of 0.1 to 5 parts by weight. In the case of further use of such a polymer, not only excellent adhesion can be imparted, but also the viscosity of the composition can be appropriately adjusted.

In the present invention, the vinyl chloride copolymer has a hydroxyl group in the middle of the molecular chain, and polyester and polyurethane have a hydroxyl group at the terminal. In the present invention, salts such as salts of carboxylic acids, salts of sulfonic acids, salts of phosphoric acid and the like are salts formed of alkali metals such as lithium, sodium, potassium or ammonium, and these salts may be used alone or in combination.

As a specific example of the vinyl chloride type copolymer which has the said hydroxyl group and contains functional groups, such as a carboxylic acid group and a salt of a carboxylic acid, a vinyl chloride-vinylacetate-hydroxyalkylacrylate-maleic acid copolymer (Nisshin Chemical company name SORBIN Grade MK6 Vinyl chloride copolymers having a hydroxyl group and containing functional groups such as sulfonic acid groups, salts of sulfonic acid, phosphoric acid groups, and salts of phosphoric acid may be obtained by the method described in detail in US Pat. No. 4,851,465. The Nihon Xeon company trade name MR-110 can be mentioned, The vinyl chloride type copolymer which has a hydroxyl group and contains an amino group can be obtained by the method as described in detail in US Pat. No. 5,418,285, As a specific example, Nisshin Chemical company name SOLBIN Grade TAO Can be mentioned.

In addition, polyesters and polyurethanes having hydroxyl groups and containing functional groups such as carboxylic acid groups, salts of carboxylic acids, sulfonic acid groups, salts of sulfonic acids, phosphoric acid groups, salts of phosphoric acid and amino groups are disclosed in Japanese Patent Publication No. 57-3134, Japanese Patent. 58-41565, Japanese Patent Publication No. 59-79427, Korean Patent Publication 1992-0004247, Korean Patent Registration No. 1999-0200003, etc., which may be obtained by the method described in detail. Specific examples include a polyurethane containing a sulfonic acid base. Toyobo Seki Co., Ltd. brand name VYLON UR-8300 is mentioned. The weight average molecular weight of the vinyl chloride-based copolymer, polyester, and polyurethane further added to the adhesive silver compound ink is preferably in the range of 50,000 to 100,000, preferably 20,000 to 50,000.

In addition, the present invention may optionally add 0.5 to 20 parts by weight of the metal powder, optionally 100 parts by weight of the organic silver composition. Specifically, the metal powder may be a metal powder having various conductivity such as silver, copper, silver coated copper, nickel, aluminum and the like, of which silver powder is preferable. The metal powder may be either spherical or flake, but spherical is preferable. Such metal powder is not preferable in view of economical efficiency when it exceeds 20 parts by weight of the metal powder with respect to 100 parts by weight of the adhesive silver compound ink. In particular, when nano-sized powder is added, the economical efficiency may be deteriorated, but the viscosity of the organic wire composition and the inorganic binder can be increased more easily than the paste composed of a mixture of the organic silver composition and the inorganic binder. It can help form.

In addition, the present invention may further add a black pigment 5 to 100 parts by weight based on 100 parts by weight of the inorganic binder, if necessary. Examples of such black pigments include oxides of Ru, Cr, Fe, Co, Mn and Cu, composite oxides thereof, carbon black, titanium black, nitrides or carbides, and these may be used alone or in combination. Moreover, it is preferable that the average particle diameter of a black pigment is 0.005-5.0 micrometers, Preferably it is 0.005-0.5 micrometer. The silver compound paste containing such a black pigment is suitable for the black layer 3 of the bus electrode shown in FIG.

Since the silver compound paste according to the present invention is usually coated on a glass substrate, a transparent electrode made of indium tin oxide, or the like, it is necessary to adjust the content of an inorganic binder, a resin binder, and the like according to the material properties of each substrate. As the printing method, any method such as screen, offset, gravure, and pletso may be used, but the offset and screen methods are preferable.

The silver compound paste in the present invention may vary somewhat depending on the printing method, but it is necessary to adjust the viscosity to 500 to 50,000 cP, preferably 1,000 to 10,000 cP. If the viscosity is less than 500 cP can not implement a precise line shape due to the spread phenomenon, if the viscosity is too high over 50,000 cP there is a fear that the line is formed rough.

In the present invention, in order to form a conductive silver layer on the glass substrate and the transparent electrode substrate, after coating the silver compound-based paste, after the first heat treatment at 100 ~ 300 ℃ by hot air oven, infrared lamp, etc. It should be through a two-step process of firing at ° C or a one-step process of firing immediately without intermediate heat treatment. This is because all the organic components except the organic solvent as well as silver are decomposed and removed during this process, so that only a pure conductive silver layer is formed. At this time, the inorganic binder is melted and acts as a binder of the conductive silver layer, the glass substrate, and the transparent electrode substrate, thereby exerting a role of significantly imparting the adhesive force to the glass substrate and the transparent electrode substrate of the silver layer. In the first step, organic solvents, organic components, etc. are suddenly evaporated and removed at a high temperature in a short time, and thus, fine bubbles or pinholes may occur in the coating film, which may cause deterioration of the electrode shape. In addition, the coating thickness is preferably 1 to 5㎛. If the treatment is less than 1㎛ it may be difficult to secure sufficient conductivity due to the interference of the non-conductive inorganic binder, if there is more than 10㎛ there is a fear that the economic efficiency worsens.

As described above, the electrode for PDP according to the present invention is coated with a silver compound paste, which is composed of a silver salt, an amine compound, an organic silver composition composed of an organic solvent, and a mixture with an inorganic binder, etc. By firing, the organic silver coarse matter is thermally decomposed to form a conductive silver layer, and the inorganic binder contributes to the adhesion between the glass substrate and the silver layer. Thus, the electrode thus obtained has excellent conductivity and very simple printing and baking without the need for complicated processes such as exposure and development. It is a revolutionary material with excellent economical efficiency, which can be usefully used for PDP electrodes.

Through the following examples will be described in more detail the present invention. The following examples are merely examples and are not limited to the examples.

The conductivity and adhesion to the electrode pattern samples prepared according to the following Examples and Comparative Examples were measured as follows.

(conductivity)

Conductivity was calculated | required by measuring the thickness and specific resistance of the obtained electrode pattern (line pattern of 50 micrometers width) layers. The thickness of the electrode pattern layer was measured by an electron microscope, and the resistivity was measured using a resistivity meter. The specific resistance was determined to be 10 μΩ · cm or more defective (X), 5 to 10 μΩ · cm normal (Δ), 2.5 to 5 μΩ · cm good (○), and less than 2.5 μΩ · cm excellent (◎).

(Adhesion)

The adhesive force is adhered to the obtained electrode pattern (line pattern having a width of 50 µm), and the adhesive tape is strongly pulled in the vertical direction to determine the adhesive force by viewing the state where the electrode pattern layer components are peeled off and transferred to the adhesive. It was judged as defect (X) when most of the electrode pattern layers were peeled and transferred, normal (Δ) when partially peeled and transferred, good (○) when extremely fine powder was peeled and transferred, and good (◎) when no peeled and transferred powder were found.

(Electrode shape)

The shape of the electrode pattern formed using the microscope was observed. The straightness, roughness, pinhole, and other shapes of the linear pattern were observed to determine a rating of 5 (bad X, normal △, good ○, excellent ◎).

Example 1

First, 40% by weight of silver oxide and 35% by weight of methanol were first added to a reactor equipped with a condenser and a stirrer, and maintained at about 20 ° C., and 25% by weight of isopropylamine was added dropwise to the solution while stirring to give a clear viscosity of 3,500 cP. Organic Silver prepared Composition A. In addition, an inorganic binder A composed of 69.2% by weight of Bi ₂ O ₃ , an average particle diameter of 1.0 μm, a softening point of 470 ° C., 11.5% by weight of SiO ₂ , 9.8% by weight of B ₂ O ₃ , 6.4% by weight of BaO, and 3.1% by weight of Al ₂ O ₃ . Ready. 0.5 parts by weight of the inorganic binder A was kneaded and mixed with 100 parts by weight of the obtained organic silver composition A to prepare a silver compound paste having a viscosity of 3,800 cP. The obtained silver compound paste was printed on an electrode pattern having a line width of 50 μm by an offset printing method on a 30 cm × 20 cm glass substrate. The obtained substrate was heat-treated at 200 ° C. for 3 minutes to form a conductive silver layer, and then fired in a 520 ° C. electric furnace for 30 minutes to obtain a conductive electrode pattern layer having a thickness of 2.3 μm. The conductivity, adhesion, and electrode shape of the obtained electrode pattern samples were measured, and the results are shown in Table 1.

Example 2

About the electrode pattern sample obtained by carrying out similarly to Example 1 except having used the silver compound type paste of the viscosity 4,100 cP manufactured by mix | blending with 1.5 weight part of inorganic binder A with respect to 100 weight part of organic silver compositions A obtained above. Conductivity, adhesion and electrode shape were measured and the results are shown in Table 1.

Example 3

About the electrode pattern sample obtained by carrying out similarly to Example 1 except having used the silver compound type paste of the viscosity 4700 cP manufactured by mix | blending in 3.0 weight part of inorganic binder A with respect to 100 weight part of organic silver compositions A obtained above. Conductivity, adhesion and electrode shape were measured and the results are shown in Table 1.

Example 4

The organic silver composition obtained in Example 1 was 44.2% by weight of Bi ₂ O ₃ having an average particle size of 1.5 μm, a softening point of 520 ° C., 20.0% by weight of SiO ₂ , 19.4% by weight of BaO, 11.1% by weight of ZnO, and B ₂ O. A silver compound paste having a viscosity of 5,200 cP prepared by blending 6.0 parts by weight of inorganic binder B composed of ₃ 5.3 wt% was prepared. The electrode compound sample obtained by conducting in the same manner as in Example 1 except that the obtained silver compound paste was printed on a transparent electrode coated with indium tin oxide on a 30 cm x 20 cm sized glass substrate in the same manner as in Example 1, Adhesion and electrode shape were measured and the results are shown in Table 1.

Example 5

3.0 parts by weight of inorganic binder A, 6.0 parts by weight of Noveon's water-soluble ester urethane resin (trade name Sancure 12954, solid content 30%, resin binder A) based on 100 parts by weight of the organic silver composition A obtained in Example 1 (1.8 parts by weight of pure resin binder) The conductivity, adhesion, and electrode shape of the electrode pattern samples obtained in the same manner as in Example 1 were measured except that the silver compound paste having a viscosity of 5,100 cP prepared by mixing with) was used, and the results are shown in Table 1. .

Example 6

The organic silver composition obtained in Example 1 was blended in an amount of 2.5 parts by weight of inorganic binder A, 7.0 parts by weight of resin binder A (2.1 parts by weight of pure resin binder), and 5.0 parts by weight of silver powder having an average particle diameter of 0.05 μm. The conductivity, adhesion and electrode shape of the electrode pattern samples obtained in the same manner as in Example 1 were measured except that the prepared silver compound paste having a viscosity of 5,800 cP was used, and the results are shown in Table 1.

Example 7

The organic silver composition obtained in Example 1 2.5 parts by weight of inorganic binder A, 10 parts by weight of resin binder A (3 parts by weight of pure resin binder), 4.0 parts by weight of silver powder having an average particle diameter of 0.02 μm, average particle diameter Conductive with respect to the electrode pattern sample obtained by carrying out similarly to Example 1 except having used the silver compound type paste of the viscosity 6,300 cP manufactured by mixing with 0.3 weight part of black pigment black 25 (Fe-Cu-Mn composite oxide) which is 0.3 micrometers. , Adhesion and electrode shape were measured and the results are shown in Table 1.

Comparative Example 1

About the electrode pattern sample obtained by carrying out similarly to Example 1 except having heat-processed the board | substrate at 200 degreeC and 3 minute (s) without coating process on a glass substrate using only the organic silver composition A obtained by the silver compound type paste as a silver compound paste, Conductivity, adhesion and electrode shape were measured and the results are shown in Table 1.

Comparative Example 2

Except for using the silver compound paste prepared by mixing the organic silver composition obtained in Example 1 with 15 parts by weight of inorganic binder A based on 100 parts by weight of the composition A, the conductivity, adhesion and The electrode shape was measured and the results are shown in Table 1.

Table 1 Results of evaluation of electrode pattern properties obtained according to Examples 1 to 7 and Comparative Examples 1,2

In Examples 1 to 3, as the content of the inorganic binder increases, the adhesion to the glass substrate increases, the electrode shape is improved, and the conductivity tends to be somewhat lowered, but the overall conductivity, adhesion and electrode shape are excellent. have. In addition, it can be seen that the inorganic binder has excellent conductivity, adhesion, and electrode shape, as can be seen in Example 4, in which the inorganic binder is coated on the transparent electrode. In addition to the inorganic binder, it can be seen in Example 5, in which a small amount of a resin binder is added, in Example 6, in which a small amount of a resin binder and nano-sized silver powder are added, and in Example 7, in which a small amount of a resin binder, nano-sized silver powder and a black pigment are added. As can be seen it has a very good conductivity, adhesion and electrode shape.

On the other hand, as shown in Comparative Example 1, when the inorganic binder is not added at all, the conductivity and the electrode shape are relatively good, but it can be seen that the adhesion is extremely poor. In addition, as can be seen in Comparative Example 2, when the inorganic binder is added in excess, the adhesion is excellent, but it can be seen that the conductivity and electrode shape is poor.

Eventually, the electrode for PDP according to the present invention is coated with a silver compound-based paste comprising a silver salt, an amine compound, an organic silver composition composed of an organic solvent, and a mixture with an inorganic binder in a predetermined pattern on a glass substrate, a transparent electrode substrate, and the like. It is obtained by forming a conductive silver layer by firing or direct firing after heat treatment. The electrode for PDP according to the present invention does not need a complicated process such as exposure and development, and thus a precise PDP electrode is formed with only a very simple printing and firing process to secure excellent economical efficiency. At the same time, it can be said to be a breakthrough as a thread that can secure adhesion and conductivity to an excellent substrate.

As described above, the present invention provides a novel silver compound paste which is very economically excellent in forming a precise PDP electrode with a very simple printing and baking process without the need for complicated processes such as exposure and development.

In another aspect, the present invention provides an electrode for PDP characterized in that the electrode is formed by coating and firing the silver compound paste on a substrate in a predetermined pattern.

Claims (19)

A silver compound paste comprising an organic silver composition composed of a silver salt, an amine compound and an organic solvent, and a mixture with an inorganic binder. The method of claim 1, The silver compound paste is a silver compound paste, characterized in that made by mixing 0.01 to 10 parts by weight of the inorganic binder with respect to 100 parts by weight of the organic silver composition. The method of claim 2, The organic silver composition is a silver compound paste, characterized in that composed of 10 to 60% by weight silver salt, 20 to 70% by weight amine compound, 20 to 70% by weight organic solvent. The method of claim 1, The silver salt is a silver compound paste, characterized in that the silver salt is at least one selected from silver oxide, silver carbonate, silver nitrate, silver carboxylated and silver lactate. The method of claim 1, The amine compound is a silver compound paste, characterized in that at least one selected from linear amine, alicyclic amine, heterocyclic amine, aryl amine, aralkyl amine having 1 to 30 carbon atoms. The method of claim 1, The organic solvent is a silver compound paste, characterized in that at least one selected from alcohols, acetones, cellosolves, carbitols, acetates, lactates, hydrocarbons. The method of claim 1, The inorganic binder is SiO ₂ , ZnO, B ₂ O ₃ , PbO, Bi ₂ O ₃ , BaO, Al ₂ O ₃ , TiO ₂ , K ₂ O, Na ₂ O, Li ₂ O, CaO, SrO, MgO, P A silver compound paste, comprising one or more components selected from ₂ O ₅ . The method of claim 7, wherein The inorganic binder is a silver compound paste, characterized in that the softening temperature is 400 ~ 600 ℃. The method of claim 8, The particle shape of the inorganic binder is spherical, the silver compound paste, characterized in that the average particle diameter is 0.01 ~ 5.0μm. The method of claim 1, The silver compound-based paste, characterized in that the resin binder is further added in 0.5 to 10 parts by weight based on 100 parts by weight of the organic silver composition. The method of claim 1, The organic silver has a hydroxyl group in the middle or terminal of the molecular chain with respect to 100 parts by weight of the composition, at least one selected from the group consisting of carboxylic acid groups, salts of carboxylic acids, sulfonic acid groups, salts of sulfonic acids, phosphoric acid groups, salts of phosphoric acid and amino groups A silver compound paste, characterized by further adding 0.1 to 5 parts by weight of at least one polymer selected from vinyl chloride copolymers, polyesters or polyurethanes containing functional groups. The method of claim 1, The silver compound-based paste, characterized in that the metal powder is further added in 0.5 to 20 parts by weight based on 100 parts by weight of the organic silver composition. The method of claim 1, The silver compound paste, characterized in that the black pigment is further added in 5 to 100 parts by weight based on 100 parts by weight of the inorganic binder. The method of claim 1, The silver compound paste, characterized in that the viscosity of the silver compound paste is 500 ~ 50,000 cP. The method of claim 10, The resin binder is a silver compound paste, characterized in that at least one selected from urethane resin, acrylic resin, epoxy resin, polyester resin. The method of claim 13, The silver compound paste, characterized in that the black pigment is at least one selected from any one of oxides selected from Ru, Cr, Fe, Co, Mn, and Cu, composite oxides thereof, carbon black, and titanium black. The method of claim 13, Silver compound paste, characterized in that the average particle diameter of the black pigment is 0.005 ~ 5.0㎛. An electrode for a plasma display panel, wherein the electrode is formed by coating the silver compound paste according to any one of claims 1 to 17 on a substrate in a predetermined pattern and firing or direct firing after heat treatment. A plasma display panel comprising an electrode for plasma display panel according to claim 18.

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