KR100585606B1 - Printed Circuit Board Supporting Unit - Google Patents

Abstract

According to the invention, the base frame; A backup table mounted to the upper and lower portions of the base frame; A first substrate support and a second substrate support provided to support a printed circuit board on the backup table; The first substrate support portion includes a first support member fixed to the backup table; A first elevating member provided to be movable up and down; A cylinder provided on said first elevating member; A rod bar installed at the rod end of the cylinder and having a pressing surface for pressing a side surface of the printed circuit board to an upper portion extending higher than a top height of the cylinder; And a first substrate guide fixed to an upper portion of the first supporting member and having a first contact portion formed at one end thereof in contact with an upper surface of the printed circuit board.

Description

Printed Circuit Board Supporting Unit

1 is an explanatory view showing, in some cross section, a schematic configuration of a conventional component supply apparatus.

FIG. 2 is an enlarged view of an enlarged view A in FIG. 1.

3 is an explanatory diagram schematically showing a device for supporting a printed circuit board according to the present invention.

4 is an enlarged view illustrating an enlarged view of a portion indicated by a reference B in FIG. 3.

Shown in FIG. 5 is a schematic enlarged cross-sectional view of the rod bar shown in FIG. 4.

<Brief Description of Major Codes in Drawings>

31. Base Frame 32. Backup Table

40. First substrate support 40 '. Second substrate support

42. Cylinder 44. Belt

49. Load Bar

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supporting a printed circuit board, and more particularly, to an apparatus for supporting a printed circuit board, in which the distance of the vertical motion trajectory of the suction nozzle can be minimized.

The apparatus for supporting a printed circuit board is an apparatus which enables the component mounting work by the suction nozzle by supporting the printed circuit board conveyed along the conveyor belt at a predetermined position. The apparatus for supporting a printed circuit board is provided on one side of the component mounter, for example, on a printed circuit board on which a component adsorption nozzle which performs a rectangular coordinate movement and a vertical movement by the operation of the robot is supported by the apparatus for supporting the printed circuit board. Allow components to be mounted on the The component adsorption nozzle repeats a process of adsorbing and mounting a component between a component supply apparatus such as a tray or a tape feeder and a printed circuit board.

1 is an explanatory view showing, in some cross section, a schematic configuration of a conventional component supply apparatus.

Referring to the drawings, a backup table 12 is provided on the upper portion of the base frame 11 to be elevated, and a substrate support 20 is provided on the surface of the backup table 12. The bush 13 is fixed to the base frame 11, and the upper end of the guide rod 14 inserted into the bush 13 is fixed to the bottom surface of the backup table 12. In addition, the rod end of the first lifting cylinder 15 fixed to the lower portion of the backup table 12 is fixed to the bottom surface of the backup table 12. Therefore, the backup table 12 can be elevated above the base frame 11 by the lifting action of the first lifting cylinder 15 and the guiding action of the bush 13 and the guide rod 14. Reference numeral 12 'denotes the position where the backup table 12 is raised.

 The substrate support 20 includes a belt (not shown) on which the printed circuit board 18 is placed, a function of pushing the printed circuit board up from the bottom to clamp it in a vertical direction, and a function of pressing the side surface to clamp it laterally. A part is provided for carrying out. In FIG. 1, reference numeral 16 denotes a second lifting cylinder, and the second lifting cylinder is for lifting up and down a lifting member (not shown) provided in the substrate support 20. The substrate support 20 will be described in more detail with reference to FIG. 2.

FIG. 2 is an enlarged view of an enlarged view A in FIG. 1.

Referring to the drawings, the supporting member 17 is fixed with respect to the backup table 12 (FIG. 1), and the lifting member 21 is provided to allow relative movement with respect to the supporting member 17. The elevating member 21 can be elevated by the second elevating cylinder 16 provided in the backup table 12 (FIG. 1). The substrate transfer belt 24 travels on the upper surface of the elevating member 21, and the printed circuit board 18 is supported on the substrate transfer belt 24. The cylinder 22 is installed at one side of the elevating member 21. The rod 26 of the cylinder 22 may press the side of the printed circuit board 18.

On the other hand, the substrate guide 23 is fixed to the upper portion of the support member 17, the substrate contact portion 23a is provided at the end of the substrate guide 23. The substrate contacting portion 23a is provided so that the upper surface of the printed circuit board 18 can contact and clamp the substrate contacting portion 23a when the elevating member 21 pushes up the printed circuit board 18.

In the apparatus for supporting the printed circuit board described with reference to FIGS. 1 and 2, the printed circuit board 18 is clamped in the vertical direction with respect to the contact portion 23a by the elevating member 21, and the cylinder 22. The component mounting work is performed in the state clamped in the horizontal direction by the rod 26 of the (). At this time, the distance that the suction nozzle 19 should move in the vertical direction is indicated by X, the distance (X) is substantially equal to the height of the contact portion 23a of the substrate guide 23. That is, in order to move from the state in which the suction nozzle 19 is in contact with the surface of the substrate and to take another component from the component supply apparatus, at least the distance X must be increased to perform a predetermined operation without interfering with the substrate guide 23. You can do it. Therefore, the height of the contact portion 23a is preferably as short as possible.

However, in practice, there is a restriction in reducing the height of the contact portion 23a, because the relative position of the cylinder 22 and the cylinder rod 26 affects the shape of the contact portion 23a. That is, since the position of the cylinder rod 26 cannot normally be positioned higher than the position of the cylinder 22, the bottom of the contact portion 23a is the difference between the top position of the cylinder 22 and the top position of the rod 26. The substrate guide 23 and the cylinder 22 will interfere with each other before the substrate 18 contacts the contact portion 23a even if the elevating member 21 is raised. Therefore, the height of the contact portion 23a should be designed to be relatively high, and accordingly, there is a problem that the distance X at which the suction nozzle should rise also increases.

 The present invention has been made to solve the above problems, an object of the present invention is to provide an improved printed circuit board support apparatus.                         

It is another object of the present invention to provide an apparatus for supporting a printed circuit board in which the moving distance of the suction nozzle can be minimized.

It is another object of the present invention to provide an apparatus for supporting a printed circuit board which enables quick operation of the suction nozzle.

In order to achieve the above object, according to the present invention,

A backup table;

A first substrate support and a second substrate support provided to support a printed circuit board on the backup table;

The first substrate support portion,

A first support member fixed relative to the backup table;

A first elevating member provided to be movable up and down;

A cylinder provided on said first elevating member;

A rod bar installed at the rod end of the cylinder and having a pressing surface for pressing a side surface of the printed circuit board to an upper portion extending higher than a top height of the cylinder;

And a first substrate guide fixed to an upper portion of the first fixing member and having a first contact portion formed at one end thereof in contact with an upper surface of the printed circuit board.

According to one aspect of the invention, the second substrate support portion, the second support member fixed to the backup table; A second elevating member installed to be elevated and provided with a pressing surface pressed against the other side of the printed circuit board; And a second substrate guide provided on an upper portion of the second supporting member, the second substrate guide having a second contact portion in contact with the upper surface of the printed circuit board.

According to another feature of the invention, the rod bar has a vertical extension portion into which the rod of the cylinder is inserted, and a horizontal extension portion formed at the free end of the pressing surface.

According to another feature of the invention, the contact portion of the substrate guide is formed at the free end of the horizontal extension is stepped.

According to another feature of the invention, the minimum distance that the suction nozzle for mounting the component on the printed circuit board is transferred in the vertical direction from the surface of the printed circuit board is a first contact formed on the free end of the first substrate support Is substantially equal to its height.

Hereinafter, with reference to an embodiment shown in the accompanying drawings the present invention will be described in more detail.

3 is an explanatory diagram schematically showing a device for supporting a printed circuit board according to the present invention.

Referring to the drawings, the apparatus for supporting a printed circuit board according to the present invention includes a base frame 31, a backup table 32 installed to be elevated on the base frame 31, and the backup table 32. The 1st board | substrate support part 40 and the 2nd board | substrate support part 40 'which are provided on it are provided. The base frame 31 is provided with a bush 31, and the upper end of the guide rod 34 inserted through the bush 31 is fixed to the bottom surface of the backup table 32. The rod of the first lifting cylinder 35 fixed to the base frame 31 is fixed to the bottom surface of the backup table 32. The backup table 32 is lifted and lowered by the lift driving action of the first lift cylinder 35 and the guide action of the bush 31 and the guide rod 34. Reference numeral 32 'denotes a virtual position where the backup table is raised.

The 1st board | substrate support part 40 is the 2nd lifting cylinder 36 provided in the backup table 32, the 1st support member 37 fixed to the backup table 32, and the said 2nd lifting cylinder 36 The 1st elevating member 41 provided so that elevating is possible is provided. A substrate transfer belt (not shown) runs on the upper surface of the first elevating member 41, and the substrate transfer belt supports the printed circuit board 38. The suction nozzle 39 may perform a component mounting operation on the printed circuit board 38.

4 is an enlarged view showing an enlarged view of the portion indicated by the reference B in FIG. 3, and shows the configuration of the first and second substrate support portions 40 and 40 'in more detail.

Referring to the drawings, the first elevating member 41 is provided so as to be able to perform a relative elevating motion with respect to the first supporting member 37. The substrate transfer belt 44 travels on the uppermost surface of the first elevating member 41. The substrate transfer belt 44 supports the printed circuit board 38 on its upper surface.

The cylinder 42 is installed on one side of the first elevating member 41. The cylinders 42 may be lifted together by the lifting motion of the first lifting member 41. A rod bar 49 is provided on the rod 46 of the cylinder 42, and the rod bar 49 moves laterally in accordance with the extension and contraction of the rod 46.

The rod bar 49 constituting one aspect of the present invention is for pressing the side of the printed circuit board 28 to clamp the printed circuit board 28 in the horizontal direction, and the uppermost position of the rod bar 49 is a cylinder. It is set higher than the uppermost position of 42. That is, as can be seen at a glance in Figure 4, the rod bar 49 has the shape of the letter "b" as a whole, the position of the portion extending in the horizontal direction by the portion extending in the vertical direction is the position of the cylinder 42 It can be seen that it is higher than the top position.

The first substrate guide 43 is provided on the first support member 37. The first substrate contact portion 43a is formed at the end of the first substrate guide 43. When the printed circuit board 38 rises due to the synergism of the first elevating member 41, the first substrate contact portion 43a contacts the lower surface of the first contact portion 43a. It can be clamped.

In the present invention, the first contact portion 43a of the first substrate guide 43 may have a short vertical height. This is because the rod bar 49 installed in the rod 46 of the cylinder 42 is placed at a position higher than the height of the cylinder 42, so that the height of the first contact portion 43a of the first substrate guide 43 can be designed. This is because it is not necessary to consider the top position of the cylinder 42, only the height of the contact 43a can be designed in consideration of the thickness of the printed circuit board 38 and the top position of the rod bar 49.

On the other hand, the configuration of the second substrate support 40 'is substantially similar to that of the first substrate support 40, but differs in that it lacks a configuration corresponding to the cylinder 42 only. The second substrate supporting portion 40 'includes a second elevating member 41' that is lifted by the third elevating cylinder 36 ', a second supporting member 37' fixed to the backup table 32, And a second substrate guide 43 'provided on the second supporting member 37'. The second lifting member 41 'is provided with a pressing surface 49' corresponding to the pressing surface 49b of the rod bar 49 (FIG. 5). Both sides of the printed circuit board are press-clamped between the pressing surface 49b of the rod bar 49 and the pressing surface 49 'integrally formed with the second elevating member 41'. In addition, a contact portion 43a 'is formed in the second substrate guide 43', which is a configuration corresponding to the contact portion 43a 'formed in the first substrate guide 43.

Referring to the operation of the substrate support shown in Figure 4 schematically. When the printed circuit board 38 placed on the substrate transfer belt 44 is transferred to the component mounting position, first, the rod 46 of the cylinder 42 is elongated so that the rod bar 49 is connected to the printed circuit board 38. It will press the side. At this time, the other side of the printed circuit board is clamped in the horizontal direction by being pressed against the load bar 49 'provided in the second substrate support portion 40'.

Next, the first elevating member 41 is raised to contact the upper surface of the printed circuit board 38 with the lower surface of the first contact portion 43a, thereby clamping in the vertical direction. The adsorption nozzle 39 can then move between the substrate surface and the component supply device to perform a predetermined component mounting operation. At this time, since the distance X that the suction nozzle 39 moves in the vertical direction substantially corresponds to the height of the first contact portion 43a, the shorter the height of the first contact portion 43a is, the more the component adsorption nozzle 39 is. The vertical movement distance X of the is also small. Thus, quick operation of the suction nozzle 39 can be ensured.

When the first elevating member 41 is raised, the second elevating member 41 'provided in the second substrate support portion 40' is also raised. The second lifting member 41 'is lifted by the third lifting cylinder 36'. The upper surface of the printed circuit board is then contacted with respect to the second contact 43a ', so that a vertical clamp with respect to the other side of the substrate can also be made.

Shown in FIG. 5 is a schematic enlarged cross-sectional view of the rod bar shown in FIG. 4.

Referring to the drawings, the rod bar 49 has a cross-sectional shape of the letter "A" as a whole, and has a vertically extending portion and a horizontally extending portion. The free end of the vertically extending portion is the pressing surface 49b, which presses and clamps the side surface of the printed circuit board. At the free end of the horizontally extending portion, a rod insertion port 49a through which the rod 46 of the cylinder 42 can be inserted is formed. In accordance with the contraction and expansion of the cylinder rod 46 inserted into the rod insertion port 49a, the rod bar 49 can move in the horizontal direction.

6 is a schematic enlarged cross-sectional view of the first substrate guide shown in FIG. 4.

Referring to the drawings, the first substrate guide 43 is also a member having a horizontally extending portion and a vertically extending portion. The vertically extending portion is fixed to the first support member 37 in FIG. 4. The free end of the horizontally extending portion is the first contact portion 43a as described above, wherein the bottom surface of the first contact portion 43a comes into contact with the upper surface of the printed circuit board. The height of the first contact portion 43a substantially corresponds to the minimum transport distance X of the suction nozzle. By minimizing the height of the first contact portion 43a, the height (ie, thickness) of the horizontally extending portion extending to the first contact portion 43a is also reduced, which may affect the rigidity of the member. Therefore, it is preferable to form the stepped portion 43b to ensure the rigidity of the portion extending horizontally with respect to the first contact portion 43a.

Shown in FIG. 7 is a schematic enlarged cross-sectional view of the elevating member shown in FIG. 4.

Referring to the drawings, a cylinder seating surface 41a on which the cylinder 42 of FIG. 4 can be seated is formed in the middle portion of the first elevating member 41, and the transfer belt shown in FIG. A belt running surface 41b on which 44 runs is formed.

In the apparatus for supporting a printed circuit board according to the present invention, since the height of the contact portion of the substrate guide can be minimized when clamping the printed circuit board, the distance at which the suction nozzle should be moved in the vertical direction from the upper surface of the printed circuit board can be minimized. There is an advantage.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is only illustrative, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (4)

A backup table; A first substrate support and a second substrate support provided to support a printed circuit board on the backup table; The first substrate support portion, A first support member fixed relative to the backup table; A first elevating member provided to be movable up and down; A cylinder provided on said first elevating member; A rod bar installed at the rod end of the cylinder and having a pressing surface for pressing a side surface of the printed circuit board to an upper portion extending higher than a top height of the cylinder; And a first substrate guide fixed to an upper portion of the first supporting member and having a first contact portion formed at one end thereof in contact with an upper surface of the printed circuit board. The method of claim 1, The second substrate support portion, A second support member fixed relative to the backup table; A second elevating member installed to be elevated and provided with a pressing surface pressed against the other side of the printed circuit board; And a second substrate guide provided on an upper portion of the second supporting member, the second substrate guide having a second contact portion in contact with an upper surface of the printed circuit board. The method of claim 1, And the rod bar includes a vertical extension portion into which the rod of the cylinder is inserted, and a horizontal extension portion formed at the free end of the pressing surface. The method of claim 1, The minimum distance at which the suction nozzle for mounting the component on the printed circuit board is transferred in the vertical direction from the surface of the printed circuit board is substantially the same as the height of the first contact portion formed at the free end of the first substrate support portion. An apparatus for supporting a printed circuit board.

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