KR100518962B1 - Organic Electroluminescent Device - Google Patents

Abstract

According to the organic light emitting device having the seal pattern structure according to the present invention, by forming an additional seal pattern in the area covering the interface between the substrate and the seal pattern, the external moisture and the outside air in accordance with the thermal expansion coefficient difference between the substrate and the seal pattern It effectively prevents penetration into the inside and improves the life of the product. When applied to the dual panel organic electroluminescent device, the additional seal pattern is provided while maintaining the high opening ratio / high resolution characteristic of the dual panel method. Through the improvement of product life can be obtained, it has the advantage of increasing the product competitiveness.

Description

Organic Electroluminescent Device

The present invention relates to an organic electroluminescent device, and more particularly to a seal pattern structure of the organic electroluminescent device.

One of the new flat panel displays (FPDs), the organic light emitting display device is self-luminous and thus has a better viewing angle and contrast than the liquid crystal display device. Is also advantageous. In addition, since it is possible to drive DC low voltage, fast response speed, and all solid, it is strong against external shock, wide use temperature range, and especially inexpensive in terms of manufacturing cost.

In particular, unlike the liquid crystal display device or the plasma display panel (PDP), the deposition and encapsulation equipment are all in the manufacturing process of the organic light emitting device, and the process is very simple.

Hereinafter, FIG. 1 is a schematic cross-sectional view of a conventional organic light emitting display device, and illustrates a passive type organic light emitting display device in which a separate switching device is omitted.

As illustrated, a first electrode 12 is formed on the first substrate 10, and the organic light emitting layer 14 and the second electrode 22 are sequentially formed on the first electrode 12. An organic electroluminescent diode element (E) is formed.

In more detail, the first substrate 10 includes a display area defined as a screen realization area and a non-display area that forms a periphery of the display area. It is formed to extend to the non-display area, the organic electroluminescent layer 14 is the first and second carrier transfer layer (16, 18) and the first and second carriers 12, 22, respectively positioned at the interface contacting, Located in the interval between the 1, 2 carrier transfer layer (16, 18), it consists of red, green, blue light emitting layer (20a, 20b, 20c) arranged in sequence in the sub-pixel unit that is the smallest unit to implement the screen.

The second substrate 30 is disposed to face the first substrate 10 and to be spaced apart from the organic light emitting diode device E by a predetermined distance. The second substrate 30 is made of an encapsulation canister or glass, and has an area exposing the non-display area of the first electrode 12 described above.

The edge portions of the first and second substrates 10 and 30 are sealed by the seal pattern 50.

In this case, the second substrate 30 is disposed to be spaced apart from the above-described organic light emitting diode device E by a predetermined distance, and the separation space in the substrate is made of an inert gas or a vacuum atmosphere, and the second substrate 30 The desiccant (32; desiccant) is enclosed in the inner surface of the).

Referring to the encapsulation structure, the organic light emitting diode device E is formed on the first substrate 10, and then UV (ultraviolet) curing is performed on the edge of the first substrate 10. It is formed by a process of forming a seal pattern 50 made of a sealant, and bonding the first and second substrates 10 and 30 together.

Although not shown in detail in the drawings, an end portion of the first electrode 12 exposed to the non-display area corresponds to a pad portion I, and the pad portion I is connected to an external circuit for electrical connection with an external circuit. Is connected to the means 60.

As an example, the external circuit connection means 60 may be a flexible panel connector (FPC), a tape carrier package (TCP), or the like.

As described above, in the related art, the first substrate 10 having the organic light emitting diode device E and the second substrate 30 which is an encapsulation substrate are bonded to each other by UV (ultra violet) curing sealant. Blocking for outside air was performed.

However, the aforementioned organic electroluminescent device emits heat at the same time as light emission due to the screen driving characteristic. Accordingly, the deformation force is generated at the interface part due to the difference in the coefficient of thermal expansion of the seal pattern and the substrate, so that external moisture and external air are properly blocked. There was a problem that could not be.

In order to solve the above problems, an object of the present invention is to provide an organic electroluminescent device having a structure that can effectively prevent the penetration of external moisture and external air into the device.

To this end, the present invention is to form an additional seal pattern having a structure covering the interface between the substrate and the seal pattern for bonding to the outside of the seal pattern for bonding.

In order to achieve the above object, in a first aspect of the present invention, there is provided a substrate comprising: a first substrate having an organic electroluminescent diode element comprising first and second electrodes and an organic electroluminescent layer interposed between the first and second electrodes; A second substrate disposed to face the first substrate; A first seal pattern positioned on an edge portion of the first and second substrates to bond the first and second substrates together; An organic electroluminescent device comprising a second seal pattern formed at a region covering an interface between the first and second substrates and the first seal pattern outside the first seal pattern.

According to a second aspect of the present invention, there is provided a semiconductor device comprising: first and second substrates disposed to face each other; A thin film transistor element formed on an inner surface of the first substrate in units of subpixels, which is a minimum unit for implementing a screen; An electrical connection pattern connected to the thin film transistor element and forming a column shape; A first electrode formed on an inner surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a sub-pixel unit below the organic light emitting layer and in contact with the electrical connection pattern; A first seal pattern joining the first and second substrates at a position covering the edges of the first and second substrates; An organic electroluminescent device comprising a second seal pattern formed at a region covering an interface between the first and second substrates and the first seal pattern outside the first seal pattern.

The seal pattern inner region of the first substrate according to the first and second aspects of the present invention forms a display area, the seal pattern outer region constitutes a non-display area, and the second substrate is a non-display region of the first substrate. The non-display area of the first substrate is further provided with an external circuit connection means for connecting the organic light emitting element and the external circuit, the second seal pattern is constant with the external circuit connection means. Located apart from each other, the second seal pattern is characterized in that located in an area covering a portion of the external circuit connection means.

The external circuit connection means may be any one of a flexible panel connector (FPC) and a tape carrier package (TCP), and the first and second seal patterns may be selected from UV (ultra violet) curable resins.

The second substrate according to the first aspect of the present invention is characterized in that it is made of any one of an encapsulation canister or glass. The second seal pattern according to the first and second aspects of the present invention may be formed at a position covering the side surfaces of the first seal pattern and the second substrate on the first substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

First Embodiment

FIG. 2 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention, and shows a passive organic light emitting display device as an example.

As shown, the first substrate 110 on which the organic light emitting diode element E is formed, the second substrate 130 which is an encapsulation substrate disposed to face the first substrate 110, 2. In an organic light emitting diode 120 including a first seal pattern 150, which is a sealing seal pattern that bonds edge portions of two substrates 110 and 130, the organic light emitting diode element E may include a first electrode. The organic light emitting layer 114 and the second electrode 116 are stacked in this order, and the first electrode 112 has a pad portion II extending to any non-display area. have.

The second substrate 130 has an area that exposes the non-display area of the first electrode 112. In the present embodiment, the second substrate 130 is disposed outside the first seal pattern 150 and the first and second substrates 110 and 130. And a second seal pattern 160 having a structure covering an interface between the first seal pattern 150 and the first seal pattern 150.

In addition, the pad part II is connected to the external circuit connecting means 170, and although not shown in the drawing, the pad part II has a connection relationship with the external circuit. In this case, the second seal pattern 160 corresponds to an example formed before the connection process between the external circuit connecting unit 170 and the pad unit II.

Meanwhile, the first seal pattern 150 material may be selected from a UV curable seal pattern material, and the second seal pattern 160 may be selected from the same material as the first seal pattern 150.

Second Embodiment

3 is a cross-sectional view of an organic light emitting display device according to a second embodiment of the present invention, in which an additional seal pattern overlaps with an external circuit connecting means after the external circuit connecting means is formed, and the basic structure is the first structure. Follow the example structure.

As shown, in the present embodiment, the first seal pattern 250 and the external circuit connecting means 270 are located in close proximity, and in such a structure, the pad part II and the external circuit connecting means are connected. Next, the second seal pattern 260 is formed to partially cover the external circuit connection means 270.

In this case, the structural feature of the second seal pattern 260 may be applied to the first embodiment.

According to the structure according to the present embodiment, the second seal pattern 260 may serve as a protective film to block external moisture and external air and to prevent delamination of the external circuit connection means 270. .

In more detail, the external circuit connection means 270 is bent like a kind of hinge for connection with an external image processing data input device such as a printed circuit board (PCB), which is not shown. However, it is possible to minimize such a phenomenon and the like by partially overlapping with the second seal pattern 260.

In the first and second embodiments, the passive type organic light emitting display device is shown as an example, but may be applied to an active type organic light emitting display device including a thin film transistor.

Third Embodiment

According to the present embodiment, an array element including an organic light emitting diode device and a thin film transistor is formed on a different substrate, and a seal pattern structure of a dual panel type organic light emitting diode device connecting two devices through separate electrical connection electrodes. It is about.

4 is a cross-sectional view of a dual panel type organic light emitting display device according to a third exemplary embodiment of the present invention.

As illustrated, the first substrate 310 on which the array element A including the thin film transistor T is formed and the second substrate 330 on which the organic light emitting diode element E is formed are disposed to face each other. In addition, an electrical connection pattern 332 is formed between the first and second substrates 310 and 330 to connect the thin film transistor T and the organic light emitting diode device E to each other.

In more detail, the first substrate 310 is connected to the thin film transistor T and the thin film transistor T in subpixel units to form an electrical connection electrode 340. The thin film transistor T belongs to a driving thin film transistor for supplying a current to the organic light emitting diode device E.

The edges of the first and second substrates 310 and 330 are bonded to each other by the first seal pattern 350, and the first and second substrates 310 and 330 are formed on the outer surface of the first seal pattern 350. The second seal pattern 360 is further formed to prevent the interface between the first seal pattern 350 from being exposed to the outside.

The second seal pattern 360 is formed to partially cover the external circuit connecting means 370. Although not shown in the drawing, the external circuit connecting means 370 is a portion of the wiring connected to the thin film transistor T. It has a connection with the pad part.

In such a dual panel type organic light emitting device, in order to increase the electrical contact characteristics between the organic light emitting diode device and the array device, the internal pressure is controlled to be lower than the outside, and due to the pressure difference, the adhesion between the substrate and the seal pattern is reduced. Therefore, since moisture or external air easily enters from the outside, applying an additional seal pattern structure effectively extends the life of the organic light emitting device by effectively blocking external moisture and external air while maintaining the advantages of the dual panel type.

FIG. 5 is a detailed cross-sectional view of the seal pattern of FIG. 4, and illustrates a thin film transistor structure using amorphous silicon as a semiconductor material, with a thin film transistor as an example.

As illustrated, a gate electrode 412 is formed on the first substrate 410, a gate insulating film 414 is formed at a position covering the gate electrode 412, and a gate over the gate insulating film 414. A semiconductor layer 416 is formed at a position covering the electrode 412, and a source electrode 418 and a drain electrode 420 are formed on the semiconductor layer 416 so as to be spaced apart from each other, and the gate electrode 412. The semiconductor layer 416, the source electrode 418, and the drain electrode 420 form a thin film transistor T.

The data line 422 is connected to the source electrode 418, and one end of the data line 422 extends to the non-display area to form the data pad 424.

The semiconductor layer 416 is composed of an active layer 416a made of an amorphous silicon material and an ohmic contact layer 416b made of an impurity amorphous silicon material, and is spaced apart from the source electrode 418 and the drain electrode 420. The ohmic contact layer 416b is removed, and the exposed active layer 416a forms a channel ch.

In the region covering the thin film transistor T, a protective layer 430 constituting a drain contact hole 426 partially exposing the drain electrode 420 and a data pad contact hole 428 partially exposing the data pad 424. ) Is formed.

Electrical connection electrodes 432 connected to the drain electrode 420 through the drain contact hole 426 on the protective layer 430, and data connected to the data pad 424 through the data pad contact hole 428. Pad electrodes 434 are formed, respectively. The electrical connection electrode 432 and the data pad electrode 434 are preferably made of the same material in the same process, and the data pad electrode 434 is considered in consideration of a rework process with an external circuit related device. It is preferable to select from the transparent conductive material which is easy for a rework process.

An external circuit connection means 436 is formed in an area covering the data pad electrode 434.

A columnar electrical connection pattern 438 is formed in connection with the electrical connection electrode 432. In addition, a first electrode 452, a first carrier transfer layer 454, an emission layer 455, a second carrier transfer layer 456, and a second electrode 458 are formed on an inner surface of the second substrate 450. Stacked in order, the second electrode 458 is in electrical contact with the aforementioned electrical connection pattern 438.

For example, when the first electrode 452 is an anode and the second electrode 458 is a cathode, the first carrier transport layer 454 corresponds to a hole transport layer, and the second carrier transport layer 456 is Corresponds to the electron transport layer, and in some cases, may include a hole injection layer and an electron injection layer, respectively.

The edges of the first and second substrates 410 and 430 are joined by the first seal pattern 460, and the first and second substrates 410 and 430 are outside the first seal pattern 460. The second seal pattern 470 is formed in an area covering the interface between the first seal pattern 460 and the first seal pattern 460.

However, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

For example, in the drawing according to the third embodiment, a structure in which two pixels consisting of red, green, and blue subpixels are arranged as an example for convenience of description, but in the actual structure, has a structure in which a plurality of pixels are configured. In addition to the thin film transistor device of the type proposed, a thin film transistor device structure having various structures can be applied.

As described above, the organic electroluminescent device having the seal pattern structure according to the present invention has the following effects.

First, by forming an additional seal pattern in an area covering the interface between the substrate and the seal pattern, effectively preventing external moisture and outside air from penetrating into the substrate according to the thermal expansion coefficient difference between the substrate and the seal pattern, thereby improving product life. You can.

Second, when applied to the dual panel organic electroluminescent device, it is possible to improve the product lifespan by providing the additional seal pattern while maintaining the high opening ratio / high resolution characteristics of the dual panel method. It can increase.

1 is a schematic cross-sectional view of a conventional organic light emitting display device.

2 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present invention;

3 is a cross-sectional view of an organic light emitting display device according to a second exemplary embodiment of the present invention.

4 is a cross-sectional view of a dual panel organic light emitting display device according to a third exemplary embodiment of the present invention.

5 is a detailed cross-sectional view of the seal pattern of FIG. 4.

<Explanation of symbols for main parts of the drawings>

310: first substrate 332: electrical connection pattern

340: electrical connection electrode 350: first seal pattern

360: second seal pattern 370: external circuit connection means

A: array element

E: organic light emitting diode device

T: thin film transistor

Claims (9)

A first substrate having an organic electroluminescent diode element formed of first and second electrodes and an organic electroluminescent layer interposed between the first and second electrodes; A second substrate disposed to face the first substrate; A first seal pattern positioned on an edge portion of the first and second substrates to bond the first and second substrates to define a display area and a non-display area inside and outside thereof; Connecting means connected to an external circuit formed in the non-display area of the first substrate; A second seal pattern formed outside the first seal pattern to cover an interface between the first and second substrates and the first seal pattern and a portion of the external circuit connection means. Organic electroluminescent device comprising a. First and second substrates disposed to face each other; A thin film transistor element formed on an inner surface of the first substrate in units of subpixels, which is a minimum unit for implementing a screen; An electrical connection pattern connected to the thin film transistor element and forming a column shape; A first electrode formed on an inner surface of the second substrate; An organic light emitting layer formed under the first electrode; A second electrode formed in a sub-pixel unit below the organic light emitting layer and in contact with the electrical connection pattern; A first seal pattern joining the first and second substrates at positions surrounding the edges of the first and second substrates, and defining a display area and a non-display area on the inside and the outside thereof; Connecting means connected to an external circuit formed in the non-display area of the first substrate; A second seal pattern formed outside the first seal pattern to cover an interface between the first and second substrates and the first seal pattern and a portion of the external circuit connection means. Organic electroluminescent device comprising a. The method according to claim 1 or 2, The second substrate has an area smaller than that of the first substrate to expose the non-display area of the first substrate. delete delete The method according to claim 1 or 2, The external circuit connection means is any one of a flexible panel connector (FPC), a tape carrier package (TCP). The method according to claim 1 or 2, The first and second seal patterns may be selected from UV (ultra violet) curable resins. The method of claim 1, The second substrate is an organic electroluminescent device comprising any one of an encapsulation canister or glass. The method according to claim 1 or 2, The second seal pattern is formed on a position covering the side surfaces of the first seal pattern and the second substrate on the first substrate.