KR100402891B1 - punching apparatus and the method of circuit pattern connecting parts in a cover layer for a flexible printed circuit board - Google Patents

Abstract

PURPOSE: To provide a punching device and a method for automatically punching a circuit pattern contact portion of a cover layer for a flexible printed circuit board.

Construction: This punching device is provided with a mold (5) and a die (7) having a pilot pin (17) and an eject pin (19,19) to continuously punch a contact portion of a circuit pattern on a cover layer. It consists of a conveying part 9 for conveying the cover layer punched by a predetermined constant pitch (p _c ) and a variable pitch (p _v ), cutting section 11 for cutting the conveyed cover layer; This punching method includes a transfer process for transferring a cover layer between a mold and a die, a punching process having a pilot process and an ejection process to continuously punch a circuit pattern contact portion continuously on the transferred cover layer, and a cutting process for cutting the punched cover layer. Is done.

EFFECTS: The present invention includes a pilot pin and an eject pin in a mold, and realizes a constant pitch and a variable pitch transfer to a conveying part, and realizes a pilot process and an eject process during a punch, and covers the coverlay with a variable pitch after a plurality of constant pitches. By transporting and cutting to enable continuous automatic punching of the cover layer, the quality of the cover layer and the safety and productivity of the operator can be improved.

Description

Punching apparatus and the method of circuit pattern connecting parts in a cover layer for a flexible printed circuit board}

The present invention relates to a circuit pattern contact part punching device of a cover layer for a flexible printed circuit board for punching a circuit pattern contact part of a cover layer applied to a flexible printed circuit board and a method thereof. will be.

In recent years, high reliability, high performance, miniaturization, and simplicity are considered important factors in the electric and electronic industries, and printed circuit boards having these characteristics are absolutely required in the industry. In particular, the flexible printed circuit board is being developed and constantly studied in the idea that if the substrate itself is flexible and can be folded in multiple layers, it will play an important role in making the electronic products light and thin.

The flexible printed circuit board uses screen printing or dry film photoresist to design a circuit pattern to etch the conductive metal foil, and to punch the contact portion of the cover layer for insulation and circuit protection, and to attach the cover layer to the metal foil. It adhere | attaches with a hot press, and is completed by punching together a cover layer and electroconductive metal foil according to a circuit pattern.

FIG. 6 illustrates a process of punching the contact portion (not shown) of the circuit pattern 53 while manually transporting (a) the cover layer 51 cut to the required length. At this time, the feed pitch p of the cover layer 51 is connected to the pin holes 55 formed at both sides of the cover layer 51 and the pilot pins 57 formed in the die (not shown) so that the pin holes 55 are fitted. Determined by

This punching method not only causes the risk of a safety accident due to the manual transfer (a) of the cover layer 51 and the deterioration of the quality of the cover layer 51 due to the fingerprint generated on the surface of the cover layer 51, Since the cover layer 51 is punched out by the mold (not shown) which is 59 in two sets, productivity is reduced.

As a technique for overcoming this, as shown in FIG. 7, while the cover layer 51 in a roll state is continuously transferred (b), the circuit pattern 59 is punched once into a mold having one set of ten pieces and cut once. There is a method of obtaining ten circuit patterns 59 by doing so. In this case, the cover layer 51 is continuously guided by guides 59 and 59 provided on both sides of the die (not shown).

This punching method has the advantage of obtaining a large number of circuit patterns 53 by one punching and cutting. However, since the mold and the die are enlarged, the manufacturing cost is increased, and the guides 59 and 59 are necessarily covered with the cover layer 51. Since it must be installed on both sides of the die, the design freedom of the die is reduced, and when the die is repaired, the guides 59 and 59 must be disassembled from the die, making maintenance difficult.

The present invention has been made in view of the above points, while improving the safety and productivity of the operator when the quality of the cover layer and the contact pattern of the circuit pattern in the cover layer, but rather reduce the manufacturing cost of the die and die, design of the die SUMMARY OF THE INVENTION An object of the present invention is to provide a circuit pattern contact part punching device and a method of a cover layer for a flexible printed circuit board which improves degrees of freedom and facilitates maintenance.

The circuit pattern contact part punching device of the cover layer for a flexible printed circuit board which realizes this object is a metal mold | die provided in the upper and lower sides of a press so that the contact part of a circuit pattern may be punched in the cover layer continuously supplied in roll state, respectively. And a transfer portion provided on one side of the die and the die so as to selectively transfer the cover layer punched by the mold and the die to a predetermined constant pitch and a variable pitch, and the cover layer transferred by the transfer portion corresponds to the conductive metal foil. It is composed of a cutting portion is installed on one side of the transfer portion to cut.

Here, the mold has a plurality of pilot pins and two eject pins symmetrically disposed about each of the pilot pins and ejected toward the cover layer by the compressed air.

This pilot pin fixes the cover layer to be transported while being sequentially inserted into the pin holes formed in the cover layer so as to correspond to each pitch of the circuit pattern, thereby stably punching the contact portion of the circuit pattern to the cover layer transported by a constant pitch and variable pitch. To be able.

In addition, the eject pin is free when the mold is lowered, that is, it is naturally introduced into the mold without disturbing the contact of the circuit pattern by the mold and the die in the cover layer. It is ejected toward and pulled out of the mold so that the cover layer does not rise along the mold, thereby enabling continuous automatic punching of the cover layer.

The conveying section is composed of a servo motor and a roller, and is conveyed at a constant pitch corresponding to the pitch of the circuit pattern and at a variable pitch corresponding to the pitch of the conductive metal foil to match the punching position of the cover layer with the position of the mold.

The cutting portion is composed of a cutter and an air cylinder to cut the cover layer in which the contact portion of the circuit pattern is punched out so as to correspond to the position of the conductive metal foil.

On the other hand, in the method of punching the circuit pattern contact portion of the cover layer for a flexible printed circuit board, a transfer step of continuously transferring the cover layer in a roll state between the mold and the die by a constant pitch and a variable pitch, the circuit pattern contact to the transferred cover layer The punching process of punching out a part, and the cutting process of cutting the cover layer in which the contact part of the circuit pattern was punched corresponded to electroconductive metal foil.

Here, the conveying process is dualized into a constant pitch conveying process and a variable pitch conveying process, thereby enabling cutting to convey and cut the cover layer by the required length.

The constant pitch transfer process transfers the cover layer at a pitch of a constant circuit pattern within the range of one conductive metal foil.

The variable pitch transfer process transfers the cover layer at a pitch different from the constant pitch of the circuit pattern for the new conductive metal foil when the cover layer transferred by the repeated progress of the constant pitch transfer process is transferred by the range of the conductive metal foil.

The punching process also includes a pilot process and an eject process.

The pilot process inserts the pilot pin into the pin hole of the cover layer when the mold is lowered to allow stable punching of the cover layer.

The ejection process applies compressed air to the eject pin when the inserted pilot pin rises together with the mold, thereby ejecting the eject pin from the mold to the cover layer, thereby preventing accompanying rise of the cover layer and the mold.

1 is a schematic configuration diagram of a circuit pattern contact part punching device of a cover layer according to the present invention;

2 is a plan view of a cover layer in which a pinhole is punched out;

3 is a plan view of punching a cover layer with a mold;

Figure 4 is a cross-sectional view showing the operation sequence of the pilot pin and the eject pin provided in the mold in the process of punching the cover layer.

5 is a plan view of a cover layer showing a circuit pattern to show a constant and variable pitch transfer state of the cover layer;

6 is a plan view of a cover layer showing a circuit pattern according to the prior art;

7 is a plan view of another cover layer showing a circuit pattern according to the prior art;

* Description of the symbols for the main parts of the drawings *

1: cover layer 5: mold

7 die 9 transfer unit

11: cutout portion 13: pin hole

15: circuit pattern 17: pilot pin

19,19: eject pin

p _c, p _v : fixed feed pitch, variable feed pitch

Advantages and advantages of the present invention will become more apparent from the following description with reference to the accompanying drawings.

1 is a configuration diagram of a circuit contact portion punching device of a cover layer according to the present invention, in which a press 3 is formed so as to continuously punch a contact portion of a certain circuit pattern continuously on a cover layer 1 continuously supplied in a roll state. The mold 5 and the die 7 provided opposite to the upper and lower sides of the die 5 and the cover layer 1 in which the contact portion of the circuit pattern is punched in the mold 5 and the die 7 are formed at a constant pitch such as the circuit pattern. It consists of a conveyance part 9 which selectively conveys with a variable pitch, and the cut part 11 which cut | disconnects the cover layer 1 in which the contact part of the circuit pattern was punched so that it corresponded to the conductive metal foil (not shown).

As shown in FIG. 2, the cover layer 1 has a pinhole at a constant pitch p _c and a variable pitch p _v before being supplied between the die 5 and the die 7 for punching the contact portion of the circuit pattern. (13) is supplied in the punched state.

The constant pitch p _c is the pitch of the circuit pattern formed within the range of one conductive metal foil, and the variable pitch p _v is the pitch formed at the portion where the conductive metal foil is replaced, and is a constant pitch p _c . It is formed differently from the pitch of the circuit pattern. Therefore, the variable pitch p _v is equal to the case where the cover layer 1 is cut by the required length and continuously punched even when the cover layer 1 is automatically continuously punched.

As shown in FIG. 3, the pin hole 13 is formed so that the pilot pin 17 can be inserted corresponding to the plurality of pilot pins 17 provided in the mold 5. Therefore, when the pilot pin 17 of the mold 5 is inserted into the pin hole 13, the contact portion of the circuit pattern 15 to be punched in the cover layer 1 coincides with the mold 5.

In addition, two eject pins 19 and 19 are arranged in a symmetrical structure around each of the pilot pins 17. As shown in FIG. 4, the eject pins 19 and 19 are free when the mold 5 is lowered, without interfering with the pilot pin 17 being inserted into the pin hole 13. When 5) rises, the cover layer 1 is removed from the mold 5 while being ejected toward the cover layer 1 by the compressed air c so that the cover layer 1 rises like the mold 5. prevent. Eject pins 19 and 19 having such a function are exemplified by two in this embodiment, but three are provided so that the ejection force acting on the cover layer 1 at the center of the pilot pin 17 is equal. It can work.

The conveying unit 9 is a servo motor 21 and a roller 23 which is rotated thereby to control the cover layer 1 to be transferred at a constant pitch p _c and a variable pitch p _v as described above. It is composed. Therefore, when the roller 23 rotates, the cover layer 1 in close contact with the roller 23 is transferred at a constant pitch p _c and a variable pitch p _v .

As shown in FIG. 5, the cutting part 11 may cut the cover layer 1 when the feed a of the cover layer 1 is switched from the constant pitch p _c to the variable pitch p _v . It consists of a cutter 25 and an air cylinder 27 for operating it. Thus, as the air cylinder 27 is operated in the vertical direction, the cutter 25 cuts the cover layer 1 at a position 29 corresponding to the conductive metal foil.

As a result, the cover layer 1 is transferred several times at a constant pitch p _c formed by the circuit pattern 15, and the contact portion of the circuit pattern is punched out, and when the cover layer 1 reaches a position corresponding to the conductive metal foil, the constant pitch p _c It is transported to a different variable pitch (p _v ) and is cut, and the process of being punched while being transferred several times to the same constant pitch (p _c ) as described above and the process of being transported and cut to a variable pitch (p _v ) repeatedly .

The punching method of the circuit pattern contact part punching apparatus of the cover layer comprised as mentioned above is a conveyance process of transferring the cover layer 1 of the roll state between the metal mold | die 5 and the die 7, and this cover layer 1 is conveyed. The punching process includes a punching process and a cutting process of cutting the punched cover layer 1 to correspond to the conductive metal foil.

The transfer process consists of a constant pitch p _c transfer process and a variable pitch p _v transfer process, depending on the pitch for transferring the cover layer 1. The constant pitch p _c transfer process repeatedly transfers the cover layer 1 to the constant pitch p _c of the circuit pattern 15 within the range of the conductive metal foil, and the variable pitch p _v transfer process covers the cover layer 1. When the layer 1 corresponds to the conductive metal foil, it is moved between the conductive metal foil and the new conductive metal foil. This variable pitch p _v is formed differently from the constant pitch p _c .

The punching process for punching the cover layer 1 thus transferred includes a pilot process and an ejecting process together with the punching by the mold 5. The pilot process inserts the pilot pin 17 provided in the mold 5 into the pin hole 13 formed in the cover layer 1 to match the contact portion of the circuit pattern 15 to be punched with the mold 5. The ejection process is performed by applying the compressed air (c) to eject the eject pin (19) from the mold (5) to the cover layer (1) side, and when the mold (5) is raised, the cover layer (1) is removed from the mold (5) and continuously Enable punching.

In the subsequent cutting process, the air cylinder 27 operates the cutter 25 to cut the cover layer 1 at a position 29 corresponding to the conductive metal foil.

As the transfer process, the punching process, and the cutting process are automatically repeated, the cover layer 1 repeats the process of cutting the circuit pattern 15 contact portion and cutting at a position corresponding to the conductive metal foil.

The punched and cut cover layer 1 is automatically transferred by the belt conveyor 31.

As described above, the present invention includes a pilot pin and an eject pin in the mold, a servo motor and a roller in the transfer unit, and transfers the cover layer at a constant pitch and a variable pitch, while ejecting the pin when the mold is raised after the punching. By ejecting to the side, the cover layer is removed from the mold, enabling continuous automatic punching of the circuit pattern contact portion on the cover layer, thereby improving the quality of the punched cover layer compared to the prior art of manually transferring the cover layer, Product productivity can be improved. In addition, since the present invention uses two sets of molds and dies compared to the prior art using 10 sets of molds and dies, the manufacturing cost of the molds and dies can be lowered, and a guide for guiding the cover layer is provided. Compared to the prior art of installing the die on both sides of the die, the pilot pin and the eject pin can be installed at various positions of the mold, thereby improving the design freedom of the die, and the guide according to the prior art is removed, thereby making the die easier to maintain. Let's do it.

Claims (7)

Mold and die installed in the press to punch the contact portion of the circuit pattern on the cover layer continuously supplied in the roll state, A transfer part installed at one side of the die and the die to transfer the cover layer punched by the die and the die to a predetermined constant pitch and a variable pitch; The circuit pattern contact part punching device of the cover layer for a flexible printed circuit board comprising a cutting portion provided on one side of the transfer portion to cut the cover layer transferred by the transfer portion corresponding to the conductive metal foil. The method of claim 1, wherein the mold is a plurality of pilot pins protruding toward the die, 2. A circuit pattern contact punching device of a cover layer for a flexible printed circuit board, the ejection pin being symmetrically disposed on each of the pilot pins and operated by compressed air. The method of claim 1, wherein the transfer unit is a servo motor, The circuit pattern contact part punching device of the cover layer for a flexible printed circuit board including a roller which is rotated by the servo motor. The method of claim 1, wherein the cut portion is an air cylinder, The circuit pattern contact part punching device of the cover layer for a flexible printed circuit board including a cutter which is operated up and down by the air cylinder. A conveying process of transferring the cover layer continuously supplied in the roll state between the die and the die of the press, A punching process for punching a circuit pattern contact part a plurality of times on the cover layer transferred in the process; The circuit pattern contact part punching method of the cover layer for flexible printed circuit boards including the cutting process which cut | disconnects the cover layer punched in the said process so that it corresponds to the conductive metal foil. The method of claim 5, wherein the transfer process is a constant pitch transfer process for transferring the cover layer a plurality of times at a constant pitch of the circuit pattern, And a variable pitch conveyance step of transferring the cover layer at a pitch different from the pitch of the circuit pattern after repeating the constant pitch transfer process. The method of claim 5, wherein the punching process is a pilot process for inserting the pilot pin provided in the mold into the pin hole of the cover layer, And a step of ejecting the eject pin to the cover layer by applying compressed air to an eject pin provided symmetrically on the pilot pin. 2. The method of punching a circuit pattern contact portion of a cover layer for a flexible printed circuit board.