KR100353223B1 - Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate - Google Patents

Abstract

A semiconductor device manufacturing method includes providing a semiconductor chip having a pad mounting surface with an adhesive pad, forming an insulating isolation layer on the pad mounting surface, and forming a conductor in the insulating isolation layer. The isolation layer has a contact receiving cavity and an access hole for accessing the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductor has a fixing portion that fills the contact receiving cavity and the access hole and electrically connects with the adhesive pad.

Description

METHOD FOR MOUNTING A SEMICONDUCTOR CHIP ON A SUBSTRATE AND SEMICONDUCTOR DEVICE ADAPTED AD MOTED ON MOUNTING ON A SUBSTRATE}

The present invention relates to a method of mounting a semiconductor chip on a substrate and a semiconductor device suitable for mounting on a substrate.

With the rapid advance of semiconductor manufacturing technology, adhesive pads on the surface of semiconductor chips are getting smaller and smaller, and the distance between adjacent adhesive pads is getting shorter and shorter. This may cause difficulties when connecting the semiconductor chip to an external circuit and may adversely affect the production yield.

Therefore, a main object of the present invention is to provide a method of mounting a semiconductor chip on a substrate to overcome the above-mentioned drawbacks.

Another object of the present invention is to provide a semiconductor device suitable for mounting on a substrate and capable of overcoming the aforementioned drawbacks.

According to one aspect of the present invention, a method of mounting a semiconductor chip on a substrate having a chip mount provided with a plurality of welding points is provided. The semiconductor chip has a pad mounting surface provided with a plurality of adhesive pads, and the adhesive pads are in contact with corresponding welding points, respectively, so that the pads are offset from the positions of the corresponding points of the welding points on the chip mounting portion. It is placed on the mounting surface. The method includes forming a pad protector over the pad mounting surface, each made of an insulating material to cover at least a portion of each adhesive pad; Forming a photoresist layer on the pad mounting surface so that the pad protector is buried in the photoresist layer; Forming access holes in the photoresist layer, each access hole exposing a portion of each pad protector; Removing the pad protector from the pad mounting surface via the access hole to form a plurality of contact receiving cavities in the photoresist layer at a position correctly aligned with the adhesive pad on the pad mounting surface; And an extension portion and a fixing portion and a contact portion at opposite ends of the expansion portion, the fixing portion filling the contact receiving cavities and the respective access holes to electrically connect the adhesive pads, and the contact portion Formed on a surface of the photoresist layer opposite the pad mounting surface and disposed at a position corresponding to the respective welding point on the chip mounting portion of the substrate, and the extension is formed on the surface of the photoresist layer Forming a plurality of conductors adapted to connect the stationary and contact portions together.

According to another aspect of the present invention, the semiconductor element is suitable for mounting on a substrate having a chip mount provided with a plurality of welding points. The semiconductor device may include: a semiconductor chip having a pad mounting surface provided with a plurality of adhesive pads disposed on the pad mounting surface at a position offset from a position of a corresponding point of a welding point on the chip mounting portion; A plurality of contact receiving cavities adjacent to and properly aligned with the adhesive pad on the pad mounting surface, and for accessing the contact receiving cavities, a plurality of access holes narrower than the contact receiving cavities are formed, A photoresist layer formed on the pad mounting surface of the semiconductor chip; And an extension portion and a fixing portion and a contact portion at opposite ends of the expansion portion, the fixing portion filling the contact receiving cavities and the respective access holes to electrically connect the adhesive pads, and the contact portion Formed on a surface of the photoresist layer opposite the pad mounting surface and disposed at a position corresponding to the respective welding point on the chip mounting portion of the substrate, and the extension is formed on the surface of the photoresist layer And a plurality of conductors adapted to connect the fixed portion and the contact portion to each other.

According to another aspect of the invention, there is provided a semiconductor chip having a pad mounting surface having an adhesive pad; Forming an insulating isolation layer over said pad mounting surface, said contact receiving cavity adjacent said adhesive pad and adapted to access said contact receiving cavity, said insulating isolation layer having an access hole narrower than said contact receiving cavity; And forming a conductor having a fixing portion for filling the contact accommodating cavity and the access hole to electrically connect with the adhesive pad.

According to still another aspect of the present invention, a semiconductor device includes a semiconductor chip having a pad mounting surface provided with an adhesive pad; An insulating isolation layer adjacent to the adhesive pad and adapted to access the contact receiving cavity, and an access hole narrower than the contact receiving cavity, the access isolation cavity being formed on the pad mounting surface. ; And a conductor having a fixing portion for filling the contact receiving cavity and the access hole and electrically connecting the adhesive pad.

1 is a schematic diagram illustrating a semiconductor chip to be mounted on a substrate according to the method of the present invention.

FIG. 2 is a schematic diagram illustrating a printing screen plate used in the method of the present invention for forming a pad protector on an adhesive pad of a pad mounting surface of the semiconductor chip of FIG. 1.

3 is a schematic diagram illustrating a photoresist layer formed on the pad mounting surface of the semiconductor chip of FIG. 1 and a mask used in the method of the present invention.

4 is a schematic diagram illustrating the photoresist layer of FIG. 3 subjected to a photolithographic process according to the method of the present invention.

FIG. 5 is a schematic diagram illustrating access holes formed in the cured photoresist layer of FIG. 4 in accordance with the method of the present invention. FIG.

Fig. 6 is a schematic view illustrating the formation of a contact receiving cavity by removing the pad protector by the solvent washing treatment by the method of the present invention.

FIG. 7 is a schematic diagram illustrating the formation of a conductor and an insulating protective layer in the contact receiving cavity over the cured photoresist layer of FIG. 6.

<Description of the symbols for the main parts of the drawings>

1: semiconductor chip 2: printed screen plate

3: pad protector 4: photoresist layer

4 ': insulation layer 5: mask

6: insulation protective layer 7: substrate

8: conductor 10: pad mounting surface

11: adhesive pad 20: hole

40: contact receiving cavity 44: access hole

71: welding point

Fig. 1 illustrates a semiconductor chip 1 to be mounted on a substrate 7 (see Fig. 7) by the method of the present invention. The substrate 7 has a chip mounting portion provided with a plurality of welding points 71 (only one welding point 71 is shown in FIG. 7). The semiconductor chip 1 has a pad mounting surface 10 provided with a plurality of adhesive pads 11 (only one adhesive pad 11 is shown in FIG. 1), each of which has a corresponding welding point ( 71 is placed on the pad mounting surface 10 to a position offset from the position of the corresponding point of the welding point 71 on the chip mount of the substrate 7 (see FIG. 7).

2 to 7 illustrate the continuous steps of processing the semiconductor chip 1 for forming the semiconductor element to be mounted on the substrate 7 by the method of the present invention.

In FIG. 2, the steel plate 2 is used and is mounted on the pad mounting surface 10 of the semiconductor chip 1. The steel plate 2 is a printing screen plate 2 in the embodiment of the present invention, and a plurality of non-crossing holes 20 (one in FIG. 2) at a position correctly aligned with the adhesive pad 11 of the semiconductor chip 1. Only the holes 20 are shown). On the pad mounting portion 10, a plurality of pad protectors 3 are formed by a printing technique using an insulating material such as gel resin or rosin as a printing material. Each pad protector 3 covers at least a portion of each adhesive pad 11. The pad protector 3 includes the steps of forming a photoresist layer on the pad mounting surface 10, exposing the photoresist layer to a position correctly aligned with the adhesive pad 11, and an unexposed portion of the photoresist layer. It may be formed by a photolithography process and a corrosion process comprising the step of removing the solvent by washing. Each pad protector 3 has a cross section gradually reduced in a direction away from the pad mounting surface 10.

In FIG. 3, a photopolymerization layer such as photoresist layer 4 is formed on the pad mounting surface 10 so that the pad protector 3 is embedded in the photoresist layer 4, and on the photoresist layer 4. The mask 5 is put on.

In FIG. 4, the photoresist layer 4 is exposed at a position offset from the pad protector 3. The exposed portion of the photoresist layer 4 is cured to form an insulating isolation layer 4 'covering the pad mounting surface 10.

In FIG. 5, a plurality of access holes 44 are formed in the photoresist layer 4 by removing unexposed portions of the photoresist layer 4 ′ from the isolation layer 4 ′ by solvent washing. Each access hole 44 exposes a portion of each pad protector 3.

In FIG. 6, the pad protector 3 is removed from the pad mounting surface 10 via the access hole 44 by solvent washing, thereby adhering on the pad mounting surface 10 in the isolation layer 4 '. A plurality of contact receiving cavities 40 (only one is shown) are formed at a position correctly aligned with the pad 11. Each contact receiving cavity 40 is widened from each access hole 44, and has a larger width than each access hole 44. Preferably, the contact receiving cavity 40 and each access hole 44 form an inverted T-shaped cross section.

In Fig. 7, a plurality of conductors 8 (only one is shown) are formed in the contact receiving cavity 40 and the access hole 44, respectively. Each conductor 8 has an expansion portion 42 and a fixing portion 41 and a contact portion 43 at opposite ends of the expansion portion 42. The fixing part 41 fills each contact receiving cavity 40 and each access hole 44, and electrically connects with each adhesive pad 11, and each contact receiving cavity 40 and each access. It has a cross section that matches the inverted T-shaped cross section of the hole 44. The contact portion 43 is formed on the surface of the isolation layer 4 'facing the pad mounting surface 10 and is disposed at a position corresponding to each welding point 71 on the chip mounting portion of the substrate 7. An extension 42 is formed on the surface of the isolation layer 4 ', connecting the fixing portion and the contact portions 41 and 43 to each other. The conductor 8 is made of a conductive paste. An insulating protective layer 6 may be formed on the isolation layer 4 ′ to cover the fixing part and the extension parts 41 and 42 of the conductor 8.

With the design of the conductor 8 by the method of the invention, the difficulties encountered in the prior art can be reduced, so that the production yield can be significantly increased. In addition, by the fixing portion 41 embedded in the isolation layer 4 'and the expansion portion 42 embedded in the protective layer 6, the fixing portion 41 of the conductor 8 is subjected to subsequent processing such as thermal testing. The contact with the adhesive pad 11 can be maintained firmly without leaving during the step.

In the above-described invention, it is apparent that various modifications and changes can be made without departing from the intention of the present invention. Therefore, the present invention should be limited only as described in the appended claims.

Claims (25)

A method of mounting a semiconductor chip on a substrate, the substrate having a chip mounting portion provided with a plurality of welding points, the semiconductor chip having a pad mounting surface provided with a plurality of adhesive pads, the adhesive pad having a corresponding point of the welding point. A method for mounting a semiconductor chip on a substrate, the method comprising: connecting to an array, arranged on the pad mounting surface at a position offset from a position of a corresponding point of the welding point on the chip mounting portion, Forming a pad protector on the pad mounting surface, each being made of an insulating material to cover at least a portion of each adhesive pad; Forming a photoresist layer on the pad mounting surface and embedding the pad protector in the photoresist layer; Forming access holes in the photoresist layer, each access hole exposing a portion of each pad protector; Removing the pad protector from the pad mounting surface via the access hole to form a plurality of contact receiving cavities in the photoresist layer at a position correctly aligned with the adhesive pad on the pad mounting surface; And Each having an extension portion and a fixing portion and a contact portion at opposite ends of the expansion portion, the fixing portion filling the respective contact receiving cavities and the respective access holes to electrically connect with the respective adhesive pads; It is formed on the surface of the photoresist layer opposite the pad mounting surface and disposed at a position corresponding to the respective welding point on the chip mounting portion of the substrate, the extension is formed on the surface of the photoresist layer to secure And forming a plurality of conductors which connect the contact portions to each other. The method of claim 1, The pad protector is formed on the pad mounting surface by printing. The method of claim 1, Wherein each of the pad protectors has a cross section gradually reduced in a direction away from the pad mounting surface. The method of claim 1, And said pad protector is removed from said pad mounting surface by solvent cleaning. The method of claim 1, The conductor is a semiconductor chip mounting method, characterized in that formed from a conductive paste. The method of claim 1, And forming an insulating protective layer over the photoresist layer to cover the fixing and extension portions of the conductor. A semiconductor device suitable for mounting on a substrate having a chip mount provided with a plurality of welding points, A semiconductor chip having a pad mounting surface provided with a plurality of adhesive pads disposed on the pad mounting surface at positions offset from corresponding positions of welding points on the chip mounting portion; A plurality of contact receiving cavities adjacent to and properly aligned with the adhesive pad on the pad mounting surface, and for accessing the contact receiving cavities, a plurality of access holes narrower than the contact receiving cavities are formed, A photoresist layer formed on the pad mounting surface of the semiconductor chip; And Each having an extension portion and a fixing portion and a contact portion at opposite ends of the expansion portion, the fixing portion filling the respective contact receiving cavities and the respective access holes to electrically connect with the respective adhesive pads; It is formed on the surface of the photoresist layer opposite the pad mounting surface and disposed at a position corresponding to each welding point on the chip mounting portion of the substrate, the extension is formed on the surface of the photoresist layer and the A semiconductor device comprising a plurality of conductors to connect the government and the contact portion to each other. The method of claim 7, wherein And the conductor is formed from a conductive paste. The method of claim 7, wherein And an insulating protective layer formed on the photoresist layer to cover the fixing and extension portions of the conductor. In the semiconductor device manufacturing method, Providing a semiconductor chip having a pad mounting surface having an adhesive pad; Forming an insulating isolation layer over said pad mounting surface, said contact receiving cavity adjacent said adhesive pad and adapted to access said contact receiving cavity, said insulating isolation layer having an access hole narrower than said contact receiving cavity; And And forming a conductor having a fixing portion for filling the contact receiving cavity and the access hole and electrically connecting the adhesive pad. The method of claim 10, The isolation layer forming step, Forming a pad protector made of an insulating material on at least a portion of the adhesive pad on the pad mounting surface; Forming the photopolymerization layer on the pad mounting surface such that the pad protector is embedded in the photopolymerization layer; Applying a photolithography process and a corrosion process to the photopolymerization layer to obtain the isolation layer having the access hole exposing a portion of the pad protector; And And removing the pad protector from the pad mounting surface via the access hole to form the isolation layer with the contact receiving cavity. The method of claim 11, The pad protector is formed on the pad mounting surface by printing. The method of claim 11, The pad protector has a cross section gradually reduced in a direction away from the pad mounting surface. The method of claim 11, And the pad protector is removed from the pad mounting surface by solvent washing. The method of claim 11, The photopolymer layer is a semiconductor device manufacturing method, characterized in that the photoresist layer. The method of claim 10, And the conductor is formed from a conductive paste. The method of claim 10, And the conductor further comprises an extension portion formed on a surface of the isolation layer opposite to the pad mounting surface and having one end connected to the fixing portion. The method of claim 17, And the conductor further comprises a contact portion formed on a surface of the isolation layer at the other end of the extension portion facing the fixing portion. The method of claim 18, And forming an insulating protective layer over the isolation layer to cover the fixing and extension portions of the conductor. In a semiconductor device, A semiconductor chip having a pad mounting surface provided with an adhesive pad; An insulating isolation layer adjacent to the adhesive pad and adapted to access the contact receiving cavity and the contact receiving cavity, wherein an access hole narrower than the contact receiving cavity is formed and formed on the pad mounting surface; And And a conductor having a fixing portion for filling the contact receiving cavity and the access hole and in electrical contact with the adhesive pad. The method of claim 20, And the conductor is formed from a conductive paste. The method of claim 20, And the isolation layer is made of a photoresist material. The method of claim 20, And the conductor further comprises an extension part formed on a surface of the isolation layer opposite to the pad mounting surface and having one end contacting the fixing part. The method of claim 23, wherein And the conductor further comprises a contact portion formed on the surface of the isolation layer at the other end of the extension portion opposite the fixing portion. The method of claim 24, And an insulating protective layer formed on the isolation layer so as to cover the fixed and extended portions of the conductor.