KR100332304B1 - Manufacturing method for multi-layer printed circuit board - Google Patents

Abstract

PURPOSE: A method for manufacturing a multi-layer PCB(Printed Circuit Board) is provided to reduce the size and weight by building up a conductive layer and an insulating layer on a removable layer and eliminating the removable layer. CONSTITUTION: Insulating layers(4,9) provided with via-holes(5,8,11) are formed on a substrate which is provided with a removable layer. Conductive layers(6,12) provided with a conductor pattern(13) having a predetermined shape are formed on the insulating layers(4,9). By repeating the two forming procedures, the insulating layers(4,9) and the conductive layers(6,12) are build up to a predetermined height. In order to connect the conductive layer(6,12) to each other, the via-holes(5,8,11) are filled with a conductive paste. Thereafter, the removable layer is eliminated.

Description

Manufacturing method for multi-layer printed circuit board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed circuit board (hereinafter referred to as a PCB), in particular, on a substrate having a removable layer, a build-up of a conductor layer and an insulating layer, The present invention relates to a multilayer PCB manufacturing method that can easily manufacture a multilayer PCB that can be thinner and lighter by removing the substrate by removing the removable layer.

PCB is the most basic component of many fields of electronic products currently manufactured. In recent years, high-density multilayer PCBs for miniaturization have been developed for electronic products such as mobile phones, laptops, palmtops, camcorders, ball grid arrays (BGAs), It is widely used in package substrates for semiconductors such as chip scale packaging (CSP) and multi chip module (MCM). The PCB demands further weight reduction, thinning, and high multi-layer, so that the manufacturing method by build-up is taken.

Referring to Figure 1 will be described the manufacturing process of a multilayer PCB by a conventional build-up method. In order to manufacture a multilayer PCB by a build-up method, a substrate is essential. This basic substrate generally uses multilayer PCBs with more than two sides. The multilayer PCB is manufactured by stacking a single-sided or double-sided board of a desired layer on a double-sided PCB (sequential lamination method).

In the conventional embodiment shown in FIG. 1, in step (A), a double sided copper clad laminate is used as the base substrate. The said double-sided copper clad laminated board means the board | substrate with which copper foil 21 was coated on both surfaces.

In the step (B), the through holes 23 are drilled with a drill to connect the upper and lower conductor layers of the double-sided copper clad laminate, and plating is performed inside the through holes to connect the upper and lower conductor layers. do. The through hole 23 also has a cavity so that the through hole is filled with filler 25. The upper and lower copper foils are etched in a desired shape to form a first conductor layer having the first conductor pattern 21a of a predetermined shape.

In the step (C), the resin is laminated by pressing Resin Coated Copper foil (RCC) on the upper and lower surfaces of the base substrate. The RCC refers to an adhesive insulating resin 27 coated on one surface of the copper foil 26.

In the step (D), the copper foil of the portion 26b for forming the via hole on the surface of the laminated RCC is etched to expose the insulating resin 27.

In the step (E), a via hole 29 is formed in the insulating resin 27 to expose the first conductor layer by drilling a hole in the insulating resin 27.

In the step (F), plating 29a is applied to the inside of the via hole to connect the second conductor layer made of copper foil of the RCC with the first conductor layer.

In the step (G), the second conductor layer is etched to a desired shape to form a second conductor pattern 26a having a predetermined shape.

In the step (H), the steps C to E are repeated to form the third conductor layer 33 and the third insulating layer 32 and to process the via holes 34.

In the step (I), the through hole 35 for interlayer connection and component mounting is drilled.

In the step (J), plating (34a) and (35a) are applied to the inside of the via hole 34 and the through hole 35, respectively, to connect the conductor layers.

In the step (K), the third conductor layer is etched to form a desired conductor pattern 33a.

In the step (L), the via hole 34 is filled with the filler 39 and the solder resist 40 is coated. In the above process, the via hole 34 may not be plugged.

In the above, the process of manufacturing a multilayer printed circuit board by stacking RCCs on the upper and lower surfaces, respectively, using the double-sided printed circuit board as a base substrate was described. Such a conventional manufacturing method is essentially a structure using a base substrate. In addition, it can be seen that via holes are processed by a laser drill and each conductor layer is connected by plating of such via holes.

Considering the trend of electronic products, it can be seen that the pursuit of further miniaturization, high density, thinness, light weight, and high multilayer. However, according to the above conventional manufacturing method, certain limitations are pointed out.

With reference to Figure 2, while looking at the cross-sectional view of a multilayer printed circuit board completed by the prior art, let's look at this technical problem.

First, in view of miniaturization and high density, a conventional substrate is essentially used in the conventional method. In the case of using such a base substrate, it is understood that a plating through-hole 41 penetrating the base substrate is inevitably required in order to connect the upper and lower conductor layers.

Recently, the number of component mounting holes 42 has been reduced due to the development of surface mounting technology (SMT). However, as the printed circuit board becomes more multilayered, two or more layers of conductors are inserted without inserting components. The number of interstitial via holes (IVH) 44 and 45 for connecting only the conductor layer without penetrating completely through the plated through hole 43 for connection is increasing in proportion to the number of layers to be multilayered. Therefore, the increase of the plated through-holes in the multilayered layer is a barrier to densification and increases the manufacturing time.

And in the layer manufactured by the build-up method, each independent via hole 46 is not so much a problem at the time of manufacture, but the connection of the plating through hole 44 and the via hole 47 has a limitation in positioning. That is, since the via hole cannot be installed vertically in the upper portion 48 of the plated through hole, the plated through hole 44 and the via hole 47 are positioned at a distance d apart from each other. This problem can also be seen in the connection between the via holes 49 and 50. Therefore, it can be seen that this problem is a barrier to the densification of the multilayer printed circuit board. In addition, when another via hole 52 is positioned on the upper part of the via hole 51, a problem occurs in that the diameter of the via hole located at the upper part becomes larger. This problem is another obstacle to densification because it adversely affects the density on the surface.

In addition, considering the trend of electronic products that have improved functionality while being miniaturized, certain limitations have been pointed out in terms of miniaturization in the conventional manufacturing method, which has a limitation in densification.

From the standpoint of thinning and weight reduction, it can be seen that the use of a basic substrate is essential according to the conventional manufacturing method. It can be seen that it has a relatively thick layer compared to the layer being built up. Therefore, the presence of such a substrate is exposed to the limit of thinning, and this problem can be said to be a barrier to weight reduction along with the problem of miniaturization.

In addition, in order to realize a high multilayer in a certain thickness, since it cannot be realized without solving the problem of the thinning, a certain limit is also exposed in the high multilayer layer.

As described above, according to the manufacturing method and structure of the conventional multilayer printed circuit board, it takes a long time for the manufacturing process and there is a disadvantage in that the structural miniaturization, high density, thinness, light weight, and multilayer are limited.

Accordingly, the present invention has been made to solve the above problems, and a first object of the present invention is to provide a method for manufacturing a multilayer printed circuit board which can be made thinner and lighter overall.

It is a second object of the present invention to provide a method for manufacturing a multilayer printed circuit board which can be made denser and miniaturized as a whole.

It is a third object of the present invention to provide a method for manufacturing a multilayer printed circuit board which can build-up of a desired number of layers in a relatively fast time.

In order to achieve the above object, an embodiment of the present invention includes the steps of manufacturing a multilayer printed circuit board composed of at least one conductor layer and an insulating layer on a substrate having a removable layer; After the desired number of layers is completed, the step of removing the removable layer to separate the base substrate from the multilayer printed circuit board.

In order to achieve the above object, another embodiment of the present invention further includes a process of additionally forming at least one conductor layer and / or insulation layer on at least one side of the upper and lower surfaces of the multilayer printed circuit board on which the substrate is separated. To configure.

According to each embodiment of the present invention, it is possible to provide a multilayer printed circuit board without a substrate basically, it is possible to provide a multilayer printed circuit board that can be further thinner, lighter.

In addition, the via hole formed in the insulating layer may be filled with a conductive paste to provide a multilayer printed circuit board having a higher density and a smaller size.

In addition, since the conductive pattern of the inner layer is formed of a conductive paste, a multilayer printed circuit board can be manufactured more quickly.

1 is a conventional multilayer PCB manufacturing process diagram

2 is a cross-sectional view of a multilayer PCB completed by a conventional manufacturing process

3 is a cross-sectional view of a multilayer PCB with a removable layer in accordance with the present invention.

Figure 4 is a multi-layer PCB manufacturing process according to an embodiment of the present invention

5 is a cross-sectional view of a multi-layer PCB completed by an embodiment of the present invention.

<Explanation of symbols for main parts of the drawings>

1: porous substrate 1a: porous substrate

1b: fiber mesh (or metal mesh) substrate 1c: light transmissive substrate

2: soluble layer 2a: degradable layer

3: pore 4, 9: insulation layer

5, 8, 11: Via hole 6, 12: Conductor layer

10 part mounting hole 13 conductor pattern

14: solder resist

Hereinafter, with reference to the embodiment shown in the drawings, the present invention will be described in more detail.

First, a substrate having a removable layer will be described in detail with reference to FIGS. 3A to 3D.

A substrate with a removable layer consists of a removable layer and a substrate for effectively attaching and removing it. As an example of the material constituting the removable layer, a soluble material can be used. Specifically, for example, the substance is dissolved in water, an aqueous solution, or a solvent of a specific component.

As another example of the material constituting the removable layer, a material removed by light can be used. Specifically, for example, a material that loses adhesion or is decomposed into a gas by light having a specific wavelength and specific energy, such as ultraviolet rays or X-rays.

It is of course also possible to use materials that can be removed in a particular gaseous atmosphere.

Therefore, the removable layer according to the present invention means using a material that can be removed by a chemical or physical reaction under a constant atmosphere.

Substrates with similar removable layers have already been proposed in Korean Patent Application No. 10-1999-0000777 along with removable substrates. It can be seen that the removable substrate proposed in the patent application may take a long time to dissolve using a solvent because of its thick thickness. In addition, it can be seen that a substrate having a removable layer on a general substrate has a structure that takes a long time for the solvent to penetrate through the substrate to the inside of the removable layer.

Accordingly, the present invention seeks to provide a substrate having a more effective removable layer to compensate for these drawbacks.

With reference to FIG. 3, the cross section of the substrate with the more effective removable layer will be described in detail.

The substrate with the removable layer consists of the removable layer 2 and the substrates 1 (1a) (1b) 1c for fixing it. The removable layer 2 may be formed by applying a liquid material and then drying or curing the same, and may also laminate or attach a film by compressing the material. Therefore, the removable layer may be referred to as a layer formed by attaching a removable material to a predetermined thickness on a specific substrate.

An example of the substrate for more effectively attaching or removing the removable layer is a porous substrate having a plurality of pores.

The porous substrate will be able to remove the removable layer more effectively since it is easy to access the removable layer through a plurality of pores.

3A illustrates a substrate 1 having a plurality of holes as an example of the porous substrate. The hole 3 can be processed by a method such as drilling or drilling, and can be freely manufactured in any size, shape, and quantity of holes. In addition, the removable layer 2 is a layer made of a material that is physically and / or chemically removable, and may be applied to the porous substrate 1 in a liquid form or laminated in a film form. Through the holes, the removable layer may be more effectively removed.

As another example of the porous substrate, as shown in FIG. 3B, a substrate 1a having a porosity such as a sintered plate or a gypsum plate may be used. The sintered plate (or gypsum plate) has fine pores, through which the removable layer may be more effectively removed. In addition, since the porous substrate such as the sintered plate (or gypsum plate) has a high heat resistance, it can be used for the manufacture of a printed circuit board requiring heat resistance like a ceramic (sintered) printed circuit board.

In addition, as another example of the porous substrate, as shown in FIG. 3C, a fiber net or a metal net 1b may be used. The fibers (or metal mesh) also have many pores, which will allow for more effective removal of the removable layer 2. However, since the substrate having the form of the fiber (or the metal mesh) is flexible, it should be fixed to a frame (fixing frame) of a predetermined shape or impregnated with a material that can be removed to the inside to solidify to a certain form.

The removable layer 2 may also consist of a layer 2a of photodegradable material that is removable by light, in this case a substrate for the photodegradable layer 2a, as in FIG. As an example, the removable substrate may be applied to the light-transmissive substrate 1c such as glass to form a removable substrate. The layer 2a that can be removed by the light may be formed of a liquid or film-like material. Removal of the removable layer 2a may be effectively removed by specific light passing through the adherent substrate.

According to each embodiment of the substrate having each of the removable layers, it can be seen that the substrate is configured to remove the removable layer more effectively. That is, the substrate 1 having a plurality of holes, the porous substrate 1a such as the sintered plate (or gypsum plate), and the mesh type substrate 1b such as the fiber network (or the metal mesh) have a common porosity and are various. It can be seen that the fluid is freely accessible. Therefore, it can be seen that the solvent used in the subsequent substrate removal operation is advantageous to access the removable layer through these pores, so that the removable layer can be easily removed.

In addition, in the case of using a light-transmissive substrate, light can be easily removed to the removable layer, so that the easily removable layer can be removed. Of course, in this case, the removable layer must be made of a material which is removed by light.

Hereinafter, an embodiment of the present invention will be described in more detail with reference to steps (A) to (J) of FIG. 4.

In the step (A), the porous substrate 1 having a plurality of holes 3 and the dissolvable layer 2 are used as basic substrates for manufacturing a multilayer printed circuit board. The removable layer may be attached by applying or laminating a liquid or film-like material on the porous substrate. In addition, the removable layer may be a material that can be removed by chemical and / or physical reactions, including a material that can be dissolved under a certain atmosphere.

In addition, the porous substrate may be a substrate having a plurality of through holes, and a porous substrate such as a sintered plate (or gypsum plate) or a fiber (or metal mesh) may also be used, and the removable layer may be removed by a specific light. In the case of using a material, a light-transmissive substrate may be used.

In the method of manufacturing a multilayer printed circuit board according to the present invention, any of an insulating layer and a conductor layer can be formed from a desired layer on the removable layer. The proper layer can be formed by considering the properties of the product and the ease of operation. In this embodiment, the first insulating layer 4 is first formed on the removable layer.

In the step (B), the first insulating layer 4 is formed on the removable layer 2. As an insulating material constituting the insulating layer, an insulating material in the form of a film may be used as an example. The insulating material in the form of a film may be laminated by a laminator such as a roller or a press. In addition, in the lamination step, it may be laminated by applying a vacuum state to increase the adhesion.

As another example of the insulating material constituting the insulating layer, an insulating layer may be formed by coating or printing a liquid insulating material.

In addition, the insulating material in the liquid or film form may use a material having photosensitive (photo developing) characteristics. That is, the material may be a material capable of exposing a specific light (or ultraviolet) through a mask and developing it in an exposed form or a negative form.

Therefore, a liquid insulating material may be applied or printed on the removable layer, or an insulating layer may be formed by stacking an insulating material in the form of a film. In addition, since it is also possible to laminate a recently developed thermal curable dielectric material or an RCC described in a conventional manufacturing method, any insulating material used for manufacturing a multilayer printed circuit board may be used.

In step (C), a step of processing the via holes 5 for interlayer connection is shown. This is a via hole for electrically connecting two or more different conductor layers in a multilayer printed circuit board, and may be said to be the most important part in manufacturing a multilayer printed circuit board. In the case where an insulating material having photosensitivity is used in the above step, a method by exposure and development (photovia method) can be used. The via hole forming process will be described in detail. First, exposure using a predetermined mask is performed. At this time, the part exposed to light will have a different physical or chemical properties. Next, a portion not exposed to light is developed to form a predetermined via hole.

In addition, the photosensitive insulating material has a feature that can be processed via holes with a laser drill. Therefore, the laser drill introduced in the conventional method of manufacturing a multilayer printed circuit board may be used, and may be processed in various ways in the future. In addition, it can be seen that each embodiment according to the present invention can be processed by any of these methods, and in particular, when the photosensitive insulating material is used, a photo developing method can be applied.

In the step (D), a step of filling the via hole 5 using a conductive paste 5a and a step of forming the conductor pattern 6 on the first insulating layer 4 are shown. The steps may be performed separately, or may be performed simultaneously. Here, the conductive paste refers to a material mixed with a conductive metal powder, a polymer, a thinner, and the like, and for example, silver paste, gold paste, and copper paste. It refers to a material that is often used as a material for conductors in the manufacture of printed circuit boards.

The conductive paste may fill the via hole 5 using a silk screen printing method or a metal mask, and simultaneously print the conductive pattern 6 having a predetermined shape while filling the via hole. In addition, in order to avoid bubbles or cavities inside the via hole filling process, a vacuum may be applied to increase reliability. In addition, a step of curing the via hole or the conductor pattern formed of the conductive paste under certain conditions in accordance with the specification of the conductive paste is added.

Moreover, as another example of forming a conductor pattern, copper foil may be laminated or plating may be performed. That is, the via hole may be filled with a conductive paste and the copper foil may be compressed and laminated, or the plated layer may be formed by electroless plating and electroplating to form a conductor layer, and then a predetermined conductor pattern may be formed by etching.

As described above, the single-sided printed circuit board having one conductor layer and one insulation layer is completed. In addition, it can be seen that the via layer 5 exists for the interlayer connection in the insulating layer 4. It can be seen that the via hole 5 according to the present invention is filled with a conductive paste, and the formation process of the conductor pattern can be applied by various methods such as conductive paste, copper foil, or plating.

In the step (E), a multi-layered step of building-up is performed by repeating the steps (C) and (D). In the embodiment of the present invention, it can be seen that after the build-up of the insulating layer and the conductor layer having the desired number of layers, the finish is finished with the fifth insulating layer 9 having the via holes 8 filled with the conductive paste. Of course, the last step of the multilayering process may be finished with the desired layer of insulating layer or conductor layer. That is, it is natural that another conductor layer may be formed on the fifth insulating layer 9.

In the step (F), a process of separating the porous substrate 1 from the formed multilayer printed circuit board by removing the removable layer 2 is shown. The removable layer 2 may be effectively removed through the pores 3 of the porous substrate 1. When a soluble substrate is used as the removable layer in the present invention, it may be removed by dissolving using the solvent. Since the solvent is free to enter and exit smoothly through the pores (3) will be able to more effectively dissolve and remove the removable layer.

In addition, the removal of the removable layer can be removed at any time after the desired number of layers is completed, it is also possible to remove even after the completion of the printed circuit board of the first layer in the step (D).

After the separation, the multilayer printed circuit board is manufactured by stacking or building up at least one insulating layer or conductor layer on at least one of the upper surface (a) or the lower surface (b) of the printed circuit board. You may.

In the step (G), the component hole 10 for attaching the electronic component is drilled. In the prior art, not only the through-holes for this component but also the via-holes 11 for the interlayer connection were drilled, but in the manufacturing method according to the present invention, the interlayer connection to the inner conductor layer is already filled with the conductive paste. Therefore, it can be seen that via holes for interlayer connection are not drilled.

In step (H), panel plating is performed on the outermost upper, lower surfaces, and through holes of the formed multilayer printed circuit board. The panel plating may form the conductor layer 12 to a desired thickness by electroless plating and electroplating.

In the step (I), the conductor layer 12 on the outermost upper and lower surfaces formed by the panel plating is etched into a desired shape to complete the conductor pattern 13 having a predetermined shape.

In the step (J), a multilayer printed circuit board having six conductive layers is completed while applying the solder resist 14.

In addition, although not shown in the drawings, in the present invention, in particular, it is also possible to form one or more printed parts on at least one or more layers of the conductor layer and the insulating layer produced in the above steps. The printed component may include, for example, an active device such as a resistor or a transistor, a hybrid device, or the like, which may be formed by stacking and combining a p-type semiconductor, an n-type semiconductor, or the like in a desired form.

A cross section of the multilayer printed circuit board completed through the above process is shown in FIG. 5. As shown, it can be seen that there is no basic substrate that was initially used to manufacture a multilayer printed circuit board. Of course, the substrate is removed in the process (F) in FIG. Therefore, it can be seen that a multilayer printed circuit board can be provided that is thinner and lighter than a conventional manufacturing method.

Looking at the conductor layer of the multilayer printed circuit board, the inner layer is formed of four conductive layers (e2) (e3) (e4) (e5) formed of a conductive paste, and the outer layers are the first conductor layer (e1) and the sixth layer. The conductor layer e6 is formed by plating. Each conductive layer is composed of five insulating layers d1 (d2) (d3) (d4) and d5 having predetermined via holes. Therefore, in FIG. 5, it can be seen that a multilayer printed circuit board having six layers including a surface conductor layer is illustrated.

Now let's look at the structure of the via hole. First, it can be seen that the plated through-hole h is plated after being drilled through as a part hole. Separately, it can be seen that the through-hole h2 for interlayer connection and the interstitial via hole h3 for interlayer connection therein are built-up and filled with conductive paste without mounting components.

In addition, in FIG. 2 according to the conventional method, the vertical interlayer connection, which is not feasible in the connection of the interstitial via hole 44 and the via hole 47, is a straight line above and below the interstitial via hole h3 of FIG. 5. It can be seen that there exists one via hole h3a and h3b. In addition, it can be seen that the vertical connection (h4) (h4a) between the via holes, which is difficult to realize in the conventional method, is also possible.

Therefore, it is possible to use the internal area more efficiently than the conventional method, it is possible to provide a multilayer printed circuit board that is more dense and miniaturized.

In addition, in the present invention, since the via holes without mounting of the parts are simultaneously generated during build-up, it can be seen that the manufacturing time can be shortened by shortening the drilling and plating process. In addition, it can be seen that the manufacturing time is further shortened by manufacturing the conductive layer to the inner layer conductive pattern and plating only the outer layer.

Next, other embodiments that can be modified within the basic technical scope of the present invention will be described.

Another embodiment of the present invention will be described with respect to the printed component applicable to the manufacturing technology of the multilayer printed circuit board. The printed component is an electronic component formed by a printing technology, which is an independent active element such as a print coil, a print resistor, a capacitor, a strip line, or the like, or an electronic component that combines independent elements such as a hybrid IC.

Therefore, in the multilayer printed circuit board manufacturing process according to the present invention, it is possible to simultaneously form such a printed component on any layer. That is, when manufacturing a multilayer printed circuit board according to the present invention, at least one or more of the above-described printed parts may be mounted on at least one layer among the lowermost layer, the middle layer, and the uppermost layer. It becomes possible to manufacture electronic products with added functions as well as a circuit board.

As described above, according to the present invention, a substrate having a removable layer is used. Technical process is to manufacture a printed circuit board composed of at least one insulating layer and a conductor layer on the removable layer and to remove and remove the removable layer, the upper and lower middle of the separated printed circuit board The method further includes forming at least one conductor layer and / or an insulation layer on at least one side.

In the embodiment of the present invention, the via hole is filled using the conductive paste, and it can be seen that the inner conductor layer can be formed. In addition, it can be seen that the multilayer printed circuit board may be manufactured by simultaneously mounting one or more printed parts on an arbitrary layer.

As described above, according to the present invention, it is possible to provide a multilayer printed circuit board without a base substrate, and to further thinner and lighter weight by separating a substrate having a removable layer that has been used as a base substrate for work. It may be possible to provide a printed circuit board.

In addition, if the method of filling the via hole with the conductive paste is selected in the manufacturing method according to the present invention, it will be possible to quickly provide a multilayer printed circuit board with higher density and smaller size.

In the present invention, since the via holes without mounting of the parts are simultaneously generated while being built up, it can be seen that the manufacturing time can be shortened by shortening the drilling and plating process. In addition, it can be seen that the manufacturing time is further shortened by manufacturing the conductive layer up to the inner layer conductive pattern and plating only the outer layer.

In addition, it can be seen that the manufacture of the multilayer printed circuit board by simultaneously mounting one or more printed parts on a predetermined layer enables the manufacture of an electronic product having a function as well as a simple multilayer printed circuit board.

Claims (29)

Claim 1 has been deleted. Forming at least one multilayer printed circuit board comprising a conductive layer and an insulating layer on the substrate having a porous layer and a removable layer formed of a removable layer attachable to or removed from the porous substrate; And removing the removable layer by separating the substrate from the formed multilayer printed circuit board after the desired number of layers is completed by the above process. The method of claim 2, wherein the removable layer, A method for manufacturing a multilayer PCB, characterized in that it is formed of a material removed by chemical and physical reactions. The method of claim 2 wherein the removable layer is Multi-layer PCB manufacturing method characterized in that formed of a material removed by any one of the chemical and physical reactions. The method of claim 2, wherein the porous substrate, A method for removing a multilayer PCB, characterized in that it is formed of a substrate having a plurality of holes perforated. The method of claim 2, wherein the porous substrate, Multi-layer PCB manufacturing method characterized in that formed of a porous sintered plate. Claim 7 has been deleted. Claim 8 has been deleted. Claim 9 has been deleted. Claim 10 has been deleted. Claim 11 has been deleted. The substrate of claim 2, wherein the substrate with the removable layer is A translucent substrate; And a photodegradable layer attached to the light transmissive substrate and capable of being removed by specific light. Claim 13 has been deleted. Forming an insulating layer having a predetermined via hole on the substrate having the removable layer; Forming a conductor layer having a conductor pattern having a predetermined shape on the insulating layer; Repeating the above two processes to build up the insulating layer and the conductor layer to the desired number of layers; Filling the via hole with a conductive paste for connecting the conductor layers; And then removing the removable layer to separate the substrate from the formed multilayer printed circuit board after the desired number of layers is completed by the above process. Claim 15 has been deleted. Claim 16 has been deleted. The method of claim 14, wherein the forming of the multilayer printed circuit board comprises: And forming a conductor pattern after the conductor layer is formed by using a conductive paste. The method of claim 14, wherein the forming of the multilayer printed circuit board comprises: Forming a conductor pattern having a predetermined shape while filling the via hole with a conductive paste to form a conductor layer. The method of claim 2, wherein the forming of the multilayer printed circuit board comprises: A method for manufacturing a multilayer PCB, wherein an insulating layer is formed using a liquid insulating material. The method of claim 2, wherein the forming of the multilayer printed circuit board comprises: Method for removing a multilayer PCB, characterized in that the insulating layer is formed using an insulating material in the form of a film. The method of claim 2, wherein the forming of the multilayer printed circuit board comprises: A method for manufacturing a multilayer PCB, wherein an insulating layer is formed using a thermosetting insulating material. The method of claim 2, wherein the forming of the multilayer printed circuit board comprises: A method for manufacturing a multilayer PCB, wherein an insulating layer is formed using a photosensitive (photo developing) insulating material. The method of claim 19, wherein the forming of the multilayer printed circuit board comprises: A method for manufacturing a multilayer PCB, wherein an insulating layer is formed on a substrate having a removable layer by printing the insulating material having a predetermined via hole and curing the printed insulating material. The method of claim 22, wherein the forming of the multilayer printed circuit board is performed by: The via hole is formed by exposing an insulating material through a predetermined mask and developing the exposed portion. The method of claim 19, wherein the multilayer printed circuit board forming process is performed by: The method of manufacturing a multilayer PCB, characterized in that for forming the via hole by a laser drill. The multilayer PCB of claim 2, further comprising: forming at least one conductor layer and an insulating layer on at least one of an upper surface and a lower surface after removing the removable layer to separate the substrate. Manufacturing method. 3. The method of claim 2, further comprising forming one or more conductive layers and an insulating layer on at least one of an upper surface and a lower surface after removing the removable layer to separate the substrate. Multi-layer PCB manufacturing method. 28. The method according to claim 26 or 27, wherein after removing the removable layer to separate the substrate, plating is performed on upper and lower surfaces and through holes to form a conductor layer, and the conductor layer is etched to form a predetermined conductor pattern. Multi-layer PCB manufacturing method characterized in that it further comprises a process. The method of claim 2, And mounting at least one printed component on at least one layer of the conductor layer and the insulating layer.