KR100319802B1 - Device handler and method of control thereof - Google Patents

Abstract

An object of the present invention is to provide a component handling apparatus and a method of controlling the same, which speeds up the sequence operation of an actuator mounted on the component handling apparatus and improves the throughput of the component processing.

The component holding part 6 which detachably supports a component, the pressure cylinder 10 which moves the component holding part 6 to a Z-axis direction, and the component holding part 6 and the pressure cylinder 10 are referred to as said Z The motor 18 which moves in the X-axis or Y-axis direction different from the axial direction, and the component holding part 6 and the pressure cylinder 10 are moved along the X-axis or Y-axis direction by the motor 18, At the time point before detecting that the predetermined stop position A or B has been reached, the interruption signal generation circuit 22 generating the interruption signal and the time point at which the interruption signal generating circuit 22 generates the interruption signal are referred to. To generate a pressure cylinder drive signal for outputting a signal for driving the pressure cylinder 10 when the timer circuit 22 and the timer circuit 22 detect that the predetermined waiting time has elapsed. Has a circuit 22.

Description

Device handling device and control method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component handling apparatus for handling components such as an IC chip and the like, and more particularly, to a component handling apparatus for speeding up the sequence operation of an actuator mounted in the component handling apparatus and improving the throughput of the component processing. An apparatus and a control method thereof are provided.

In order to test components, such as the finally manufactured IC chip, a component test apparatus is required. In such a test apparatus, a component handling apparatus called a handler is used. In this type of handler, a large number of IC chips stored in a tray are held by a component holding device and conveyed on a test head of a test apparatus, each IC chip is electrically connected to a test head, and each IC chip is tested. . Then, when the test is completed, each IC chip is taken out from the test head by the component holding device and transferred to the tray according to the test result, whereby the classification into the categories of good and defective products is performed.

In this kind of handler, the IC chip is carried between the customer tray and the test tray before and after the test. In the handler, the IC chip is moved by the component holding device at various positions. The part holding device generally has a part holding part for detachably holding a part, a pressure cylinder for moving the part holding part in the vertical direction, and a motor actuator for moving the part holding part and the pressure cylinder in a planar direction.

In the sequence operation of the handler, the component holding part and the pressure cylinder are usually moved to a predetermined position by using a motor actuator, and then the pressure cylinder is driven to move the component holding part up and down to hold or release the part. When the component holding part and the pressure cylinder are moved to a predetermined position by using the motor actuator, the vibration of the mechanical system caused by the motor actuator operation subsides to some extent, and then the pressure cylinder, which is the next operation, is driven. As a time to which the vibration of a mechanical system sinks to some extent, the waiting time of about 50-100 milliseconds is estimated normally.

In the conventional handler, after the waiting time has elapsed, a driving signal is sent to the solenoid valve for driving the pressure cylinder, the pressure cylinder is driven, and the component holding part is moved up and down to hold or release the part.

By the way, such a conventional handler typically sends a driving signal to the solenoid valve for driving the pressure cylinder, and then until the pressure cylinder is actually driven to start operation (the air pressure is filled inside the pressure cylinder), it is usually about 100 It took a few milliseconds and wasted that much time.

As a component holding device of a conventional handler, one IC chip can be transported and returned from one position to another within about one second, and about 3600 IC chips can be processed in one hour. If 100 milliseconds of idle time can be eliminated in about one second, 3996 IC chips can be processed per hour, which can lead to a significant improvement in throughput.

This invention is made | formed in view of such a situation, and an object of this invention is to provide the component handling apparatus and its control method which speed up the sequence operation | movement of the actuator mounted in the component handling apparatus, and aimed at the improvement of the throughput of component processing.

1 is a schematic diagram of a component adsorption holding device of a component handling apparatus according to an embodiment of the present invention;

2 is a flowchart showing the operation of the control device shown in FIG. 1;

3 is a logic circuit diagram showing a part of a circuit of the control device shown in FIG. 1;

4A is a timing chart of a component handling apparatus according to an embodiment of the present invention, and FIG. 4B is a timing chart of a conventional component handling apparatus.

Fig. 5A is a timing chart from another viewpoint of a component handling apparatus according to an embodiment of the present invention, Fig. 5B is a timing chart from another aspect of a conventional component handling apparatus.

6 is a schematic plan view of an IC chip component testing apparatus having a component handling apparatus according to one embodiment of the present invention;

FIG. 7 is a schematic side view of the IC chip component test apparatus shown in FIG.

<Description of the symbols for the main parts of the drawings>

2: Component adsorption retention device 2a, 2b: X-Y shifter

4: IC chip (component) 6: Adsorption pad

8: movable shaft 10, 10a, 10b: pressure cylinder

12, 12a, 12b: movable head 14: guide rail

14a, 14b, 14c, 14d: Rail 16: rotary shaft

18: motor 22: controller

24: solenoid valve 27: ejector

In order to achieve the above object, the component handling apparatus according to the present invention includes a component holding part for detachably holding a component, a first actuator for moving the component holding part in a first direction, the component holding part and the first actuator. A second actuator for moving the motor in a second direction different from the first direction, and the component holding part and the first actuator being moved in the second direction by the second actuator and reaching a predetermined stop position. An interruption signal generating circuit for generating an interruption signal at a point before the detection, a timer circuit for counting a waiting time on the basis of the point at which the interruption signal generating circuit has generated the interruption signal, and predetermined by the timer circuit A first actuator that outputs a signal for driving the first actuator when detecting that the waiting time has elapsed It has a drive signal generating circuit.

It is preferable that the component handling apparatus which concerns on this invention has a 1st direction position detection sensor which detects the position of the said component holding part moved to a 1st direction by the said 1st actuator. When the position of the component holding portion is detected by the first direction position detection sensor and the component holding portion is moved to a predetermined position, the component holding portion is moved to the next suction operation or suction release operation.

It is preferable that the component handling apparatus which concerns on this invention has a 2nd actuator drive signal generation circuit which outputs the drive signal which drives the said 2nd actuator.

Preferably, the interruption signal generating circuit outputs the interruption signal after a predetermined time on the basis of the time point at which the driving signal is started output from the second actuator driving signal generating circuit to the second actuator.

It is preferable that the said component holding part is provided with the adsorption pad which adsorb | sucks a component by underpressure.

The first actuator and the second actuator are not particularly limited, but examples thereof include a pressure cylinder using a fluid pressure, a motor actuator, and the like. In the present invention, the first actuator is a pressure cylinder, and the second actuator corresponds to a drive signal. This is particularly effective in the case of a motor which can control the rotation angle by using the motor.

The control method of the component handling apparatus of the present invention includes a component holding part for detachably holding a component, a first actuator for moving the component holding part in a first direction, and the component holding part and the first actuator in the first direction. A method of controlling a component handling apparatus having a second actuator for moving in a second direction different from the second actuator, wherein the component holding part and the first actuator are moved along the second direction by a second actuator and stop a predetermined stop. A process of generating an interruption signal at a time point before detecting that the position has been reached, a process of counting a wait time based on the time point at which the interruption signal is generated, and a case where a predetermined wait time has been detected And outputting a signal for driving the first actuator.

Preferably, the timing for generating the interruption signal is set after a predetermined time has elapsed based on the time point at which the driving signal for driving the second actuator is output.

<Action>

In the component handling apparatus of the present invention and a control method thereof, an interruption signal is generated at a point before the component holding part and the first actuator are moved in the second direction by the second actuator to detect that the predetermined stop position is reached. do. The waiting time is counted based on the time point at which the interruption signal is generated, and when it is detected that the predetermined waiting time has elapsed, a signal for driving the first actuator is output.

For this reason, the vibration of the mechanical system sinks by driving stop of the second actuator such as the motor between outputting a signal for driving the first actuator such as the pressure cylinder and actually driving the first actuator. Therefore, the wasteful time from the actual driving stop of the second actuator to the actual start of the first actuator is virtually eliminated, and the sequence operation of the actuator is speeded up, resulting in the improvement of the throughput of the component processing.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated based on embodiment shown in drawing.

1 is a schematic diagram of a component adsorption holding device of a component handling apparatus according to one embodiment of the present invention, FIG. 2 is a flowchart showing the operation of the control device shown in FIG. 1, and FIG. 3 is a control device shown in FIG. 4A is a timing chart of a component handling apparatus according to an embodiment of the present invention. FIG. 4B is a timing chart of a conventional component handling apparatus. Is a timing chart from another viewpoint of the component handling apparatus which concerns on one Embodiment of this invention, FIG. 6B is a timing chart from another viewpoint of the conventional component handling apparatus, FIG. 6 is an embodiment of this invention. A schematic plan view of an IC chip component testing apparatus having a component handling apparatus relating thereto, and FIG. 7 is a schematic side view of the IC chip component testing apparatus shown in FIG.

First embodiment

As shown in Fig. 1, the component handling apparatus according to the present embodiment has a component adsorption holding device 2 which detachably adsorbs and holds the IC chip 4 as a component. The component adsorption holding device 2 has a suction pad 6 for sucking the IC chip 4 under negative pressure. The adsorption pad 6 is preferably made of, for example, elastic rubber material or synthetic resin so as not to damage the IC chip 4 to be adsorbed. However, the adsorption pad 6 is made of metal depending on the type and use of the parts to be adsorbed. can do.

The suction pad 6 is fixed to the lower end of the movable shaft 8, the upper end of the movable shaft 8 is connected to the pressure cylinder 10 as a first actuator, and the movable shaft is driven by driving the pressure cylinder 10. Reference numeral 8 is movable in the Z-axis direction (first direction). The pressure cylinder 10 is an air pressure cylinder in this embodiment, and is fixed to the movable head 12. The movable head 12 is hold | maintained so that reciprocation is possible along the guide rail 14 along the X-axis direction or the Y-axis direction (2nd direction). The movable head 12 is screwed with the rotating shaft 16 of the motor 18 as the second actuator, and moves along the guide rail 14 in the X-axis direction or the Y-axis direction by the rotation of the rotating shaft 16. Controlled.

The motor 18 is controlled by the controller 22 via the motor driver circuit 20. The pressure cylinder 10 is also controlled by sending a drive signal from the controller 22 to the solenoid valve 24. In addition, the introduction and release of the negative pressure to the suction pad 6 sends a drive signal from the controller 22 through the ejector driver circuit 28 to the ejector 27 which introduces the negative pressure into the negative pressure line tube 26. Is controlled.

The component adsorption holding apparatus 2 which concerns on this embodiment is used, for example, to hold | maintain and hold | maintain the IC chip 4 in a predetermined position A, convey it to another position B, etc. The flow of the entire control sequence in that case will be described next.

First, a drive signal is sent from the controller 22 to the solenoid valve 24, the solenoid valve 24 is operated, air is sent to the lower cylinder chamber of the pressure cylinder 10, and the movable shaft 8 is Z-axis. In the downward direction, and the suction pad 6 is brought into contact with the upper surface of the IC chip 4 accommodated in the predetermined position A. As shown in FIG. After confirmation by the position sensor, the control device 22 sends a drive signal to the ejector driver 28 to drive the ejector 27, introduces a negative pressure into the adsorption pad 6, and draws the IC chip 4 onto the adsorption pad. Adsorption is maintained at (6).

After confirming that the IC chip 4 is being sucked by the sensor, the control device 22 sends a drive signal to the solenoid valve 24, sends air to the cylinder chamber for raising the pressure cylinder 10, and the suction pad ( 6) is moved upward along the Z-axis direction. The suction pad 6 is in a state in which the IC chip 4 is sucked and held. Subsequently, the controller 22 sends a drive signal to the motor 18 through the motor driver 20, drives the motor 18 to rotate the rotation shaft 16 at a predetermined rotation angle. As a result, the movable head 12 moves along the guide rail 14 in the X-axis or Y-axis direction and stops while the suction pad 6 is positioned above the other position B. As shown in FIG.

Subsequently, the controller 22 sends a drive signal to the solenoid valve 24, sends air to the lower cylinder chamber of the pressure cylinder 10, and moves the suction pad 6 downward along the Z axis. In the stage where the IC chip 4 is located near the position B, the control device 22 sends a drive signal to the ejector 27 through the ejector driver 28, releases the negative pressure of the suction pad 6, The suction holding of the IC chip 4 by the suction pad 6 is released. As a result, the IC chip 4 falls from the suction pad 6 to the position B. FIG.

Thereafter, the empty suction pad 6 is raised along the Z-axis direction by the pressure cylinder 10, and moves to the original position or another position by driving the motor 18, so that the IC chip 4 as described above. ) Adsorption holding and conveying are repeated.

In this series of control sequences, in this embodiment, the suction pad 6 is moved to a predetermined position A or B along the X-axis or Y-axis direction, and then the suction pad 6 is moved downwardly along the Z-axis direction. A control sequence is performed based on the flowchart of FIG. In addition, although the control shown in FIG. 2 may be performed by the dedicated control circuit, it may be performed by the computer which has the software program corresponding to FIG.

As shown in Fig. 2, when control starts in step S1, the control device 22 shown in Fig. 1 determines whether or not a motor output pulse is generated in step S2. The motor output pulse is generated by a motor drive signal generation circuit (second actuator drive signal generation circuit) built in the control device 22. When it is determined that the motor output pulse is generated in step S2 shown in Fig. 2, the control device 22 shown in Fig. 1 sends the moving pulse signal to the motor driver circuit 20 in step S3. Output The motor driver circuit 20 outputs a motor drive signal to the motor 18 based on the movement pulse signal to rotate the rotating shaft 16. The output monitor of the motor movement pulse signal is shown in Fig. 4A. As shown in Fig. 4A, a motor drive signal is generated at a timing Tms at which the moving pulse signal is output, and a motor operation command is performed. The motor speed rises from the timing Tms, then becomes a constant speed, decelerates at the falling timing Tme of the motor movement pulse, and after that, the speed is completely zero after being slightly vibrated.

The motor 18 sends an encoder feedback signal corresponding to the rotation angle to the motor driver circuit 20, and in the motor driver circuit 20 or the control device 22, at step S4 shown in FIG. As shown, the motor movement pulse (the duration of the pulse or the number of pulses) is measured, and the measurement result is referred to as P1. The motor movement pulse P1 as the measurement result corresponds to the movement distance along the guide rail 14 of the movable head 12 shown in FIG.

In this embodiment, it is determined whether or not the motor movement pulse P1 measured in step S5 shown in FIG. 2 has reached the interruption output pulse (the duration of the pulse or the number of pulses) P2 before stopping. If P1 becomes P2 or more, the process goes to step 26 shown in Fig. 2, and if not, steps S4 and S5 are repeated. Whether P1 is equal to or larger than P2 is determined by the comparator 80 shown in FIG. 3 incorporated in the control device 22 shown in FIG.

As shown in Fig. 3, the output signal of the comparator 80 is input to the first input terminal of the AND circuit 82. The interruption signal before stopping is input to the second input terminal of the AND circuit 82, and the output terminal of the AND circuit 82 is input to the first input terminal of the OR circuit 84. In the present embodiment, the second input terminal of the OR circuit 84 is connected to the output terminal of the other AND circuit 86. The moving pulse output completion signal is input to the first input terminal of the AND circuit 86. The movement pulse output completion signal is a signal output at the timing Tme shown in Fig. 4A. In addition, the positioning completion signal is input to the second input terminal of the AND circuit 86. The positioning completion signal means that the axial center position in the X-axis or Y-axis direction of the suction pad 6 shown in Fig. 1 is detected inside the servo driver by a feedback signal of a position sensor or an encoder, and the predetermined position A or It is a signal indicating that movement to B is detected, and in Fig. 4A, it is the position of timing Ti.

If it is determined that the moving pulse P1 measured in step S5 shown in Fig. 2 has reached the interruption output pulse P2 before stopping, the process proceeds to step S6 and the timing shown in Fig. 4A. At Tws, an interruption signal is generated from the output terminal of the OR circuit 84 shown in FIG. In addition, in the example shown in Fig. 3, even when it is determined that the moving pulse P1 measured by any malfunction has not reached the interruption output pulse P2 before stopping, the moving pulse output completion signal is sent to the AND circuit 86. And an interruption signal is generated by the OR circuit 84 when the positioning completion signal is input. That is, in the timing chart shown in Fig. 4A, when the motor movement pulse ends at the timing Tme and the positioning completion signal occurs at the timing Ti, the interruption signal is not generated at the timing Tws. Even if an interruption signal is generated, the system is secured. In addition, since the interruption signal generation circuit of the conventional control apparatus generates the interruption signal only by the AND circuit 86 shown in Fig. 3, in this embodiment, the comparator 80 and the AND are connected to the conventional interruption signal generation circuit. It is enough to add the circuit 82 and the OR circuit 84, and the change of the circuit (or software) can be minimized.

In this embodiment, the interruption output pulse P2 before stopping is before detecting that the axial center of the suction pad 6 shown in FIG. 1 has reached a predetermined stop position A or B in the X-axis or Y-axis direction. It is determined to generate an interruption signal at this point and is a preset value in the register. That is, the interruption output pulse P2 before stop is determined by experiment or the like in advance so that the interruption signal generation timing Tws shown in Fig. 4A is earlier than the stop timing Tme of the motor movement pulse. It is stored in the register of the control apparatus 22 shown in FIG.

In step S6 shown in Fig. 2, when an interruption signal is generated, an interruption is generated and control is transferred to a wait routine, but a moving pulse is output until the driver reaches a prescribed position in the meantime. do. The control device 22 shown in Fig. 1 measures the time from the occurrence of the interruption signal by a timer circuit or the like in step S7, and assumes that the measurement time is t. Next, in step S8, the control apparatus 22 shown in FIG. 1 determines whether the measurement time t is more than the predetermined | prescribed waiting time tw. If the measurement time t is equal to or greater than the predetermined waiting time tw, the process proceeds to step S9. Otherwise, steps S7 and S8 are repeated. In step S9, a drive signal is output from the control apparatus 22 shown in FIG. 1 to the solenoid valve 24 of the pressure cylinder 10. As shown in FIG. The waiting time tw is time for adjusting the timing Te which outputs a drive signal from the control apparatus 22 shown to FIG. 1 to the solenoid valve 24 of the pressure cylinder 10, for example, 100 millimeters. About a second or so.

When a drive signal is output from the control device 22 shown in Fig. 1 to the solenoid valve 24 of the pressure cylinder 10, the solenoid valve 24 is operated, and air is supplied to the lower cylinder chamber of the pressure cylinder 10. As shown in Fig. 4A, the movable shaft 8 shown in Fig. 1 starts to move at a timing Tss slightly later than the timing Te. The upper cylinder sensor attached to the pressure cylinder 10 detects the timing Tss at which the movement starts. Then, the lower cylinder sensor attached to the pressure cylinder 10 detects whether the movable shaft 8 shown in FIG. 1 has moved to a predetermined lowered position along the Z-axis direction (FIG. 2). Step S10 shown in FIG. The timing is shown by the timing Tse shown in FIG. At this timing, it means that the adsorption pad 6 shown in Fig. 1 has reached the lowered position as much as possible at the predetermined position A or B, and in that state, the process proceeds to step S11 shown in Fig. 2, The adsorption holding or desorption operation of the IC chip 4 by the suction pad 6 which is a sequence operation is performed. The adsorption holding or desorption operation of the IC chip 4 by the suction pad 6 is performed by the controller 22 controlling the ejector 27 via the ejector driver circuit 28.

Instead of the above-described cylinder sensor, a position sensor for mechanically or optically detecting the Z-axis direction position of the suction pad 6 or the movable shaft 6 from the outside may be used.

In the component adsorption holding device 2 and the control method of the component handling apparatus of the present embodiment, the suction pad 6 and the pressure cylinder 10 are moved along the X-axis or Y-axis direction by the motor 18, An interruption signal is generated at timing Tws (see Fig. 4A) before detecting that the predetermined stop position has been reached. When the waiting time tw is counted on the basis of the time at which the interruption signal is generated, and when it is detected that the predetermined waiting time tw has elapsed, the solenoid valve of the pressure cylinder 10 shown in FIG. A signal for driving 24) is output.

Therefore, as shown in Fig. 4A, the timing Te outputs a signal for driving the solenoid valve 24 of the pressure cylinder 10 to the timing Tss at which the pressure cylinder is actually driven. The vibration of the mechanical system due to the driving stop of the motor 18 sinks. Therefore, the wasteful time from the actual drive stop of the motor 18 to the actual drive start timing tss of the pressure cylinder 10 is almost eliminated, and it is possible to shift to the next sequence operation at the timing Tse. This speeds up the sequence operation. This sequence operation is repeated thousands of times or tens of thousands of times in the component handling apparatus, and as a result, the throughput of the component processing can be improved.

In this regard, a conventional sequence operation corresponding to Fig. 4A is shown in Fig. 4B. As shown in Fig. 4B, in the conventional apparatus, an interruption signal is generated at the timing Ti 'at which the positioning completion signal occurs, and the waiting time is measured based on the interruption signal, and the timing Te ') Outputs the drive signal of the solenoid valve. Therefore, the present embodiment in which Fig. 4A shows the timing Tss 'at which the pressure cylinder starts to move and the time Tse' at which the movement of the pressure cylinder stops and is shifted to the next sequence operation. Very late compared to the device.

5A and 5B are timing charts showing timing charts shown in Figs. 4A and 4B from different viewpoints, and timings similar to those shown in Figs. 4A and 4B are shown in Figs. Are given the same signs. 5 (A) and (B) indicated by the diagonal line MT is the actual operation time of the motor 18 including the vibration of the mechanical system, and the time PT indicated by the diagonal line represents the actual operation of the pressure cylinder 10. It's time. Fig. 5A is the control result of the apparatus of this embodiment corresponding to Fig. 4A, and Fig. 5B is the control result of the conventional apparatus corresponding to Fig. 4B. As shown in Fig. 5A, according to the control of the apparatus of the present embodiment, the actual operating time of the pressure cylinder 10 immediately after the actual operating time MT of the motor 18 including the vibration of the mechanical system ( PT), and it can be seen that the speed of the sequence operation can be significantly increased as compared with the control of the conventional apparatus shown in Fig. 5B. Specifically, in this embodiment, the time from Tms to Tse can be shortened by about 100 milliseconds compared to the time from Tms to Tse 'in the conventional apparatus.

2nd Embodiment

In this embodiment, the example which applied the component adsorption holding apparatus similar to the component adsorption holding apparatus 2 which concerns on said 1st embodiment to the actual IC chip component test apparatus is shown.

As shown in Figs. 6 and 7, the IC chip component test apparatus 30 of this embodiment is an apparatus for heating test in the state where the temperature of the IC chip as the component to be tested is higher than room temperature, and the handler 32 and It has a test head 34 and a test main device 36.

The handler 32 conveys the IC chip 4 to be tested to the IC socket 36 formed in the test head 34 in sequence, classifies the IC chip 4 after the test is completed according to the test result, and selects a predetermined tray. It executes the operation to store in.

As shown in FIG. 7, the IC socket 36 formed in the test head 34 is connected to the test main device 36 via a cable 38, and is detachably mounted to the IC socket 36. As shown in FIG. The IC chip 4 is connected to the test main device 36 via the cable 38, and the IC chip 4 is tested by the test signal from the test main device 36.

The handler 32 has a base 40 and is mainly equipped with a driving portion for IC chip conveyance on top of the base 40. Although the control unit for controlling the handler 32 is built in the lower part of the base 40, a space portion 42 is formed in part. The test head 34 is arranged in this space part 42 so that exchange is possible, and it is possible to mount the IC chip 4 to the IC socket 36 via the hole 44 formed in the base 40. .

As shown in FIG. 6, two sets of first and second X-Y moving devices (corresponding to the component adsorption holding device 2 shown in FIG. 1) 2a and 2b are provided on the base 40. As shown in FIG. One of the first X-Y moving devices 2a carries out the work of conveying the tested IC chip 4 and the sorting of the tested IC chip 4 from now on. The other 2nd XY shifter 2b conveys the IC chip 4 supplied by the buffer 50 on the test head 34, and completed the test from the test head 34. Is moved to the other buffer 51.

The first XY moving device 2a is configured to be movable in the X direction along the first X axis rail 14a extending along the X axis direction and the first X axis rail 14a. It has the 1st Y-axis rail 14b extended along and the 1st movable head 12a which can move to a Y direction along the 1st Y-axis rail 14b. Two pressure cylinders 10a are attached to the first movable head 12a. This first XY moving device 2a basically has the same configuration as the component adsorption holding device 2 shown in FIG. 1, and in the present embodiment, the first area 52 on the base 40 shown in FIG. 6. ) Is the transportable area.

The other 2nd XY moving apparatus 2b is comprised so that it may move to a X direction along the 2nd X-axis rail 14c extending along the X-axis direction, and the 2nd X-axis rail 14c, and Y It has the 2nd Y-axis rail 14d extended along an axial direction, and the 2nd movable head 12b movable in the Y direction along the 2nd Y-axis rail 14d. Two pressure cylinders 10b are mounted on the second movable head 12b. This XY moving device 2b basically has the same configuration as the component adsorption holding device 2 shown in FIG. 1, and in the present embodiment, the second region 56 on the base 40 shown in FIG. Let it be a conveyable area.

Classification in which the supply tray 58 which stores the IC chip 4 to be tested from now on, and the IC chip 4 which have been tested are classified and stored according to the test result are stored in the first transferable region 52. The trays 60, 61, 62, 63, and the portion 64 on which the empty trays are stacked are arranged, and the heat plate 65 is arranged in proximity to the buffer 50.

The heat plate 65 is made of, for example, a metal material, and includes a plurality of IC storage recesses 66 for storing the IC chip 4 to be tested, and the supply tray is provided in the IC storage recess 66. From 58, the IC chip 4 under test is conveyed by the XY moving device 2a. The heat plate 65 is heated by a heater not shown in order to heat the IC chip 4 at a predetermined temperature before the test. The IC chip 4 under test is heated to a desired temperature on the heat plate 65, and then transferred to the buffer 50 using the first XY shifter 2a, and the second XY shifter 2b. Is conveyed to the test head 34 and tested there. That is, the IC chip 4 is tested in a state higher than normal temperature.

The buffers 50 and 51 are configured to be movable in the X direction along the rails 68 and 69, and the operating regions 52 of the first XY shifter 2a and the second XY shifter 2b It is configured to reciprocate between the operating regions 56. That is, the buffer 50 performs the operation of moving the IC chip 4 under test from the region 52 to the region 56, and the buffer 51 is the IC which has been tested from the region 56 to the region 52. The work of carrying the chip 4 is performed. The presence of the buffers 50 and 51 allows the X-Y mobile devices 2a and 2b to operate without mutual interference.

The pressure cylinders 10a and 10b are attached to the X-Y moving apparatuses 2a and 2b, respectively. These pressure cylinders 10a and 10b are provided with a movable shaft 8 and a suction pad 6 in the same manner as the pressure cylinder 10 shown in FIG. 1, and have a tray or a heat plate 65 or a test head 34. ) Picks up the IC chip 4 and lowers the IC chip 4 to the tray and the heat plate 65 or the test head 34.

Since the XY moving apparatuses 2a and 2b of the handler 30 according to the present embodiment are controlled in the same way as the component adsorption holding apparatus shown in Fig. 1, the throughput of the component processing in the handler 30 can be improved. have.

In addition, this invention is not limited to this embodiment mentioned above, A various deformation | transformation is possible within the scope of this invention.

For example, in the first embodiment described above, the control device 22 shown in FIG. 1 has been described as executing the sequence control shown in FIG. 2, but part or all of the control shown in FIG. The sequence controller connected to (22) may be performed.

In addition, the component handling apparatus (handler) which concerns on this invention is not limited to the handler of the structure shown in FIG. 6 and FIG. 7, It can be variously modified.

As described above, according to the component handling apparatus and control method thereof according to the present invention, it is possible to speed up the sequence operation of the actuator attached to the component handling apparatus and to improve the throughput of the component processing.

Claims (8)

A part holding part for holding a part detachably; A first actuator for moving the component holding part in a first direction; A second actuator for moving the component holding part and the first actuator in a second direction different from the first direction; An interruption signal generating circuit for generating an interruption signal at a time point before detecting that the component holding part and the first actuator are moved along the second direction by the second actuator and reach a predetermined stop position; A timer circuit for counting a waiting time based on a time point at which the interruption signal generation circuit generates the interruption signal; And a first actuator drive signal generation circuit for outputting a signal for driving the first actuator when the timer circuit detects that a predetermined waiting time has elapsed. The method of claim 1, And a first direction position detection sensor for detecting a position of the part holding portion moved in the first direction by the first actuator. The method according to claim 1 or 2, And a second actuator drive signal generation circuit for outputting a drive signal for driving said second actuator. The method of claim 3, And the interruption signal generator outputs the interruption signal after a predetermined time from the time point at which the interruption signal generation circuit starts outputting the drive signal from the second actuator drive signal generation circuit to the second actuator. The method according to claim 1 or 2, The component holding part is provided with a suction pad for adsorbing the component by the negative pressure. The method according to claim 1 or 2, And the first actuator is a pressure cylinder using fluid pressure, and the second actuator is a motor capable of controlling a rotation angle by a drive signal. A component holding part for holding the component detachably, a first actuator for moving the component holding part in a first direction, and a component for moving the component holding part and the first actuator in a second direction different from the first direction 2. A method of controlling a component handling apparatus having two actuators, the method comprising: Generating an interruption signal at a time point before detecting that the component holding part and the first actuator are moved along the second direction by the second actuator and reach a predetermined stop position; Counting a waiting time based on a time point at which the interruption signal is generated; And a step of outputting a signal for driving the first actuator when detecting that a predetermined waiting time has elapsed. The method of claim 7, wherein And a timing for generating the interruption signal is set after a predetermined time has elapsed based on a time point at which the driving signal for driving the second actuator is output.