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JPWO2023157175A1 - - Google Patents

Info

Publication number
JPWO2023157175A1
JPWO2023157175A1 JP2024500811A JP2024500811A JPWO2023157175A1 JP WO2023157175 A1 JPWO2023157175 A1 JP WO2023157175A1 JP 2024500811 A JP2024500811 A JP 2024500811A JP 2024500811 A JP2024500811 A JP 2024500811A JP WO2023157175 A1 JPWO2023157175 A1 JP WO2023157175A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024500811A
Other versions
JPWO2023157175A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023157175A1 publication Critical patent/JPWO2023157175A1/ja
Publication of JPWO2023157175A5 publication Critical patent/JPWO2023157175A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
JP2024500811A 2022-02-17 2022-02-17 Pending JPWO2023157175A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/006374 WO2023157175A1 (ja) 2022-02-17 2022-02-17 電動機および空気調和機

Publications (2)

Publication Number Publication Date
JPWO2023157175A1 true JPWO2023157175A1 (ja) 2023-08-24
JPWO2023157175A5 JPWO2023157175A5 (ja) 2024-04-11

Family

ID=87577823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024500811A Pending JPWO2023157175A1 (ja) 2022-02-17 2022-02-17

Country Status (2)

Country Link
JP (1) JPWO2023157175A1 (ja)
WO (1) WO2023157175A1 (ja)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259666A (ja) * 1992-03-12 1993-10-08 Matsushita Electric Ind Co Ltd モータ用集積回路の放熱装置
JP2005333099A (ja) * 2004-04-22 2005-12-02 Matsushita Electric Ind Co Ltd 半導体モジュール

Also Published As

Publication number Publication date
WO2023157175A1 (ja) 2023-08-24

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