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JPWO2021010199A1 - - Google Patents

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Publication number
JPWO2021010199A1
JPWO2021010199A1 JP2021532789A JP2021532789A JPWO2021010199A1 JP WO2021010199 A1 JPWO2021010199 A1 JP WO2021010199A1 JP 2021532789 A JP2021532789 A JP 2021532789A JP 2021532789 A JP2021532789 A JP 2021532789A JP WO2021010199 A1 JPWO2021010199 A1 JP WO2021010199A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021532789A
Other languages
Japanese (ja)
Other versions
JP7572008B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021010199A1 publication Critical patent/JPWO2021010199A1/ja
Priority to JP2023113387A priority Critical patent/JP2023130461A/en
Application granted granted Critical
Publication of JP7572008B2 publication Critical patent/JP7572008B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Photovoltaic Devices (AREA)
JP2021532789A 2019-07-12 2020-07-04 SnZn solder and its manufacturing method Active JP7572008B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023113387A JP2023130461A (en) 2019-07-12 2023-07-11 SnZn SOLDER AND PRODUCTION METHOD OF THE SAME

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019129866 2019-07-12
JP2019129866 2019-07-12
JP2020103656 2020-06-16
JP2020103656 2020-06-16
PCT/JP2020/026311 WO2021010199A1 (en) 2019-07-12 2020-07-04 Snzn solder and production method therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023113387A Division JP2023130461A (en) 2019-07-12 2023-07-11 SnZn SOLDER AND PRODUCTION METHOD OF THE SAME

Publications (2)

Publication Number Publication Date
JPWO2021010199A1 true JPWO2021010199A1 (en) 2021-01-21
JP7572008B2 JP7572008B2 (en) 2024-10-23

Family

ID=74210496

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021532789A Active JP7572008B2 (en) 2019-07-12 2020-07-04 SnZn solder and its manufacturing method
JP2023113387A Pending JP2023130461A (en) 2019-07-12 2023-07-11 SnZn SOLDER AND PRODUCTION METHOD OF THE SAME

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023113387A Pending JP2023130461A (en) 2019-07-12 2023-07-11 SnZn SOLDER AND PRODUCTION METHOD OF THE SAME

Country Status (5)

Country Link
JP (2) JP7572008B2 (en)
KR (1) KR20220013497A (en)
CN (1) CN114206542A (en)
TW (2) TWI817020B (en)
WO (1) WO2021010199A1 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH09155587A (en) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd Tin-zinc based leadless solder
JP2000015478A (en) * 1998-06-30 2000-01-18 Toshiba Corp Soldering material
JP2002361476A (en) * 2001-06-08 2002-12-18 Showa Denko Kk Solder metal, solder paste, soldering method, soldered circuit board and soldered part
JP2003010996A (en) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd Lead-free soldering paste
WO2003061896A1 (en) * 2002-01-21 2003-07-31 Fujitsu Limited Solder alloy and soldered joint
WO2004039533A1 (en) * 2002-10-31 2004-05-13 Senju Metal Industry Co., Ltd. Lead-free solder and soldered article
CN1861311A (en) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 Lead-free antioxidant rare earth-containing SnZn alloy solder and preparation method thereof
CN101092006A (en) * 2006-06-21 2007-12-26 北京有色金属研究总院 Lead-free solder for micro alloyed eutectic alloy of stannum and zinc
JP2009502512A (en) * 2005-08-02 2009-01-29 キョセイ マ A kind of low melting point lead-free solder alloy

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101780607B (en) * 2010-03-17 2012-05-09 华南理工大学 Lead-free solder for electronic packaging assembly soldering and preparation method thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JPH09155587A (en) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd Tin-zinc based leadless solder
JP2000015478A (en) * 1998-06-30 2000-01-18 Toshiba Corp Soldering material
JP2002361476A (en) * 2001-06-08 2002-12-18 Showa Denko Kk Solder metal, solder paste, soldering method, soldered circuit board and soldered part
JP2003010996A (en) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd Lead-free soldering paste
WO2003061896A1 (en) * 2002-01-21 2003-07-31 Fujitsu Limited Solder alloy and soldered joint
WO2004039533A1 (en) * 2002-10-31 2004-05-13 Senju Metal Industry Co., Ltd. Lead-free solder and soldered article
JP2009502512A (en) * 2005-08-02 2009-01-29 キョセイ マ A kind of low melting point lead-free solder alloy
CN1861311A (en) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 Lead-free antioxidant rare earth-containing SnZn alloy solder and preparation method thereof
CN101092006A (en) * 2006-06-21 2007-12-26 北京有色金属研究总院 Lead-free solder for micro alloyed eutectic alloy of stannum and zinc

Also Published As

Publication number Publication date
JP2023130461A (en) 2023-09-20
CN114206542A (en) 2022-03-18
TWI817020B (en) 2023-10-01
JP7572008B2 (en) 2024-10-23
TW202108778A (en) 2021-03-01
KR20220013497A (en) 2022-02-04
TW202206614A (en) 2022-02-16
WO2021010199A1 (en) 2021-01-21

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