JPWO2019065519A1 - Piezoelectric vibrator and method for manufacturing the piezoelectric vibrator - Google Patents

Abstract

The base member and the lid member are made to conduct stably. The crystal resonator is bonded to the base member via an insulating sealing frame and a bonding member so that the crystal vibration element is accommodated in an internal space formed by the crystal vibration element, the base member, and the base member. A lid member that is electrically conductive and is accommodated in the internal space and is joined to the base member and the lid member so as to electrically connect the base member and the lid member. Prepare.

Description

  The present invention relates to a piezoelectric vibrator and a method for manufacturing the piezoelectric vibrator.

  In general, a crystal resonator is known as one of piezoelectric resonators. The crystal resonator includes, for example, a crystal resonator element, a base member on which the crystal resonator element is mounted, and a lid member joined to the base member so as to accommodate the crystal resonator element in the internal space.

  Here, when the lid member having conductivity is joined to the base member by using a joining member having electrical insulation (hereinafter referred to as “insulation”), an insulating property is provided between the lid member and the base member. Since the joining member exists, the lid member is not grounded. As a result, for example, the oscillation frequency of the crystal resonator element may fluctuate due to the influence of external electromagnetic noise.

  Therefore, for example, in Patent Document 1, a substrate, a conductor pattern provided along the outer peripheral edge of the upper surface of the substrate, a crystal element bonded to the upper surface of the substrate, and a substrate are bonded to each other through a bonding member. A quartz device is disclosed. In this quartz crystal device, the lid portion of the lid is in contact with the conductor pattern that is electrically connected to the external terminal of the substrate that is connected to the ground potential.

Japanese Patent Laid-Open No. 2006-184779

  However, in the quartz crystal device of the cited document 1, since the connecting portion between the collar portion and the conductor pattern is exposed outside the internal space, the connecting portion is influenced by the external environment such as temperature, humidity, and corrosive gas. It was easy to receive, and the electrical connection might be obstructed. Further, since the connection between the collar portion and the conductor pattern is merely contact, the connection may be easily released due to, for example, thermal shock or mechanical shock.

  The present invention has been invented in view of such circumstances, and an object of the present invention is to provide a piezoelectric vibrator capable of stably conducting a base member and a lid member, and a method of manufacturing the piezoelectric vibrator. That is.

  A piezoelectric vibrator according to one aspect of the present invention includes a base via an insulating bonding member so that the piezoelectric vibration element is accommodated in an internal space formed by the piezoelectric vibration element, the base member, and the base member. A lid member joined to the member and having conductivity, and a brazing material housed in the internal space and joined to the base member and the lid member so as to electrically connect the base member and the lid member. And comprising.

  A method of manufacturing a piezoelectric vibrator according to another aspect of the present invention includes a step of preparing a base member, a step of disposing a brazing material on one of the base member or the conductive lid member, a piezoelectric vibration element, and a brazing material. A step of joining the base member and the lid member by an insulating joining member so as to form an internal space in which the base member is accommodated, and a step of electrically connecting the base member and the lid member by joining the brazing material And including.

  According to the present invention, the base member and the lid member can be stably conducted.

FIG. 1 is an exploded perspective view of the crystal resonator according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a plan view of the base member of FIG. FIG. 4 is a flowchart showing a method for manufacturing a crystal resonator according to the first embodiment of the present invention. FIG. 5 is a diagram illustrating a process of arranging the brazing material on the lid member. FIG. 6 is a cross-sectional view of a crystal resonator according to a second embodiment of the present invention. FIG. 7 is a flowchart showing a method for manufacturing a crystal resonator according to the second embodiment of the present invention. FIG. 8 is a diagram illustrating a process of arranging the brazing material on the base member.

  Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiments.

  In the following description, a crystal resonator (Quartz Crystal Resonator Unit) including a crystal resonator element (Quartz Crystal Resonator) will be described as an example of a piezoelectric resonator (Piezoelectric Resonator Unit). The quartz resonator element uses a quartz piece (Quartz Crystal Element) as a piezoelectric body that vibrates according to an applied voltage. However, the piezoelectric vibration element according to the embodiment of the present invention is not limited to the crystal vibration element, and other piezoelectric bodies such as ceramics may be used.

<First Embodiment>
The crystal resonator according to the first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is an exploded perspective view of the crystal resonator according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is a plan view of the base member shown in FIG.

  As shown in FIG. 1, the crystal resonator 1 according to the present embodiment includes a crystal resonator element 10, a lid member 20, and a base member 30. The lid member 20 and the base member 30 are a part of the structure of a holder (Enclosure) for accommodating the crystal resonator element 10 in the internal space. The lid member 20 is joined to the base member 30 via the sealing frame 37 and the joining member 40.

  The crystal resonator element 10 includes an AT-cut crystal piece 11. The AT-cut type crystal piece 11 includes a crystal axis of crystal (Quartz Crystal), of the X axis, the Y axis, and the Z axis, the Y axis and the Z axis around the X axis from the Y axis to the Z axis. When the axes rotated in the direction of 35 degrees 15 minutes ± 1 minute 30 seconds are the Y ′ axis and the Z ′ axis, respectively, a plane parallel to the plane specified by the X axis and the Z ′ axis (hereinafter referred to as “XZ ′”). It is called “surface.” The same applies to the surfaces specified by other axes. The crystal piece 11 has a first main surface 12 a and a second main surface 12 b which are XZ ′ surfaces facing each other.

  The crystal piece 11 which is an AT cut crystal piece includes a long side direction in which a long side parallel to the X-axis direction extends, a short side direction in which a short side parallel to the Z′-axis direction extends, and a Y′-axis direction. A thickness direction extending in parallel with the thickness direction. Further, the crystal piece 11 has a rectangular shape on the XZ ′ plane.

  A quartz resonator element using an AT-cut quartz piece has high frequency stability over a wide temperature range. In addition, the AT-cut quartz crystal resonator element is excellent in aging characteristics and can be manufactured at low cost. Furthermore, the AT-cut quartz crystal resonator element uses a thickness shear vibration mode as a main vibration.

  In the present embodiment, the crystal piece 11 has a flat plate shape. The first main surface 12a and the second main surface 12b of the crystal piece 11 are flat surfaces.

  The crystal resonator element 10 includes a first excitation electrode 14a and a second excitation electrode 14b that constitute a pair of electrodes. The first excitation electrode 14a is provided on the first main surface 12a. The second excitation electrode 14b is provided on the second main surface 12b. The first excitation electrode 14a and the second excitation electrode 14b are provided to face each other across the crystal piece 11 in a region including the center of each main surface. The first excitation electrode 14a and the second excitation electrode 14b are arranged so as to substantially overlap each other when the XZ ′ plane is viewed in plan.

  The first excitation electrode 14a and the second excitation electrode 14b each have a long side parallel to the X-axis direction, a short side parallel to the Z′-axis direction, and a thickness parallel to the Y′-axis direction. . In the example shown in FIG. 1, the long sides of the first excitation electrode 14 a and the second excitation electrode 14 b are parallel to the long side of the crystal piece 11 in the XZ ′ plane. Similarly, the short sides of the first excitation electrode 14a and the second excitation electrode 14b are parallel to the short side of the crystal piece 11, respectively. The long sides of the first excitation electrode 14 a and the second excitation electrode 14 b are separated from the long side of the crystal piece 11. Similarly, the short sides of the first excitation electrode 14 a and the second excitation electrode 14 b are separated from the short side of the crystal piece 11, respectively.

  The crystal resonator element 10 includes lead electrodes 15a and 15b and connection electrodes 16a and 16b. The connection electrode 16a is electrically connected to the first excitation electrode 14a via the extraction electrode 15a. The connection electrode 16b is electrically connected to the second excitation electrode 14b through the extraction electrode 15b. The connection electrode 16a and the connection electrode 16b are terminals for electrically connecting to the base member 30, respectively. The connection electrode 16a and the connection electrode 16b are provided on the second main surface 12b of the crystal piece 11, respectively. The connection electrode 16 a and the connection electrode 16 b are arranged along the short side direction in the vicinity of the short side of the crystal piece 11 on the negative side of the Z ′ axis.

  The extraction electrode 15a electrically connects the first excitation electrode 14a and the connection electrode 16a. Specifically, the extraction electrode 15a extends on the first main surface 12a from the first excitation electrode 14a in the Z′-axis negative direction and the X-axis negative direction, and from the first main surface 12a to the crystal piece 11. It extends so as to reach the second main surface 12b through each side surface, and is electrically connected to the connection electrode 16a on the second main surface 12b. The extraction electrode 15b electrically connects the second excitation electrode 14b and the connection electrode 16b. Specifically, the extraction electrode 15b extends from the second excitation electrode 14b toward the X-axis negative direction on the second main surface 12b and is electrically connected to the connection electrode 16b on the second main surface 12b. ing. By extending the extraction electrodes 15a and 15b in this way, the lead electrodes 15a and 15b are electrically connected to the first excitation electrode 14a and the second excitation electrode 14b provided on both the first principal surface 12a and the second principal surface 12b. The connection electrodes 16a and 16b thus formed can be arranged on one second main surface 12b.

  The connection electrodes 16a and 16b are electrically connected to the electrode of the base member 30 through the conductive holding members 36a and 36b. The conductive holding members 36a and 36b are formed by thermally solidifying a conductive adhesive.

  The materials of the first excitation electrode 14a and the second excitation electrode 14b, the extraction electrodes 15a and 15b, and the connection electrodes 16a and 16b are not particularly limited. For example, a chromium (Cr) layer is used as a base. And may further have a gold (Au) layer on the surface of the chromium layer.

  In the present embodiment, the crystal resonator element 10 has been described as including a flat plate-shaped crystal piece 11, but is not limited thereto. The crystal piece may adopt a mesa structure in which the vibration part including the center of the main surface is thicker than the peripheral part, or an inverted mesa structure in which the vibration part is thinner than the peripheral part. Alternatively, a convex shape or a bevel shape in which changes in thickness (steps) between the vibrating portion and the peripheral portion continuously change may be applied to the crystal piece. Moreover, you may apply different cuts other than AT cut, for example, BT cut etc., as the cut angle of a crystal piece. Furthermore, the quartz resonator element has at least a base and a base extending from the base using a quartz plate cut at a predetermined angle with respect to the X axis, the Y axis, and the Z axis orthogonal to each other as crystal axes of the quartz. It may be a tuning fork type crystal vibrating element including a crystal piece having one vibrating arm and an excitation electrode provided on the vibrating arm so as to bend and vibrate.

  The lid member 20 is joined to the base member 30 via a sealing frame 37 and a joining member 40 described later. The base member 30 and the lid member 20 form an internal space 26 that houses the crystal resonator element 10.

  The lid member 20 has a concave shape, specifically a box shape including an opening, and has an inner surface 24 and an outer surface 25. The lid member 20 is connected to the top surface portion 21 facing the first main surface 32 a of the base member 30 and the outer edge of the top surface portion 21, and extends in the normal direction with respect to the main surface of the top surface portion 21. Side wall portion 22. The lid member 20 includes, for example, a long side direction in which a long side parallel to the X-axis direction extends, a short side direction in which a short side parallel to the Z′-axis direction extends, and a height parallel to the Y′-axis direction. Direction. The lid member 20 has a facing surface 23 that faces the first main surface 32a of the base member 30 at the concave opening edge. The facing surface 23 has a frame shape and extends so as to surround the periphery of the crystal resonator element 10.

  The lid member 20 has conductivity. The material of the lid member 20 is, for example, a metal. Specifically, the lid member 20 is made of an alloy (for example, 42 alloy) containing iron (Fe) and nickel (Ni). A nickel (Ni) layer or the like formed by plating may be provided on the innermost surface (the surface including the inner surface 24) of the lid member 20. Further, a gold (Au) layer for preventing oxidation may be provided on the outermost surface (the surface including the outer surface 25) of the lid member 20. However, the material of the lid member 20 is not particularly limited.

  The base member 30 has the crystal resonator element 10 mounted thereon. Specifically, the crystal resonator element 10 is held on the first main surface 32a of the base member 30 through the conductive holding members 36a and 36b so as to be able to be excited.

  The base member 30 has a flat plate shape. The base member 30 has a long side direction in which a long side parallel to the X-axis direction extends, a short side direction in which a short side parallel to the Z′-axis direction extends, and a thickness parallel to the Y′-axis direction. Extending in the thickness direction.

  The base member 30 includes a base 31. The base 31 has a first main surface 32a and a second main surface 32b which are XZ ′ surfaces facing each other. The base 31 is a sintered material such as insulating ceramic (alumina). In this case, the base 31 may be laminated and sintered with a plurality of insulating ceramic sheets. Alternatively, the base 31 is made of a glass material (for example, silicate glass or a material mainly composed of materials other than silicate and having a glass transition phenomenon due to a temperature rise), a crystal material (for example, an AT-cut crystal), or You may form with a glass epoxy resin etc. The base 31 is preferably made of a heat resistant material. The base 31 may be a single layer or a plurality of layers. In the case of a plurality of layers, the base 31 includes an insulating layer formed on the outermost layer of the first main surface 32a.

  The base member 30 includes electrode pads 33a and 33b and an internal electrode 33c provided on the first main surface 32a, and external electrodes 35a, 35b, 35c and 35d provided on the second main surface 32b. The electrode pads 33 a and 33 b are electrically connected to the crystal resonator element 10. The internal electrode 33c is electrically connected to the brazing material 50. The external electrodes 35a, 35b, 35c, and 35d are electrically connected to a circuit board (not shown). The electrode pad 33a is electrically connected to the external electrode 35a via a via electrode 34a extending in the Y′-axis direction, and the electrode pad 33b is connected to the external electrode via a via electrode 34b extending in the Y′-axis direction. It is electrically connected to 35b. The via electrodes 34a and 34b are formed in via holes (not shown) that penetrate the base 31 in the Y'-axis direction. The height of the brazing material 50 is preferably smaller than the distance between the first main surface 32 a of the base material 30 and the crystal resonator element 10.

  The electrode pads 33a and 33b are provided in the vicinity of the short side of the base member 30 on the X axis negative direction side on the first main surface 32a. In the example shown in FIG. 1, the electrode pads 33 a and 33 b are arranged away from the short side of the base member 30 and along the short side direction. The electrode pad 33a is connected to the connection electrode 16a of the crystal resonator element 10 via the conductive holding member 36a. The electrode pad 33b is connected to the connection electrode 16b of the crystal resonator element 10 through the conductive holding member 36b.

  The internal electrode 33c is provided on the first major surface 32a in the vicinity of the short side of the base member 30 on the positive side in the X-axis direction and in the vicinity of the long side of the base member 30 on the negative direction side in the Z′-axis. In the example shown in FIG. 1, the internal electrode 33c is arranged along the short side direction and the long side direction. Further, the internal electrode 33 c is in contact with the corner on the Z′-axis negative direction side and the X-axis positive direction side on the inner periphery of the sealing frame 37.

  The internal electrode 33c is electrically connected to the external electrode 35c. In the example illustrated in FIG. 3, the internal electrode 33 c is electrically connected to the external electrode 35 c via a via electrode 42 extending in the Y′-axis direction.

  The plurality of external electrodes 35a, 35b, 35c, and 35d are provided near the respective corners of the second main surface 32b. In the example shown in FIG. 1, the external electrodes 35a and 35b are disposed immediately below the electrode pads 33a and 33b. Accordingly, the external electrodes 35a and 35b can be electrically connected to the electrode pads 33a and 33b by the via electrodes 34a and 34b extending in the Y′-axis direction. The external electrode 35c is disposed directly below the internal electrode 33c. Thereby, the external electrode 35c can be electrically connected to the internal electrode 33c by the via electrode 42 extending in the Y′-axis direction.

  In the example illustrated in FIG. 1, among the four external electrodes 35 a to 35 d, the external electrodes 35 a and 35 b disposed near the short side of the base member 30 on the X axis negative direction side receive input / output signals of the crystal resonator element 10. Input / output electrodes to be supplied. The external electrodes 35c and 35d arranged near the short side of the base member 30 on the X axis positive direction side are dummy electrodes to which input / output signals of the crystal resonator element 10 are not supplied.

  An insulating sealing frame 37 is provided on the first main surface 32 a of the base 31. The sealing frame 37 has a rectangular frame shape when viewed in plan from the first main surface 32a. The electrode pads 33a and 33b and the internal electrode 33c are disposed inside the sealing frame 37, respectively. On the sealing frame 37, a joining member 40 described later is provided, and a lid member 20 is further provided. As a result, the lid member 20 is joined to the base member 30 via the sealing frame 37 and the joining member 40. When the sealing frame 37 has electrical insulation, it passes between the base 31 of the base member 30 that is a single layer, the sealing frame 37 and the first main surface 32a, and the first main surface 32a and the first main surface 32a. A base having a side surface connecting the main surface 32a and the second main surface 32 and a front and back connection electrode that is provided on the surface of the base 31 continuously to the second main surface 32b and electrically connects the internal electrode and the external electrode. The member 30 is desirable. In this case, a via electrode is not used for electrical conduction between the front and back surfaces of the base member 30, and therefore, there is an effect of eliminating sealing leakage that occurs at the boundary surface between the via electrode and the base 31. In addition, when the base member 30 having a via electrode is used, if the manufacturing process such as printing, sputtering, and vapor deposition is made common with the internal electrode forming process by using the conductive sealing frame 37, the internal electrode And the sealing frame 37 can be formed at the same time.

  In the example illustrated in FIG. 3, the inner periphery of the sealing frame 37 has a rectangular shape (hereinafter, referred to as “rectangular shape”) when viewed in plan from the first main surface 32 a. In the first main surface 32 a, the inner part of the sealing frame 37 having the inner periphery as the outer edge constitutes a surface surrounding the inner space 26. Therefore, when viewed in plan from the first main surface 32 a of the base member 30, the internal space 26 has a rectangular shape like the inner periphery of the sealing frame 37.

  The electrode pads 33a and 33b, the internal electrode 33c, and the external electrodes 35a to 35d of the base member 30 are all made of a metal film. For example, the electrode pads 33a and 33b, the internal electrode 33c, and the external electrodes 35a to 35d are configured by laminating a molybdenum (Mo) layer, a nickel (Ni) layer, and a gold (Au) layer from the lower layer to the upper layer, respectively. ing. The via electrode 42 is formed, for example, by filling a hole 41 penetrating the base 31 from the first main surface 32a to the second main surface 32b with a metal material such as molybdenum (Mo).

  In addition, the arrangement | positioning relationship of electrode pad 33a, 33b, the internal electrode 33c, and the external electrodes 35a-35d is not limited to the example mentioned above. For example, the electrode pad 33 a may be disposed near one short side of the base member 30, and the electrode pad 33 b may be disposed near the other short side of the base member 30. In such a configuration, the crystal resonator element 10 is held by the base member 30 at both ends of the crystal piece 11 in the long side direction.

  Further, the arrangement of the internal electrodes 33c is not limited to the example described above. For example, the internal electrode may be provided over the entire inner periphery of the sealing frame 37 on the first main surface 32a of the base member 30 having the via electrode. Alternatively, the internal electrode may be disposed not in the corner portion of the inner periphery of the sealing frame 37 but in a region inside the sealing frame 37 on the first main surface 32a. Further, the number of internal electrodes is not limited to one. For example, a plurality of internal electrodes may be provided.

  Further, the arrangement of the external electrodes is not limited to the example described above. For example, two external electrodes that are input / output electrodes may be provided on the diagonal of the second major surface 32b. Alternatively, the four external electrodes may be arranged near the center of each side instead of the corner of the second main surface 32b. Further, the number of external electrodes is not limited to four. For example, only two external electrodes that are input / output electrodes may be provided.

  Further, the manner of electrical connection between the electrode pad or the internal electrode and the external electrode is not limited to that using the via electrode. For example, an electrical connection between the electrode pad or the internal electrode and the external electrode may be achieved by drawing out the extraction electrode on the first main surface 32a or the second main surface 32b. Alternatively, the base 31 of the base member 30 is formed of a plurality of layers, the via electrode is extended to reach the intermediate layer, and the extraction electrode is drawn out in the intermediate layer, whereby the electrical connection between the electrode pad or the internal electrode and the external electrode is achieved. Connections may be made.

  As shown in FIG. 2, the crystal vibrating element 10 is surrounded by the lid member 20 and the base member 30 by joining both the lid member 20 and the base member 30 via the sealing frame 37 and the joining member 40. The inner space 26 is sealed. In this case, the pressure in the internal space 26 is preferably in a vacuum state lower than the atmospheric pressure. Thereby, a change with time due to oxidation of the first excitation electrode 14a and the second excitation electrode 14b can be reduced.

  At this time, the internal electrode 33 c provided on the first main surface 32 a is also accommodated in the internal space 26. On the other hand, the external electrodes 35 a to 35 d provided on the second main surface 32 b are disposed outside the internal space 26. Thereby, the external electrodes 35a to 35d can be electrically connected to a circuit board (not shown) on which the crystal resonator 1 is mounted. Further, when a ground potential is supplied from the circuit board to the external electrodes 35c and 35d, the external electrodes 35c and 35d serve as grounding electrodes, and the lid member 20 is electrically connected to the external electrodes 35c and 35d. The member 20 can be added with an electromagnetic shielding function having a higher shielding performance.

  The joining member 40 joins the lid member 20 and the base member 30. The joining member 40 is provided over the entire circumferences of the lid member 20 and the base member 30. Specifically, the joining member 40 has a rectangular frame shape when the first main surface 32 a of the base member 30 is viewed in plan, and is provided on the sealing frame 37.

  In addition, the joining member 40 has an insulating property like the sealing frame 37. The material of the sealing frame 37 and the joining member 40 is inorganic glass, for example. The inorganic glass is, for example, low-melting glass such as lead boric acid or tin phosphoric acid. Here, the inorganic glass is characterized in that it emits less gas during solidification than the organic resin adhesive. Thereby, the change of the atmospheric | air pressure of the internal space 26 resulting from discharge | release gas, and the fluctuation | variation of the frequency characteristic of the crystal vibration element 10 by adsorption | suction of discharge | release gas can be suppressed. In addition, inorganic glass also has a feature that its airtightness is better than that of a resin adhesive. Thereby, the airtightness of the internal space 26 can be improved.

When the sealing frame 37 and the joining member 40 are low melting glass adhesives, lead-free vanadium (V) glass that melts at a temperature of 300 ° C. or higher and 410 ° C. or lower may be included. Vanadium-based glass exhibits an adhesive action when a binder and a solvent are added in a paste form, melted, and solidified. The vanadium glass may contain other metals such as silver (Ag). Vanadium-based glass is characterized by good airtightness at the time of bonding and high reliability in terms of water resistance, moisture resistance and the like as compared with other glass adhesives. Vanadium-based glass also has a feature that the thermal expansion coefficient can be flexibly controlled by controlling the glass structure. Furthermore, vanadium-based glass has a feature that its melting temperature is lower than that of SiO ₂ glass. Thereby, damage to the crystal unit 1 in the bonding process can be reduced.

  Further, the sealing frame 37 and the joining member 40 may be, for example, a resin adhesive. The resin adhesive may include a thermosetting resin or a photocurable resin. For example, an epoxy adhesive mainly composed of an epoxy resin can be used. Examples of the epoxy resin include bifunctional epoxy resins such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, and novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can also be applied.

  Thus, the sealing frame 37 and the joining member 40 are glass adhesives or resin adhesives, so that the heating temperature at the time of joining can be suppressed as compared with the case of joining with metal, and the manufacturing process can be reduced. It can be simplified.

  The brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the base member 30 and the lid member 20. Thereby, compared with the case where the base member 30 and the lid member 20 are electrically connected by simple contact, it is possible to increase the bonding strength. For example, even when subjected to thermal shock or mechanical shock, the electrical connection Is difficult to release.

  The brazing material 50 is melted and solidified by heating to join the lid member 20 and the base member 30. The brazing material 50 is an alloy composed of a plurality of metals. Specifically, the brazing material 50 is made of, for example, a gold (Au) -tin (Sn) eutectic alloy. In this case, the melting point of the brazing material 50 is 280 ° C. Moreover, the brazing material 50 may contain a flux.

  The brazing material 50 preferably has a melting point of 270 ° C. or higher and lower than the melting points of the sealing frame 37 and the joining member 40. As described above, since the melting point of the brazing material 50 is 270 ° C. or higher, the brazing material 50 can be melted again by heating when the crystal unit 1 is mounted on a circuit board (not shown) and the bonding can be released. Can be reduced. Further, since the melting point of the brazing material 50 is equal to or lower than the melting points of the sealing frame 37 and the joining member 40, the brazing material 50 is melted at the time of joining by the sealing frame 37 and the joining member 40, and the lid member 20 and the base The member 30 can be electrically connected. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

  When the lid member 20 is a metal member, a metal bond is generated between the lid member 20 and the brazing material 50 when the brazing material 50 is joined, and an alloy layer is formed. Therefore, compared with the case where the lid member 20 is a member other than metal, the bonding strength by the brazing material 50 can be increased.

  In the example shown in FIG. 1, the brazing material 50 is disposed on a part of the inner surface 24 of the lid member 20. As shown in FIG. 2, the brazing material 50 is accommodated in the internal space 26 by the sealing frame 37 and the joining member 40 joining the lid member 20 and the base member 30. Thereby, the joining by the brazing material 50 becomes difficult to be influenced by external humidity, corrosive gas, etc., and the change with time can be reduced.

  Further, the brazing material 50 disposed on the lid member 20 spreads out during joining and is provided on the internal electrode 33c of the base member 30 as shown in FIG. As described above, the internal electrode 33 c is electrically connected to the external electrode 35 c through the via electrode 42. As described above, the brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the internal electrode 33c and the lid member 20, so that the base member 30 and the lid member 20 are electrically connected. Can be easily realized. Further, the lid member 20 can be grounded by supplying a ground potential to the external electrode 35d. Therefore, the stray capacitance that can be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal resonator element 10 can be prevented.

  Further, as described above, the internal electrode 33c is arranged at a corner in the rectangular shape of the internal space 26 when the first main surface 32a of the base member 30 is viewed in plan. In this way, by providing the brazing material 50 at the corners of the rectangular shape with respect to the crystal vibrating element 10 held at the substantially center of the rectangular shape, the influence that can be exerted on the crystal vibrating element 10 by the joining of the brazing material 50. Can be reduced.

  The brazing material 50 may be provided at a corner portion relatively far from the electrode pads 33a and 33b of the base member 30 among the four corner portions of the rectangular shape when the first main surface 32a of the base member 30 is viewed in plan. preferable. In the example shown in FIGS. 1 and 2, the brazing material 50 is provided at the corner on the X-axis positive direction side and the Z′-axis negative direction side. Thereby, the influence which can exert on conduction | electrical_connection of the crystal oscillation element 10 via electrode pad 33a, 33b can be reduced.

  The arrangement of the brazing material 50 is not limited to the above example. For example, a part of the brazing material 50 may enter between the facing surface 23 of the lid member 20 and the first main surface 32 a of the base member 30. This case is also included in a mode in which the brazing material 50 is accommodated in the sealed internal space 26 formed by the base member 30 and the lid member 20. Alternatively, in the rectangular shape of the internal space 26 when viewed from the first main surface 32 a of the base member 30, the brazing material 50 may be provided over the entire circumference in contact with the sealing frame 37. Moreover, the brazing material 50 may be provided at a plurality of the four corners of the rectangle. Further, when the brazing material 50 is disposed at a corner portion relatively far from the conductive holding members 36a and 36b of the base member 30, instead of the corner portion on the X axis positive direction side and the Z ′ axis negative direction side, Alternatively, in addition to this, it may be provided at the corner on the X-axis positive direction side and the Z′-axis positive direction side.

  Further, the rectangular shape of the internal space 26 is not limited to the case where the corner has a strict meaning. For example, in the rectangular shape of the internal space 26, some or all of the corners may be rounded or cut off. Therefore, the term “corner” in the present application means a region including a corner, a rounded (R) corner, and a cut-off corner. Further, the term “rectangular shape” in the present application does not exclude a square, but includes a rectangular shape and a square shape.

  In the crystal resonator element 10 according to this embodiment, one end portion (the end portion on the side where the conductive holding members 36a and 36b are disposed) of the crystal piece 11 in the long side direction is a fixed end, and the other end is It is a free end. Further, the crystal resonator element 10, the lid member 20, and the base member 30 each have a rectangular shape on the XZ 'plane, and the long side direction and the short side direction are the same.

  The position of the fixed end of the crystal resonator element 10 is not particularly limited. As a modification, the crystal resonator element 10 may be fixed to the base member 30 at both ends of the crystal piece 11 in the long side direction. In this case, the crystal resonator element 10 and the electrodes of the base member 30 may be formed in such a manner that the crystal resonator element 10 is fixed at both ends of the crystal piece 11 in the long side direction.

  In the crystal resonator 1 according to the present embodiment, an alternating electric field is generated between the pair of first excitation electrode 14 a and second excitation electrode 14 b in the crystal resonator element 10 via the external electrodes 35 a and 35 b of the base member 30. Apply. Thereby, the vibration part of the crystal piece 11 vibrates in a predetermined vibration mode such as a thickness shear vibration mode, and resonance characteristics associated with the vibration are obtained.

(Production method)
Next, a method for manufacturing a crystal resonator according to the first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 4 is a flowchart illustrating a method for manufacturing the crystal unit 1, and FIG. 5 is a diagram illustrating a process of arranging the brazing material 50 on the lid member 20.

  As shown in FIG. 4, first, the base member 30 is prepared (S101). Specifically, the internal electrode 33c and the external electrodes 35a to 35d are provided on the base 31 made of an insulating ceramic such as alumina. The internal electrode 33c and the external electrodes 35a to 35d can be formed by stacking molybdenum (Mo), nickel (Ni), and gold (Au). As described above, the internal electrode 33 c is provided at the corner of the inner periphery of the sealing frame 37 on the first main surface 32 a of the base 31 and is accommodated in the internal space 26. On the other hand, the external electrodes 35 a to 35 d are provided on the second main surface 32 b of the base 31 and are disposed outside the internal space 26.

  In addition, various electrodes including the electrode pads 33a and 33b, the via electrodes 34a and 34b, the sealing frame 37, the holes 41, and the like are formed. In this way, the base member 30 shown in FIGS. 1 to 3 can be prepared.

  Next, the brazing material 50 is disposed on the lid member 20 (S102). Specifically, as shown in FIG. 5, the opening 27 of the lid member 20 has a rectangular shape when the top surface portion 21 of the lid member 20 is viewed in plan, and the brazing material 50 is attached to the corners of the rectangular shape. Placed in the section. This corner is a position corresponding to the internal electrode 33 c of the base member 30 when the base member 30 and the lid member 20 are joined.

  Next, the prepared crystal resonator element 10 is mounted on the first main surface 32a of the base 31 of the base member 30 (S103). Specifically, a conductive adhesive is applied on the electrode pads 33a and 33b on the first main surface 32a of the base 31, and the conductive adhesive is heated and solidified in a state where the crystal resonator element 10 is mounted. The connection electrodes 16a and 16b of the crystal resonator element 10 and the electrode pads 33a and 33b of the base member 30 are electrically connected by the conductive holding members 36a and 36b in which the conductive adhesive is solidified in this way. Further, the crystal resonator element 10 is held by the conductive holding members 36a and 36b so as to be able to be excited. The crystal resonator element 10 is mounted such that the second excitation electrode 14 b faces the first main surface 32 a of the base member 30.

  The crystal piece processing step and various electrode forming steps are common, and the configuration of the crystal resonator element 10 is as described above. Therefore, the description of the step of preparing the crystal resonator element 10 is omitted.

  Next, the base member 30 and the lid member 20 are joined by the sealing frame 37 and the joining member 40 so as to form the internal space 26 in which the crystal resonator element 10 and the brazing material 50 are accommodated (S104). As described above, since the brazing material 50 is accommodated in the sealed internal space 26, the joining by the brazing material 50 becomes less susceptible to the influence of external humidity, corrosive gas, etc., and the change with time can be reduced. it can. In this case, it is desirable that the sealed internal space 26 has an atmosphere with a lower activity than the atmosphere, such as an oxygen concentration lower than the atmosphere.

  Specifically, the sealing frame 37 is provided over the entire circumference on the first main surface 32 a of the base member 30. The sealing frame 37 is provided by screen printing, and then heated to solidify (temporarily solidify). Then, the joining member 40 and the lid member 20 which are glass adhesives are placed on the sealing frame 37 of the base member 30 and heated again to melt the sealing frame 37 and the joining member 40 and fire (main firing). ) As a result, the base member 30 and the lid member 20 are joined. In this way, the base member 30 and the lid member 20 can be joined.

  Finally, the base member 30 and the lid member 20 are electrically connected by joining the brazing material 50 (S105). Thereby, compared with the case where the base member 30 and the lid member 20 are electrically connected by simple contact, it is possible to increase the bonding strength. For example, even when subjected to thermal shock or mechanical shock, the electrical connection Is difficult to release.

  Specifically, the base member 30 and the lid member 20 joined by the sealing frame 37 and the joining member 40 are placed on a heating jig and heated, and the brazing material 50 arranged on the lid member 20 is melted and solidified. Let At this time, the brazing material 50 wets and spreads from the lid member 20 to the internal electrode 33c, and electrically connects the internal electrode 33c and the lid member 20. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. In addition, the lid member 20 can be grounded by supplying a ground potential to the external electrode 35d. Therefore, the stray capacitance that can be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal resonator element 10 can be prevented.

  In this way, the internal electrode 33 c and the lid member 20 can be electrically connected by joining the brazing material 50.

  When the melting point of the brazing material 50 is 270 ° C. or more and not more than the melting points of the sealing frame 37 and the joining member 40, the joining described above preferably melts the sealing frame 37 and the joining member 40. Specifically, when the brazing material 50 is a gold (Au) -tin (Sn) eutectic alloy and its melting point is 280 ° C., it is below the melting point of the brazing material 50, the sealing frame 37 and the joining member 40. After preheating at 250 ° C. for 5 minutes, the sealing frame 37 and the joining member 40 are heated for 5 minutes at a melting point of the sealing frame 37 and the joining member 40, for example, 310 ° C. higher than 300 ° C., thereby melting the sealing frame 37 and the joining member 40. In this case, the brazing material 50 is also melted together, and the internal electrode 33c and the lid member 20 are joined. Thereby, the process of joining the base member 30 and the lid member 20 and the process of electrically coupling the base member 30 and the lid member 20 can be performed simultaneously. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

Second Embodiment
Next, a crystal resonator according to a second embodiment of the invention will be described with reference to FIGS. In the second and subsequent embodiments, descriptions of matters common to the first embodiment are omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

  FIG. 6 is a cross-sectional view of a crystal resonator 201 according to the second embodiment of the present invention. 6 is a view in the same sectional view as FIG. The configuration example of the second embodiment shown in FIG. 6 is the same as that of the first embodiment shown in FIG. 2 in that the lid member 220 is a flat plate-like member and the base member 230 has a box shape including an opening. It is different from the configuration example.

  The base member 230 has an inner bottom surface 238a, an opposing surface 238b, and an inner side surface 238c on the lid member 220 side. The inner bottom surface 238 a and the facing surface 238 b are opposed to the first main surface 222 a of the lid member 220. The inner bottom surface 238a is located in the central portion on the lid member 220 side. A crystal resonator element 210 is mounted on the inner bottom surface 238a. The facing surface 238b is positioned outside the inner bottom surface 238a when the inner bottom surface 238a is viewed in plan, and has a frame shape. The inner side surface 238c is a surface that connects the inner bottom surface 238a and the opposing surface 238b. An internal electrode 233c is provided on a part of the inner surface 238c. The internal electrode 233c is electrically connected to the external electrode 235c through a connection electrode (not shown). The internal space 226 is a space surrounded by the inner bottom surface 238a, the opposing surface 238b, the inner side surface 238c, and the first main surface 222a of the lid member 220.

  The lid member 220 has a first main surface 222a and a second main surface 222b facing each other. The joining member 240 is located between the facing surface 238 b of the base member 230 and the second main surface 222 b of the lid member 220. The base member 230 and the lid member 220 are joined by the joining member 240 and the internal space 226 is sealed. In the internal space 226, the crystal vibrating element 210 and the brazing material 250 are accommodated.

(Production method)
Next, a method for manufacturing a crystal resonator according to the second embodiment of the present invention will be described with reference to FIGS. Here, FIG. 7 is a flowchart showing a manufacturing method of the crystal unit 201, and FIG. 8 is a diagram illustrating a process of arranging the brazing material 250 on the base member 230.

  As shown in FIG. 7, first, the base member 230 is prepared (S301). Specifically, the inner bottom surface 238a, the opposing surface 238b, and the inner side surface 238c of the base member 230 are formed by etching or the like. Since the process of preparing the base member 230 is the same as that of S101 of 1st Embodiment shown in FIG. 4 about another structure, the description is abbreviate | omitted.

  Next, the brazing material 250 is disposed on the base member 230 (S302). Specifically, as shown in FIG. 8, a brazing material 250 is disposed on the opening edge side on the surface of the internal electrode 233 c of the base member 230. Thus, by arranging the brazing material 250 on the internal electrode 233c, the electrical connection between the internal electrode 233c and the lid member 220 can be easily realized.

  Next, the crystal resonator element 10 prepared in advance is mounted on the inner bottom surface 238a of the base member 230 (S303).

  Next, the base member 230 and the lid member 220 are joined by the joining member 240 so as to form the internal space 326 in which the crystal resonator element 210 and the brazing material 250 are accommodated (S304). Specifically, on the opposing surface 238b of the base member 230, the bonding member 240, which is a resin adhesive, is provided over the entire circumference. Then, the lid member 220 is placed on the bonding member 240 and heated, for example, at 200 ° C. for 10 minutes to melt and solidify the bonding member 240. Since this heating temperature (200 ° C.) is lower than the melting point (280 ° C.) of the brazing material 250, the brazing material 250 does not melt at this point.

  Finally, the internal electrode 233c of the base member 230 and the lid member 220 are electrically connected by joining the brazing material 250 (S305). Specifically, the base member 230 and the lid member 220 joined by the joining member 240 are heated at 290 ° C., which is higher than the melting point of the brazing material 250 for 2 minutes to melt and solidify the brazing material 250. At this time, the brazing material 250 spreads from the internal electrode 233c to the lid member 220, and the internal electrode 33c and the lid member 220 are joined.

  The exemplary embodiments of the present invention have been described above. In the crystal unit 1, an insulating sealing frame 37 and a joining member are provided so that the crystal resonator element 10 is accommodated in an internal space 26 formed by the crystal resonator element 10, the base member 30, and the base member 30. The base member 30 is joined to the base member 30 via 40 and has conductivity, and is accommodated in the internal space 26 so as to electrically connect the base member 30 and the lid member 20. And a brazing material 50 joined to the lid member 20. As described above, since the brazing material 50 is accommodated in the internal space 26, the joining with the brazing material 50 is less affected by external humidity, corrosive gas, and the like, and the change with time can be reduced. Further, since the brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the base member 30 and the lid member 20, the base member 30 and the lid member 20 are simply contacted with each other. As compared with the case where the two are electrically connected, the bonding strength can be increased. For example, even when a thermal shock or a mechanical shock is applied, the electrical connection is hardly released. Accordingly, the base member 30 and the lid member 20 can be stably conducted.

  In the crystal unit 1 described above, the base member 30 includes external electrodes 35a to 35d provided outside the internal space 26, an internal electrode 33c that is housed in the internal space 26 and electrically connected to the external electrode 35c, The brazing material 50 is joined to the base member 30 and the lid member 20 so as to electrically connect the internal electrode 33 c and the lid member 20. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. Moreover, the lid member 20 can be grounded by supplying the ground potential to the external electrode 35c. Therefore, the stray capacitance that can be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal resonator element 10 can be prevented.

  In the crystal resonator 1 described above, the internal space 26 has a rectangular shape when the first main surface 32a of the base member 30 is viewed in plan, and the brazing material 50 is provided at a rectangular corner. In this way, by providing the brazing material 50 at the corners of the rectangular shape with respect to the crystal vibrating element 10 held at the substantially center of the rectangular shape, the influence that can be exerted on the crystal vibrating element 10 by the joining of the brazing material 50. Can be reduced.

  In the crystal resonator 1 described above, the base member 30 includes electrode pads 33a and 33b that are electrically connected to the crystal resonator element 10, and the brazing material 50 is a plan view of the first main surface 32a of the base member 30. Sometimes, it is provided at a corner portion relatively far from the electrode pads 33a and 33b among the plurality of corner portions. Thereby, the influence which can exert on conduction | electrical_connection of the crystal oscillation element 10 via electrode pad 33a, 33b can be reduced.

  In the crystal resonator 1 described above, the material of the lid member 20 is a metal. Thereby, at the time of joining by the brazing material 50, a metal bond arises between the cover member 20 and the brazing material 50, and an alloy layer is formed. Therefore, compared with the case where the material of the lid member 20 is other than metal, the bonding strength by the brazing material 50 can be increased.

  In the crystal unit 1 described above, the material of the sealing frame 37 and the bonding member 40 is inorganic glass. Here, the inorganic glass is characterized in that it emits less gas during solidification than the organic resin adhesive. Thereby, the change of the atmospheric | air pressure of the internal space 26 resulting from discharge | release gas, and the fluctuation | variation of the frequency characteristic of the crystal vibration element 10 by adsorption | suction of discharge | release gas can be suppressed. In addition, inorganic glass also has a feature that its airtightness is better than that of a resin adhesive. Thereby, the airtightness of the internal space 26 can be improved.

  In the crystal unit 1 described above, the brazing material 50 has a melting point of 270 ° C. or higher and lower than the melting points of the sealing frame 37 and the bonding member 40. As described above, since the melting point of the brazing material 50 is 270 ° C. or higher, the brazing material 50 can be melted again by heating when the crystal unit 1 is mounted on a circuit board (not shown) and the bonding can be released. Can be reduced. Further, since the melting point of the brazing material 50 is equal to or lower than the melting points of the sealing frame 37 and the joining member 40, the brazing material 50 is melted at the time of joining by the sealing frame 37 and the joining member 40, and the lid member 20 and the base The member 30 can be electrically connected. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

  Further, in the method of manufacturing the crystal unit 1, the step of preparing the base member 30, the step of disposing the brazing material 50 on one of the base member 30 or the conductive lid member 20, the crystal resonator element 10 and the brazing material 50. The base member 30 is joined by the step of joining the base member 30 and the lid member 20 by the insulating sealing frame 37 and the joining member 40 and the joining of the brazing material 50 so as to form the internal space 26 in which the base member 30 is accommodated. And a step of electrically connecting the lid member 20 to each other. As described above, since the brazing material 50 is accommodated in the internal space 26, the joining with the brazing material 50 is less affected by external humidity, corrosive gas, and the like, and the change with time can be reduced. In addition, when the lid member 20 and the base member 30 are electrically connected by joining the brazing material 50, the joining strength is higher than when the base member 30 and the lid member 20 are electrically connected by simple contact. For example, even when subjected to thermal shock or mechanical shock, the electrical connection is difficult to be released. Accordingly, the base member 30 and the lid member 20 can be stably conducted.

  In the manufacturing method of the crystal resonator 1 described above, the preparing step is to provide the external electrodes 35a to 35d at positions outside the internal space 26, and to be electrically connected to the external electrodes 35a to 35d. The step of electrically connecting the inner electrode 33c to the position accommodated in the first and second steps includes electrically connecting the inner electrode 33c and the lid member 20 by joining the brazing material 50. Thereby, conduction between the base member 30 and the lid member 20 can be easily realized. In addition, the lid member 20 can be grounded by supplying a ground potential to the external electrode 35d. Therefore, the stray capacitance that can be generated in the lid member 20 can be reduced, and the frequency fluctuation of the crystal resonator element 10 can be prevented.

  Further, in the method for manufacturing the crystal resonator 201, the arranging step includes arranging the brazing material 250 on the internal electrode 233c. Thereby, the electrical connection between the internal electrode 233c and the lid member 220 can be easily realized.

  In the method for manufacturing the crystal unit 1 described above, the brazing material 50 has a melting point of 270 ° C. or higher and lower than the melting point of the sealing frame 37 and the bonding member 40, and the bonding step includes the sealing frame 37 and the bonding member 40. Heating and melting. Thereby, the process of joining the base member 30 and the lid member 20 and the process of electrically coupling the base member 30 and the lid member 20 can be performed simultaneously. Therefore, the manufacturing process of the crystal unit 1 can be simplified.

  Each embodiment described above is for facilitating the understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. Each embodiment is an exemplification, and it is needless to say that a partial replacement or combination of configurations shown in different embodiments is possible, and these are also included in the scope of the present invention as long as they include the features of the present invention. .

  DESCRIPTION OF SYMBOLS 1 ... Quartz crystal resonator, 10 ... Quartz vibration element, 11 ... Crystal piece, 12a ... 1st main surface, 12b ... 2nd main surface, 14a ... 1st excitation electrode, 14b ... 2nd excitation electrode, 15a, 15b ... Extraction Electrode, 16a, 16b ... connection electrode, 20 ... lid member, 21 ... top surface portion, 22 ... side wall portion, 23 ... opposing surface, 24 ... inner surface, 25 ... outer surface, 26 ... inner space, 27 ... opening, 30 ... base member 31 ... Base body, 32a ... First main surface, 32b ... Second main surface, 33a ... Electrode pad, 33b ... Electrode pad, 33c ... Internal electrode, 34a, 34b ... Via electrode, 35a, 35b, 35c, 35d ... External Electrodes 36a, 36b ... conductive holding member, 37 ... sealing frame, 40 ... bonding member, 41 ... hole, 42 ... via electrode, 50 ... brazing material, 201 ... crystal resonator, 210 ... crystal resonator element, 220 ... Lid member, 222a... First main surface, 22 b ... second main surface, 226 ... internal space, 230 ... base member, 233c ... internal electrode, 235d ... external electrode, 238a ... inner bottom surface, 238b ... opposite surface, 238c ... inner side surface, 240 ... joining member, 250 ... wax Material, 326 ... Internal space.

Claims (11)

A piezoelectric vibration element;
A base member;
A lid member that is joined to the base member via an insulating joining member so as to accommodate the piezoelectric vibration element in an internal space formed by the base member, and that has electrical conductivity;
A brazing material housed in the internal space and joined to the base member and the lid member so as to electrically connect the base member and the lid member;
Piezoelectric vibrator. The base member includes an external electrode provided outside the internal space, and an internal electrode housed in the internal space and electrically connected to the external electrode,
The brazing material is joined to the base member and the lid member so as to electrically connect the internal electrode and the lid member.
The piezoelectric vibrator according to claim 1. The internal space has a rectangular shape when the main surface of the base member is viewed in plan view,
The brazing material is provided at the rectangular corner,
The piezoelectric vibrator according to claim 1. The base member includes an electrode pad electrically connected to the piezoelectric vibration element,
The brazing material is provided at a corner portion relatively far from the electrode pad among the plurality of corner portions when the main surface of the base member is viewed in plan view.
The piezoelectric vibrator according to claim 3. The material of the lid member is a metal,
The piezoelectric vibrator according to any one of claims 1 to 4. The material of the joining member is inorganic glass,
The piezoelectric vibrator according to any one of claims 1 to 5. The brazing material has a melting point of 270 ° C. or higher and lower than the melting point of the joining member;
The piezoelectric vibrator according to any one of claims 1 to 6. Preparing a base member;
Disposing a brazing material on one of the base member or the conductive lid member;
Bonding the base member and the lid member with an insulating bonding member so as to form an internal space in which the piezoelectric vibration element and the brazing material are accommodated;
Electrically connecting the base member and the lid member by joining the brazing material,
A method of manufacturing a piezoelectric vibrator. The preparing step includes providing an external electrode at a position outside the internal space, and providing an internal electrode at a position electrically connected to the external electrode and accommodated in the internal space. ,
The electrically connecting step includes electrically connecting the internal electrode and the lid member by joining the brazing material.
The method for manufacturing a piezoelectric vibrator according to claim 8. The placing step includes placing the brazing material on the internal electrode.
The method for manufacturing a piezoelectric vibrator according to claim 9. The brazing material has a melting point of 270 ° C. or higher and lower than the melting point of the joining member,
The step of joining includes heating and melting the joining member;
The method for manufacturing a piezoelectric vibrator according to claim 8.

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