JPWO2018159574A1 - エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 - Google Patents
エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 Download PDFInfo
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- JPWO2018159574A1 JPWO2018159574A1 JP2018511508A JP2018511508A JPWO2018159574A1 JP WO2018159574 A1 JPWO2018159574 A1 JP WO2018159574A1 JP 2018511508 A JP2018511508 A JP 2018511508A JP 2018511508 A JP2018511508 A JP 2018511508A JP WO2018159574 A1 JPWO2018159574 A1 JP WO2018159574A1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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Abstract
Description
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)〜(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物。
少なくとも構成要素[A]〜[C]を含み、構成要素[B]のアミノ基と構成要素[A]のエポキシ基との官能基の当量比が0.7〜1.5であり、構成要素[A]100質量部に対して、構成要素[C]の配合量が1〜10質量部であるエポキシ樹脂組成物。
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)〜(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物。
(c4)1分子内にカルボニル基を1つかつフェノール性ヒドロキシル基を1つ有するフェノール化合物
(c4)に該当するフェノール化合物は、(c1)に該当するフェノール化合物の一部である。すなわち、(c4)に該当するフェノール化合物は、(c1)にも該当する。(c4)に該当するフェノール化合物としては、4−ヒドロキシベンゾフェノン、3−ヒドロキシベンゾフェノン、2−ヒドロキシベンゾフェノン、4−ヒドロキシ−3−メチルベンゾフェノンなどが挙げられる。
(1)構成要素[B]のアミノ基と構成要素[A]のエポキシ基の官能基の当量比が0.7〜1.5である。
(2)構成要素[C]の含有量が、構成要素[A]100質量部に対して、1〜10質量部である。
当量比=(構成要素[B]の質量部数/構成要素[B]の活性水素当量)/(構成要素[A]の質量部数/構成要素[A]のエポキシ当量)。
当量比=(構成要素[B]成分1の質量部数/構成要素[B]成分1の活性水素当量+構成要素[B]成分2の質量部数/構成要素[B]成分2の活性水素当量)/(構成要素[A]成分1の質量部数/構成要素[A]成分1のエポキシ当量+構成要素[A]成分2の質量部数/構成要素[A]成分2のエポキシ当量)。
(1)構成要素[A]:エポキシ樹脂
・ビスフェノールA型エポキシ樹脂(“jER(登録商標)”825、三菱化学(株)製)エポキシ当量:175(g/eq.)
・ビスフェノールF型エポキシ樹脂(“EPICLON(登録商標)”830、DIC(株)製)エポキシ当量:172(g/eq.)
・テトラグリシジルジアミノジフェニルメタン(“アラルダイト(登録商標)”MY721、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:113(g/eq.)
・トリグリシジル−m−アミノフェノール(“アラルダイト(登録商標)”MY0600、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:106(g/eq.)
・トリグリシジル−p−アミノフェノール(“アラルダイト(登録商標)”MY0500、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:106(g/eq.)
・トリフェニロールメタントリグリシジルエーテル(TACTIX742、ハンツマン・アドバンスト・マテリアルズ社製)エポキシ当量:160(g/eq.)。
・4,4’−ジアミノジフェニルスルホン(セイカキュアS、和歌山精化工業(株)製)活性水素当量:62(g/eq.)
・3,3’−ジアミノジフェニルスルホン(3,3’−DAS、三井化学ファイン(株)製)活性水素当量:62(g/eq.)。
・4,4’−ジヒドロキシベンゾフェノン(c1に該当)
・4−ヒドロキシベンゾフェノン(c4に該当)
・2,4−ビス(フェニルスルホニル)フェノール(c2に該当)
・3,3’−ジフェニル−4,4’−ジヒドロキシジフェニルスルホン(c3に該当)。
・4,4’−ジヒドロキシジフェニルスルホン。
・ポリエーテルスルホン(“スミカエクセル(登録商標)”PES5003P、住友化学(株)社製)。
以下の方法にて各実施例および比較例のエポキシ樹脂組成物を作製、測定した。
混練装置中に、表1〜6に記載の構成要素[A]に該当するエポキシ樹脂および必要に応じて熱可塑性樹脂を投入し、加熱混練を行い、熱可塑性樹脂を溶解させた。次いで、混練を続けたまま100℃以下の温度まで降温させ、表1〜6に記載の構成要素[B]と構成要素[C](ただし、比較例においては、構成要素[C]を加えない場合や、構成要素[C]の代わりに化合物Xを加える場合もある。)を加えて撹拌し、エポキシ樹脂組成物を得た。
エポキシ樹脂組成物の粘度は、動的粘弾性測定装置ARESレオメーター(TAインスツルメント社製)を用いた。上下部測定冶具に直径40mmの平板のパラレルプレートを用い、パラレルプレートを70℃に加温後、上部と下部の冶具間距離が1mmとなるように該エポキシ樹脂組成物をセットし、ねじりモード(測定周波数:0.5Hz)で測定した。「70℃から80℃まで2℃/分の速度で昇温し、80℃に到達後、1分間保持した時の粘度」をη* 1、「70℃から80℃まで2℃/分の速度で昇温し、80℃に到達後、2時間保持した時の粘度」をη* 120と定め、増粘倍率(ポットライフ)をη* 120÷η* 1より求めた。ここで粘度とは、動的粘弾性測定における複素粘性率η*のことを指す。ポットライフの評価に関し、表1〜6において、増粘倍率が3.0倍以下をA、3.0倍超、4.0倍以下をB、4.0倍超、5.0倍以下をC、5.0倍超をDで表記した。
エポキシ樹脂組成物を、縦15cm、幅13cm、厚さ2mmのモールドに注入した後、熱風乾燥機中で30℃から速度1.5℃/分で昇温し、180℃で2時間加熱硬化した後、30℃まで速度2.5℃/分で降温して厚さ2mmの樹脂硬化板を作製した。作製した樹脂硬化板から幅12.7mm、長さ55mmの試験片を切り出し、SACMA SRM18R−94に従い、DMA法によりガラス転移温度を求めた。貯蔵弾性率G’曲線において、ガラス状態での接線と転移状態での接線との交点温度値をガラス転移温度とした。ここでは、昇温速度5℃/分、周波数1Hzで測定した。耐熱性の評価に関し、表1〜6において、ガラス転移温度が190℃以上をA、180℃以上190℃未満をB、170℃以上180℃未満をC、170℃未満をDで表記した。
回転トルクの経時変化からエポキシ樹脂組成物の硬化反応性を評価した。ここでは、Rubber Process Analyzer RPA2000(ALPHA TECHNOLOGIES社製)を用い、直径4cm、深さ3mmの円孔にエポキシ樹脂組成物を4.5g流し入れ、40℃から180℃まで1.7℃/分の速度で昇温し、180℃で2時間加熱した。ゲルタイムは、40℃で加熱開始時点からトルクが1dNmを超えるまでの時間とした。速硬化性の評価に関し、表1〜6において、ゲルタイムが80分以下をA、80分超、90分以下をB、90分超、95分以下をC、95分超をDで表記した。
構成要素[C]として、表1に記載の(c1)〜(c4)のフェノール化合物を用いた結果、表5に記載の比較例1(構成要素[C]非含有)と比べ、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮され、優れた速硬化性を示した。ガラス転移温度に関しては、実施例1〜4とも比較例1に比べて大幅な低下はなく、190℃以上の高い値を示した。
表1、2、5に示すように、種々のエポキシ樹脂組成物を用いた。実施例5〜9および実施例15〜18では、構成要素[C]として(c1)に該当する4,4’−ジヒドロキシベンゾフェノンを含有することにより、比較例2〜6(構成要素[C]非含有)に比べて、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮された。また、実施例10〜14では、構成要素[C]として(c4)に該当する4−ヒドロキシベンゾフェノンを含有することにより、(c1)を用いた実施例5〜9に比べて、増粘倍率が小さくなっており、好ましい傾向を示した。実施例5〜9に比べて、ゲルタイムの若干の増加および耐熱性の若干の低下が見られたが、実用上問題のない優れた値を示した。
実施例5〜9および実施例10〜14において、1分子中にグリシジル基を3個以上含むエポキシ樹脂であるテトラグリシジルジアミノジフェニルメタンの含有量が増えることで、速硬化性、ポットライフへの悪影響なく、ガラス転移温度の向上が見られ、好ましい傾向を示した。
表2、3、5に示すように、実施例19〜22では、比較例7、8(構成要素[C]非含有)に比べて、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムの短縮が見られた。さらに、ガラス転移温度の大幅な低下も抑えられており、好ましい特性であった。実施例1、2、9、14から実施例19〜22へ、構成要素[B]のアミン硬化剤を変更した結果、ポットライフおよび耐熱性が若干低下する傾向が見られたが、実用上問題のない優れた値を示した。
表3に示すように、実施例23〜26では、実施例1、2における構成要素[B]のアミン硬化剤を変更した結果、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが短縮しており、優れた特性を示した。
表3、4に示すように、実施例27〜34において構成要素[C]の含有量を変更した結果、含有量の増加により、ゲルタイムの短縮と共に増粘倍率が上昇する傾向が見られたが、実用上問題のない優れた特性を示した。
表4に示すように、構成要素[B]のアミン硬化剤の含有量を変更した結果、含有量の増加に伴い、ゲルタイムが短縮される傾向を示した。
表5に示すように、硬化促進剤として構成要素[C]に含まれない化合物Xを用いた結果、増粘倍率が高く、好ましくない特性であった。
表6の比較例11、13、15、17に示すように、構成要素[A]100質量部に対し、構成要素[C]の含有量が1質量部未満であった結果、ゲルタイムの短縮効果が十分ではなく、好ましくない結果であった。比較例12、14、16、18に示すように、構成要素[A]100質量部に対し、構成要素[C]の含有量が10質量部より大きい場合、増粘倍率の上昇が著しく、好ましくない特性であった。
構成要素[C]として、表4に記載の(c1)と(c4)のフェノール化合物を用いた結果、実施例39と40では、表6に記載の比較例19(構成要素[C]非含有)と比べ、増粘倍率の大幅な増加を抑制しつつ、ゲルタイムが大きく短縮され、優れた速硬化性を示した。ガラス転移温度に関しては、実施例39、40とも比較例19に比べて大幅な低下はなく、190℃以上の高い値を示した。
Claims (9)
- 少なくとも次の構成要素[A]〜[C]を含み、構成要素[B]のアミノ基と構成要素[A]のエポキシ基との官能基の当量比が0.7〜1.5であり、構成要素[A]100質量部に対して、構成要素[C]の配合量が1〜10質量部であるエポキシ樹脂組成物。
[A]エポキシ樹脂
[B]アミン硬化剤
[C]次の(c1)〜(c3)のいずれか1つ以上より構成される、フェノール化合物
(c1)1分子内にカルボニル基を1つ以上有するフェノール化合物
(c2)1分子内にスルホニル基を2つ以上有するフェノール化合物
(c3)1分子内にスルホニル基を1つかつ芳香環を3つ以上有するフェノール化合物 - 構成要素[A]が、全エポキシ樹脂100質量部に対してグリシジルアミン型エポキシ樹脂を40〜100質量部含む、請求項1に記載のエポキシ樹脂組成物。
- 構成要素[B]が、ジアミノジフェニルスルホンまたはジアミノジフェニケトンを含む、請求項1または2に記載のエポキシ樹脂組成物。
- 構成要素[C]が、次の(c4)より構成されるフェノール化合物である、請求項1から3のいずれかに記載のエポキシ樹脂組成物。
(c4)1分子内にカルボニル基を1つかつフェノール性ヒドロキシル基を1つ有するフェノール化合物 - 180℃で2時間硬化して得られる硬化物のガラス転移温度が190℃以上である、請求項1から4のいずれかに記載のエポキシ樹脂組成物。
- 80℃で2時間保持した時の粘度が、80℃における初期粘度の4.0倍以下である、請求項1から5のいずれかに記載のエポキシ樹脂組成物。
- 請求項1から6のいずれかに記載のエポキシ樹脂組成物を強化繊維に含浸させてなるプリプレグ。
- 請求項7に記載のプリプレグを硬化させてなる繊維強化複合材料。
- 請求項1から6のいずれかに記載のエポキシ樹脂組成物を硬化させてなるエポキシ樹脂硬化物、および、強化繊維を含んでなる繊維強化複合材料。
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CN110352207A (zh) | 2019-10-18 |
WO2018159574A1 (ja) | 2018-09-07 |
EP3590991A4 (en) | 2020-10-28 |
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