JPS6359086B2 - - Google Patents
Info
- Publication number
- JPS6359086B2 JPS6359086B2 JP17546982A JP17546982A JPS6359086B2 JP S6359086 B2 JPS6359086 B2 JP S6359086B2 JP 17546982 A JP17546982 A JP 17546982A JP 17546982 A JP17546982 A JP 17546982A JP S6359086 B2 JPS6359086 B2 JP S6359086B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- common terminal
- independent
- insulating substrate
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】
この発明は、発熱体の温度を検出して制御する
ために用いる複合温度検知素子の製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a composite temperature sensing element used for detecting and controlling the temperature of a heating element.
ヒータや半導体、放熱器などの発熱体の温度を
数段階にわたつて検出し、温度に応じて電子機器
を制御したいような場合、正特性サーミスタや負
特性サーミスタなどの検知素子を使い、各温度に
対応するよう特性のちがう検知素子を発熱体に取
付け、熱を電流信号に変換して検出している。 When you want to detect the temperature of a heating element such as a heater, semiconductor, or radiator over several stages and control electronic equipment according to the temperature, you can use a sensing element such as a positive temperature coefficient thermistor or a negative coefficient thermistor to detect the temperature at each temperature. Detecting elements with different characteristics are attached to the heating element in order to correspond to the heat generation, and the heat is converted into a current signal and detected.
従来の検知素子取付方法は、第1図に示すよう
に、ラグ端子板1に、樹脂モールドされたリード
線2,2付の検知素子3を嵌込んで接着剤で固定
し、この検知素子3を第2図に示すように、発熱
体4上にそれぞれ別個にビス5止して取付けるよ
うにしていた。 As shown in FIG. 1, the conventional detection element mounting method involves fitting a resin-molded detection element 3 with lead wires 2 and 2 into a lug terminal plate 1 and fixing the detection element 3 with adhesive. As shown in FIG. 2, they were each attached to the heating element 4 with screws 5 separately.
しかし、検知素子を別個に取付ける方法は、取
付けに手間がかゝり、しかも各検知素子を個々に
独立して加工する必要があるので、全体としてコ
ストアツプになり、また一個当りの素子が大きい
ので大きな取付スペースを必要とするという問題
がある。 However, the method of installing the sensing elements separately takes time and effort to install, and each sensing element needs to be processed individually, which increases the overall cost, and each element is large. There is a problem that a large installation space is required.
この発明は上記のような問題を解消するために
なされたものであり、発熱体に対する複数個の検
知素子の取付けが簡単にしかもコンパクトに行な
え、検知能力にすぐれた複合温度検知素子を製作
することができる製造方法を提供することを目的
とする。 This invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to manufacture a composite temperature sensing element that can easily and compactly attach a plurality of sensing elements to a heating element and has excellent sensing ability. The purpose is to provide a manufacturing method that can.
この発明の構成は、一枚の金属板を打抜いて共
通端子と複数の独立端子を一体に形成し、各独立
端子の先端と共通端子の間に検知素子を挾み込ん
で取付け、端子と検知素子の電極を半田で接続し
た後、共通端子を絶縁基板上に接着し、金属板の
不要部分を切取つて独立端子と共通端子に分離す
るようにしたものである。 The structure of the present invention is that a common terminal and a plurality of independent terminals are integrally formed by punching out a single metal plate, and a detection element is inserted and attached between the tip of each independent terminal and the common terminal. After the electrodes of the sensing element are connected with solder, the common terminal is glued onto an insulating substrate, and unnecessary parts of the metal plate are cut off to separate the independent terminal and the common terminal.
以下、この発明の実施例を添付図面の第3図な
いし第8図にもとづいて説明する。 Embodiments of the present invention will be described below with reference to FIGS. 3 to 8 of the accompanying drawings.
先づ、第3図に示すように、好ましくは弾性を
有する薄い導電性の金属板11を用い、この金属
板11に複数の長孔12を並べて打抜き、複数本
の独立端子13と、一方の端部に少し広幅の共通
端子14とを一体に形成する。 First, as shown in FIG. 3, a thin conductive metal plate 11 preferably having elasticity is used, a plurality of long holes 12 are punched out in line with the metal plate 11, and a plurality of independent terminals 13 are inserted into one side. A slightly wider common terminal 14 is integrally formed at the end.
上記各独立端子13の自由先端は、共通端子1
4の内部に進入するよう、隣接する長孔12の共
通端子14の部分にコ字形の切欠15を設けてお
く。 The free tip of each independent terminal 13 is connected to the common terminal 1.
A U-shaped notch 15 is provided in the common terminal 14 portion of the adjacent elongated hole 12 so as to enter the inside of the terminal 4 .
次に、正特性サーミスタや負特性サーミスタの
ような検知温度の異なる複数個の検知素子16
a,16b,16cを用意し、各検知素子を共通
端子14と各独立端子13の間に挾み込んで、第
4図に示すように取付ける。 Next, a plurality of sensing elements 16 having different detection temperatures, such as a positive characteristic thermistor or a negative characteristic thermistor, are used.
A, 16b, and 16c are prepared, each detection element is inserted between the common terminal 14 and each independent terminal 13, and attached as shown in FIG.
各検知素子16a,16b,16cは独立端子
13の弾性によつて共通端子14上に押え込ま
れ、その両面に設けた電極に共通端子14および
独立端子13が接触することになり、この状態で
電極と共通端子14および独立端子13の重なり
部分を半田付によつて固定化する。 Each detection element 16a, 16b, 16c is pressed onto the common terminal 14 by the elasticity of the independent terminal 13, and the common terminal 14 and the independent terminal 13 come into contact with the electrodes provided on both sides of the common terminal 14. The overlapping portions of the electrodes, common terminal 14, and independent terminals 13 are fixed by soldering.
次に第5図に示すように、共通端子14と検知
素子16a,16b,16cおよび独立端子13
の積層部分を絶縁樹脂等の外装樹脂内に浸漬さ
せ、外装樹脂17が固化する前に共通端子14を
別体に用意した絶縁基板18上に載置し、外装樹
脂17を接着剤に利用して固着する。 Next, as shown in FIG. 5, the common terminal 14, the sensing elements 16a, 16b, 16c and the independent terminal 13
The laminated portion is immersed in an exterior resin such as an insulating resin, and before the exterior resin 17 hardens, the common terminal 14 is placed on a separately prepared insulating substrate 18, and the exterior resin 17 is used as an adhesive. It will stick.
この後金属板11の周囲不要部分を、たとえば
第6図のようにカツトし、共通端子14と各独立
端子13とを分離独立させる。 Thereafter, unnecessary portions around the metal plate 11 are cut off as shown in FIG. 6, for example, so that the common terminal 14 and each independent terminal 13 are separated and independent.
上記絶縁基板18としては、アルミナ磁器や樹
脂板、金属板に絶縁コートしたもの等、表面が絶
縁されておれば材質は何ら限定されない。 The material of the insulating substrate 18 is not limited at all as long as the surface is insulated, such as alumina porcelain, a resin plate, a metal plate coated with an insulating coating, etc.
また、検知素子16a,16b,16cの外周
面を外装樹脂17で覆うので、検知素子を外部環
境から保護することができ、信頼性が高くなる。 Furthermore, since the outer circumferential surfaces of the detection elements 16a, 16b, and 16c are covered with the exterior resin 17, the detection elements can be protected from the external environment and reliability is increased.
でき上つた複合温度検知素子の発熱体19への
取付けは、第7図に示すように、絶縁基板18を
発熱体19上に重ね、ビス20の締付によつて固
定してもよいが、第8図に示すように、プリント
基板21を発熱体19の面に対して略垂直に設定
し、このプリント基板21に接続した共通端子1
4および独立端子13のばね性を利用し、絶縁基
板18を発熱体19上に圧着させるようにしても
よい。 The completed composite temperature sensing element may be attached to the heating element 19 by stacking the insulating substrate 18 on the heating element 19 and fixing it by tightening screws 20, as shown in FIG. As shown in FIG. 8, a printed circuit board 21 is set approximately perpendicular to the surface of the heating element 19, and a common terminal 1 is connected to the printed circuit board 21.
4 and the independent terminals 13 may be used to press the insulating substrate 18 onto the heating element 19.
以上のように、この発明によると、一枚の金属
板に共通端子と複数本の独立端子を一体形成し、
各独立端子の自由先端と共通端子の間に各々検知
素子を挾み込んで取付け、検知素子の電極と端子
を半田付により接続した後、共通端子を絶縁基板
上に接着するようにし、金属板の不要部分をカツ
トして共通端子と独立端子を分離するようにした
ので、複数の検知素子に対する端子の取付けが一
度に行なえるようになり、複数検知素子の発熱体
への取付けも一度に行なえ、組立加工が簡単で、
取付作業も手軽に能率よく行なえるようになる。 As described above, according to the present invention, a common terminal and a plurality of independent terminals are integrally formed on one metal plate,
A sensing element is inserted and installed between the free tip of each independent terminal and the common terminal, and after connecting the electrode of the sensing element and the terminal by soldering, the common terminal is glued onto the insulating substrate, and the metal plate By cutting out the unnecessary parts and separating the common terminal and independent terminal, it is now possible to attach the terminals to multiple sensing elements at once, and it is also possible to attach multiple sensing elements to the heating element at the same time. , easy to assemble,
Installation work can be done easily and efficiently.
また、複数の検知素子を共通端子上に取付ける
ので、全体をコンパクトにまとめることができ、
電子機器の小型化を実現することができる。 In addition, since multiple sensing elements are attached to a common terminal, the whole can be made compact.
It is possible to downsize electronic devices.
さらに、端子が一枚の金属板から形成されてい
るので、端子ピツチの精度が良く、プリント基板
への挿入および発熱体への設置が容易に行なえ、
しかも共通端子が吸熱板の働きをするので、検知
素子に熱が伝導しやすく、検知能力が優れたもの
となるという効果がある。 Furthermore, since the terminals are formed from a single metal plate, the terminal pitch is accurate and can be easily inserted into a printed circuit board and installed on a heating element.
In addition, since the common terminal functions as a heat absorbing plate, heat is easily conducted to the sensing element, resulting in excellent sensing ability.
第1図は従来の複合温度検知素子を示す斜視
図、第2図は同上の発熱体への取付け状態を示す
平面図、第3図ないし第6図の各々は、この発明
の製造方法を示す工程図、第7図と第8図の各々
は発熱体への取付状態を示す側面図である。
11……金属板、13……独立端子、14……
共通端子、16a,16b,16c……検知素
子、17……外装樹脂、18……絶縁基板、19
……発熱体。
Fig. 1 is a perspective view showing a conventional composite temperature sensing element, Fig. 2 is a plan view showing how it is attached to the above heating element, and Figs. 3 to 6 each show the manufacturing method of the present invention. Each of the process diagrams, FIGS. 7 and 8 is a side view showing the state of attachment to the heating element. 11...Metal plate, 13...Independent terminal, 14...
Common terminal, 16a, 16b, 16c...Detection element, 17...Exterior resin, 18...Insulating substrate, 19
...Heating element.
Claims (1)
端子を一体に形成し、各独立端子の先端と共通端
子の間に各々検知素子を挾み込んで取付け、検知
素子の電極と各端子とを半田で接続した後、共通
端子を絶縁基板上に接着固定し、金属板の不要部
分を切取つて独立端子と共通端子を分離したこと
を特徴とする複合温度検知素子の製造方法。 2 共通端子の絶縁基板上への接着固定を、共通
端子、検知素子、独立端子にわたつて樹脂外装を
施し、この樹脂外装の硬化前に共通端子を絶縁基
板上に重ねることによつて行なうことを特徴とす
る特許請求の範囲第1項に記載の複合温度検知素
子の製造方法。[Claims] 1. A common terminal and a plurality of independent terminals are integrally formed using a single metal plate, and a detection element is inserted and attached between the tip of each independent terminal and the common terminal for detection. A composite temperature sensing element characterized in that after the electrodes of the element and each terminal are connected with solder, the common terminal is adhesively fixed on an insulating substrate, and the independent terminal and the common terminal are separated by cutting off unnecessary parts of the metal plate. manufacturing method. 2. The common terminal is adhesively fixed onto the insulating substrate by applying a resin sheath to the common terminal, the sensing element, and the independent terminal, and stacking the common terminal on the insulating substrate before the resin sheath hardens. A method for manufacturing a composite temperature sensing element according to claim 1, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17546982A JPS5963536A (en) | 1982-10-04 | 1982-10-04 | Manufacture of compound temperature detecting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17546982A JPS5963536A (en) | 1982-10-04 | 1982-10-04 | Manufacture of compound temperature detecting element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5963536A JPS5963536A (en) | 1984-04-11 |
JPS6359086B2 true JPS6359086B2 (en) | 1988-11-17 |
Family
ID=15996600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17546982A Granted JPS5963536A (en) | 1982-10-04 | 1982-10-04 | Manufacture of compound temperature detecting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5963536A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260889A (en) * | 1988-07-13 | 1990-03-01 | Lohr Ind Sa | Trailer unit |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4104709A1 (en) * | 1991-02-15 | 1992-08-20 | Hofsass P | METHOD FOR PRODUCING MADE-UP SELF-STABLIZING RESISTORS AND SUCH A RESISTANT |
US5835004A (en) * | 1995-04-21 | 1998-11-10 | Raychem Corporation | Electrical devices and assemblies |
-
1982
- 1982-10-04 JP JP17546982A patent/JPS5963536A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260889A (en) * | 1988-07-13 | 1990-03-01 | Lohr Ind Sa | Trailer unit |
Also Published As
Publication number | Publication date |
---|---|
JPS5963536A (en) | 1984-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6241146B1 (en) | Process for manufacturing a sensor arrangement for temperature measurement | |
JPS5923406A (en) | Laminated bus and method of producing same | |
JPS5855576Y2 (en) | Connector-fixing device | |
JPS6359086B2 (en) | ||
JP6810526B2 (en) | Resistor | |
JPH0330961B2 (en) | ||
JPH09297069A (en) | Temperature detecting sensor | |
JPH0338801Y2 (en) | ||
JPS6017776Y2 (en) | temperature fuse | |
JP4751101B2 (en) | Temperature sensor | |
JPH07111897B2 (en) | Method of connecting electrode formed on conductive film and lead wire | |
JPS6041668Y2 (en) | Electrode structure of planar heating element | |
JPH0711393Y2 (en) | Substrate type thermal fuse | |
JPS5844562Y2 (en) | Painted electrode lead wire terminal | |
JPH0114430Y2 (en) | ||
JPS5852641Y2 (en) | Positive characteristic thermistor | |
JPH0121524Y2 (en) | ||
JPH0658796B2 (en) | Thin battery mounting structure | |
JPH037870Y2 (en) | ||
JPH0333042Y2 (en) | ||
JPH046212Y2 (en) | ||
JPS608446Y2 (en) | Insulation device using flexible substrate | |
JPH0256024B2 (en) | ||
JPS595922Y2 (en) | Chip parts with lead wires | |
JPS626642Y2 (en) |