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JPS6357772U - - Google Patents

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Publication number
JPS6357772U
JPS6357772U JP15076586U JP15076586U JPS6357772U JP S6357772 U JPS6357772 U JP S6357772U JP 15076586 U JP15076586 U JP 15076586U JP 15076586 U JP15076586 U JP 15076586U JP S6357772 U JPS6357772 U JP S6357772U
Authority
JP
Japan
Prior art keywords
recess
thick film
conductor pattern
circuit board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15076586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15076586U priority Critical patent/JPS6357772U/ja
Publication of JPS6357772U publication Critical patent/JPS6357772U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はこの考案の一実施例によ
る厚膜回路基板の外観図と断面図、第3図は凹部
の断面図、第4図および第5図は凹部の他の形状
例を示す厚膜回路基板の各々の断面図、第6図は
従来の回路基板の断面図である。 1…回路基板、2…導体パターン、3…凹部。
なお、図中同一符号は同一又は相当部分を示す。
Figures 1 and 2 are an external view and a sectional view of a thick film circuit board according to an embodiment of the invention, Figure 3 is a sectional view of a recess, and Figures 4 and 5 are examples of other shapes of the recess. Each of the thick film circuit boards shown is a sectional view, and FIG. 6 is a sectional view of a conventional circuit board. DESCRIPTION OF SYMBOLS 1...Circuit board, 2...Conductor pattern, 3...Recessed part.
Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に導体パターンを形成した厚膜回路基板
において、基板面に凹部を形成し、この凹部に厚
膜状の導体パターンの一部を埋込んで形成したこ
とを特徴とする厚膜回路基板。
1. A thick film circuit board having a conductor pattern formed on the substrate, characterized in that a recess is formed on the substrate surface, and a part of the thick film conductor pattern is embedded in the recess.
JP15076586U 1986-09-30 1986-09-30 Pending JPS6357772U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15076586U JPS6357772U (en) 1986-09-30 1986-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15076586U JPS6357772U (en) 1986-09-30 1986-09-30

Publications (1)

Publication Number Publication Date
JPS6357772U true JPS6357772U (en) 1988-04-18

Family

ID=31067203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15076586U Pending JPS6357772U (en) 1986-09-30 1986-09-30

Country Status (1)

Country Link
JP (1) JPS6357772U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254265U (en) * 1988-10-13 1990-04-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254265U (en) * 1988-10-13 1990-04-19

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