JPS63297587A - Local electrolytic plating method for isolated electric conductor and its equipment - Google Patents
Local electrolytic plating method for isolated electric conductor and its equipmentInfo
- Publication number
- JPS63297587A JPS63297587A JP13681587A JP13681587A JPS63297587A JP S63297587 A JPS63297587 A JP S63297587A JP 13681587 A JP13681587 A JP 13681587A JP 13681587 A JP13681587 A JP 13681587A JP S63297587 A JPS63297587 A JP S63297587A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- electrode
- electrolytic plating
- microcap
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 23
- 238000009713 electroplating Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 10
- 239000004917 carbon fiber Substances 0.000 claims abstract description 10
- 239000003792 electrolyte Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000835 fiber Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はプリント基板等のボンディング個所のみを金メ
ッキする孤立した導電体の局所電解メッキ法に関するも
ので、プリント基板の局所にマイクロキャップを押しつ
け、電解液を圧送し、カーボンファイバー等で作製され
るブラシ状の電極を回動し、孤立した導電体（ボンディ
ング個所等）をブラシ先端で当接し、メッキ皮膜形成後
に電解液を吸引し、マイクロキャップをプリント基板よ
り離すものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a local electrolytic plating method for isolated conductors in which only the bonding points of printed circuit boards are plated with gold. A brush-shaped electrode made of fiber or the like is rotated, the tip of the brush touches an isolated conductor (such as a bonding point), and after a plating film is formed, the electrolyte is sucked and the microcap is separated from the printed circuit board. be.
プリント基板上の孤立した導電体を電解メッキ法で処理
すると同一平面上の全ての導電体にメッキ皮膜が形成さ
れる。高価な金メッキ処理はボンディング個所にのみ施
し、同一基板上の残りの導電体はニッケルメッキ処理し
て、省資源と低コストを図るニーズが高まってきた。こ
の対策として面倒であるがメッキすべき局所のみを露出
して残りのプリント基板表面に全てメンキレジストを塗
布し、無電解メッキ法により局所のみをメッキし、次い
でこのメツキレシストを剥離する手段が採られている。When isolated conductors on a printed circuit board are treated with electrolytic plating, a plating film is formed on all conductors on the same plane. There is a growing need to apply expensive gold plating only to the bonding areas, and nickel plate the remaining conductors on the same board to save resources and lower costs. As a countermeasure to this problem, although it is cumbersome, a method has been adopted in which only the area to be plated is exposed, a coating resist is applied to the entire surface of the remaining printed circuit board, only the area is plated using an electroless plating method, and the coating resist is then peeled off. There is.
剥離液の処理や無電解メッキ自体の制御の難しさに鑑み
、電解メッキ法により局所のみメッキ処理せんと案出さ
れたのが本発明であり、以下図面に基づいて詳しく説明
する。In view of the difficulty in treating the stripping solution and controlling the electroless plating itself, the present invention was devised to perform plating only locally by electrolytic plating, and will be described in detail below with reference to the drawings.
、（手段）
抑圧ロッド（１）にて上下動自在に支承されるマイクロ
キャップ（２）の開口端縁に適度の弾性を有する封止帯
（３）を貼着し、その内部にブラシ状の電極（４）を連
通管（５）にて回動自在に配置する。可とり性を有する
導電性のカーボンファイバー（６）ト導電性ディスク（
７）に多数植設してブラシ状の電極（４）を作製する。, (Means) A sealing band (3) having appropriate elasticity is attached to the opening edge of a microcap (2) that is vertically movably supported by a suppression rod (1), and a brush-shaped sealing band (3) is attached inside the sealing band (3). The electrode (4) is rotatably arranged in the communication tube (5). Conductive carbon fiber (6) with flexible conductive disk (
7) to prepare a brush-like electrode (4).
連通管（５）からの電解液の流出入を容易にすべくブラ
シ中央をあけたドーナツ形状のブラシ状の電極（４）が
好ましい。このブラシ状の電極（４）を陰極に接続し、
陽極プレート（８）をマイクロキャップ（２）内に配置
する。A doughnut-shaped brush electrode (4) with an opening in the center of the brush is preferred to facilitate the inflow and outflow of the electrolyte from the communication tube (5). Connect this brush-like electrode (4) to the cathode,
Place the anode plate (8) inside the microcap (2).
（作用）
第２図のプリント基板（９）中央のボンディング個所＜
１１の孤立した導電体ｑυを金メッキするには、このボ
ンディング個所（点線で囲んだ領域）にマイクロキャッ
プ（２）を押し当て、連通管（５）を通して電解液をマ
イクロキャップ（２）内に圧送する。マイクロキャップ
（２）とプリント基板（９）とで区画された浴槽内に電
解液が充填されると、連通管（５）を回動し、一体のブ
ラシ状の電極（４ンを浴槽内で回動させる。カーボンフ
ァイバー（６）の先端部が導電体ａυを軽く撫でるよう
にゆっくりとブラシ状の電極（４）が回動するため、孤
立した多数の導電体αυは確実にカーボンファイバー（
６）に当接し、その接触している間に金メッキ処理され
る。一定時間このブラシ状の電極（４）は回動し続け、
導電体０υ表面に光分なメッキ皮膜が形成された時点で
停止し、電解メッキを終了する。(Function) The bonding point in the center of the printed circuit board (9) in Figure 2 <
To gold plate the 11 isolated conductors qυ, press the microcap (2) against this bonding point (area surrounded by dotted lines), and pump the electrolyte into the microcap (2) through the communication tube (5). do. When the bath divided by the microcap (2) and the printed circuit board (9) is filled with electrolyte, the communication tube (5) is rotated and the integrated brush-shaped electrode (4) is inserted into the bath. The brush-like electrode (4) rotates slowly so that the tip of the carbon fiber (6) lightly strokes the conductor aυ, so that the many isolated conductors αυ are reliably removed from the carbon fiber (
6), and is plated with gold while in contact. This brush-shaped electrode (4) continues to rotate for a certain period of time,
The electrolytic plating is stopped when a light-strength plating film is formed on the surface of the conductor 0υ, and the electrolytic plating is completed.
浴槽内の電解液を連通管（５）にて吸引し、マイクロキ
ャップ（２）をプリント基板（９）より離す。The electrolyte in the bathtub is sucked through the communication tube (5), and the microcap (2) is separated from the printed circuit board (9).
（他の実施例）
第３図のブラシ状の電極（４）は、細断したカーボンフ
ァイバー（６）を導電性の支持台αつに植設したもので
、マイクロキャップ（２）内で矢印方向に移動するか、
あるいは回動する。電解液の圧送と吸引はブラシ状の電
極（４）と一体の連通管（５）でなく、別の連通管をマ
イクロキャップ（２）に取りつけても良い。ブラシ状の
電極（４）材料としては、カーボンファイバー（６）に
限定されるものでなく、適度の可とう性を有する導電性
繊維であれば良く、また、メッキ金属がカーボンファイ
バー（６）等の電極表面に沈着するのを防ぐには、離型
性の良い材料を繊維表面にコーティングする。(Other Examples) The brush-shaped electrode (4) shown in Fig. 3 is made by planting shredded carbon fiber (6) on a conductive support stand, and the brush-like electrode (4) shown in FIG. move in the direction or
Or rotate. For pressure feeding and suction of the electrolytic solution, instead of using the communication tube (5) integrated with the brush-like electrode (4), a separate communication tube may be attached to the microcap (2). The brush-shaped electrode (4) material is not limited to carbon fiber (6), but any conductive fiber with appropriate flexibility may be used, and the plated metal may be carbon fiber (6), etc. To prevent this from depositing on the electrode surface, coat the fiber surface with a material that has good mold releasability.
（効果）
要するに、本発明はプリント基板（９）のメッキすべき
局所に押しつけられて浴槽を区画するマイクロキャップ
（２）と、このマイクロキャップ（２）内に電解液を圧
送する連通管（５）と、プリント基板（９）表面を撫で
るようにブラシ状の電極（４）を回動自在に配置したた
め、ボンディング個所Ｑｌのようなプリント基板（９）
の局所を電解メッキすることができ、その局所に存する
孤立した導電体αυのみを確実にメッキすることができ
る。(Effects) In short, the present invention includes a microcap (2) that is pressed against a portion of a printed circuit board (9) to partition a bathtub, and a communication pipe (5) that pumps an electrolyte into this microcap (2). ), and the brush-shaped electrode (4) is rotatably arranged so as to stroke the surface of the printed circuit board (9), so that the printed circuit board (9) like the bonding point Ql
It is possible to electrolytically plate only the isolated conductor αυ existing in that local area.
図面は本発明実施の一例を示すものにして、第１図は一
部切り欠き斜視図、第２図は電解メッキすべきプリント
基板の平面図、第３図は他のブラシ状の電極の斜視図で
ある。
２・・・・マイクロキャップ ４・・・・電
極５・：・・連 通 管 ６・・・・カーボン
ファイバー９・・・・プリント基板 １１・・・・
導 電体特許出願人 有限会社相模商会
第２図
ソ
第３図
「−〇The drawings show an example of the implementation of the present invention, and FIG. 1 is a partially cutaway perspective view, FIG. 2 is a plan view of a printed circuit board to be electrolytically plated, and FIG. 3 is a perspective view of another brush-shaped electrode. It is a diagram. 2... Micro cap 4... Electric
Pole 5...Communication tube 6...Carbon fiber 9...Printed circuit board 11...
Conductor patent applicant Sagami Shokai Co., Ltd. Figure 2 So Figure 3 “-〇
Claims (4)
れて浴槽を区画するマイクロキャップと、このマイクロ
キャップ内に電解液を圧送する連通管と、プリント基板
等の表面を撫でるように回動あるいは移動自在に配置さ
れたブラシ状の電極とを有する、孤立した導電体の局所
電解メッキ装置。(1) A microcap that is pressed against the area to be plated on a printed circuit board, etc. to divide the bath, and a communication tube that pumps the electrolyte into this microcap, rotates or moves to stroke the surface of the printed circuit board, etc. A local electrolytic plating device for isolated conductors, having freely arranged brush-like electrodes.
、特許請求の範囲第１項記載の孤立した導電体の局所電
解メッキ装置。(2) A local electrolytic plating apparatus for isolated conductors according to claim 1, wherein a brush-like electrode is made of carbon fiber.
ブラシ状の電極を内蔵するマイクロキャップを押接し、
区画される槽内に電解液を供給し、陰極に接続されるブ
ラシ状の電極を回動あるいは移動してブラシ先端部をメ
ッキすべき導電体に当接し、金やニッケル等のメッキ皮
膜を導電体表面に形成し、マイクロキャップ内の電解液
を吸引し、プリント基板よりこのマイクロキャップを離
す、孤立した導電体の局所電解メッキ法。(3) Locally on a printed circuit board with an isolated conductor,
A microcap with a built-in brush-like electrode is pressed into contact with the
Electrolyte is supplied into the divided tank, and the brush-like electrode connected to the cathode is rotated or moved so that the tip of the brush comes into contact with the conductor to be plated, making the plating film of gold, nickel, etc. conductive. A local electrolytic plating method for isolated conductors that is formed on the body surface, attracts the electrolyte in the microcaps, and separates the microcaps from the printed circuit board.
、特許請求の範囲第３項記載の孤立した導電体の局所電
解メッキ法。(4) The local electrolytic plating method for isolated conductors according to claim 3, wherein a brush-like electrode is made of carbon fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13681587A JPS63297587A (en) | 1987-05-29 | 1987-05-29 | Local electrolytic plating method for isolated electric conductor and its equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13681587A JPS63297587A (en) | 1987-05-29 | 1987-05-29 | Local electrolytic plating method for isolated electric conductor and its equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63297587A true JPS63297587A (en) | 1988-12-05 |
Family
ID=15184152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13681587A Pending JPS63297587A (en) | 1987-05-29 | 1987-05-29 | Local electrolytic plating method for isolated electric conductor and its equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63297587A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0458863A1 (en) * | 1989-02-15 | 1991-12-04 | KADIJA, Igor V. | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| WO1999052336A1 (en) * | 1998-04-06 | 1999-10-14 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| WO2004072330A2 (en) * | 2003-02-14 | 2004-08-26 | Technology Development Associate Operations Ltd | Electro-plating method and apparatus |
| US6939447B2 (en) | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
-
1987
- 1987-05-29 JP JP13681587A patent/JPS63297587A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0458863A1 (en) * | 1989-02-15 | 1991-12-04 | KADIJA, Igor V. | Method and apparatus for manufacturing interconnects with fine lines and spacing |
| WO1999052336A1 (en) * | 1998-04-06 | 1999-10-14 | John Michael Lowe | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| US6939447B2 (en) | 1998-04-06 | 2005-09-06 | Tdao Limited | Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| WO2004072330A2 (en) * | 2003-02-14 | 2004-08-26 | Technology Development Associate Operations Ltd | Electro-plating method and apparatus |
| WO2004072330A3 (en) * | 2003-02-14 | 2004-12-02 | Technology Dev Associate Opera | Electro-plating method and apparatus |
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