JPS6315100B2 - - Google Patents
Info
- Publication number
- JPS6315100B2 JPS6315100B2 JP13006481A JP13006481A JPS6315100B2 JP S6315100 B2 JPS6315100 B2 JP S6315100B2 JP 13006481 A JP13006481 A JP 13006481A JP 13006481 A JP13006481 A JP 13006481A JP S6315100 B2 JPS6315100 B2 JP S6315100B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grinding wheel
- grinding
- finish
- rough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007246 mechanism Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13006481A JPS5834751A (ja) | 1981-08-21 | 1981-08-21 | ウエハ研削盤 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13006481A JPS5834751A (ja) | 1981-08-21 | 1981-08-21 | ウエハ研削盤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5834751A JPS5834751A (ja) | 1983-03-01 |
JPS6315100B2 true JPS6315100B2 (sv) | 1988-04-02 |
Family
ID=15025147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13006481A Granted JPS5834751A (ja) | 1981-08-21 | 1981-08-21 | ウエハ研削盤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5834751A (sv) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59232758A (ja) * | 1983-06-13 | 1984-12-27 | Matsushita Electric Ind Co Ltd | 球面加工装置 |
JPS6044206A (ja) * | 1983-08-19 | 1985-03-09 | Kitamura Kikai Kk | 多軸立型フライス盤における工具長調整装置 |
JPS6076959A (ja) * | 1983-09-30 | 1985-05-01 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS60242951A (ja) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | 面取り加工システム |
JPS60242953A (ja) * | 1984-05-17 | 1985-12-02 | Matsushita Electric Ind Co Ltd | 面取り加工装置 |
JP4808278B2 (ja) * | 1999-01-06 | 2011-11-02 | 株式会社東京精密 | 平面加工装置及び方法 |
JP4455750B2 (ja) * | 2000-12-27 | 2010-04-21 | 株式会社ディスコ | 研削装置 |
-
1981
- 1981-08-21 JP JP13006481A patent/JPS5834751A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5834751A (ja) | 1983-03-01 |
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