JPS63139718A - Sandwich molding method for resin molded form - Google Patents
Sandwich molding method for resin molded formInfo
- Publication number
- JPS63139718A JPS63139718A JP28624386A JP28624386A JPS63139718A JP S63139718 A JPS63139718 A JP S63139718A JP 28624386 A JP28624386 A JP 28624386A JP 28624386 A JP28624386 A JP 28624386A JP S63139718 A JPS63139718 A JP S63139718A
- Authority
- JP
- Japan
- Prior art keywords
- core
- cavity
- movable pin
- skin
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 29
- 239000011347 resin Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 27
- 239000011162 core material Substances 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000012792 core layer Substances 0.000 claims abstract description 31
- 238000002347 injection Methods 0.000 claims abstract description 30
- 239000007924 injection Substances 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims abstract description 19
- 239000011800 void material Substances 0.000 abstract description 4
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 238000012805 post-processing Methods 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- VNWKTOKETHGBQD-YPZZEJLDSA-N carbane Chemical compound [10CH4] VNWKTOKETHGBQD-YPZZEJLDSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1642—Making multilayered or multicoloured articles having a "sandwich" structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は樹脂成形方法、特に表面を覆うスキン層と、導
電性の芯を形成するコア層とからなる樹脂成形品を成形
するサンドイッチ成形方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a resin molding method, and particularly to a sandwich molding method for molding a resin molded product consisting of a skin layer covering the surface and a core layer forming a conductive core. It is something.
従来、スキン層とコア層とから成る樹脂成形品を形成す
るサンドイッチ成形方法については、例えば特公昭50
−28464号公報に記載されている方法が知られてい
る。これは所望する例えばカメラの鏡筒部材を成形する
金型の空隙(キャビティ)内に、先ず該鏡筒の表面層を
形成するスキン材を注入し、次に芯層を形成するコア材
を注入することによって、スキン層とコア層とから成る
サンドイッチ成形品を得る方法である。Conventionally, a sandwich molding method for forming a resin molded product consisting of a skin layer and a core layer has been described, for example, in Japanese Patent Publication No. 50
A method described in Japanese Patent No. 28464 is known. This is done by first injecting the skin material that will form the surface layer of the lens barrel into the cavity of a mold for molding a desired camera lens barrel member, and then injecting the core material that will form the core layer. In this method, a sandwich molded product consisting of a skin layer and a core layer is obtained.
前記方法において、例えば、スキン層のために絶縁性の
樹脂材料を用い、他方コア層のために導電性フィラーあ
るいは箔を混入した導電性樹脂材料を用いることで、コ
ア層により電極波の発性及び吸収による障害をなくすと
共に、スキン層によシ表面の絶縁性は保たれるという効
果がある成品が得られる。In the above method, for example, by using an insulating resin material for the skin layer and using a conductive resin material mixed with conductive filler or foil for the core layer, the core layer can generate electrode waves. A product can be obtained that has the effect of eliminating problems caused by absorption and maintaining the insulation properties of the surface of the skin layer.
しかしながら前記方法によって成形された成形品は、表
面府会てがスキン材で覆われることになる為、例えばコ
ア層への部分的な電気的導通をとりたい場合において、
成形後、切削加工等によシ成形品に穴をあけるか、ある
いはスキン材を除去加工し、コア層を露出させることが
必要となる。このために成形品の外観をそこない、また
後加工によシコストが高くなるという問題を招ていた。However, since the surface of the molded product molded by the above method is covered with a skin material, for example, when it is desired to establish partial electrical conduction to the core layer,
After molding, it is necessary to make a hole in the molded product by cutting or the like, or to remove the skin material to expose the core layer. This has caused problems such as deteriorating the appearance of the molded product and increasing the cost of post-processing.
そこで成形時において所望の部分にコア層が露出出来る
ようにした後加工不要の成形法が望まれていた。Therefore, there has been a desire for a molding method that allows the core layer to be exposed in desired areas during molding and does not require post-processing.
本発明は前記従来例の欠点を除去した新規な成形方法を
提供するものであシ、具体的には、サンドイッチ成形方
法においてその成形時に、成形品の所望の部分でコア層
を露出させることを可能としたサンドイッチ成形方法を
提供することを目的とする。The present invention provides a novel molding method that eliminates the drawbacks of the conventional examples. Specifically, in the sandwich molding method, during molding, the core layer is exposed at a desired portion of the molded product. The purpose of the present invention is to provide a sandwich forming method that makes it possible to form a sandwich.
而して上記目的の実現のためになされた本発明よシなる
樹脂成品のサンドイッチ成形方法の特徴は、サンドイッ
チ成形品成形用の金型を用いて、表面の非導電性スキン
層と肉厚内部の導電性のコア層とを有する樹脂成形品を
成形する成形方法において、上記金型内部の成形用キャ
ビティを画する該金型内面の一部に該キャビティに対し
突出、後退可能の可動ピンを設けて一成形のスキン材注
入及びこれに続くコア材注入に際し、該キャビティの厚
み方向隙間を制限して注入材料の流入を排除する領域を
形成するために上記可動ピンをキャビティ内に突出させ
−次いで注入された上記スキン材の流動性が失われる面
に、上記突出した可動ピンをキャビティ内から後退させ
ると共に上記コア材を注入するように結成したところに
ある。The feature of the sandwich molding method for resin products according to the present invention, which has been made to achieve the above object, is that a non-conductive skin layer on the surface and a thick inner layer are formed using a mold for molding sandwich molded products. In the molding method for molding a resin molded product having a conductive core layer, a movable pin that can protrude and retract with respect to the mold cavity is provided on a part of the inner surface of the mold that defines a molding cavity inside the mold. The movable pin is made to protrude into the cavity in order to form a region in which the gap in the thickness direction of the cavity is limited and the inflow of the injection material is excluded during injection of the skin material and subsequent injection of the core material. Next, the protruding movable pin is retreated from the cavity and the core material is injected into the surface where the injected skin material loses its fluidity.
上記において、金型内部のキャビティに対し突出、後退
される可動ピンは中央棒状のものであってもよいし、あ
るいはキャビティ内に突出固定された固定ピンに滑合さ
れた筒状のものであってもよく、後者では固定ピンの部
分が孔開きとされた成形品を得ることができる。In the above, the movable pin that protrudes and retreats from the cavity inside the mold may be a central rod-shaped one, or a cylindrical one that is slidably fitted to a fixed pin that protrudes and is fixed in the cavity. In the latter case, it is possible to obtain a molded product having a hole in the fixing pin portion.
本発明において、スキン材の注入、コア材の注入これに
次ぐ可動ピンのキャビティからの後退のタイミングは、
該可動ピンの後退により形成される空所に対し、コア材
は十分に流入するがスキン材は流入しないという関係を
満足するように設定されるが、具体的には例えば、スキ
ン材としてポリカーデネート、コア材として、カーボン
ファイバーとアルミファイドを4対1の割合で計40%
混入したポリカーがネート材を用い、ダートから可動ピ
ン迄の流動長が10〜SOWの範囲にある場合、スキン
材注入速度を1〜10 m/sとすると(スキン材樹脂
温度300〜330℃、金型温度80〜130℃とする
。)スキン材注入時可動シンの形成する空隙は、0.4
〜0.8問に維持し、スキン材注入完了後、0.6〜1
.5 s@a以内にコア材を注入する。In the present invention, the timing of the retraction of the movable pin from the cavity after the injection of the skin material and the injection of the core material is as follows:
The space formed by the retraction of the movable pin is set to satisfy the relationship that the core material flows sufficiently but the skin material does not flow. Specifically, for example, polycarbonate is used as the skin material. Carbon fiber and aluminiumide are used as core materials at a ratio of 4:1 for a total of 40%.
When the mixed polycarbon is a nate material and the flow length from the dart to the movable pin is in the range of 10 to SOW, and the skin material injection speed is 1 to 10 m/s (skin material resin temperature 300 to 330 ° C, The mold temperature is 80 to 130°C.) The void formed by the movable thin when injecting the skin material is 0.4
- Maintained at 0.8 questions, after completion of skin material injection, 0.6-1
.. Inject the core material within 5 s@a.
この時可動ピンは、コア材注入開始から、0.1〜0.
3秒以内に、後退を開始する。コア材注入完了と#I
J’!’同時に、可動ピンの後退が完了する。At this time, the movable pin moves from 0.1 to 0.0 from the start of core material injection.
Begin reversing within 3 seconds. Core material injection completed and #I
J'! 'At the same time, the retraction of the movable pin is completed.
以下本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第1図は、本発明の方法によシ成形されて、肉厚内芯部
に導電性のコア層を形成させた場合の鏡筒りを含むカメ
2鏡筒部の構造概要を示したものであシ、第8図はサン
ドイツチ法によらない従来法に従って一材質によシ鏡筒
等を成形した場合のカメラ鏡筒部の構造を示している。Fig. 1 shows a structural outline of the camera 2 lens barrel including the lens barrel when molded by the method of the present invention and a conductive core layer is formed in the thick inner core. FIG. 8 shows the structure of a camera lens barrel when the lens barrel is molded from a single material according to a conventional method other than the Sand-Deutsch method.
これら第1図・及び第8図により本発明方法により成形
されて肉厚部内に導電性のコア層を有する成形品の作用
につき、まず概略説明する。Referring to FIGS. 1 and 8, the function of a molded product formed by the method of the present invention and having a conductive core layer in its thick portion will first be briefly described.
第8図は本発明を適用するに好適なレンズ鏡筒の構造を
示し、この第8図に示すように合焦レンズL、#変倍し
ンズLse補正レンズL。FIG. 8 shows the structure of a lens barrel suitable for applying the present invention, and as shown in FIG. 8, a focusing lens L, #variable lens Lse correction lens L.
及び結像レンズL、を有する構成において、合焦レンズ
Llは合焦レンズホルダ1に保持され、この合焦し/ズ
ホルダ1はレンズ固定鏡筒2とへリフイド結合によって
連結され、合焦レンズホルダ1を回転することによシ合
焦レンズL8を光軸方向に繰シ出すようになされている
。and an imaging lens L, the focusing lens Ll is held in a focusing lens holder 1, and this focusing lens holder 1 is connected to a lens fixed lens barrel 2 by a heliphide coupling, and the focusing lens Ll is held in a focusing lens holder 1. By rotating the focusing lens L8, the focusing lens L8 is extended in the optical axis direction.
また、変倍レンズL、と補正レンズL、は、それぞれレ
ンズホルダ3、レンズホルダ44C保持され、これらの
レンズホルダ3、レンズホルダ4は周知の3本パ一方式
によυガイドバー5等に案内されて光軸方向に移動でき
るようになってイル。変倍レンズL3と補正レンズL1
の光軸方向の可動量は、レンズ固定鏡筒2に回転自在に
保持されているカム環6に設けられたカムリフ ) 6
a e 6 bによって制御される。カム環Gはレン
ズ固定鏡筒2の外周に嵌合されたズーム操作環7の回転
動作に応じて、カム環6に植設された運動軸8と連動し
て回転するようになっている噛また、結像レンズL、は
絞シ12を介して結像レンズホルダ13によシ後部のリ
レーホルダー14内に保持され、ビス15によりて固定
されている。Further, the variable magnification lens L and the correction lens L are held in a lens holder 3 and a lens holder 44C, respectively, and these lens holders 3 and 4 are attached to the υ guide bar 5 etc. by a well-known three-way system. It is now possible to be guided and move in the direction of the optical axis. Variable magnification lens L3 and correction lens L1
The amount of movement in the optical axis direction is determined by a cam rift provided in a cam ring 6 that is rotatably held on the fixed lens barrel 2.
Controlled by a e 6 b. The cam ring G rotates in conjunction with a movement shaft 8 implanted in the cam ring 6 in accordance with the rotation of the zoom operation ring 7 fitted on the outer periphery of the lens fixed barrel 2. In addition, the imaging lens L is held in a relay holder 14 at the rear of the imaging lens holder 13 through an aperture 12, and is fixed with screws 15.
カム環6はレンズ固定鏡筒2の内部で3本のガイドバー
5を保持する前側マスク板8、後側マスク板9とにより
て挾まれている。The cam ring 6 is held between a front mask plate 8 and a rear mask plate 9 that hold three guide bars 5 inside the lens fixed barrel 2.
第1図は、本発明のサンドインチ成形品を前記第8図の
レンズ鏡筒にそのまま適用した場合の断面図であシ、こ
の例では固定鏡筒2.中継筒18.リレーホルダー14
が各々サンドインチ成形されている。なお、本実施例に
おいて、スキン層には例えばPC(ポリカーがネート)
樹脂を、またコア層にはPC樹脂中にカーがンファイバ
ーを401混入させた樹脂を用いることができるが、ス
キン層材料としてはこの他に、POM (ポリアセター
ル)樹脂、変性ppo (ポリフェニレンオキサイド)
樹脂、 AB8樹脂、 PBT(/リプテレンテレフタ
レート)樹脂等を例示でき、又コア層材料の導電性充填
物質としてAtのファイバー又はフレーク、真ちゅうフ
ァイバー、ガラス繊維に表面導電コートしたもの等を例
示することができる。FIG. 1 is a sectional view of the sandwich molded product of the present invention applied as is to the lens barrel shown in FIG. 8, and in this example, the fixed lens barrel 2. Relay tube 18. Relay holder 14
Each sandwich is inch molded. In this example, the skin layer is made of, for example, PC (polycarbonate).
For the core layer, a resin made by mixing carbon fiber 401 in PC resin can be used, but as the skin layer material, POM (polyacetal) resin, modified PPO (polyphenylene oxide) can also be used.
Examples include resins, AB8 resins, PBT (lipterene terephthalate) resins, etc., and examples include At fibers or flakes, brass fibers, glass fibers coated with surface conductivity as the conductive filler material of the core layer material. I can do it.
第1図の例においては、各部材の導電性のコア層の導通
をとる為に、固定鏡筒2と、中継筒18とは17ピスに
よシ固定導通され、また中継筒18とリレーホルダー1
4とは19ビスにより固定・導通されている。In the example shown in FIG. 1, the fixed lens barrel 2 and the relay barrel 18 are fixedly electrically connected through 17 pins in order to conduct the conductive core layers of each member, and the relay barrel 18 and the relay holder 1
4 and is fixed and electrically connected with 19 screws.
これによシ、鏡筒内部及び16マウントホルダ近傍の電
子部品及び回路(いずれも図示せず)は、電磁波障害か
ら守られることとなる。As a result, electronic components and circuits (none of which are shown) inside the lens barrel and near the mount holder 16 are protected from electromagnetic interference.
第2図(1)、第2図6)は、本例における固定鏡筒2
と中継筒18及びビス17の結合部分の断面拡大図であ
シ、これらの図から分かるように、固定鏡筒2のビス止
め用下穴33において、ビス17のネジ山かかん合する
部分32のスキン膜厚り、は、ビス17のネジ山高さh
8よシも小さく設定しておくことで、ビス17の嵌合螺
着時に該ビスによシセル7タップされ、螺着結合した時
にビスのネジ山部には導電性のコア材2aが接するよう
にしておくことができる。また本例の中継筒18は、ビ
ス17が貫通嵌合する孔部周辺の面31a*31bで、
導電性のコア層を露出させ、ビス止めによシ接合する面
31m及び31bを介してビスと中継筒との導通がとれ
るようにしている。中継f418とリレーホルダー14
の間も前記と同様にして導通がとられるようになってい
る。Figure 2 (1) and Figure 2 6) show the fixed lens barrel 2 in this example.
1 is an enlarged cross-sectional view of the connecting portion of the relay tube 18 and the screw 17. As can be seen from these figures, the screw thread of the screw 17 and the engaging portion 32 of the screw fixing pilot hole 33 of the fixed lens barrel 2 are The skin film thickness is the thread height h of screw 17.
By setting the width smaller than 8, when the screw 17 is fitted and screwed, the cell 7 is tapped by the screw, and the conductive core material 2a is in contact with the threaded part of the screw when the screw is screwed together. You can leave it as In addition, the relay tube 18 of this example has a surface 31a*31b around the hole where the screw 17 is fitted through,
The conductive core layer is exposed so that electrical conduction can be established between the screw and the relay cylinder through the surfaces 31m and 31b that are joined by the screw. Relay f418 and relay holder 14
Conductivity is maintained between the two in the same manner as described above.
次ぎに上記部材の成品について詳しく述べる。Next, the product of the above member will be described in detail.
第4図(1)は本発明方法に用いる成形装置を示した図
であシ、41はスキン材射出シリンダー、42はコア材
射出シリンダー、43は固定側取付板、44は固定板、
45はランナーグレート、46は型板、47は可動側固
定板、48はを板中に設けられた成形品を成形する!2
vj(キャビティ)、41aはスキンスゲルー、42m
はコアスグルー%41bはスキンスプルーとコアスプル
ーを継ぐパイノJ?スランナー、42bはランナー、4
9tj:可動ピンユニットである。FIG. 4(1) is a diagram showing a molding apparatus used in the method of the present invention, 41 is a skin material injection cylinder, 42 is a core material injection cylinder, 43 is a fixed side mounting plate, 44 is a fixed plate,
45 is a runner grate, 46 is a template, 47 is a movable side fixed plate, and 48 is for molding the molded product provided in the plate! 2
vj (cavity), 41a is skins gel, 42m
Is Cores Glue %41b a Pineo J that inherits skin sprue and core sprue? Srunner, 42b is runner, 4
9tj: Movable pin unit.
fJ、4図(b)は可動ピンユニット断面図であシ、4
には可動ピン制御用バネ、49Cは、可動ピンによシ作
られる空隙Tを制御するスイーサーである。第4図(b
)に示す可動ピンは、スキン材注入時は、バネ4にとス
R−サ49cにより決まる空隙tを維持しており(スキ
ン材注入時は、内部圧力はほぼ0)ひき続いてコア材を
注入し、キャビティが満たされ始めると、樹脂に圧力が
発生する為、コア材の樹脂圧力によりスライドピン49
mがバネ4kを押し上げ始め、完全に充填する。fJ, 4 (b) is a cross-sectional view of the movable pin unit, 4
49C is a spring for controlling the movable pin, and 49C is a sweeter for controlling the gap T created by the movable pin. Figure 4 (b
The movable pin shown in ) maintains the gap t determined by the spring 4 and the spacer 49c when the skin material is injected (the internal pressure is almost 0 when the skin material is injected), and then the core material is injected. When the cavity begins to be filled with resin, pressure is generated in the resin, so the slide pin 49
m begins to push up spring 4k, filling it completely.
また、第4図(c)は、スライドピン49&を、エアシ
リンダ411によシ強制的に可動させるタイプのものの
構造を示している。Further, FIG. 4(c) shows a structure of a type in which the slide pin 49& is forcibly moved by an air cylinder 411.
このような装置において、まずはじめにスキン材射出シ
リンダ41よシスキン材がスキンスフ’/I/ −41
a 、パイノ臂スランナー41b、:!7スプA/−4
2m、ランナー42bを通じ、上記キャビティ48内へ
適量注入される。次にコア劇射出シリンダ42よシ、コ
アスプルー421゜ランナー42bを通じて、前記先に
注入されたスキン材を押し広げつつコア材をキャビティ
内48へ注入させて該キャビティ内を完全に満たし、サ
ンドイッチ成形品が成形される。In such a device, first of all, the skin material is injected into the skin material injection cylinder 41 through the skin material injection cylinder 41.
a, Pine-arm Srunner 41b, :! 7 sp A/-4
2m, and an appropriate amount is injected into the cavity 48 through the runner 42b. Next, the core material is injected into the cavity 48 through the core sprue 421 and the runner 42b through the core injection cylinder 42 and the core sprue 421 while spreading out the previously injected skin material to completely fill the cavity and produce a sandwich molded product. is formed.
次いでコア材注入後、該スキン材の流動性が失なわれる
前に、可動ピン49&をキャビティ48内から後退させ
、この後退によ多形成される空所にスキン材の層を破っ
てコア材を流入させて、所望のコア露出部を形成させる
ことができる。Next, after injecting the core material, before the skin material loses its fluidity, the movable pin 49& is retracted from the cavity 48, and the layer of the skin material is broken into the void formed by this retraction, and the core material is injected into the cavity. can be allowed to flow in to form a desired core exposed portion.
第5図(a)、第5図(b)はこのよ・うな可動ピン部
分及びその動きを説明するための拡大断面図である。FIGS. 5(a) and 5(b) are enlarged sectional views for explaining such a movable pin portion and its movement.
第5図(a)において、コア材の注入後適当時間の経過
迄は、可動ピン49aは固定ピン49bと摺動面5&で
接して空隙TIの間隔をあけたit静止されている。そ
して上記スキン材注入後、コア材注入と同時又は、0.
6〜1.5s@e経過後、第5図(b)に示すように、
可動ピン49&を固定ピン49bにガイドされつつ適当
な空隙量T、になる迄移動させ、静止させる。この可動
ピンの動きによシ、第5図(a)の状態では、可動ピン
の近彷に流れて来たスキン材は、空隙が狭く流動抵抗が
大きいために空隙を満たせずに他の流動抵抗の小さい部
分(略)へ流れていくが、¥5図(b)のように、可動
ピンを移動し、空隙を広げた後は該部分のコア材の流動
抵抗が減ってコア材が注入され、先に可動ピンの近傍に
少量注入されたスキン材を押し破シ、コア材が露出され
る部分を形成する。In FIG. 5(a), the movable pin 49a is in contact with the fixed pin 49b at the sliding surface 5&, and remains at rest with an interval TI between the movable pins 49a and the fixed pins 49b until a suitable period of time has elapsed after the injection of the core material. After injecting the skin material, at the same time as injecting the core material, or at 0.
After 6~1.5s@e, as shown in Figure 5(b),
The movable pin 49& is moved while being guided by the fixed pin 49b until an appropriate gap amount T is reached, and then held still. Due to this movement of the movable pin, in the state shown in Fig. 5(a), the skin material that has flowed near the movable pin cannot fill the void because the gap is narrow and the flow resistance is large, and other flow The flow will flow to the part with low resistance (omitted), but after moving the movable pin and widening the gap as shown in Figure (b), the flow resistance of the core material in that part will decrease and the core material will be injected. The skin material, which was previously injected in a small amount near the movable pin, is pushed and broken to form a portion where the core material is exposed.
実施例
スキン材 11?リカーゲネート
コア材 ポリカーがネート(カーがンファイバー30チ
、アルミファイバー10
チ含有)
スキン材樹脂温 320℃
コア材樹脂温 330℃
金型温度 110℃
スキン材射出速度 10%/3・C注入時間 Q、5s
ecコア材射出速度 3%/易・C注入時間 1.
8sec可動ピン可動開始時間 コア材注入開始後0.
4S・C可動ピン可動完了 1 1
.0sec可動ピン作動源 エアーシリンダー
スキン材注入時樹脂圧力 3 K4f /cm”コ
ア材 1 950Kff/cIn”以上に
よってサンドイッチ構造の成形品が成形された。Example skin material 11? Licargenate core material Polycarbonate (contains 30% carbon fiber and 10% aluminum fiber) Skin material resin temperature 320℃ Core material resin temperature 330℃ Mold temperature 110℃ Skin material injection speed 10%/3・C injection Time Q, 5s
EC core material injection speed 3%/Easy C injection time 1.
8sec movable pin movement start time 0.
4S/C movable pin movement completed 1 1
.. 0 sec movable pin operating source Air cylinder Resin pressure during injection of skin material 3 K4f/cm Core material 1 950 Kff/cIn A sandwich structure molded product was molded.
第6図は、前記よシ成形された成形品の可動ピン近傍の
断面図を示し、45mはスキン層。FIG. 6 shows a cross-sectional view of the movable pin vicinity of the above-mentioned well-molded product, and 45 m is a skin layer.
6bはコア層、61.62.63はコア材露出部を示し
ている。6b indicates a core layer, and 61, 62, and 63 indicate exposed portions of the core material.
本実施例では鏡筒部材を用いたが、複写機。In this embodiment, a lens barrel member was used, but the lens barrel member was used in a copying machine.
ワープロ、電卓、コンビ島−夕等のノーウジングに適用
する事も同様の方法によシ成形できる。Applications to word processors, calculators, kombi islands, etc. can also be molded using the same method.
第7図(a)〜(e)は、他の実施例を示し、この例で
は成形品の表裏面でコア層を露出させるようにしている
。FIGS. 7(a) to 7(e) show another embodiment, in which the core layer is exposed on the front and back surfaces of the molded product.
すなわち、この例では、中央棒状の可動ピン71が、ス
キン材注入に続いてコア材注入後適当時間経過後上記実
施例と同様にして第7図(b)。That is, in this example, the central bar-shaped movable pin 71 is moved in the same manner as in the above embodiment after an appropriate time has elapsed after the injection of the skin material and the injection of the core material, as shown in FIG. 7(b).
第7図(、)の状態へと移動され、前記第5図と同様の
充填態様により、第7図(C)のように、72゜73表
裏面でコア層が露出された成形品となる。The molded product is moved to the state shown in Fig. 7 (,), and the core layer is exposed on the front and back surfaces at 72° and 73°, as shown in Fig. 7 (C), by the same filling method as shown in Fig. 5. .
第7図によ抄成形された成形品は、アースを取ったシ、
あるいは、ビスを用いず、面同志の接合によシ導通を計
るのに非常に有効である。The molded product shown in Fig. 7 has a grounded surface.
Alternatively, it is very effective to measure conductivity by joining surfaces together without using screws.
以上説明したように、サンドイッチ成形する際に用いる
金型において、導通あるいはアースを取りたい成形品の
所望の部分に、可動ピンを設け、樹脂注入中の適当な時
間経過後、上記可動ピンを移動させる事によシ、スキン
層とコア層とからなるサンドイッチ成形品の所定の部分
でコア層を露出させることが出来、その結果従来行なわ
れていたようなコア層を部分的に露出する為に穴あけ、
切削除去等する後加工が不要となシ、外観が美しく、成
形後の加工が不要なサンドイッチ成形品を提供する事が
可能となった。As explained above, in the mold used for sandwich molding, a movable pin is provided at the desired part of the molded product where continuity or grounding is desired, and the movable pin is moved after an appropriate amount of time has elapsed during resin injection. By doing so, it is possible to expose the core layer at a predetermined portion of a sandwich molded product consisting of a skin layer and a core layer, and as a result, it is possible to expose the core layer partially, unlike the conventional method. drilling,
It has become possible to provide a sandwich molded product that does not require post-processing such as cutting and removing, has a beautiful appearance, and does not require post-molding processing.
図面第1図は本発明方法により形成されたスキン層及び
コア層の2Mを有する成形品を用いて構成されたカメラ
のレンズ鏡筒の一例構造を示す断面図、第2図は上記2
Mを有する部材同士の導電性を保った結合部の構造を説
明するための結合前の状態を示した図、第3図は同第2
図の結合後の状態を示した図、第4図(a)は本発明方
法に使用される金型装置の一例の構造概悶を示した断面
図、第4図(b) 、 (e)は夫々可動ピンユニット
の構造を示した図、第5図(a) # (b)は第4図
(a)に示した金型装置の可動ピンの動きを説明するた
めの図、第6図は第5図装置により成の他の例の可動ピ
ンの動きを説明するための図、第8図はコア層を有しな
い成形品を用いて構成されたカメラのレンズ鏡筒の一例
構造を示す断面図である。
1・・・合焦レンズホルダ2・・・固定鏡筒2J1・・
・コア[2b・・・スキン層3.4・・・レンズホルダ
5・・・ガイドバー6・・・カムiJ1 6
m 、 6 b ・・−カムリフト7・・・ズーム操
作環 8・・・前側マスク板9・・・後側マスク板
12・・・絞シ13・・・レンズホルダ 14・・・
リレーホルダー15・・・ビス 16・・・マ
ウントホルダ17・・・ビス 18−・・中継
筒18m・・・コア層 18b・・・スキン層19
・・・ビス 31m・・・穴内面31b・・・
穴開口周縁の面
32・・・嵌合部 33・・・ビス止め用下穴4
1・・・スキン材射出シリンダ
41a…スキンスプルー
4 l b−・・パイノ臂スランナー
42・・・コア材射出シリンダ
42m・・・コアスプルー42b・・・ランナー43・
・・固定側取付板 44・・・固定板45・・・ランナ
ープレート46・・・型板47・・・可動側固定板
48・・・キャビティ(空隙)
49・・・可動ピンユニット
61.62,63・・・コア’A露出面71・・e可動
ピン
72.73・・・コア層の表裏露出面
本多小XIr’
岸 1) 正 行
新部興愉゛璽二
1、′
谷 浩太部−〜−
第2図
第3図
第4図
(b) 49b
4ソb
第5図
第7図
第7図
(C)Figure 1 is a cross-sectional view showing an example of the structure of a camera lens barrel constructed using a molded product having a skin layer and a core layer of 2M formed by the method of the present invention, and Figure 2 is a cross-sectional view showing an example of the structure of a lens barrel of a camera constructed using a molded product having a skin layer and a core layer of 2M formed by the method of the present invention.
Figure 3 is a diagram showing the state before joining to explain the structure of the joining part that maintains conductivity between members having M.
Figure 4(a) is a sectional view showing the structural outline of an example of the mold device used in the method of the present invention, Figures 4(b) and (e) 5(a) and 5(b) are diagrams illustrating the movement of the movable pin of the mold device shown in FIG. 4(a), and FIG. 6 is a diagram showing the structure of the movable pin unit, respectively. Fig. 5 is a diagram for explaining the movement of the movable pin in another example of the apparatus, and Fig. 8 shows an example of the structure of a camera lens barrel constructed using a molded product without a core layer. FIG. 1... Focusing lens holder 2... Fixed lens barrel 2J1...
・Core [2b...Skin layer 3.4...Lens holder 5...Guide bar 6...Cam iJ1 6
m, 6 b...-Cam lift 7...Zoom operation ring 8...Front side mask plate 9...Rear side mask plate
12...Aperture 13...Lens holder 14...
Relay holder 15... Screw 16... Mount holder 17... Screw 18-... Relay tube 18m... Core layer 18b... Skin layer 19
...screw 31m...hole inner surface 31b...
Surface around the hole opening 32...Mating part 33...Prepared hole 4 for screw fixing
1...Skin material injection cylinder 41a...Skin sprue 4l b...Pine arm srunner 42...Core material injection cylinder 42m...Core sprue 42b...Runner 43.
... Fixed side mounting plate 44... Fixed plate 45... Runner plate 46... Template plate 47... Movable side fixed plate 48... Cavity (gap) 49... Movable pin unit 61.62 ,63...Core 'A exposed surface 71...e movable pin 72.73...Front and back exposed surfaces of core layer Honda Ko Part - ~ - Fig. 2 Fig. 3 Fig. 4 (b) 49b 4 so b Fig. 5 Fig. 7 Fig. 7 (C)
Claims (3)
の非導電性スキン層と肉厚内部の導電性のコア層とを有
する樹脂成形品を成形する成形方法において、上記金型
内部の成形用キャビティを画する該金型内面の一部に該
キャビティに対し突出、後退可能の可動ピンを設けて、
成形のスキン材注入及びこれに続くコア材注入に際し、
該キャビティの厚み方向隙間を制限して注入材料の流入
を排除する領域を形成するために上記可動ピンをキャビ
ティ内に突出させ、次いで注入された上記スキン材の流
動性が失われる前に、上記突出した可動ピンをキャビテ
ィ内から後退させると共に上記コア材を注入することを
特徴とするサンドイッチ成形方法(1) In a molding method for molding a resin molded product having a non-conductive skin layer on the surface and a conductive core layer inside the thickness using a mold for molding a sandwich molded product, A movable pin capable of protruding and retracting with respect to the cavity is provided in a part of the inner surface of the mold defining the molding cavity,
When injecting the skin material for molding and the subsequent core material injection,
The movable pin is projected into the cavity in order to limit the gap in the thickness direction of the cavity to form a region that excludes the inflow of the injection material, and then, before the injected skin material loses its fluidity, the above-mentioned A sandwich molding method characterized by retreating the protruding movable pin from inside the cavity and injecting the core material.
定ピンの外周を囲む筒状体を用いることを特徴とする特
許請求の範囲第(1)項記載のサンドイッチ成形方法(2) The sandwich molding method according to claim (1), characterized in that the movable pin is a cylindrical body surrounding the outer periphery of a fixed pin discharged into a cavity.
特徴とする特許請求の範囲第(1)項記載のサンドイッ
チ成形方法(3) A sandwich forming method according to claim (1), characterized in that a central rod-shaped body is used as the movable pin.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28624386A JPS63139718A (en) | 1986-12-01 | 1986-12-01 | Sandwich molding method for resin molded form |
US07/022,210 US4805991A (en) | 1986-03-13 | 1987-03-05 | Multi-layer resin molded article and method of making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28624386A JPS63139718A (en) | 1986-12-01 | 1986-12-01 | Sandwich molding method for resin molded form |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63139718A true JPS63139718A (en) | 1988-06-11 |
JPH0366136B2 JPH0366136B2 (en) | 1991-10-16 |
Family
ID=17701836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28624386A Granted JPS63139718A (en) | 1986-03-13 | 1986-12-01 | Sandwich molding method for resin molded form |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63139718A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001058369A (en) * | 1999-07-14 | 2001-03-06 | Ticona Gmbh | Conductive plastic molding |
US6555041B1 (en) | 1996-10-29 | 2003-04-29 | Kabushiki Kaisha Kobe Seiko Sho | Method of injection molding a skin layer around a core resin |
JP2010076244A (en) * | 2008-09-25 | 2010-04-08 | Panasonic Electric Works Co Ltd | Sandwich molded product and its manufacturing method |
KR20220029255A (en) * | 2020-09-01 | 2022-03-08 | 엘지전자 주식회사 | Co-injection molding apparatus, controlling method thereof and co-injection product |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7692263B2 (en) | 2006-11-21 | 2010-04-06 | Cree, Inc. | High voltage GaN transistors |
-
1986
- 1986-12-01 JP JP28624386A patent/JPS63139718A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555041B1 (en) | 1996-10-29 | 2003-04-29 | Kabushiki Kaisha Kobe Seiko Sho | Method of injection molding a skin layer around a core resin |
JP2001058369A (en) * | 1999-07-14 | 2001-03-06 | Ticona Gmbh | Conductive plastic molding |
JP2010076244A (en) * | 2008-09-25 | 2010-04-08 | Panasonic Electric Works Co Ltd | Sandwich molded product and its manufacturing method |
KR20220029255A (en) * | 2020-09-01 | 2022-03-08 | 엘지전자 주식회사 | Co-injection molding apparatus, controlling method thereof and co-injection product |
US12090693B2 (en) | 2020-09-01 | 2024-09-17 | Lg Electronics Inc. | Co-injection molding apparatus, method for controlling same, and injection product by co-injection molding |
Also Published As
Publication number | Publication date |
---|---|
JPH0366136B2 (en) | 1991-10-16 |
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