JPS63139069A - Ceramic joining method - Google Patents
Ceramic joining methodInfo
- Publication number
- JPS63139069A JPS63139069A JP28209186A JP28209186A JPS63139069A JP S63139069 A JPS63139069 A JP S63139069A JP 28209186 A JP28209186 A JP 28209186A JP 28209186 A JP28209186 A JP 28209186A JP S63139069 A JPS63139069 A JP S63139069A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramics
- acicular
- metal plate
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 12
- 238000005304 joining Methods 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 150000002739 metals Chemical class 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009975 flexible effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- -1 iron-based Chemical class 0.000 description 1
- 229910001234 light alloy Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003923 scrap metal Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はセラミックスの接合法だ関し、例えばボイラー
バーナーノズルまわりのセラミックス耐熱タイル、スペ
ースシャトルのセラミックス耐熱タイル等各種機器、部
材等にセラミックスを取付る際の接合法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for joining ceramics, and is used for attaching ceramics to various devices and members, such as ceramic heat-resistant tiles around boiler burner nozzles and space shuttle ceramic heat-resistant tiles. Regarding the joining method when
第３図、第４図に従来のセラミックス接合法の実施例を
示す。第５図は平面図、第４図はそのＩＶ−ＩＶ線矢視
断面図である。FIGS. 3 and 4 show examples of conventional ceramic bonding methods. FIG. 5 is a plan view, and FIG. 4 is a sectional view taken along the line IV-IV.
第３，４図において、セラミックスタイル０１は接着剤
０３によって金属板０２に接着されている。In FIGS. 3 and 4, a ceramic tile 01 is bonded to a metal plate 02 with an adhesive 03.
一般にセラミックスの線膨張係数は金属の線膨張係数に
比べて大変率さい。このため高温時にはセラミックスタ
イル０１と金属板０２の熱伸び差の拘束に起因する熱応
力が生じ、接着面０４にせん断力が作用して接着がはず
れることがあり、熱応力の発生が問題となっている。Generally, the coefficient of linear expansion of ceramics is much higher than that of metals. Therefore, at high temperatures, thermal stress occurs due to the restraint of the thermal expansion difference between the ceramic style 01 and the metal plate 02, and shear force acts on the bonding surface 04, causing the bond to come off, and the generation of thermal stress becomes a problem. ing.
本発明は、このような高温時の問題が生じないセラミッ
クスの接合法を提案するものである。The present invention proposes a ceramic bonding method that does not cause such problems at high temperatures.
本発明は、上記問題点を、セラミックスタイルと金属板
の間に空間を設け、この空間に多数の針状柱を置き、該
針状柱を介してセラミックスタイルと金属板を接合し、
両者の熱伸び差を互いに拘束しないようにして解決する
ものである。The present invention solves the above problem by providing a space between the ceramic tile and the metal plate, placing a large number of acicular columns in this space, and joining the ceramic tile and the metal plate via the acicular columns.
This is to solve the difference in thermal expansion between the two so as not to restrict each other.
また、この接合法はセラミックス同志の接合にも適用す
ることができる。Furthermore, this joining method can also be applied to joining ceramics together.
従って本発明は、セラミックス同志又はセラミックスと
金属との間に空間を設け、該空間に設けた多数の針状柱
を介して前記セラミックス同志又はセラミックスと金属
とを接合することを特徴とするセラミックスの接合法に
関するものである。Therefore, the present invention provides a ceramic material which is characterized in that a space is provided between the ceramics or the ceramic and the metal, and the ceramics or the ceramic and the metal are bonded to each other through a large number of acicular columns provided in the space. It concerns a joining method.
本発明法により接合できるセラミックスとしては、アル
ミナ、窒化けｈ素、炭化けい素、ジルコニア等の他に、
コージライト、ムライト。Ceramics that can be bonded by the method of the present invention include alumina, silicon nitride, silicon carbide, zirconia, etc.
cordierite, mullite.
サイアロン等各種のものがあり、また金属としては、鉄
系、銅合金、軽合金等各種のものがある０
また、本発明法における針状柱としては、セラミックス
と金属の熱膨張の差が生じた際に適度に撓み、その撓み
では折損しないことが必要であり、また耐高温酸化性に
優れ、かつ金属やセラミックスとの接合性に優れること
が必要であり、各種金属、特に８０８材が適して因る。There are various types of materials such as sialon, and various types of metals such as iron-based, copper alloys, and light alloys.0 Also, as for the needle-shaped columns in the method of the present invention, there is a difference in thermal expansion between ceramics and metals. It is necessary that the material flexes appropriately when it is bent and does not break during that flexure, and it also needs to have excellent high-temperature oxidation resistance and excellent bondability with metals and ceramics, so various metals, especially 808 material, are suitable. It depends.
この針状柱の形状は、中実円柱、中実角柱。The shape of this acicular column is a solid cylinder or a solid prism.
中空円筒、中空角筒等が用いられる。また、針状柱の太
さ、長さ、使用本数については、主として強度により決
定され、接合しようとするセラミックスや金属にどのよ
うな力が作用するが（例えば、セラミックスタイルにあ
らゆる方向ニ加東度が１０Ｇまで作用するとか、セラミ
ックスタイルと金属板の熱伸び差によ、すせん断力。A hollow cylinder, a hollow rectangular cylinder, etc. are used. In addition, the thickness, length, and number of acicular pillars to be used are determined primarily by their strength, and what kind of force will act on the ceramics or metals to be joined (for example, the force applied to ceramic tiles in all directions). The shear force can act up to 10G due to the difference in thermal expansion between the ceramic style and the metal plate.
曲げモーメントが作用する等）によシ決定される。(bending moment acts, etc.).
針状柱は撓みやすい性質を有しているので、両者の熱伸
び差を吸収しやすく、従って両者の熱伸び差〈よる熱応
力がほとんど発生しない。Since the acicular column has a flexible property, it easily absorbs the difference in thermal elongation between the two, and therefore almost no thermal stress is generated due to the difference in thermal elongation between the two.
また、両者間に空間を設けているので、セラミック（タ
イル）から金属又はセラミックス（板）への伝熱を防ぐ
いわゆる断熱効果も大である。Furthermore, since a space is provided between the two, the so-called heat insulation effect that prevents heat transfer from the ceramic (tile) to the metal or ceramic (plate) is also great.
第１図、第２図に本発明方法の一実施例を示す。第１図
は平面図、第２図はその■−「線矢視断面図である。An embodiment of the method of the present invention is shown in FIGS. 1 and 2. FIG. 1 is a plan view, and FIG. 2 is a sectional view taken along the line 2-1.
第１，２図において、セラミックスタイル１と金屑板又
はセラミック板２との間には空間５があり、この空間５
には針状柱６が多数設けられている。In FIGS. 1 and 2, there is a space 5 between the ceramic tile 1 and the scrap metal plate or the ceramic plate 2, and this space 5
A large number of needle-like columns 6 are provided.
針状柱６とセラミックスタイル１と、及び針状柱６と金
属板又はセラミックス板２とは接着。The acicular column 6 and the ceramic tile 1 and the acicular column 6 and the metal plate or ceramic plate 2 are bonded.
溶接、ろう付（例えば、セラミックス表面に銅を蒸着し
、これと鋼製状状柱をろう付する）。Welding, brazing (for example, depositing copper on a ceramic surface and brazing it to a steel column).
拡散接合（例えば、セラミックスと鋼製針状柱との間に
ニッケルをインサートして拡散接合する）等によって接
合される。They are joined by diffusion bonding (for example, by inserting nickel between a ceramic and a steel acicular column and performing diffusion bonding).
本発明によればセラミックスタイル１と金属板又はセラ
ミックス板２とに熱伸び差が生じても、その熱伸び差は
針状柱６の撓みで吸収され、熱伸び差に起因する熱応力
は殆んど発生せず、耐熱性の高いセラミックス接合が提
供できる。According to the present invention, even if a difference in thermal expansion occurs between the ceramic tile 1 and the metal plate or the ceramic plate 2, the difference in thermal expansion is absorbed by the deflection of the needle-shaped columns 6, and the thermal stress caused by the difference in thermal expansion is almost eliminated. It is possible to provide ceramic bonding with high heat resistance and no generation.
また本発明によれば、セラミックスタイル１の熱は針状
柱６及び空間５を通って金属板又はセラミックス板２に
伝わるが、針状柱６の断面積は大変小さく、また空間５
の伝熱特性も大変小さいため、結果として金属板又はセ
ラミックス板２への伝熱量は大変小さい。従って、断熱
特性の高いセラミックス接合をも提供することができる
。Further, according to the present invention, the heat of the ceramic tile 1 is transmitted to the metal plate or the ceramic plate 2 through the acicular columns 6 and the spaces 5, but the cross-sectional area of the acicular columns 6 is very small, and the spaces 5
Since the heat transfer characteristics of the metal plate 2 are also very small, as a result, the amount of heat transferred to the metal plate or ceramic plate 2 is very small. Therefore, it is also possible to provide a ceramic bond with high heat insulation properties.
第１図は本発明方法の一実施例の平面図、第２図はその
ＩＩ−ｎ線矢視断面図、第３図は従来のものの平面図、
第４図はそのＩＶ −ＩＴ線矢視断面図である。
復代理人 内 １） 明
復代理人 萩 原 亮 −
復代理人 安 西 篤 夫
第３図
第４図FIG. 1 is a plan view of an embodiment of the method of the present invention, FIG. 2 is a sectional view taken along line II-n, and FIG. 3 is a plan view of a conventional method.
FIG. 4 is a sectional view taken along the line IV-IT. Sub-Agents 1) Meifuku Agent Ryo Hagiwara - Sub-Agent Atsuo Anzai Figure 3 Figure 4
Claims (1)
を設け、該空間に設けた多数の針状柱を介して前記セラ
ミックス同志又はセラミックスと金属とを接合すること
を特徴とするセラミックスの接合法。A method for joining ceramics, characterized in that a space is provided between the ceramics or the ceramic and the metal, and the ceramics or the ceramic and the metal are joined via a large number of acicular columns provided in the space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28209186A JPS63139069A (en) | 1986-11-28 | 1986-11-28 | Ceramic joining method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28209186A JPS63139069A (en) | 1986-11-28 | 1986-11-28 | Ceramic joining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63139069A true JPS63139069A (en) | 1988-06-10 |
Family
ID=17648004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28209186A Pending JPS63139069A (en) | 1986-11-28 | 1986-11-28 | Ceramic joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63139069A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992008681A1 (en) * | 1990-11-20 | 1992-05-29 | The Welding Institute | Joining method |
| JP2015059084A (en) * | 2013-09-20 | 2015-03-30 | アルストム テクノロジー リミテッドＡＬＳＴＯＭ Ｔｅｃｈｎｏｌｏｇｙ Ｌｔｄ | Method for fixing heat resistant component on surface of heat exposed component |
-
1986
- 1986-11-28 JP JP28209186A patent/JPS63139069A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992008681A1 (en) * | 1990-11-20 | 1992-05-29 | The Welding Institute | Joining method |
| JP2015059084A (en) * | 2013-09-20 | 2015-03-30 | アルストム テクノロジー リミテッドＡＬＳＴＯＭ Ｔｅｃｈｎｏｌｏｇｙ Ｌｔｄ | Method for fixing heat resistant component on surface of heat exposed component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08509844A (en) | Power semiconductor device having buffer layer | |
| US4981761A (en) | Ceramic and metal bonded composite | |
| JP2866411B2 (en) | Method of joining ceramic fiber material to metal member and composite member joining ceramic fiber material to metal member | |
| JPS63139069A (en) | Ceramic joining method | |
| JP3993619B2 (en) | Ceramic circuit board assembly | |
| JPS59137378A (en) | Method of bonding ceramic or cermet and metal | |
| JPS63297198A (en) | Wall body | |
| JPS5935074A (en) | Ceramic sheet | |
| JP2009280493A (en) | Method of manufacturing ceramic honeycomb structure | |
| JPS5935075A (en) | Method of bonding ceramic and metal | |
| JPH10267560A (en) | Shelf plate having stay for ceramic firing | |
| JPH022829B2 (en) | ||
| JPS62265188A (en) | Method of soldering ceramics to metals | |
| JPS60172191A (en) | Method of mounting electrode of ceramic heater | |
| JPS61136969A (en) | Method of bonding sialon and metal | |
| JPS63222077A (en) | Method of joining sic ceramics | |
| JPS59182281A (en) | Diffusion bonding process | |
| JPS632865A (en) | Method of joining ceramic to metal | |
| JPH02206125A (en) | Formation of bump and connection of semiconductor element | |
| JPH0292873A (en) | Bonded material of member having different coefficient of thermal expansion | |
| JPS59102876A (en) | Ceramics metal bonding method | |
| JPS6183687A (en) | Heat insulating structure | |
| JPS61155267A (en) | Method of bonding ceramic and metal | |
| JPS6256381A (en) | Method of joining metal member to ceramic member | |
| JPS62143881A (en) | Method of joining ceramics |