JPS6312833U - - Google Patents
Info
- Publication number
- JPS6312833U JPS6312833U JP10706886U JP10706886U JPS6312833U JP S6312833 U JPS6312833 U JP S6312833U JP 10706886 U JP10706886 U JP 10706886U JP 10706886 U JP10706886 U JP 10706886U JP S6312833 U JPS6312833 U JP S6312833U
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- transmission member
- semiconductor element
- reciprocating
- reciprocating means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はその駆動系を示す構成図、第３図はこの考
案の動作状態を示す断面図、第４図は従来装置の
側面図である。図中、７は上金型、１６はタブレ
ツト、３３はボールねじ軸、３９はナツト、４０
はロツド、４１はチエーン、４３はプランジヤ、
４４はピン、４５は内部下金型、４６は外部下金
型である。なお、各図中同一符号は、同一又は相
当部分を示す。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a configuration diagram showing its drive system, Fig. 3 is a sectional view showing the operating state of this invention, and Fig. 4 is a side view of a conventional device. It is. In the figure, 7 is the upper mold, 16 is the tablet, 33 is the ball screw shaft, 39 is the nut, 40
is the rod, 41 is the chain, 43 is the plunger,
44 is a pin, 45 is an internal lower mold, and 46 is an external lower mold. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
記半導体素子を封止すべく上記上金型と下金型内
に樹脂を圧入するプランジヤ、このプランジヤを
往復動し得る出力部を有する往復動手段、この往
復動手段の出力部と上記プランジヤとを連結して
上記出力部の往復駆動力を上記プランジヤに伝達
する可撓性の伝達部材及び上記プランジヤと上記
伝達部材とを連結し、上記伝達部材が反出力側へ
最も移動した位置にて上記上金型又は上記下金型
から露出する連結ピンを備えた半導体素子用樹脂
封止装置。 (2) 上記往復動手段は、ボールねじからなる出
力部と、この出力部を駆動するサーボモータとで
構成されていることを特徴とする実用新案登録請
求の範囲第１項記載の半導体素子用樹脂封止装置
。 (3) 上記伝達部材は、チエーンで構成されてい
ることを特徴とする実用新案登録請求の範囲第１
項記載の半導体素子用樹脂封止装置。 (4) 上記伝達部材は、ワイヤで構成されている
ことを特徴とする実用新案登録請求の範囲第１項
記載の半導体素子用樹脂封止装置。[Scope of Claim for Utility Model Registration] (1) An upper mold and a lower mold that house a semiconductor element, a plunger that press-fits resin into the upper mold and the lower mold to seal the semiconductor element, and this plunger. a reciprocating means having an output part capable of reciprocating the reciprocating means; a flexible transmission member that connects the output part of the reciprocating means with the plunger to transmit the reciprocating driving force of the output part to the plunger; and the plunger. and the transmission member, and includes a connecting pin exposed from the upper mold or the lower mold at a position where the transmission member moves farthest toward the opposite output side. (2) The semiconductor device according to claim 1, wherein the reciprocating means is composed of an output section made of a ball screw and a servo motor that drives the output section. Resin sealing equipment. (3) Utility model registration claim 1, characterized in that the transmission member is composed of a chain.
A resin sealing device for a semiconductor element as described in 1. (4) The resin sealing device for a semiconductor element according to claim 1, wherein the transmission member is composed of a wire.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10706886U JPS6312833U (en) | 1986-07-10 | 1986-07-10 | |
| US07/056,764 US4735563A (en) | 1986-06-05 | 1987-06-02 | Apparatus for sealing a semiconductor element in a resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10706886U JPS6312833U (en) | 1986-07-10 | 1986-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312833U true JPS6312833U (en) | 1988-01-27 |
Family
ID=30983004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10706886U Pending JPS6312833U (en) | 1986-06-05 | 1986-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312833U (en) |
-
1986
- 1986-07-10 JP JP10706886U patent/JPS6312833U/ja active Pending
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