JPS6312672A - Coating composition - Google Patents
Coating compositionInfo
- Publication number
- JPS6312672A JPS6312672A JP15599186A JP15599186A JPS6312672A JP S6312672 A JPS6312672 A JP S6312672A JP 15599186 A JP15599186 A JP 15599186A JP 15599186 A JP15599186 A JP 15599186A JP S6312672 A JPS6312672 A JP S6312672A
- Authority
- JP
- Japan
- Prior art keywords
- bonding units
- boron nitride
- bonding
- polymer
- coating composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008199 coating composition Substances 0.000 title claims description 10
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052582 BN Inorganic materials 0.000 claims abstract description 17
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 11
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 3
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 229920003257 polycarbosilane Polymers 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920001558 organosilicon polymer Polymers 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000555 poly(dimethylsilanediyl) polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Mold Materials And Core Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は被覆用組成物特に窒化ホウ素を特定の割合で含
有するポリメタロカルボシラン溶液からなる密着性・離
型性にすぐれた被覆用組成物に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention provides a coating composition, particularly a coating composition having excellent adhesion and mold releasability, consisting of a polymetallocarbosilane solution containing boron nitride in a specific proportion. relating to things.
(従来の技術及びその問題点)
窒化ホウ素は熱伝導性にすぐれ、熱膨張保数も小さいた
め、高温曝露あるいは熱衝撃に耐え、しかも溶融した金
属、塩類、ガラスに濡れに<<。(Prior art and its problems) Boron nitride has excellent thermal conductivity and a small coefficient of thermal expansion, so it can withstand exposure to high temperatures or thermal shock, and is resistant to getting wet with molten metals, salts, and glass.
侵食され難い性質をもつので、ガラス成型あるいはダイ
キャストの離型材などに利用されている。Because it is resistant to corrosion, it is used as a mold release material for glass molding and die casting.
このとき、離型材の使用方法として。At this time, as a method of using mold release material.
(1)窒化ホウ素を粉末あるいは成形体としてそのまま
使う方法。(1) A method of using boron nitride as it is as a powder or compact.
(2)窒化ホウ素の粉末を溶媒などに分散させた状態、
あるいはこれに結合剤を添加して、基材に塗布し、焼付
ける方法
などがある。しかし、(1)の粉末は密着性が悪く。(2) A state in which boron nitride powder is dispersed in a solvent, etc.
Alternatively, there is a method of adding a binder to this, applying it to a base material, and baking it. However, the powder (1) has poor adhesion.
良好な塗膜とは成シえず、また成形体は高価で実用性が
ない。次に、(2)の方法においては、窒化ホウ素の分
散液は基材に塗布後、焼付ける際、500°Cをこえる
高温に曝すと塗膜に亀裂、剥離が発生し、また500°
C以下の低温でも、昇温、降温速度を小さくしないと、
ふくれや亀裂等が発生するなど、施工が非常に困難であ
る。また、この分散液に結合剤として、釉薬やシリコン
樹脂を添加することによシ、上記の欠点は幾分緩和され
るが。A good coating film cannot be formed, and the molded product is expensive and impractical. Next, in method (2), when the boron nitride dispersion is applied to the substrate and then baked, the coating film will crack or peel if exposed to high temperatures exceeding 500°C.
Even at low temperatures below C, unless the rate of temperature rise and fall is reduced,
Construction is extremely difficult as blisters and cracks occur. Moreover, the above-mentioned drawbacks can be alleviated to some extent by adding a glaze or silicone resin as a binder to this dispersion.
釉薬の添加は本来の性能である潤滑性や離型性を損ない
、またシリコン樹脂は耐熱性がせいぜい300°Cにす
ぎず、焼付時あるいは使用時にこの温度をこえると熱分
解による重量減少が著しいため塗膜に亀裂やピンホール
が発生し、塗膜の密着性が著しく低下する。The addition of glaze impairs the original performance of lubricity and mold release, and silicone resin has a heat resistance of only 300°C at most, and if this temperature is exceeded during baking or use, weight loss due to thermal decomposition is significant. As a result, cracks and pinholes occur in the paint film, which significantly reduces the adhesion of the paint film.
(発明の目的)
本発明は、これらの欠点を解決することを目的とするも
ので、密着性、潤滑性及び離型性にすぐれ、しかも急激
な冷熱サイクルのかかる焼付、使用によっても剥離など
を生じない被覆用組成物を提供しようとするものである
。(Purpose of the invention) The present invention aims to solve these drawbacks, and has excellent adhesion, lubricity, and mold releasability, and is also resistant to peeling even when used or baked with rapid cooling/heating cycles. The aim is to provide a coating composition that does not generate
(発明の要旨)
本発明は、ポリメタロカルボシラ/、窒化ホウ素粉末及
び無機充填材を有機溶剤に分散、溶解させてなる被覆用
組成物である。(Summary of the Invention) The present invention is a coating composition prepared by dispersing and dissolving polymetallocarbosila/boron nitride powder and an inorganic filler in an organic solvent.
(発明の詳細な説明)
本発明における窒化ホウ素粉末の使用量は、粉末分中に
無機充填材との合計量に対して5〜50重量%であるこ
とが好ましく、過度に多いと得られる組成物の基材との
密着力が低下して剥離、クラックなどが発生し、また過
度に少ないと得られる組成物の潤滑、離型性が低下する
。(Detailed Description of the Invention) The amount of boron nitride powder used in the present invention is preferably 5 to 50% by weight based on the total amount of the inorganic filler in the powder. The adhesion to the substrate of the product decreases, resulting in peeling, cracking, etc., and if the amount is too small, the lubrication and mold releasability of the resulting composition decrease.
窒化ホウ素の粒径は、基材との密着性に大きな影響を与
えるので、10μm以下であることが好ましい。The particle size of boron nitride has a large effect on the adhesion to the base material, so it is preferably 10 μm or less.
無機充填材としては、炭化ケイ素、窒化ケイ素。Inorganic fillers include silicon carbide and silicon nitride.
酸化ケイ素、酸化チタン、酸化アルミニウム等の粉末を
用いることができ、その粒径は基材との密着性などの点
から10μm以下であることが好ましい。Powders of silicon oxide, titanium oxide, aluminum oxide, etc. can be used, and the particle size thereof is preferably 10 μm or less from the viewpoint of adhesion to the base material.
ポリメタロカルボシランの使用量は窒化ホウ素と無機充
填材との合計100重量部に対し50〜200重量部で
あることが好ましい。ポリメタロカルボシランの使用量
が過度に多いと焼付時に塗膜のふくれが発生し、その使
用量が過度に少ないと塗膜の基材への密着性が低下する
。The amount of polymetallocarbosilane used is preferably 50 to 200 parts by weight based on the total of 100 parts by weight of boron nitride and inorganic filler. If the amount of polymetallocarbosilane used is too large, blistering of the coating film will occur during baking, and if the amount used is too small, the adhesion of the coating film to the substrate will be reduced.
本発明で使用されるポリメタロカルボシランは下記(A
)のカルボシラン結合単位及び少なくとも一種の下記(
B)のメタロキサン結合単位からなり。The polymetallocarbosilane used in the present invention is shown below (A
) and at least one of the following (
Consisting of the metalloxane bonding unit of B).
(A): R1
(−8i−C!H2−)−
ツ
(式中、R1及びR2は同−又は異なってもよく相互に
独立に炭素数1〜4のアルキル基・フェニル基又は水素
原子を示す。)
(B): (−M−0−)
(式中1MはTi、Zr、Mo及びOrからなる群から
選ばれる少なくとも一種の元素を示し、場合によっては
前記各元素の少なくとも一部分が側鎖基として炭素数1
〜4のアルコキシ基又はフェニル基を少なくとも1個有
する。)
前記(A)及び(B)各結合単位が主鎖骨格中でランダ
ムに結合した重合体、及び/又は前記(A)の結合単位
の珪素原子の少なくとも一部が前記(B)の結合単位の
前記各元素と酸素原子を介して結合し、これらによって
前記(4)の結合単位の連鎖によシ得られるポリカルボ
シラン部分が前記(B)の結合単位にょって架橋された
重合体である。前記GA)の結合単位の全数対前記(B
)の結合単位の全数の比率が1−1から10:1の範囲
にあることが好ましい。まだ。(A): R1 (-8i-C!H2-)- (in the formula, R1 and R2 may be the same or different and independently represent an alkyl group having 1 to 4 carbon atoms, a phenyl group, or a hydrogen atom) (B): (-M-0-) (In the formula, 1M represents at least one element selected from the group consisting of Ti, Zr, Mo, and Or, and in some cases, at least a portion of each element is on the side. 1 carbon number as chain group
-4 alkoxy group or at least one phenyl group. ) A polymer in which the bonding units of (A) and (B) are randomly bonded in the main chain skeleton, and/or at least a portion of the silicon atoms of the bonding units of (A) are the bonding units of (B). A polymer in which the polycarbosilane moiety obtained by the chaining of the bonding units of (4) is crosslinked by the bonding units of (B), which are bonded to each of the above elements through oxygen atoms. be. The total number of binding units of said GA) versus said (B
) is preferably in the range of 1-1 to 10:1. still.
ポリメタロカルボシランの数平均分子量は400〜50
000であることが好ましい。The number average molecular weight of polymetallocarbosilane is 400 to 50
Preferably, it is 000.
ポリメタロカルボシランは1組成物の造膜性を高めるた
めに、シリコーン樹脂を含有していることが好ましい。The polymetallocarbosilane preferably contains a silicone resin in order to improve the film-forming properties of the composition.
シリコーン樹脂としては、シリコーンオイル、シリコー
ンフェス及ヒシリコーンゴムのいずれも使用することが
できる。シリコーン樹脂の配合量は、ポリメタロカルボ
シラン100重量部当た9900重量部以下、特に10
〜200重量部であることが好ましい。As the silicone resin, any of silicone oil, silicone face, and silicone rubber can be used. The blending amount of the silicone resin is 9900 parts by weight or less, especially 10 parts by weight per 100 parts by weight of polymetallocarbosilane.
It is preferable that it is 200 parts by weight.
有機溶剤の使用量は、窒化ホウ素及び無機充填材の混合
分散を円滑にし、かつ塗装作業を容易にするために、窒
化ホウ素と無機充填材との合計100重量部に対し、1
0重量部以上であることが好ましい。有機溶剤の使用量
の上限については特に制限はないが、過度に多いとポリ
メタロカルボシランの濃度が相対的に低下するので、窒
化ホウ素と無機充填材との合計100重量部に対して1
00重量部以下であることが好ましい。溶剤としてはト
ルエン、キシレンなどの芳香族炭化水素溶剤が好ましく
使用される。The amount of organic solvent used is 1 part by weight per 100 parts by weight of boron nitride and inorganic filler in order to facilitate mixing and dispersion of boron nitride and inorganic filler and to facilitate painting work.
It is preferably 0 parts by weight or more. There is no particular restriction on the upper limit of the amount of organic solvent used, but if it is too large, the concentration of polymetallocarbosilane will decrease relatively, so 1 part by weight per 100 parts by weight of boron nitride and inorganic filler.
The amount is preferably 0.00 parts by weight or less. As the solvent, aromatic hydrocarbon solvents such as toluene and xylene are preferably used.
本発明の被覆用組成物を製造するには、窒化ホウ素、無
機充填材、ポリメタロカルボシラン及び有機溶剤とを通
常の混合機で数時間混合すれば良い。The coating composition of the present invention can be prepared by mixing boron nitride, inorganic filler, polymetallocarbosilane, and organic solvent in a conventional mixer for several hours.
このようにして得られる被覆用組成物は、鉄。The coating composition thus obtained is made of iron.
アルミナ、黒鉛などの基材に適当な手段1例えば刷毛塗
シ、スプレィなどの塗装機によシ塗布し。The coating is applied to a base material such as alumina or graphite using an appropriate method such as brush coating or a coating machine such as spraying.
常温で乾燥、あるいは常温乾燥後、高温で加熱焼付する
ことによシ優れた性能を有する塗膜を与えることができ
る。A coating film with excellent performance can be obtained by drying at room temperature or by baking at a high temperature after drying at room temperature.
(発明の効果) 本発明による被覆用組成物から得られる塗膜は。(Effect of the invention) The coating film obtained from the coating composition according to the invention.
急激な冷熱サイクル下でも基材との密着性が良く。Good adhesion to the base material even under rapid heating and cooling cycles.
潤滑、離型性に優れているため、鋳物、アルミニウム、
亜鉛等のグイキャスト、ガラス成形の離型剤として使用
することが可能である。It has excellent lubrication and mold release properties, so it can be used for castings, aluminum,
It can be used as a mold release agent for guicasting zinc and glass molding.
(実施例)
以下1本発明の実施例を示し、さらに本発明を説明する
。以下において「チ」及び「部」は、それぞれ、「重量
%」及び「重量部」を意味する。(Example) An example of the present invention will be shown below to further explain the present invention. In the following, "chi" and "parts" mean "% by weight" and "parts by weight", respectively.
参考例1
無水キシレン2.51及びナトリウム4002を窒素ガ
ス気流中でキシレンの沸点まで加熱し、ジメチルジクロ
ロシラン1tを1時間で滴下した。Reference Example 1 2.51 g of anhydrous xylene and 4002 g of sodium were heated in a nitrogen gas stream to the boiling point of xylene, and 1 t of dimethyldichlorosilane was added dropwise over 1 hour.
滴下終了後、10時間加熱還流し沈澱物を生成させた。After the dropwise addition was completed, the mixture was heated under reflux for 10 hours to form a precipitate.
この沈澱を濾過し、メタノール、ついで水で洗浄して、
白色粉末のポリジメチルシラン4202を得た。The precipitate was filtered, washed with methanol and then water,
Polydimethylsilane 4202 as a white powder was obtained.
他方、ジフェニルジクロロシラン7591とホウ酸12
42を窒素ガス雰囲気下、n−ブチルエーテル中、10
0〜120°Cの温度で加熱し、生成した白色樹脂状物
を、さらに真空中400°Cで1時間加熱することによ
って5己0りのポリボロジフェニルシロキサンヲ得り。On the other hand, diphenyldichlorosilane 7591 and boric acid 12
42 in n-butyl ether under nitrogen gas atmosphere, 10
A 5-0 polyborodiphenylsiloxane was obtained by heating at a temperature of 0 to 120°C and further heating the produced white resinous material at 400°C in vacuum for 1 hour.
次に、上記のポリジメチルシラン4002に上記のポリ
ボロジフェニルシロキサン0.22を添加混合し、還流
管を備えた2tの石英管中で、窒素気流下で350°C
まで加熱し、3時間重合して。Next, 0.22 of the above polyborodiphenylsiloxane was added to the above polydimethylsilane 4002 and mixed, and the mixture was heated to 350°C under a nitrogen stream in a 2t quartz tube equipped with a reflux tube.
and polymerize for 3 hours.
有機ケイ素重合体を得た。An organosilicon polymer was obtained.
この有機ケイ素重合体400fとチタンテトライソプロ
ポキシド2002とを、キシレン4tを反応溶媒とし、
窒素ガス雰囲気下で130’Cで1時間攪拌しながら反
応させた。キシレンを留去した後、300°Cで10時
間さらに反応を行い、シリコンとチタンを含有する有機
金属架橋重合体を得た。その数平均分子量は蒸気圧浸透
法で測定したところ1165であった。This organosilicon polymer 400f and titanium tetraisopropoxide 2002 were mixed with xylene 4t as a reaction solvent,
The reaction was carried out under a nitrogen gas atmosphere at 130'C for 1 hour with stirring. After distilling off the xylene, the reaction was further carried out at 300°C for 10 hours to obtain an organometallic crosslinked polymer containing silicon and titanium. Its number average molecular weight was 1165 when measured by vapor pressure osmosis method.
ゲルバーミエイションクロマトグラフ、赤外吸収スペク
トルからここで得られた重合体は、有機ケイ素重合体中
の5i−H結合が一部消失し、この部分のケイ素原子が
、チタンテトライソプロポキシドのチタン原子と酸素原
子を介して結合し、これによって一部は有機ケイ素重合
体の側鎖に−o −T1(003H))3基を有し、ま
た一部は有機ケイ素重合体が+Ti−0+結合で架橋し
たポリチタノカルボシランであった。この重合体の(−
8i−]H2+結合単位結合数対−Ti−0−結合単位
の全数はる:1であることを確認した。Gel permeation chromatography and infrared absorption spectroscopy revealed that the 5i-H bonds in the organosilicon polymer have partially disappeared, and the silicon atoms in this part have been replaced by the titanium of titanium tetraisopropoxide. atoms and oxygen atoms, so that some of the organosilicon polymers have -o -T1(003H))3 groups in their side chains, and some of the organosilicon polymers have +Ti-0+ bonds. It was a polytitanocarbosilane crosslinked with This polymer (−
8i-]H2+ bonding units versus the total number of -Ti-0- bonding units was confirmed to be 1.
実施例1
窒化ホウ素(平均粒径3μm)15%、酸化ケイ素(平
均粒径2μm ) 85 %の混合物100部に対し、
ポリチタノカルボシラン100部及び参考例1のキシレ
ン100部をボールミルで均一に混合した。これを鉄板
に厚さ100μmにハケ塗膜し、常温で乾燥後、300
°Cのオープン中に入れ、30分焼付けた後、直ちに室
温まで冷却した。Example 1 For 100 parts of a mixture of 15% boron nitride (average particle size 3 μm) and 85% silicon oxide (average particle size 2 μm),
100 parts of polytitanocarbosilane and 100 parts of xylene from Reference Example 1 were uniformly mixed in a ball mill. This was applied to an iron plate with a brush to a thickness of 100 μm, and after drying at room temperature,
The sample was placed in an open oven at °C, baked for 30 minutes, and then immediately cooled to room temperature.
次にこの被覆鋼板を600°Cの純アルミニウム融液に
10分間浸漬後、引上げて塗膜のアルミニウム融液に対
する耐食性、濡れ性(引上げたときに塗膜表面にアルミ
ニウム融液が付着すること。)を調べたが、亀裂、剥離
は見られず、濡れも認められなかった。Next, this coated steel plate is immersed in a pure aluminum melt at 600°C for 10 minutes, and then pulled up to test the corrosion resistance and wettability of the coating film against the aluminum melt (the aluminum melt adheres to the surface of the coating when it is pulled up). ), but no cracks, peeling, or wetting was observed.
比較例1
ポリチタノカルボシランの代わりにシリコン樹脂(スト
レートシリコン)100部を使用した以外は、実施例1
と同様にして得られた被覆鋼板について試験を行ったと
ころ、塗膜のひびわれ、一部剥離が発生し、剥離部でア
ルミニウムの濡れが見られた。Comparative Example 1 Example 1 except that 100 parts of silicone resin (straight silicone) was used instead of polytitanocarbosilane.
When a test was conducted on a coated steel plate obtained in the same manner as above, the coating film cracked and peeled off in some areas, and wetting of the aluminum was observed in the peeled areas.
実施例2
窒化ホウ素(平均粒径6μm)15%、窒化ケイ素(平
均粒径1μm)85%の混合物100部に対し、参考例
1のポリチタノカルボシラン200部及びトルエン20
0部を高速ミキサーで均一に混合した。これを黒鉛棒(
直径20■、長さ200■)に厚さ0.31t1mにハ
ケ塗膜し、常温で乾燥後。Example 2 200 parts of the polytitanocarbosilane of Reference Example 1 and 20 parts of toluene were added to 100 parts of a mixture of 15% boron nitride (average particle size 6 μm) and 85% silicon nitride (average particle size 1 μm).
0 parts were uniformly mixed using a high speed mixer. This graphite rod (
20cm diameter, 200cm long) with a brush coating to a thickness of 0.31t1m, and dried at room temperature.
200°Cのオープン中で2時間焼付けた。次にこの基
材をガラス融液に10分間浸漬したのち基材を引上げて
塗膜の様子を観察したが、亀裂、剥離は見られず、ガラ
スの濡れも認められなかった。Baking was carried out in the open at 200°C for 2 hours. Next, this base material was immersed in the glass melt for 10 minutes, and then the base material was pulled up and the condition of the coating film was observed, but no cracks or peeling were observed, and no wetting of the glass was observed.
Claims (2)
機充填材を有機溶剤に分散、溶解させてなることを特徴
とする被覆用組成物。(1) A coating composition characterized by dispersing and dissolving polymetallocarbosilane, boron nitride powder, and an inorganic filler in an organic solvent.
ラン結合単位及び少なくとも1種の下記(B)のメタロ
キサン結合単位とからなり、 (A):▲数式、化学式、表等があります▼ (但し、R_1及びR_2は同一又は異なってもよく相
互に独立に低級アルキル基、フェニル基又は水素原子を
表す) (B):−(M−O)− (但し、MはTi、Zr、Cr及びMoからなる群から
選ばれた少なくとも1種の元素を示し、場合によっては
前記各元素の少なくとも1部分が側鎖基として低級アル
コキシ基又はフェノキシ基を少なくとも1個有する) 前記(A)及び(B)各結合単位が主鎖骨格中でランダ
ムに結合した重合体、及び/又は前記(A)の結合単位
のケイ素原子の少なくとも1部が前記(B)の結合単位
の前記各元素と酸素原子を介して結合し、これによって
前記(A)の結合単位の連鎖によりえられるポリカルボ
シラン部分が前記(B)の結合単位によって架橋された
重合体であり、前記(A)の結合単位の全数対前記(B
)の結合単位の全数の比率が1:1から10:1の範囲
にあり数平均分子量が400〜50,000であること
を特徴とする特許請求の範囲第1項に記載の被覆用組成
物。(2) Polymetallocarbosilane consists of the carbosilane bond unit shown below (A) and at least one metalloxane bond unit shown below (B), (A): ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (However, R_1 and R_2 may be the same or different and independently represent a lower alkyl group, a phenyl group, or a hydrogen atom) (B): -(M-O)- (However, M is a group consisting of Ti, Zr, Cr, and Mo. at least one element selected from the group consisting of (A) and (B) each of the above (A) and (B). A polymer in which the bonding units are randomly bonded in the main chain skeleton, and/or at least a portion of the silicon atoms in the bonding unit (A) are connected to each of the elements in the bonding unit (B) via an oxygen atom. is a polymer in which the polycarbosilane moiety obtained by the chaining of the bonding units of (A) is crosslinked by the bonding units of (B), and the total number of bonding units of (A) to the ( B
Coating composition according to claim 1, characterized in that the ratio of the total number of bonding units in ) is in the range of 1:1 to 10:1 and the number average molecular weight is 400 to 50,000. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15599186A JPS6312672A (en) | 1986-07-04 | 1986-07-04 | Coating composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15599186A JPS6312672A (en) | 1986-07-04 | 1986-07-04 | Coating composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6312672A true JPS6312672A (en) | 1988-01-20 |
Family
ID=15617961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15599186A Pending JPS6312672A (en) | 1986-07-04 | 1986-07-04 | Coating composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6312672A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989006261A1 (en) * | 1987-12-28 | 1989-07-13 | Nippon Carbon Co., Ltd. | Heat- and corrosion-resistant composition |
US20080280064A1 (en) * | 2005-12-21 | 2008-11-13 | Ngk Insulators, Ltd. | Marking composition and information display method |
WO2011118315A1 (en) * | 2010-03-23 | 2011-09-29 | 東海ゴム工業株式会社 | Electroconductive crosslinked product, process for producing same, and transducer, flexible wiring board and electromagnetic-wave shield made by using same |
WO2013046489A1 (en) * | 2011-09-30 | 2013-04-04 | 日本特殊陶業株式会社 | Lubricating coating composition and attachment component for internal combustion engine |
US9410468B2 (en) | 2013-04-30 | 2016-08-09 | Ngk Spark Plug Co., Ltd. | Temperature sensor attachment member treated with dry film lubricant |
-
1986
- 1986-07-04 JP JP15599186A patent/JPS6312672A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989006261A1 (en) * | 1987-12-28 | 1989-07-13 | Nippon Carbon Co., Ltd. | Heat- and corrosion-resistant composition |
US20080280064A1 (en) * | 2005-12-21 | 2008-11-13 | Ngk Insulators, Ltd. | Marking composition and information display method |
JP5118495B2 (en) * | 2005-12-21 | 2013-01-16 | 日本碍子株式会社 | Marking composition and information display method |
WO2011118315A1 (en) * | 2010-03-23 | 2011-09-29 | 東海ゴム工業株式会社 | Electroconductive crosslinked product, process for producing same, and transducer, flexible wiring board and electromagnetic-wave shield made by using same |
JP5603344B2 (en) * | 2010-03-23 | 2014-10-08 | 東海ゴム工業株式会社 | Conductive crosslinked body, method for producing the same, transducer using the same, flexible wiring board, electromagnetic wave shield |
US9051446B2 (en) | 2010-03-23 | 2015-06-09 | Sumitomo Riko Company Limited | Conductive crosslinked body and production process thereof, and transducer, flexible wiring board and electromagnetic wave shield using the conductive crosslinked body |
WO2013046489A1 (en) * | 2011-09-30 | 2013-04-04 | 日本特殊陶業株式会社 | Lubricating coating composition and attachment component for internal combustion engine |
JP2013076036A (en) * | 2011-09-30 | 2013-04-25 | Ngk Spark Plug Co Ltd | Lubricating coating composition, and fixing component for internal engine |
US9428708B2 (en) | 2011-09-30 | 2016-08-30 | Ngk Spark Plug Co., Ltd. | Lubricating coating composition and attachment component for internal combustion engine |
US9410468B2 (en) | 2013-04-30 | 2016-08-09 | Ngk Spark Plug Co., Ltd. | Temperature sensor attachment member treated with dry film lubricant |
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