JPS6238863B2 - - Google Patents
Info
- Publication number
- JPS6238863B2 JPS6238863B2 JP53131639A JP13163978A JPS6238863B2 JP S6238863 B2 JPS6238863 B2 JP S6238863B2 JP 53131639 A JP53131639 A JP 53131639A JP 13163978 A JP13163978 A JP 13163978A JP S6238863 B2 JPS6238863 B2 JP S6238863B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- outer frame
- tie bar
- effective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 230000008054 signal transmission Effects 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 10
- 239000008188 pellet Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、リードフレーム、特にレジンモール
ド型半導体装置の組立に用いるリードフレーム及
びそれを用いたレジンモールド半導体装置の製法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead frame, particularly a lead frame used for assembling a resin molded semiconductor device, and a method for manufacturing a resin molded semiconductor device using the lead frame.
レジンモールドされたICを製造するために第
１図に示すようなリードフレームを提案した。こ
のリードフレームは、アウターリードの先端部と
外枠フレームとは一体的に接続してあるため、半
導体装置を完成させるには、素子要部をレジンモ
ールド後本箇所を切断する必要がある。このため
には、切断する金型が必要であり、タイバー切断
後、アウターリードと外枠を分離する、切断工程
が必要であつた。また、従来リードフレームで
は、タイバー切断後外枠と半導体素子（チツプ）
とは電気的に導通状態であるため、完成品の電気
的特性の選別がむずかしく、選別工数低減の合理
化が計りにくくなつている。又、実装上の問題か
らアウターリードの先端部にはんだメツキ等をほ
どこす場合にも問題がある。 In order to manufacture resin-molded ICs, we proposed a lead frame as shown in Figure 1. In this lead frame, the tips of the outer leads and the outer frame are integrally connected, so in order to complete the semiconductor device, it is necessary to resin-mold the main part of the element and then cut at this point. For this purpose, a cutting die was required, and a cutting process was required to separate the outer lead and the outer frame after cutting the tie bar. In addition, in conventional lead frames, after cutting the tie bars, the outer frame and semiconductor element (chip)
Because they are electrically conductive, it is difficult to sort out the electrical characteristics of finished products, making it difficult to rationalize the reduction of sorting man-hours. Further, there are also problems when applying solder plating or the like to the tips of the outer leads due to mounting problems.
本発明は、これらを解決することを目的として
なされたものであり、レジンモールド型電子部品
の組立に用いるリードフレームであつて、そのリ
ードフレームは、所定間隔を保つて長手方向に延
びる一対のフレーム外枠部５と、それらフレーム
外枠部５に連接された他のフレーム外枠部２と、
電子部品の実際の信号伝達路となる有効リード及
び該有効リード間を接続するタイバーとを有し、
前記有効リードは前記タイバーを基準として前記
他のフレーム外枠部側に位置するアウターリード
部分とこのアウターリード部分に連接し前記タイ
バーを基準として前記他のフレーム外枠部とは反
対方向に位置するインナーリード部分とからな
り、前記有効リードと他のフレーム外枠部を一体
的に保持する働きをする支え部が前記他のフレー
ム外枠部と前記タイバーとを連接するように設け
られ、前記アウターリードの先端部が前記他のフ
レーム外枠部から分離していることを特徴とする
リードフレームにある。以下、実施例により本発
明を説明する。 The present invention has been made with the aim of solving these problems, and is a lead frame used for assembling resin molded electronic components, the lead frame comprising a pair of frames extending in the longitudinal direction with a predetermined spacing between them. An outer frame portion 5, another frame outer frame portion 2 connected to the frame outer frame portions 5,
It has an effective lead that serves as an actual signal transmission path of the electronic component and a tie bar that connects the effective leads,
The effective lead is connected to an outer lead portion located on the outer frame side of the other frame with the tie bar as a reference, and is located in a direction opposite to the outer frame portion of the other frame with the tie bar as a reference. A support portion is provided to connect the other frame outer frame portion and the tie bar, and is configured to connect the other frame outer frame portion and the tie bar, and is configured to connect the other frame outer frame portion and the tie bar. The lead frame is characterized in that the leading end portion of the lead is separated from the other frame outer frame portion. The present invention will be explained below with reference to Examples.
第２図は本発明のリードフレームの一実施例を
示す平面図である。同図には、アウターリードの
先端部１と一方のフレーム外枠部２とが完全に分
離されており、それらのリード部はタイバー３に
よつて連接され外枠フレーム５に支持されてい
る。また、素子要部をレジン４でモールドしタイ
バー３を切断した後でも第３図に示すように、レ
ジンモールド部４と一方のフレーム外枠５とを半
導体素子とは電気的に絶縁した状態で接続する一
対接続部６，６′が外枠フレーム５の内側面に設
けられている。又、同図から明らかなようにタブ
リードと外枠フレームが接続部８を介して連結さ
れ、これによつても電子部品は支持される。ま
た、アウターリード１と一方のフレーム外枠部２
とを分離しているため、レジンモールド時にタイ
バー３が変形する場合があるため、この変形防止
を目的としてタイバー変形支え部７がタイバー３
とフレーム２との間を連結して設けられている。 FIG. 2 is a plan view showing an embodiment of the lead frame of the present invention. In the figure, the tip end 1 of the outer lead and one of the frame outer frame parts 2 are completely separated, and these lead parts are connected by tie bars 3 and supported by the outer frame 5. Furthermore, even after molding the main parts of the element with resin 4 and cutting the tie bars 3, the resin mold part 4 and one frame outer frame 5 are electrically insulated from the semiconductor element, as shown in FIG. A pair of connecting portions 6, 6' are provided on the inner surface of the outer frame 5. Further, as is clear from the figure, the tab lead and the outer frame are connected via the connecting portion 8, and the electronic component is also supported by this. In addition, the outer lead 1 and one frame outer frame part 2
Since the tie bars 3 are separated from each other, the tie bars 3 may be deformed during resin molding.In order to prevent this deformation, the tie bar deformation support part 7 is attached to the tie bars 3.
and the frame 2 are connected to each other.
このようなリードフレームを用いてICの如き
電子装置を製造する方法を説明すると、まず第２
図に示した構造のリードフレームのタブ９上に半
導体ペレツトを固着し、ペレツト上面に設けられ
ている電極と各リード線の内部先端部とをコネク
タワイヤ１１でボンデイングし、かかる構成を所
定の金型に設置し、レジンを金型内に注入するこ
とによつて４で示すように素子要部、リード内部
先端部及び接続部６，８をレジンモールドする。
然るのち、タイバー部３を切断機により切断し第
２図に示す如き構成をうる。この第２図で判るよ
うに各アウターリード（外部導出リード）が互い
に又外枠フレームから分離された状態でかつ一連
の外枠フレームに接続部６（その一部がリード線
より分離されモールドされている）により支持さ
れているので、又、タブに連結する接続部８によ
つて支持されているので外部導出リード１に測定
端子を接触するだけで連続的に自動的にこのIC
の電気的特性を検査することができる。８はタブ
に接続されICペレツトの基板を電気的に外枠フ
レームに接続しかつこのペレツトを外枠フレーム
に支持するものであり測定の際の便を計つてい
る。又、上記タイバー支え部７は外部導出リード
としては寄与しないけれども、前記モールドの工
程において、圧力，加熱等によつてタイバー３が
変形するのを防止するのに有効な働きをしてい
る。更に又第１図に示すように、この支え部７の
先端部１０をタイバー３より所定の長さだけ突出
せしめておく（例えばモールド体の側壁部近くま
で突出せしめる）ことにより、レジンモールド時
にレジンがはみ出るのを防止するためのストツパ
ーの役割を果すことができ、所謂レジンバリ対策
として有効である。 To explain the method of manufacturing electronic devices such as ICs using such lead frames, we will first explain the second method.
A semiconductor pellet is fixed on the tab 9 of the lead frame having the structure shown in the figure, and the electrode provided on the upper surface of the pellet and the internal tip of each lead wire are bonded with the connector wire 11. The device is placed in a mold, and resin is injected into the mold to resin-mold the element main portion, the internal lead end portion, and the connecting portions 6 and 8 as shown at 4.
Thereafter, the tie bar portion 3 is cut using a cutting machine to obtain a structure as shown in FIG. As can be seen in FIG. 2, each outer lead (external lead-out lead) is separated from each other and from the outer frame, and is connected to a series of outer frames at the connection part 6 (part of which is separated from the lead wire and molded). Since it is supported by the connection part 8 connected to the tab, this IC is automatically and continuously connected just by touching the measurement terminal to the external lead 1.
It is possible to test the electrical characteristics of Reference numeral 8 is connected to the tab to electrically connect the substrate of the IC pellet to the outer frame and to support this pellet on the outer frame for convenience in measurement. Although the tie bar support portion 7 does not serve as an external lead, it has an effective function in preventing the tie bar 3 from deforming due to pressure, heating, etc. during the molding process. Furthermore, as shown in FIG. 1, by making the tip 10 of the support part 7 protrude from the tie bar 3 by a predetermined length (for example, protruding close to the side wall of the mold body), the resin can be easily removed during resin molding. It can act as a stopper to prevent resin from protruding, and is effective as a countermeasure against so-called resin burrs.
然るのち、接続部６，６′，８を切断しIC本本
をフレーム５，２より分離する。この時は切断機
を用いてもよいがあらかじめこれら接続部にくび
れを設けておくことにより、軽くIC本体をプレ
スするのみで分離できるようにしておくことが望
ましい。 Thereafter, the connecting portions 6, 6', 8 are cut and the IC main body is separated from the frames 5, 2. At this time, a cutting machine may be used, but it is preferable to make constrictions in these connecting parts in advance so that they can be separated by simply pressing the IC body lightly.
かくして個々に分離されたICを得ることがで
きるが、本発明によれば第４図に示すような特殊
形状のものがえられる。例えば、外部導出リード
の内１本が歯ぬけのような形態となるので、それ
を複数リード線又はICそれ自体の極性及び姿勢
表示として活用することができる。 In this way, individually separated ICs can be obtained, and according to the present invention, ICs having a special shape as shown in FIG. 4 can be obtained. For example, since one of the external leads has a tooth-like shape, it can be used to indicate the polarity and orientation of multiple lead wires or the IC itself.
なお、上記実施例では接続部８を素子ペレツト
を固定するタブと一体になつている例を説明した
が、ペレツトの基板端子が不要な場合或いは他の
外部導出リードがタブと一体に形成される場合に
は、この接続部８はタブとは分離され、他の接続
部６，６′と同様単にモールド体をIC構成部品か
ら完全に分離して外枠フレームに支持するだけの
役割をもたせてもよい。 In the above embodiment, an example was explained in which the connecting portion 8 is integrated with the tab for fixing the element pellet, but if the board terminal of the pellet is not required, or other external leads are formed integrally with the tab. In this case, this connection part 8 is separated from the tab and, like the other connection parts 6 and 6', has the role of simply completely separating the molded body from the IC components and supporting it on the outer frame. Good too.
又、接続部６，６′，８はモールド体の側面と
外枠フレームとの間の任意の位置に設ければよく
又その個数もICモールド体の大きさ，重さ等に
より任意にきめることができる。又、タイバー支
え部７の位置も複数のリード線の間の任意の位置
にきめることができる。 Furthermore, the connecting parts 6, 6', and 8 may be provided at arbitrary positions between the side surface of the molded body and the outer frame, and the number of the connecting parts can also be arbitrarily determined depending on the size, weight, etc. of the IC molded body. I can do it. Further, the position of the tie bar support portion 7 can also be determined at any position between the plurality of lead wires.
以上述べた実施例の説明から判るように、本発
明に係るリードフレーム及びそれを用いた組立方
法によれば、リード先端部の切断工程が不要とな
り切断金型が不要もしくは簡単化される。又、実
施例に説明した如く接続部を設けることによつ
て、タイバー切断後、リードフレームとレジンモ
ールド部を分離することなくICの電気的特性の
検査が可能になる。 As can be seen from the description of the embodiments described above, according to the lead frame and the assembly method using the lead frame according to the present invention, the step of cutting the lead tip portion is unnecessary, and a cutting mold is unnecessary or simplified. Further, by providing the connection portion as described in the embodiment, it is possible to inspect the electrical characteristics of the IC without separating the lead frame and the resin mold portion after cutting the tie bar.
第１図は本発明を説明するためのリードフレー
ムの要部平面図、第２図及び第３図は本発明のリ
ードフレーム及びそれを用いた組立法を説明する
ためのリードフレームの要部平面図、第４図は本
発明の一実施例によつて得られた電子部品の構造
を示すもので、ａは上面図、ｂは正面図、ｃは底
面図、ｄは左側面図、ｅは右側面図である。
１……アウターリード部、２……フレーム外枠
部、３……タイバー、４……レジンモールド部、
５……フレーム外枠部、６……接続部、７……タ
イバー支え部。
FIG. 1 is a plan view of the main part of a lead frame for explaining the present invention, and FIGS. 2 and 3 are plan views of main parts of the lead frame for explaining the lead frame of the present invention and an assembly method using the same. 4 shows the structure of an electronic component obtained by an embodiment of the present invention, in which a is a top view, b is a front view, c is a bottom view, d is a left side view, and e is a It is a right side view. 1... Outer lead part, 2... Frame outer frame part, 3... Tie bar, 4... Resin mold part,
5... Frame outer frame portion, 6... Connection portion, 7... Tie bar support portion.
Claims (1)
ードフレームであつて、そのリードフレームは、
所定間隔を保つて長手方向に延びる一対のフレー
ム外枠部５と、それらフレーム外枠部５に連接さ
れた他のフレーム外枠部２と、電子部品の実際の
信号伝達路となる有効リード及び該有効リード間
を接続するタイバーとを有し、前記有効リードは
前記タイバーを基準として前記他のフレーム外枠
部側に位置するアウターリード部分とこのアウタ
ーリード部分に連接し前記タイバーを基準として
前記他のフレーム外枠部とは反対方向に位置する
インナーリード部分とからなり、前記有効リード
と他のフレーム外枠部を一体的に保持する働きを
する支え部が前記他のフレーム外枠部と前記タイ
バーとを連接するように設けられ、前記アウター
リードの先端部が前記他のフレーム外枠部から分
離していることを特徴とするリードフレーム。1 A lead frame used for assembling resin molded electronic components, which lead frame is:
A pair of frame outer frame parts 5 that extend in the longitudinal direction with a predetermined interval maintained, another frame outer frame part 2 connected to these frame outer frame parts 5, and effective leads and leads that serve as actual signal transmission paths of electronic components. a tie bar that connects the effective leads, and the effective lead is connected to an outer lead portion located on the outer frame side of the other frame with the tie bar as a reference; An inner lead portion located in the opposite direction to the other frame outer frame portion, and a support portion that functions to integrally hold the effective lead and the other frame outer frame portion together with the other frame outer frame portion. A lead frame, which is provided so as to be connected to the tie bar, and wherein a tip end portion of the outer lead is separated from the other frame outer frame portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163978A JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13163978A JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6392887A Division JPS62252959A (en) | 1987-03-20 | 1987-03-20 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5559749A JPS5559749A (en) | 1980-05-06 |
| JPS6238863B2 true JPS6238863B2 (en) | 1987-08-20 |
Family
ID=15062750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13163978A Granted JPS5559749A (en) | 1978-10-27 | 1978-10-27 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5559749A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105867U (en) * | 1989-02-10 | 1990-08-22 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5749129A (en) * | 1980-09-09 | 1982-03-20 | Matsushita Electric Ind Co Ltd | Method of producing electronic part |
| JPS5827332A (en) * | 1981-08-11 | 1983-02-18 | Toshiba Corp | Lead frame and manufacture of semiconductor device employing the same |
| JPS58154240A (en) * | 1982-03-10 | 1983-09-13 | Hitachi Ltd | Resin sealed type semiconductor device |
| JPS58170834U (en) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | Lead frame island suspension structure |
| JPS6155349U (en) * | 1984-08-29 | 1986-04-14 | ||
| JPS62190858A (en) * | 1986-02-18 | 1987-08-21 | Mitsubishi Electric Corp | Semiconductor device |
| JPS63147832U (en) * | 1987-03-19 | 1988-09-29 | ||
| JPS62252959A (en) * | 1987-03-20 | 1987-11-04 | Hitachi Ltd | Lead frame |
| JP2803642B2 (en) * | 1996-06-27 | 1998-09-24 | 日本電気株式会社 | Semiconductor device |
| CN107845575A (en) * | 2017-11-03 | 2018-03-27 | 浙江人和光伏科技有限公司 | A kind of production method of thin slice diode |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
-
1978
- 1978-10-27 JP JP13163978A patent/JPS5559749A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105867U (en) * | 1989-02-10 | 1990-08-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5559749A (en) | 1980-05-06 |
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