JPS6228777Y2 - - Google Patents
Info
- Publication number
- JPS6228777Y2 JPS6228777Y2 JP6766482U JP6766482U JPS6228777Y2 JP S6228777 Y2 JPS6228777 Y2 JP S6228777Y2 JP 6766482 U JP6766482 U JP 6766482U JP 6766482 U JP6766482 U JP 6766482U JP S6228777 Y2 JPS6228777 Y2 JP S6228777Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting base
- cooling
- amplifier
- mounting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 34
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims 1
- 238000004512 die casting Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Description
【考案の詳細な説明】
この考案は、サーボモータなどを駆動する半導
体アンプの改良に関するものである。[Detailed Description of the Invention] This invention relates to an improvement of a semiconductor amplifier that drives a servo motor or the like.
従来、この種の装置として第１図に示すものが
あつた。 Conventionally, there has been a device of this type as shown in FIG.
図において、１は取付台で、この取付台１には
冷却フイン１ａが設けられている。そして、この
取付台１には複数のパワートランジスター８、基
板支え金具４によつて上記パワートランジスタ８
部を被うよう保持されるプリント基板５などがそ
れぞれねじ６により固定されている。７は上記取
付台１の切欠部１ｂに配設される冷却フアンで、
この冷却フアン７が回転することによつて冷却フ
イン１ａ相互の間隙を図中矢印Ａ，Ｂで示すよう
に冷却風が流れ、上記冷却フイン１ａを介して取
付台１を冷却する。２は上記取付台１の両端部に
ねじ６で止められたアンプ取付金具で、この取付
金具２によりこのアンプを制御機器の筐体などに
固着させる。 In the figure, reference numeral 1 denotes a mounting base, and this mounting base 1 is provided with cooling fins 1a. A plurality of power transistors 8 are mounted on this mounting base 1, and the power transistors 8 are mounted on the board support fitting 4.
A printed circuit board 5 and the like, which are held so as to cover the parts, are each fixed with screws 6. 7 is a cooling fan disposed in the notch 1b of the mounting base 1;
As the cooling fan 7 rotates, cooling air flows through the gap between the cooling fins 1a as indicated by arrows A and B in the figure, thereby cooling the mounting base 1 through the cooling fins 1a. Reference numeral 2 denotes amplifier mounting brackets fixed to both ends of the mounting base 1 with screws 6, and the amplifier is fixed to a casing of a control device or the like by means of the mounting brackets 2.
ところで、上記半導体アンプは基板取付金具４
やアンプ取付金具２などをそれぞれねじ６によつ
て締付固定しなければならず、組立て作業が繁雑
なものとなつていた。また、冷却フアン７が取付
台１の中央部に配設されているので冷却風が上下
両方に分かれて流れ、それだけ冷却風の流速が減
小されて冷却効果を小さなものとしていた。 By the way, the above semiconductor amplifier has board mounting bracket 4.
The amplifier mounting bracket 2 and the like must be tightened and fixed with the screws 6, respectively, making the assembly work complicated. Further, since the cooling fan 7 is disposed in the center of the mounting base 1, the cooling air flows in both upper and lower directions, and the flow velocity of the cooling air is reduced accordingly, thereby reducing the cooling effect.
この考案は、上記のような従来の欠点を除去す
るためになされたもので、基板取付部やアンプ取
付部などを取付台と共に一体的にダイカスト形成
して組立て作業を容易にするとともに、冷却フア
ンを取付台の一方の端部に配設し一方向だけに冷
却風が流れるようにして流速を増大させ、冷却効
果を大きくすることができる半導体アンプを提供
することを目的としている。 This idea was made in order to eliminate the above-mentioned drawbacks of the conventional technology.The board mounting part, amplifier mounting part, etc. are integrally die-cast together with the mounting base to facilitate assembly work, and the cooling fan mounting part is integrally formed with the mounting base. It is an object of the present invention to provide a semiconductor amplifier in which a cooling air is disposed at one end of a mounting base so that cooling air flows in only one direction, increasing the flow velocity and increasing the cooling effect.
以下、この考案の一実施例を第２図について説
明する。 An embodiment of this invention will be described below with reference to FIG.
図において、第１図と同一符号はそれぞれ同一
または相当部分を示し、これの説明を省略する。 In the figure, the same reference numerals as in FIG. 1 indicate the same or corresponding parts, and the explanation thereof will be omitted.
１ｃは基板取付部、１ｄはアンプ取付部で、こ
れらは冷却フイン１ａなどと共にダイカスト形成
されて取付台１が構成されている。そして、この
取付台１にパワートランジスター８がねじ６によ
つて締付けるとともに、プリント基板５が上記パ
ワートランジスター８部を被うよう基板取付部１
ｃのねじ６によつて締付けられている。 Reference numeral 1c denotes a board attachment part, and 1d denotes an amplifier attachment part, which are die-cast together with the cooling fins 1a and the like to form the mounting base 1. Then, the power transistor 8 is fastened to the mounting base 1 with the screws 6, and the board mounting portion 1 is attached so that the printed circuit board 5 covers the power transistor 8.
It is tightened with screw 6 of c.
また、冷却フアン７は取付台１の上端部の切欠
部１ｂに配設され、この冷却フアン７が回転する
ことによつて冷却風が冷却フイン１ａ相互の間隙
を図中矢印Ｃで示す一方向に流れ、上記冷却フイ
ン１ａを介して取付台１を冷却する。このとき、
冷却風は一方向だけに流れるので流速が大きく、
冷却効果が増大する。なお、冷却フアン７の取付
部の上面は取付台１に設けられた被い部１ｅによ
つて冷却風が上方には流れないようにされてい
る。 The cooling fan 7 is disposed in the notch 1b at the upper end of the mounting base 1, and as the cooling fan 7 rotates, the cooling air blows in one direction as shown by the arrow C in the figure. , and cools the mounting base 1 via the cooling fins 1a. At this time,
The cooling air flows in only one direction, so the flow velocity is high.
Cooling effect increases. Note that the upper surface of the mounting portion of the cooling fan 7 is prevented from flowing upward by a covering portion 1e provided on the mounting base 1.
以上のようにこの考案は、基板取付部やアンプ
取付部などが取付台と一体形成されており、かつ
冷却風が一方向に流れるように構成したので、部
品点数が減少されて組立て作業が容易になるとと
もに冷却作用が増大される効果がある。 As mentioned above, this design has the board mounting part, amplifier mounting part, etc. integrally formed with the mounting base, and is configured so that cooling air flows in one direction, reducing the number of parts and simplifying assembly work. There is an effect that the cooling effect is increased as the temperature increases.
第１図は従来の半導体アンプを示す斜視図、第
２図はこの考案の一実施例による半導体アンプを
示す斜視図である。
図において、同一符号は同一または相当部分を
示し、１は取付台、１ａは冷却フイン、１ｂは切
欠部、１ｃは基板取付部、１ｄはアンプ取付部、
５はプリント基板、６はねじ、７は冷却フアン、
８はパワートランジスターである。
FIG. 1 is a perspective view showing a conventional semiconductor amplifier, and FIG. 2 is a perspective view showing a semiconductor amplifier according to an embodiment of the invention. In the figures, the same reference numerals indicate the same or equivalent parts, 1 is the mounting base, 1a is the cooling fin, 1b is the notch, 1c is the board mounting part, 1d is the amplifier mounting part,
5 is a printed circuit board, 6 is a screw, 7 is a cooling fan,
8 is a power transistor.
Claims (1)
導体部品が取付けられた取付台と、この取付台に
配設され、取付台に設けられた冷却フインの相互
間に冷却風を送風する冷却フアンとを備えた半導
体アンプにおいて、上記半導体部品が取付けられ
る取付部、アンプ自体を制御装置などに取付ける
アンプ取付部、冷却風が流通する冷却フインがダ
イカストによつて一体形成されるとともに、上記
冷却フアンは取付台の端部に配設され、冷却風を
一方向に送風することを特徴とする半導体アン
プ。 A semiconductor amplifier that includes a mounting base on which semiconductor components such as power transistors and printed circuit boards are mounted, and a cooling fan that is installed on the mounting base and blows cooling air between the cooling fins provided on the mounting base. A mounting part to which the semiconductor component is mounted, an amplifier mounting part to which the amplifier itself is mounted to a control device, etc., and a cooling fin through which cooling air flows are integrally formed by die-casting, and the cooling fan is attached to the end of the mounting base. A semiconductor amplifier that is installed in a semiconductor amplifier and is characterized by blowing cooling air in one direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6766482U JPS58170845U (en) | 1982-05-10 | 1982-05-10 | semiconductor amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6766482U JPS58170845U (en) | 1982-05-10 | 1982-05-10 | semiconductor amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58170845U JPS58170845U (en) | 1983-11-15 |
| JPS6228777Y2 true JPS6228777Y2 (en) | 1987-07-23 |
Family
ID=30077480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6766482U Granted JPS58170845U (en) | 1982-05-10 | 1982-05-10 | semiconductor amplifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170845U (en) |
-
1982
- 1982-05-10 JP JP6766482U patent/JPS58170845U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58170845U (en) | 1983-11-15 |
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