JPS62241358A - One-time program type semiconductor device - Google Patents

Abstract

PURPOSE:To erase resins, and to improve reliability by potting an ultraviolet-ray transmitting type resin and further potting an ultraviolet-ray non-transmitting type resin onto the ultraviolet-ray transmitting type resin when an EPROM element is molded with the resins. CONSTITUTION:An EPROM element 5 is die-bonded at a predetermined position on a conductor layer 2, and electrodes 6 on the element 5 and the conductor layer 2 are connected by wires 7 for connectors through a wire bonding system. The electrodes 6 and the conductor layer 2 are wire-bonded, a potting frame 8 consisting of the quality of a material such as glass epoxy is fitted to a glass epoxy film substrate 1 by epoxy adhesives and the like in order to stop a flow on resin potting, and an ultraviolet-ray transmitting type resin 9 is potted first, and cured, thus molding the EPROM element 5. An overall byte writing test is conducted at the stage, and the possibility of writing is checked. The assembly of the element is aged by being positioned at a high temperature, and the capacity of data-hold is checked. The capacity of data-hold is checked, and data are erased by ultraviolet irradiation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of application on M beam] The present invention relates to one-time programmable medium conductor device technology, which has optical erasable and data retention characteristics in bamboo.

The present invention relates to a technology effective for one-time program type IC cards that can ensure high reliability as a result of being able to evaluate write characteristics, etc.

[Conventional technology]

Recently, one-time programming (O
A new Time Program (hereinafter simply referred to as OTP) type memory card has been proposed.

However, since the IC back cage incorporated in the conventional card is generally an EPROM element that has been punched out (sealed) by boxing with opaque resin, the charges trapped in the element's cells can be removed by ultraviolet irradiation. Test the writing characteristics in order to be unerasable,
Even if you tried to guarantee this or test the data retention characteristics and guarantee it, there was a problem that it was impossible.

For EPROMs, it is necessary to be able to write all bits and have data retention performance for all bits in order to ensure high reliability. If it cannot be done, there is a problem in terms of ensuring high reliability.

Note that tjf! is an example of a patent that describes IC cards such as memory cards. There is Japanese Patent Publication No. 59-48984.

[Problem that the invention seeks to solve]

The present invention eliminates the drawbacks of the prior art, and allows checking whether the write timeability and data retention ability are present during the M manufacturing process. Moreover, since it is erasable, it is not possible to return to the original state after checking. Is there a technology that can ensure high reliability because it can check the characteristics of the elements? : The purpose is to provide.

The above and other objects and novel features of the present invention include:
This will become clear from the description in the unclear specification and the attached drawings.

[Means for solving problems]

47. Outline of typical inventions disclosed in the investigation? A brief explanation is as follows.

That is, in the present invention, when resin molding an EPROM element, first, an ultraviolet transmitting resin is potted. Next, an ultraviolet opaque resin is further potted thereon.

[For production]

As mentioned above, first, by molding with UV-transparent resin by botting, since the resin is UV-transparent, it is possible to check the element stability, and after checking, by erasing it, it can be returned to the initial state. Then, by molding an ultraviolet opaque resin by botting, an OTP type semiconductor device that cannot be erased becomes possible.

[Example 1] Next, the invention will be described based on an example shown in the drawings.

FIG. 1 shows a cross section of an IC back cage used in the invention.

In this back cage, a conductor layer 2 made of G4 foil with a desired wiring pattern is formed on a glass epoxy substrate, and a conductor layer 2 as a lower electrode made of steel foil similar to the above conductor layer 2 is formed. 3 are electrically connected by a conductor layer 4 formed by a through-hole conductor layer forming technique. A 5ft EPROM element is die-bonded to a predetermined position on the conductor layer 2, and the electrode 6 on the element 5 and the conductor layer 2 are connected by a wire bonding method using a connector wire 7. After the wire bonding, to prevent the resin from flowing when potting the resin, a potting block 8 made of a material such as epoxy is attached to the glass epoxy film substrate 1 using an epoxy adhesive, and first, an ultraviolet transparent resin is attached. The EPROM element 5 is molded by bottling 9fjt and curing it at 9°C. At this stage, perform a test to write all bytes to check whether writing is possible.

The electronic assembly is then aged by placing it under high temperature. Then check the data retention ability. After checking, the data will be erased by UV irradiation. As a result, the storage state of the EPROM element returns to its initial state, ie, a state in which no writing has been performed.

Therefore, later writing is possible.

Next, an ultraviolet transmissive resin 1 (1 mark) is inked and molded on a different surface of the ultraviolet transmissive resin 9 so that it cannot be erased.

The ultraviolet transmitting resin 9 is a resin that transmits light having enough energy to discharge the charges trapped in the cells of the EPROM element 5, and is a transparent resin, such as an acrylic resin. Resin etc. are used.

On the other hand, the ultraviolet-transmissive resin 10 includes a DIL (Deal-In-Line) plastic package, etc. 1]! Epoxy resins, silicone resins, and the like, which are used as mold resins for 1-liquid-sealed semiconductor devices, are used.

[Example 2] Fig. 2 is a plan view of an example of an IC card, and Fig. 3 is a plan view of an example of an IC card.
Figure I-I? It is an fJ sectional view.

In the IC card shown in FIG. 2, the IC module 11 obtained in the same manner as above is incorporated. Although not shown, the card base material is provided with a recess for embedding the module, and the IC module 11 is embedded therein as shown in FIG.

The card base material is made of, for example, a center core 12 made of hard vinyl chloride, and a desired pattern 1 is printed on the front and back sides by off-cent printing or the like.
After printing 3, an oversheet 14 made of transparent hard vinyl chloride is applied to the front and back sides, and the sheets are sandwiched between two mirror-finished gold maple plates made of stainless steel or the like and heated and pressurized to obtain the desired laminate. Form a concave part. Then, the IC module 11 is attached to the center core 12 by the adhesive 15.
Obtain an IC card that is in close contact with the In addition, in Figure 2, 16
indicates a magnetic stripe.

The IC module 11 of this second embodiment has a configuration as shown in FIG. That is, on one surface of the substrate 1, together with the conductor layer 2, there is an EP rtOM element 5, a connector wire 7 between the electrode 6 on the element 5 and the conductor layer 2, a boxing frame 8, an ultraviolet transmitting resin 9, and an ultraviolet ray transmitting resin 9. A non-transmissive resin 10 is provided. On the other surface of the substrate 1, I
A conductor layer 3 that functions as an external electrode in the C card is provided, and this conductor layer 3 is connected to the page-conducting conductor layer 4 of the substrate 1.
? ! ' is electrically coupled to the conductor layer 2 through the conductor layer 2.

According to the present invention, ultraviolet transmitting resin (transparent resin) 9
After botting, we perform checks similar to normal DILG (dual in-line glass) packages, such as data retin silane (retention), and then perform UV non-transparent type (opaque resin) 1 (1' botting), so E F ROM is removed during the manufacturing process. It is possible to check the element characteristics of the element 5, and since it is coated with an ultraviolet opaque resin 10, it can be used as an OTP type I type upper C module that cannot be erased.
TP type IC cards can be obtained, and these can be checked (as described above), and have been checked, so they have a high degree of trust.

Although the invention made by the non-inventor has been specifically explained based on the examples above, the present invention is not limited to the above examples, and has undergone many changes without departing from the gist of the invention.
Needless to say, he is highly skilled.

For example, in the above embodiment, a non-UV transparent resin is potted and coated on top of a UV transparent resin. It may be stored in a container that can prevent UV rays from being erased, or any other non-erasable form may be used, such as using a cap so that it cannot be erased by ultraviolet rays.

In the above explanation, the IC module of the present invention is
Although the case where the present invention is applied to a C (plastic leadless chip carrier) package has been described, it is not applicable to an LCC back cage using ceramic.

Also, the IC card in the present invention refers to an IC module (chip) such as a micro combinator or memory? : A general term for cards that are installed or built-in, such as chip cards, memory cards, microcomputer cards, electronic cards, etc., and includes various types of cards in addition to memory cards.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In the present invention, the resin can be erased by forming the resin into a two-layer structure, such as an inner and outer layer, and a highly reliable OTP type semiconductor device has been obtained.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional structural view showing an example of a back cage showing an embodiment of the present invention, Fig. 2 is a plan view showing an example of an IC card, and Fig. 3 is a cross-sectional structural view showing an example of an IC card.
It is a sectional view taken along the line I-I in FIG. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Conductor layer, 3... Lower electrode, 4
...Through hole, 5...E L? ROM element,
6...11 poles, 7...Connector wire, 8...
Boxing frame, 9... Ultraviolet transparent resin, 10.
...Ultraviolet opaque resin, 11...Ic back cage (module), 12...Center core, 13...Picture, 14...Oversheet, 15...Adhesive, 1
6...Magnetic stripe.

Claims (1)

[Scope of Claims] 1. A one-time program semiconductor device characterized in that an EPROM element is covered with an ultraviolet-transmissive resin and an ultraviolet-opaque resin formed thereon. 2. After coating the EPROM element with an ultraviolet-transmitting resin, check the element characteristics of the device assembly, and then further coating the surface of the ultraviolet-transmitting resin with a non-UV-transmitting resin, or A one-time programmable semiconductor device that uses a package in which an assembled product is housed in a container that prevents ultraviolet rays from entering from the outside. 3. The one-time programmable semiconductor device according to claim 2, wherein each resin coating is performed by botting.