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JPS62170698U - - Google Patents

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Publication number
JPS62170698U
JPS62170698U JP5869686U JP5869686U JPS62170698U JP S62170698 U JPS62170698 U JP S62170698U JP 5869686 U JP5869686 U JP 5869686U JP 5869686 U JP5869686 U JP 5869686U JP S62170698 U JPS62170698 U JP S62170698U
Authority
JP
Japan
Prior art keywords
shield
copper foil
board
circuit boards
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5869686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5869686U priority Critical patent/JPS62170698U/ja
Publication of JPS62170698U publication Critical patent/JPS62170698U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguide Connection Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示す縦断正面図
、第2図はシールド板の底面図、第3図は従来の
シールド装置の縦断正面図である。 9a,9b…回路基板、11a,11b…パタ
ーン面、13…シールド板、15,16…銅箔、
17…基板配線。
FIG. 1 is a longitudinal sectional front view showing an embodiment of this invention, FIG. 2 is a bottom view of a shield plate, and FIG. 3 is a longitudinal sectional front view of a conventional shielding device. 9a, 9b... Circuit board, 11a, 11b... Pattern surface, 13... Shield plate, 15, 16... Copper foil,
17... Board wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の回路基板をシールドすべく配置されたシ
ールド板を、その両面に夫々銅箔を施したプリン
ト板に形成し、回路基板のパターン面に対向する
該シールド板の上記一方の銅箔に、該回路基板を
相互に結合するための基板配線を設けたことを特
徴とするシールド装置。
A shield plate arranged to shield a plurality of circuit boards is formed on a printed board with copper foil applied on both sides, and the copper foil on one of the shield plates facing the patterned surface of the circuit board is coated with copper foil. A shield device characterized by having board wiring for interconnecting circuit boards.
JP5869686U 1986-04-21 1986-04-21 Pending JPS62170698U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5869686U JPS62170698U (en) 1986-04-21 1986-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5869686U JPS62170698U (en) 1986-04-21 1986-04-21

Publications (1)

Publication Number Publication Date
JPS62170698U true JPS62170698U (en) 1987-10-29

Family

ID=30889492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5869686U Pending JPS62170698U (en) 1986-04-21 1986-04-21

Country Status (1)

Country Link
JP (1) JPS62170698U (en)

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