JPS62169439A - Holder - Google Patents

Abstract

PURPOSE:To hold a semiconductor wafer steadily without a damage by holding two points of a circumferential part of the semiconductor wafer by two supporting parts from the both sides. CONSTITUTION:A circumferential part 22 of a semiconductor wafer 21 is inserted in a groove 6a formed in a first supporting part 6 by grasping a hand grip 5. Next, a hand grip 13is pulled up with fingers so that a guiding part 4 guides a movable part 12 upward, in other words, it is pulled up in a direction of arrow B. Then, a second supporting part 14 is also pulled up unitarily and a part of the circumferential of the semiconductor wafer 21 is fitted in a groove 14a. If a holder 1 is lifted up while holding the hand grips 5 and 13, the semiconductor wafer 21 is lifted up unitarily.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor wafer holder suitable for use in semiconductor integrated circuit manufacturing processes and the like.

[Conventional technology]

Semiconductor integrated circuits (hereinafter referred to as ICs) are formed on semiconductor wafers, and the manufacturing process for ICs is complex and diverse. During this period, the semiconductor wafer may be subjected to a predetermined process every 10th wafer, and once every 10th wafer is processed.
In some cases, each sheet is extracted from the carrier and subjected to a predetermined process. For example, the above operations are required when wafer charging is performed during oxidation and diffusion processes, and when handling individual wafers during transverse strain processes.

In such a case, conventionally, the semiconductor wafer was held using a VINCEFTRA as shown in Japanese Utility Model Publication No. 53-48591, and predetermined transfers and the like were performed.

Furthermore, a vacuum binsect is also used, which uses air suction from an air compressor to vacuum-suction the side surface of a semiconductor wafer, and holds the semiconductor wafer by this suction.

On the other hand, the diameter of semiconductor wafers has gradually become larger in order to improve the yield of ICs, combined with improvements in device process technology. For example, conventionally the diameter was 75
Previously, the diameter was about 150 mm, but recently the diameter has increased to 150 mm, and memory ICs in particular are often formed on 150 mm semiconductor wafers.

As semiconductor wafers become larger in diameter, their weight also increases.

[Problem that the invention seeks to solve]

According to the inventor's study, retention by Vinsect:
It has been found that both sides of the semiconductor wafer are easily scratched, and since the semiconductor wafer is supported at one point, it is difficult to stably hold the semiconductor wafer if it has a large diameter and a large M amount.

As for the vacuum tweezers (y), it has become clear that because the vacuum suction force is weak, unforeseen accidents such as falling while holding the tweezers are likely to occur.

In other words, any of the above-mentioned holders cannot stably hold a large diameter and heavy semiconductor wafer.

Even if a semiconductor wafer is slightly scratched by the tweezers, it will be difficult to form a good ICY on that part, resulting in a decrease in yield.

In addition, if the semiconductor wafer is held unstable, not only will the semiconductor wafer be cracked or chipped due to a fall, but a portion of the semiconductor wafer may also hit another object, causing accidents such as cracking or chipping.

An object of the present invention is to provide a semiconductor wafer holder that can stably hold a large diameter and heavy semiconductor wafer without damaging it.

The above and other objects and novel features of the present invention will become apparent from the description and accompanying drawings.

Means for Solving Problem L] Outline of typical inventions disclosed in this application! Briefly stated, it is as follows.

That is, a first support body is formed with a support part that supports the outer edge of the semiconductor wafer at one end of the outside of a cylinder serving as a guide part, and a movable part consisting of a rod-shaped body that is moved within the cylinder body by finger operation. and a second support member formed with a support portion that supports the outer edge portion of the semiconductor wafer, and the second support portion supports the outer door portion of the semiconductor wafer. : Two points are supported.

[Effect]

According to the above-mentioned means, the outside of the semiconductor wafer is 2 parts.
Since the points can be clamped and stably held by the support parts 2, the inventive objective of stably holding the semiconductor wafer without damaging it can be achieved.

〔Example〕

Hereinafter, an embodiment of a semiconductor wafer holder to which the present invention is applied will be described with reference to FIGS. 1 and 2. The drawings show the structure of the holder and the manner in which the semiconductor wafer is held.

The main feature of the embodiment is that the outer edge of the semiconductor wafer is supported at two points so that the NL'C can be stably held.

The holder 1 includes a first support 2 and a second support 11.

First, regarding the first support body 1, an annular handle 5 is integrally formed at one end of a cylindrical guide portion 4. As shown in FIG. These may be integrally molded from synthetic resin.

The first support portion 6 is made of quartz glass and is fixed to the outside of the cylindrical guide portion 4 .

As shown in FIG. 2, a groove 6a is formed in the first support portion 6, and as shown in FIG.
It is formed so as to support a part of the outer edge 22 of 1.

Next, referring to the second support part 11, the movable part 12 is formed into a rod shape, and one end of the movable part 12 is provided with a movable part 12.
A handle 13 is formed for moving the device 2 in the vertical direction, in other words, in the direction of the arrow BB'. In addition, at the other end of the movable part, in other words, at the lower end shown in the figure,
A second support portion 14 made of quartz glass is fixed.

As shown in FIG. 2, the second support portion 14 has a groove 14a formed therein so as to partially support the outer edge portion 22 of the semiconductor wafer 21. As shown in FIG.

Next, a method of using the holder 1 will be described.

Holding the handle 5, fit the outer edge 22' of the semiconductor wafer 21 into the groove 6a formed in the first support part 6. On this occasion,
Since the handle 13 remains lowered, the second support portion 14 is in the position shown by the dotted line. At this point, if we further consider the position of the second support part 14, since a part of the semiconductor wafer 21 is fitted into the groove 6a, the second support part 14 is located at the position indicated by the arrow C in FIG. It does not move significantly in the direction shown.

If it were to move, the outer edge 22 in contact with the groove 6a would be cracked or chipped.

That is, by fitting the support portion 6aY in FIG. 1 as described above, the position of the second support portion 14 is automatically set.

Next, when the handle 13 is pulled upward as shown in the figure with a finger, the movable part 12 is guided by the guide part 4 and pulled upward, in other words, in the direction of arrow B. Then, the second support portion 14 is also pulled up, and a portion of the outer edge portion 22 of the semiconductor wafer 21 is fitted into the groove 14a.

At this point, the holding of the semiconductor wafer 21 is completed, and by lifting the holder 17a/upward while holding the handle 5 1:11, the semiconductor wafer 21 is lifted together with the holder 17a.

What should be noted here is that the semiconductor wafer 21 is
This is supported by two points.

Furthermore, the semiconductor wafer 21 is clamped from two opposing directions by the force of lifting the handle 13. Therefore, the semiconductor wafer 21 does not come off from the holder 1 and is stably held.

What should be further noted is that no part of the holder 1 is in contact with the flat surface of the semiconductor wafer 21. Although a portion of the outer periphery of the semiconductor wafer 21 slightly contacts the first and second support portions 6.14, the contact position is originally outside the usage category during IC formation.

Therefore, when the usage section of the semiconductor wafer 21 is held as described above, undesired scratches are not caused, and the yield of ICs is improved.

(11 A first support part supports a part of the outer edge of the semiconductor wafer, and a second support part whose distance can be controlled with respect to the first support part supports another part of the outer edge of the semiconductor wafer. By doing so, it is possible to obtain the effect that the semiconductor wafer can be held securely by supporting the semiconductor wafer at two points.

121 According to +11 above, it is possible to prevent an undesirable accident such as a semiconductor wafer falling when transferring a semiconductor wafer or the like.

+31 According to the above (11), the holder does not come into contact with the IC-forming section of the semiconductor wafer, and damage to the semiconductor wafer can be reduced.5 Effects such as improving the product yield can be obtained.

(41 When a part of the outer edge of the semiconductor wafer is supported by the first support part, the position of the support part W and 2 is automatically set, and then the second support part moves while being guided by the guide part. With this structure, the holding work can be carried out quickly, thereby improving work efficiency.

[51 Since the distance between the first support part and the second support part can be changed to a desired distance by the guide part and the movable part, it can be used for various semiconductor wafers regardless of the size of the semiconductor wafer 1 to be held.・The effect of improving the utilization of the holder is achieved by not holding the holder.

Although the invention made by the non-inventor has been specifically explained based on the examples above, the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say.

For example, the groove 6a * 14a is a semiconductor wafer.
It can be formed into an arc shape to match the thickness of the bag. In this case, the semiconductor wafer 1 will not be displaced in the left-right direction shown in FIG. 1 (and the semiconductor wafer 1 can be held even more reliably).

The guide portion and the moving portion may be formed to have a rectangular cross section. In this case, rotation of the movable part and the second support part is prevented, and the positioning of the second support part becomes even better.

In addition, a nitrogen suction hole may be formed in, for example, the first support part of the above-mentioned holder, and vacuum suction may be performed simultaneously with the above-mentioned two-point support.

〔effect〕

What effects can be obtained by typical inventions disclosed in this application? : A brief explanation is as follows.

That is, since the semiconductor wafer can be supported by two points on the outer edge, the semiconductor wafer can be held securely and the vortex vi of the semiconductor wafer will not be formed.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a semiconductor wafer holder showing an embodiment of the invention, and FIG. 2 is a sectional view taken along the line A-X in FIG. 1. DESCRIPTION OF SYMBOLS 1... Holder, 2... First support body, 4... Guide part, 5... Handle, 6... First support part, 11...
Second support body, 12...Movable part, 14...Second support part, 21...Semiconductor wafer, 22...Outer edge of semiconductor wafer.

Claims (1)

[Claims] 1. (1) a first support body provided with a first support part that supports the outer edge of a semiconductor wafer and a guide part; (2) a movable part guided by the guide part; and a second support member provided with a second support part formed at one end of the movable part and whose distance from the first support part is controlled to a desired distance; A holder characterized in that an outer edge portion of the semiconductor wafer is clamped and held by a second support portion.