JPS62146230A - Copper alloy for spring - Google Patents
Copper alloy for springInfo
- Publication number
- JPS62146230A JPS62146230A JP28548385A JP28548385A JPS62146230A JP S62146230 A JPS62146230 A JP S62146230A JP 28548385 A JP28548385 A JP 28548385A JP 28548385 A JP28548385 A JP 28548385A JP S62146230 A JPS62146230 A JP S62146230A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- spring
- stress relaxation
- copper alloy
- balance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（目 的）
本発明は、電子・電気機器の端子、コネクター、スイッ
チ等に使用するばね用銅合金に関するものである。[Detailed Description of the Invention] (Object) The present invention relates to a copper alloy for springs used in terminals, connectors, switches, etc. of electronic and electrical equipment.
（従来技術及び問題点）
従来、電子・電気機器の端子、コネクター、スイッチ等
のばね材には、洋白、りん青銅、黄銅などが使用されて
いる。これらばね材に、は以下のことが要求されている
。(Prior Art and Problems) Conventionally, materials such as nickel silver, phosphor bronze, and brass have been used as spring materials for terminals, connectors, switches, etc. of electronic and electrical equipment. These spring materials are required to:
（１）強度が高いこと
（２）耐応力緩和特性に優れていること（３）電気伝導
度が高いこと
（４）耐食性に優れていること
（５）安価であること
」二記洋白は強度が高く、耐応力緩和特性に優れ、電気
伝導度が高く、しかも耐食性に優れているため、高級ば
ね材として高信頼性が要求される機器に多く使用されて
いる。しかし近年、機器の小型化、軽量化と共に、低シ
ス１〜化の要望が強く、洋白と同程度のばね特性をもち
しかも洋白より安価な材料が望まれていた。(1) It has high strength (2) It has excellent stress relaxation properties (3) It has high electrical conductivity (4) It has excellent corrosion resistance (5) It is inexpensive Because it has high strength, excellent stress relaxation resistance, high electrical conductivity, and excellent corrosion resistance, it is often used as a high-grade spring material in equipment that requires high reliability. However, in recent years, as equipment has become smaller and lighter, there has been a strong demand for lower cis.
（構 成）
本発明は、この様な状況に鑑みて研究を行った結果、Ｚ
ｎ２０−４０ｗｔ％、Ｎｉ２−１０ｗｔ％、Ｍ ｎ
ｌ 〜ｌ Ｏｗ ｔ ％、 Ｓｎ０．０１〜３ｗｔ％を
含み、残部Ｃｕ及び不可避的不純物からなるばね用銅合
金、並びにＺｎ２０〜４０ｗｔ％、Ｎｉ２−１０ｗｔ％
、Ｍ ｎ １〜１０ ｗ ｔ％、ＳｎＯ，０１〜３ｗし
％及び他にＴｅ、Ｃｒ、Ｃｏ、Ｚｒ、Ｖ、Ｂｅ、Ｃｄ、
Ａｓ、Ｐの内１種又は２種以上を０．０１〜３ｗｔ％含
み、残部Ｃｕ及び不可避的不純物からなるばね用銅合金
を提供するものである。(Structure) As a result of research conducted in view of this situation, the present invention is based on the Z
n20-40wt%, Ni2-10wt%, Mn
Copper alloy for springs containing l~l Owt%, Sn0.01~3wt%, balance Cu and unavoidable impurities, and Zn20~40wt%, Ni2-10wt%
, Mn 1-10 wt%, SnO, 01-3wt% and others Te, Cr, Co, Zr, V, Be, Cd,
The present invention provides a copper alloy for springs containing 0.01 to 3 wt% of one or more of As and P, with the balance being Cu and inevitable impurities.
（発明の詳細な説明）
次に本発明合金を構成する合金成分及び内容の限定理由
について説明する。(Detailed Description of the Invention) Next, the reasons for limiting the alloy components and contents constituting the alloy of the present invention will be explained.
Ｃｕ及びＺｎは本発明合金の基本成分であり、加工性、
機械的性質、及び電気伝導性を良好に保有せしめる。Ｚ
ｎ含有量を２０〜４０ｗｔ％とする理由は、Ｚｎ含有
量が２０ｗｔ％未満では強度が」分ではなく、Ｚｎ含有
量が４０ｗｔ％を超えると加工性が劣化する為である。Cu and Zn are the basic components of the alloy of the present invention, and improve workability,
It maintains good mechanical properties and electrical conductivity. Z
The reason why the n content is set to 20 to 40 wt% is that if the Zn content is less than 20 wt%, the strength will be insufficient, and if the Zn content exceeds 40 wt%, the workability will deteriorate.
Ｎｉ含イＴｍを２〜１０ｗし％とする理由は、Ｎｉ含有
量が２ｗｔ％未満では強度及び耐食性が十分でなく、Ｎ
ｉ含有量が１０ｗｔ％を超えると加工性が悪くなり、又
価格も高くなるためである。The reason why the Ni-containing Tm is set at 2 to 10 w% is that if the Ni content is less than 2 wt%, the strength and corrosion resistance are insufficient, and the N
This is because if the i content exceeds 10 wt%, processability will deteriorate and the price will also increase.
Ｍｎを添加するのは、Ｎｉよりも安価で、かつ強度を向
上させるため一部Ｎｉの代替材として使用でき、しかも
熱間加工性を向上させるからである。The reason for adding Mn is that it is cheaper than Ni, can be used as a partial substitute for Ni in order to improve strength, and also improves hot workability.
Ｍｎ含有量を１〜１０ｗｔ％とする理由は、Ｍｎ含有に
が１ｗｔ３未満では強度及び熱間加工性の向上の効果が
認められず、又Ｍｎ含有量が１０ｗｔ％を超えると逆に
加工性が悪化するためである。Ｓｎを添加するのは、強
度及び耐食性を向上させるためであり、Ｓｎ含有量を０
．０１〜３ｗｔ％とする理由は、Ｓｎ含有量がＯ，０１
ｗｔ％未満では強度及び耐食性の向上が認められず、Ｓ
ｎ含有量が３ｗｔ％を超えると加工性が悪化し、又価格
も高くなるためである。The reason why the Mn content is set to 1 to 10 wt% is that if the Mn content is less than 1 wt3, the effect of improving strength and hot workability is not recognized, and if the Mn content exceeds 10 wt%, the workability is adversely affected. This is because it gets worse. The purpose of adding Sn is to improve strength and corrosion resistance, and the Sn content is reduced to 0.
．． The reason why the Sn content is O, 01 to 3 wt% is that
If it is less than wt%, no improvement in strength or corrosion resistance is observed, and S
This is because if the n content exceeds 3 wt%, processability deteriorates and the price also increases.
さらに副成分としてＴｅ、Ｃｒ、、Ｃｏ、Ｚｒ、Ｖ、Ｂ
ｅ、Ｃｄ、Ａｓ、Ｐを添加するのは、強度及び耐食性を
向上させるからである。Furthermore, Te, Cr, Co, Zr, V, B as subcomponents
The reason for adding e, Cd, As, and P is that they improve strength and corrosion resistance.
これら副成分の内１種若しくは２種以上を０゜０１〜３
ｗｔ％とする理由は、０．０１ｗｔ％未満では強度及び
耐食性の向上の効果が認められず。One or more of these sub-ingredients at 0°01-3
The reason why it is set as wt% is that if it is less than 0.01 wt%, the effect of improving strength and corrosion resistance is not recognized.
又３ｗｔ％を超えると加工性が劣化するからである。Moreover, if it exceeds 3 wt%, workability deteriorates.
（実施例） 次に本発明合金の実施例を説明する。(Example) Next, examples of the alloy of the present invention will be described.
第１表に示す詣組成の合金を溶製し、熱間圧延及び適宜
焼鈍を加えなから冷間圧延により厚さ０．３ｍの板とし
た。An alloy having the composition shown in Table 1 was melted, hot-rolled, appropriately annealed, and then cold-rolled to form a plate with a thickness of 0.3 m.
これら供試材について引張特性及び応力緩和特性を調査
した。応力緩和特性は、１５０℃、大気中で、耐力の８
０％を負荷して１０００ｈ後の応力緩和特性を％で評価
した。又コスト（地合せ価格）についても検討を行った
。The tensile properties and stress relaxation properties of these test materials were investigated. The stress relaxation property is 8% of the yield strength at 150℃ in the atmosphere.
The stress relaxation characteristics after 1000 hours under a load of 0% were evaluated in %. We also considered the cost (agreement price).
第１表から明らかな様に、比較合金の中ではＮ１、Ｍｎ
及びＳｎ含有量の多いものは引張特性、耐応力緩和特性
は良好であるが、コストが高いことがわかる。又、それ
以外のものは安価であるが、引張特性、耐応力緩和特性
が劣る。As is clear from Table 1, among the comparative alloys, N1, Mn
It can be seen that those with a high Sn content have good tensile properties and stress relaxation resistance, but are expensive. Other materials are inexpensive, but have poor tensile properties and stress relaxation resistance.
これに対して本発明合金は、いずれも引張特性、耐応力
緩和特性が優れ、しかも安価であることがわかる。又、
副成分を添加することにより、引張特性、耐応力緩和特
性がさらに向上することがわかる。In contrast, it can be seen that the alloys of the present invention have excellent tensile properties and stress relaxation resistance, and are inexpensive. or,
It can be seen that the addition of subcomponents further improves the tensile properties and stress relaxation resistance.
（効 果）
以上の様に本発明合金は、十分な機械的強度、耐応力緩
和特性を有し、しかも安価であることから、ばね用銅合
金として電子・電気機器の端子、コネクター、スイッチ
等に最適である。(Effects) As described above, the alloy of the present invention has sufficient mechanical strength, stress relaxation resistance, and is inexpensive, so it can be used as a copper alloy for springs in terminals, connectors, switches, etc. of electronic and electrical equipment. Ideal for
以下余白Margin below
Claims (2)
ｎ１〜１０ｗｔ％、Ｓｎ０．０１〜３ｗｔ％を含み、残
部Ｃｕ及び不可避的不純物からなるばね用銅合金。(1) Zn20-40wt%, Ni2-10wt%, M
A copper alloy for springs containing 1 to 10 wt% of n, 0.01 to 3 wt% of Sn, and the balance being Cu and unavoidable impurities.
ｎ１〜１０ｗｔ％、Ｓｎ０．０１〜３ｗｔ％及び他にＴ
ｅ、Ｃｒ、Ｃｏ、Ｚｒ、Ｖ、Ｂｅ、Ｃｄ、Ａｓ、Ｐの内
１種又は２種以上を０．０１〜３ｗｔ％含み、残部Ｃｕ
及び不可避的不純物からなるばね用銅合金。(2) Zn20-40wt%, Ni2-10wt%, M
n1~10wt%, Sn0.01~3wt% and other T
Contains 0.01 to 3 wt% of one or more of e, Cr, Co, Zr, V, Be, Cd, As, P, and the balance is Cu
Copper alloy for springs consisting of and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28548385A JPS62146230A (en) | 1985-12-20 | 1985-12-20 | Copper alloy for spring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28548385A JPS62146230A (en) | 1985-12-20 | 1985-12-20 | Copper alloy for spring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62146230A true JPS62146230A (en) | 1987-06-30 |
Family
ID=17692101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28548385A Pending JPS62146230A (en) | 1985-12-20 | 1985-12-20 | Copper alloy for spring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62146230A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6627011B2 (en) | 2000-04-14 | 2003-09-30 | Dowa Mining Co., Ltd. | Process for producing connector copper alloys |
| US6949150B2 (en) | 2000-04-14 | 2005-09-27 | Dowa Mining Co., Ltd. | Connector copper alloys and a process for producing the same |
-
1985
- 1985-12-20 JP JP28548385A patent/JPS62146230A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6627011B2 (en) | 2000-04-14 | 2003-09-30 | Dowa Mining Co., Ltd. | Process for producing connector copper alloys |
| US6949150B2 (en) | 2000-04-14 | 2005-09-27 | Dowa Mining Co., Ltd. | Connector copper alloys and a process for producing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60245754A (en) | High strength copper alloy having high electric conductivity | |
| JPS592730B2 (en) | Spinodal copper-nickel-tin alloy | |
| JPH06184679A (en) | Copper alloy for electrical parts | |
| US5041176A (en) | Particle dispersion-strengthened copper alloy | |
| JPH0830235B2 (en) | Copper alloy for conductive spring | |
| JPS6326320A (en) | High power conductive copper alloy | |
| JPH03111529A (en) | High-strength and heat-resistant spring copper alloy | |
| JPS62146230A (en) | Copper alloy for spring | |
| JPS60245752A (en) | High strength copper alloy having high electric conductivity | |
| JPS63213628A (en) | Copper alloy for fuse | |
| JP2722401B2 (en) | Highly conductive copper alloy for electrical and electronic component wiring with excellent migration resistance | |
| JPS63230837A (en) | Copper alloy for fuse | |
| JPS6086231A (en) | High-strength conductive copper alloy | |
| JPH04231433A (en) | Electrifying material | |
| JPH04231432A (en) | Electrifying material | |
| CN1069289A (en) | High strength elastic material of copper-base alloy | |
| JPS6140019B2 (en) | ||
| JPH089745B2 (en) | Copper-based alloy for terminals | |
| JPS62227071A (en) | Manufacture of high strength, electrically conductive copper alloy | |
| JPH0676630B2 (en) | Copper alloy for wiring connector | |
| JPH0499838A (en) | Conductive material | |
| JPS62243750A (en) | Manufacture of copper alloy excellent in property of proof stress relaxation | |
| JPH03285035A (en) | High strength copper alloy excellent in migration resistance | |
| JPH01168831A (en) | Electric conductive material | |
| JPS60174841A (en) | Phosphor-bronze for electronic and electrical instrument |