JPS6212189A - Manufacture of printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed wiring board, and particularly to a method for manufacturing a printed wiring board provided with noble metal plating.

(Prior Art) Conventionally, printed wiring boards have wiring formed by electroless plating or the like, and areas that are particularly prone to wear are electroplated with a noble metal such as gold.

To electroplate precious metals, special wiring for electroplating precious metals is provided on the insulating substrate in addition to normal wiring.

When the arrangements 1122 and 23 are provided on both sides of the insulating substrate 21, as shown in FIG. 21 to an outer peripheral portion 26. After plating precious metals using these precious metal platings F224 and F25, the outer peripheral portion 26 is cut off!
It was cut and removed by punching etc. at JIlj127.

(Problem to be Solved by the Invention) However, if the connectors 28 and 29 plated with precious metals are on both sides, if punched from one direction, as shown in FIG. The precious metal plated wire 25 connected to the connector 29 on the receiving surface has the disadvantage that it becomes crisp at the cut surface.

An object of the present invention is to provide a method for manufacturing a printed wiring board that can improve the above-mentioned drawbacks and eliminate burrs on the cut surface of a plated wire for precious metals.

(Means for Solving the Problems) In order to achieve the above object, the present invention electroplates a precious metal with a precious metal plating wire provided on both sides of an insulating substrate, and then the precious metal plating wire is In a method of manufacturing a printed wiring board that removes metal, the insulating substrate has through holes installed on both sides of the board to which precious metal plated wires can be connected, and after electroplating the precious metal, a larger hole is made at the through hole location. The present invention provides a method for manufacturing a printed wiring board, characterized in that the noble metal plated wires provided on both surfaces are disconnected.

(Function) According to the present invention, after the precious metal is electroplated, a larger hole is provided at the through hole to which the precious metal plated wire is connected, and the precious metal plated wire is disconnected. There is no need to remove the precious metal plated wire provided on one side of the metal plate.

Also, the precious metal plated wire on one side does not need to be extended to the edge of the insulating board, so it will not be removed when removing the precious metal plated line on the other side. Therefore, it is possible to prevent particles from remaining on the cut surface of the insulating substrate.

<Example) Embodiments of the present invention will be described below based on the drawings.

First, as shown in Fig. 1, a predetermined arrangement is applied to an insulating substrate 1 such as a paper phenol tree board or a epoxy resin laminate by electroless plating or the like. 2 and 3 and noble metal plated wires 4 and 5 are provided. In particular, the noble metal plating wire 4 is provided up to the outer periphery of the insulating substrate 1, but it is a precious metal plating! a5 are not provided on the outer periphery, but are connected to each other via through holes 6.

Next, this insulating substrate 1 is immersed in a precious metal plating solution such as gold.
Connect the electrodes to the precious metal plated wires, turn on the current, and as shown in FIG.
Set 0.

After forming the metal platings 8 and 9, as shown in FIG.
A through hole 6 connecting the precious metal plated wires 4 and 5 is removed by providing a hole 11 with a larger diameter than the through hole 6, and the precious metal plated wires 4 and 5 and their connection are cut off.
Line.

After forming the hole 11, the insulating substrate 1 is pressed at the cutting point 12 to cut and remove the outer peripheral portion 13 as shown in FIG.

When the outer circumferential portion 13 is cut and removed at the cutting point 12, the noble metal plated wire 4 is cut in the middle and removed together with the outer circumferential portion 12, but the noble metal plated wire 5 is connected to the noble metal plated wire 4 through the through hole 6. The outer peripheral part 1
Since it is not provided in 2, it is not cut. Therefore,
The cut portion 14 of the precious metal plated wire 4 is cut without becoming crisp.

Further, the through hole 6 is removed by the hole 11, and the noble metal plating l1i4 and l1i5 and their connections can be disconnected. Moreover, since the diameter of the hole 11 is larger than that of the through hole 6, the wire can be disconnected reliably.

<Effects of the Invention> As described above, according to the present invention, since the noble metal plating wire can be provided on only one side of the outer peripheral portion of the insulating substrate and plating can be performed on both sides, even if the precious metal plating wire is cut, flash will not occur. A method of manufacturing a printed wiring board without any problem can be obtained.

[Brief explanation of the drawing]

Figures 1 to 4 show the manufacturing process of an embodiment of the present invention. Figure 1 is a plan view of an insulating substrate with wiring, Figure 2 is a plan view of an insulating substrate plated with a noble metal, and Figure 3 is a plan view of an insulating substrate plated with a noble metal. Fig. 4 is a plan view of an insulating board with holes cut and removed, Fig. 5 is a plan view of a conventional printed wiring board, and Fig. 6 is a plan view of an insulating board after cutting and removing the outer periphery. 1 shows a plan view of a conventional printed wiring board. 1... Insulating substrate, 4.5... Plated wire for precious metals,
6...Through hole, 9.10...Metal plating,
11...hole, 12...outer peripheral part. Brass 1 Figure Brass 2 Circle Rod 3 Flash

Claims (1)

[Claims] (1) In a method for manufacturing a printed wiring board in which a precious metal is electroplated using a noble metal plated wire provided on both sides of an insulating substrate, and then the noble metal plated wire is removed, the noble metal plated on both sides of an insulated substrate is removed. It has a through hole to which a plated wire for precious metal can be connected, and after electroplating a precious metal, a larger hole is provided at the through hole to disconnect the plated wire for precious metal provided on both sides. A method for manufacturing printed wiring boards.