JPS62124835U - - Google Patents
Info
- Publication number
- JPS62124835U JPS62124835U JP1247886U JP1247886U JPS62124835U JP S62124835 U JPS62124835 U JP S62124835U JP 1247886 U JP1247886 U JP 1247886U JP 1247886 U JP1247886 U JP 1247886U JP S62124835 U JPS62124835 U JP S62124835U
- Authority
- JP
- Japan
- Prior art keywords
- multilayer capacitor
- mounting surface
- ceramic chip
- internal electrodes
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 3
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は、この考案の一実施例に係る高周波用
積層コンデンサを示す概略断面図である。第２図
は、この考案の他の実施例に係る高周波用積層コ
ンデンサを示す概略断面図である。第３図は、従
来の高周波用積層コンデンサの一例を示す概略断
面図である。
２……セラミツクチツプ、３……内部電極、５
……プリント基板、１０……この考案に係る高周
波用積層コンデンサ、Ｓ……装着面。
FIG. 1 is a schematic cross-sectional view showing a high-frequency multilayer capacitor according to an embodiment of this invention. FIG. 2 is a schematic sectional view showing a high frequency multilayer capacitor according to another embodiment of the invention. FIG. 3 is a schematic cross-sectional view showing an example of a conventional high-frequency multilayer capacitor. 2... Ceramic chip, 3... Internal electrode, 5
... Printed circuit board, 10 ... Multilayer capacitor for high frequency according to this invention, S ... Mounting surface.
Claims (1)
る積層コンデンサであつてセラミツクチツプの内
部電極面に沿う一側面を当該コンデンサのプリン
ト基板等への装着面とするものにおいて、前記内
部電極を前記装着面側に片寄らせて配置している
ことを特徴とする高周波用積層コンデンサ。 In a multilayer capacitor in which internal electrodes are embedded in a ceramic chip, and one side of the ceramic chip along the internal electrode surface is the mounting surface of the capacitor to a printed circuit board, etc., the internal electrodes are mounted on the mounting surface side. A high-frequency multilayer capacitor characterized by being arranged in a biased manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1247886U JPS62124835U (en) | 1986-01-29 | 1986-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1247886U JPS62124835U (en) | 1986-01-29 | 1986-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124835U true JPS62124835U (en) | 1987-08-08 |
Family
ID=30800642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1247886U Pending JPS62124835U (en) | 1986-01-29 | 1986-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124835U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203165A (en) * | 2005-01-20 | 2006-08-03 | Samsung Electro Mech Co Ltd | Laminated chip capacitor |
| JP2014033097A (en) * | 2012-08-03 | 2014-02-20 | Tdk Corp | Multilayer ceramic capacitor |
| JP2016058753A (en) * | 2013-07-22 | 2016-04-21 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein |
| JP2018061058A (en) * | 2012-09-27 | 2018-04-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer chip electronic component, mounting board and package thereof |
| JP2019047109A (en) * | 2017-08-29 | 2019-03-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite electronic component and mounting board thereof |
| WO2020170545A1 (en) * | 2019-02-22 | 2020-08-27 | パナソニックＩｐマネジメント株式会社 | Varistor and method for producing same |
-
1986
- 1986-01-29 JP JP1247886U patent/JPS62124835U/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203165A (en) * | 2005-01-20 | 2006-08-03 | Samsung Electro Mech Co Ltd | Laminated chip capacitor |
| JP2014033097A (en) * | 2012-08-03 | 2014-02-20 | Tdk Corp | Multilayer ceramic capacitor |
| JP2018061058A (en) * | 2012-09-27 | 2018-04-12 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer chip electronic component, mounting board and package thereof |
| JP2016058753A (en) * | 2013-07-22 | 2016-04-21 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein |
| US9607762B2 (en) | 2013-07-22 | 2017-03-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein |
| JP2019047109A (en) * | 2017-08-29 | 2019-03-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Composite electronic component and mounting board thereof |
| WO2020170545A1 (en) * | 2019-02-22 | 2020-08-27 | パナソニックＩｐマネジメント株式会社 | Varistor and method for producing same |
| JPWO2020170545A1 (en) * | 2019-02-22 | 2020-08-27 | ||
| CN113366590A (en) * | 2019-02-22 | 2021-09-07 | 松下知识产权经营株式会社 | Varistor and method for producing same |
| US11276515B2 (en) | 2019-02-22 | 2022-03-15 | Panasonic Intellectual Property Management Co., Ltd. | Varistor and method for producing same |
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