JPS6159796A - Electronic part holder - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component holder for mounting electronic components at a predetermined height on a printed wiring board used in electronic equipment and the like.

(Structure of a conventional example and its problems) A conventional method for mounting electronic components at a predetermined height on a printed wiring board will be explained with reference to FIG. In the figure, an electronic component 1 has lead wires 2 coming out from both ends.
, its attachment is bent at a right angle from a point slightly away from the root, and the mounting hole provided on the printed wiring board 4 is inserted through a vinyl pipe or insulator pipe 3 of the length necessary to secure a predetermined height. 4a, then connect the wiring circuit 6 with solder 5.
is fixed to.

At the stage of designing a printed wiring board, when the height at which electronic components are to be separated from the board is determined, the lead wires are expanded in advance to form protrusions (not shown) at predetermined positions. The lead wire 2 of the electronic component 1 is attached to the printed wiring board 4 by determining the insertion position into the hole 4a, but in the case of mass production at low cost,
Processing for forming the protrusions has been problematic in that it is difficult to implement due to cost, increase in the number of parts, and other points.

In addition, if the electronic component 1 is a semiconductor component such as a diode sealed with glass or the like, the lead wire should be attached at a point 2 or 3 days away from the root to prevent cracks from forming in the sealed part. It is necessary to bend the sealing part so that no force is applied to it, and therefore, such semiconductor parts have the problem of having to be bent in advance using a special lead wire bending jig. Ta.

(Objective of the Invention) The present invention can prevent damage to semiconductor components, which are prone to cracks in glass sealing parts among electronic components.

The present invention attempts to provide an electronic component holder in which electronic components can be mounted on a printed wiring board at a predetermined height from the surface of the printed wiring board by bending lead wires extending from both ends.

(Structure of the invention) Electronic components with lead wires at both ends are arranged in one place! ! In an electronic component holder that is attached to a board so as to maintain a predetermined distance from the surface of the board, arms are formed from both ends in one direction of the holder main body, and the a gripping part having an opening into which the lead wire is inserted;
It consists of an opening with a convex part sandwiching the insertion opening so that the interval between the insertion opening is smaller than the diameter of the lead wire, the holding part holds the lead wire of the electronic component, and the opening prevents the electronic component from falling out. At the same time, the bending force exerted on the glass sealing part of the semiconductor component is reduced by limiting the bending angle of the lead wire by the action of the clamping part whose width is more than twice the diameter of the lead wire. , which eliminates the occurrence of cracks in the sealing part. Furthermore.

In the opposite direction of the arm of the holder body, there is provided a leg with a forked tip and a hook-shaped claw, and this is attached to the printed wiring board by using the elastic deformation of the forked leg in the hole. The holder can be easily inserted into the hole, and the claws prevent the holder from falling out of the hole. Further, the distance between the electronic component and the surface of the printed wiring board can be obtained by determining the height of the holder body and the length of the arm portion according to the purpose.

(Description of Examples) Examples of the present invention will be described with reference to FIGS. 2 and 3. In FIG. 2, the electronic component holder according to the present invention has arm portions 7 having a width twice or more than the diameter of the lead wire 2 of the electronic component 1 attached to the holder, formed on both sides of the holder body 8. A gripping part 9 for gripping the lead wire 2 is provided at the tip of the part 7, and the printed wiring board 4 is fixed by being inserted into the hole 4b at the center of the holder main body, on the side opposite to the arm part 7. After inserting the lead wire 2 of the electronic component 1 into the grip portion 9 and bending the lead wire 2 in the direction of the holder body 8, the lead wire 2 is connected to the electronic component of the printed wiring board 4. The parts are installed in the hole 4a, and the legs 10 of the electronic component holder are installed in the hole 4b.
Insert each into and read! IfA2 and wiring circuit 6 are connected with solder 5.

Since the arm portion 7 and the grip portion 9 at its tip in FIG. 2 are bilaterally symmetrical, the right side is represented by a symbol.

FIG. 3 shows the details of the gripping part 9 and the leg part 10. Part 1
2 and 13 are provided to narrow the interval between the insertion ports.
In addition, a claw 15 is formed on the leg lO at a location corresponding to the thickness of the printed wiring board 4, and a slot 16 is inserted so as to go beyond the claw 15, so that the claw 15 It is configured to be elastically displaced.

The lead wire 2 is supported by a clamping portion 9 having a width more than twice the diameter of the lead wire and an interval approximately equal to the diameter of the lead wire.

Even if the lead wire is bent between the holder main body 8 and the lead wire 2, the bending angle of the lead wire is limited so that the bending does not occur to the extent that a crank occurs in the glass sealing part of the semiconductor component, thereby preventing the occurrence of cracks. I can do it.

Further, in the leg portion 10, the claw 15 is elastically deformed by the sliding split 16, so that the printed wiring board 4 can be attached to the holder in the hole 4b.
After easily passing through, it returns to its original position and the holder attachment hooks onto the back side of the hole 4b, thereby preventing the holder body 8 from falling off.

Furthermore, in order to ensure that the length of the arm portion 7 is sufficient to accommodate electronic components of various outside diameter dimensions, there is a margin between the electronic component 1 and the holder body 8 in FIG. . Furthermore,
Since the distance between the electronic component 1 and the printed wiring board 4 is determined based on the design of the printed LfA board, it goes without saying that the height of the holder main body 8 and the length of the arm portion 7 are determined to accommodate this. That's true.

The material for the electronic component holder is preferably a resin material, and the electronic component holder can be made into a shape that matches the shape of the electronic component by molding.

(Effects of the Invention) As explained above, according to the present invention, when it becomes necessary to mount electronic components at a certain distance from the surface of a printed wiring board, the preparatory process or This eliminates the labor-intensive process of attaching vinyl tubes and insulator tubes, especially for semiconductor parts with glass sealing parts.

The preparation process that was necessary to prevent cracks in the sealing part that occur when bending lead wires can be omitted, making it possible to install electronic components with less man-hours and with high reliability, and making it possible to manufacture printed wiring boards. This has a significant effect on cost reduction.

Furthermore, the legs formed on the holder body serve to securely hold the electronic components on the printed wiring board, eliminate any lifting of the electronic components during the soldering bath process, and obtain a highly reliable printed wiring board. Effective 6

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of a conventional electronic component mounting section, Fig. 2 is a cross-sectional view of a mounting section using the electronic component holder according to the present invention, and Fig. 3 is a perspective view of the electronic component holder of Fig. 2. be. 1...Electronic components, 2...Lead wires, 3.
...Insulator tube, 4...Printed wiring board, 4a...
・ Hole for lead wire installation, 4b...Hole for holder installation, 5...Solder, 6...Wiring circuit, 7...
Arm part, 8... Holder body, 9... Gripping part. 10... Leg part, 11... Clamping part, 12.13.
...Protrusion, 14...Opening, 15...Claw, 16...
・Suriwari. Patent applicant Matsushita Electric f! 22 Liang Co., Ltd. Figure 1 Figure 2

Claims (1)

[Claims] In an electronic component holder in which an electronic component having lead wires at both ends is attached to a printed wiring board so as to maintain a predetermined distance from the surface of the board, one side of the holder body has a
Arms are formed from both ends, and a gripping portion is provided at the tip of the arm portion with an opening for inserting the lead wire into the front of the main body. It consists of a holding part having a width of at least twice the diameter of the lead wire, and an opening with a convex part sandwiching the insertion opening so that the interval between the insertion openings is smaller than the diameter of the lead wire, and the arm of the holder body. The electronic component holder is characterized in that a leg section having a bifurcated tip and a hook-shaped claw is provided in the opposite direction of the electronic component holder.