JPS6157346A - Manufacture of nozzle for injection of very small quantity of article - Google Patents
Manufacture of nozzle for injection of very small quantity of articleInfo
- Publication number
- JPS6157346A JPS6157346A JP18010084A JP18010084A JPS6157346A JP S6157346 A JPS6157346 A JP S6157346A JP 18010084 A JP18010084 A JP 18010084A JP 18010084 A JP18010084 A JP 18010084A JP S6157346 A JPS6157346 A JP S6157346A
- Authority
- JP
- Japan
- Prior art keywords
- steel wire
- stainless steel
- primary
- plating layer
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000002347 injection Methods 0.000 title 1
- 239000007924 injection Substances 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 32
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000520 microinjection Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 238000004070 electrodeposition Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 239000007864 aqueous solution Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- DKAGJZJALZXOOV-UHFFFAOYSA-N hydrate;hydrochloride Chemical compound O.Cl DKAGJZJALZXOOV-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical group [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1625—Manufacturing processes electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は印刷用のインクジェットプロ7り等に用いられ
る微細孔径のノズルの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a nozzle with a fine pore diameter used in an inkjet printer for printing and the like.
一般に、印刷用のインクジェットには引抜きチューブが
用いられるが、φ0.05am以下の微細孔径の加工が
できず、微量のインク噴射用ノズルとしては不適当であ
る。そこでレーザー光線による金属孔形加工や、金B線
にニッケルめっきを行い電着完了後金H線のみ腐食熔解
させる方法等が提案されているが、前者にあっては製造
コストが高く、また後者に。Generally, drawn tubes are used for inkjet printing, but they cannot be processed into micropores with a diameter of φ0.05 am or less, making them unsuitable as nozzles for ejecting small amounts of ink. Therefore, methods have been proposed, such as processing the metal hole shape using a laser beam, or nickel-plating the gold B wire and corroding and melting only the gold H wire after electrodeposition, but the former method requires high manufacturing costs, and the latter method requires high production costs. .
あっても加工後の腐食処理を必要とすることなどから製
造工程が複雑化するという問題があった。Even if there were, there was a problem in that the manufacturing process would be complicated due to the need for corrosion treatment after processing.
本発明はかかる点に鑑がみてなされたものであって、そ
の目的とするところはめっきによる製造で低コスト化が
図れ、しかも後処理が不要な微量噴射用ノズルの製造方
法を提供するにある。The present invention has been made in view of these points, and its purpose is to provide a method for manufacturing a micro-injection nozzle that can be manufactured by plating at low cost and that does not require post-processing. .
以下、発明を図の実施例に基づいて詳述する。Hereinafter, the invention will be explained in detail based on the embodiments shown in the drawings.
まず基板1上に第1図のように2条の土手7 (幅は例
えば10〜15msとする)を水溶性感光液の塗布によ
る硬膜部により形成する1次に土手7で挟まれた基板1
表面にスルファミン酸ニッケル槽にて一次めっき屓2
(厚みは例えば0.015m+*とする)を形成してこ
れをノズル母体とする。なお、基板lとして厚みが1.
0〜2.抛−のステンレス鋼板を用いるものとする。First, as shown in Fig. 1, two banks 7 (width is, for example, 10 to 15 ms) are formed on the substrate 1 by hardening film by coating with a water-soluble photosensitive liquid.Firstly, the substrate is sandwiched between the banks 7. 1
Primary plating on the surface in a nickel sulfamate bath 2
(The thickness is, for example, 0.015 m+*) and use this as the nozzle base. Note that the thickness of the substrate l is 1.
0-2. A stainless steel plate shall be used.
次に第2図のように基板1を水洗・乾燥させたのち一次
めっき雇2上にステンレス鋼線3 (径は例えばφ0.
03mmとする)を張設して両端をビス8にて固定する
。Next, as shown in FIG. 2, after washing and drying the substrate 1 with water, a stainless steel wire 3 (with a diameter of, for example, φ0.
03mm) and fix both ends with screws 8.
しかる後土手7及び一次めっき層2の表面に溶剤型感光
液を厚みを例えばo、oos■lI〜0゜Of+mで塗
布して感光樹脂N4を形成する。この場合感光樹脂層4
はステンレス鋼線3を完全に被覆するようにし、かつ一
次めっき層2及び土手7と十分に密着するようにする。Thereafter, a solvent type photosensitive liquid is applied to the surfaces of the bank 7 and the primary plating layer 2 to a thickness of, for example, o, ooslI to 0°Of+m to form photosensitive resin N4. In this case, the photosensitive resin layer 4
is made to completely cover the stainless steel wire 3 and to be in sufficient contact with the primary plating layer 2 and the bank 7.
次に感光樹脂層4を乾燥させたのちバクーンフイルム(
図示せず)を密着させて第3図のように感光+44脂層
4を露出B1!5と被〒口lζ9とに区分りする1次に
パターンフィルムの不透明部分に相当する露出したニッ
ケル表面は酸化被膜が形成されており、この酸化被膜部
lOを塩酸水で除去し、再度スルファミン酸ニッケルメ
ッキ槽にて一次めっきと同一条件で電着をして二次めっ
き屓6(w、みは例えば0゜013R11Iとする)を
形成して一次めっき層2と密着させるとともにステンし
・ス鋼線3を覆い、最後に第4図のようにステンレス鋼
線3の固定を解除し、めっき眉2.3を基板1がら剥離
するとともにステンレス鋼線3を引き抜いてノズルAを
完成させる。Next, after drying the photosensitive resin layer 4, a Bakun film (
The exposed nickel surface corresponding to the opaque part of the primary pattern film is divided into exposed B1!5 and exposed lζ9 as shown in FIG. An oxide film has been formed, and this oxide film part 10 is removed with hydrochloric acid water, and electrodeposited again in a nickel sulfamate plating tank under the same conditions as the primary plating to form a secondary plating layer 6 (w, for example). 0°013R11I) is formed to adhere closely to the primary plating layer 2 and cover the stainless steel wire 3.Finally, the fixation of the stainless steel wire 3 is released as shown in FIG. 4, and the plated eyebrow 2. 3 from the substrate 1 and the stainless steel wire 3 is pulled out to complete the nozzle A.
なお、第4図中11はインク溜りとして使用できその形
状は上記被覆部9の形状を変えることにより任:に変え
ることができる。また、ノズルAの先端部は土手7を構
成する水溶性感光液の硬膜部と感光樹脂W14とで遮断
された状悠で形成されるために形状が均一化し、したが
って放出されるインキの方向性が同一にできる。Incidentally, reference numeral 11 in FIG. 4 can be used as an ink reservoir, and its shape can be changed arbitrarily by changing the shape of the covering portion 9. Furthermore, since the tip of the nozzle A is formed in a loose shape that is blocked by the hardened film part of the water-soluble photosensitive liquid constituting the bank 7 and the photosensitive resin W14, the shape is uniform, and therefore the direction of the ejected ink is The gender can be the same.
また水溶性感光液の基板への密着を良くするために塩酸
と硝酸の10%水溶液を温度40℃〜45℃に加温し、
5分間浸漬し、水洗及び乾燥後水溶性感光液を塗布する
ようにする。感光性塗膜は厚い程良く、その為に0.0
15mmの厚みにして原版を密着させ、高圧水銀灯で露
光現像し又塗膜の強度を保つために現@l&露光及び1
50℃の温度にて30分間ベーキング処理をする。In addition, in order to improve the adhesion of the water-soluble photosensitive liquid to the substrate, a 10% aqueous solution of hydrochloric acid and nitric acid was heated to a temperature of 40°C to 45°C.
After soaking for 5 minutes, washing with water and drying, apply a water-soluble photosensitive liquid. The thicker the photosensitive coating, the better, so 0.0
The original plate was adhered to a thickness of 15 mm, exposed and developed using a high-pressure mercury lamp.
Baking is performed at a temperature of 50° C. for 30 minutes.
スルファミン酸ニッケルめっきの液組成はスルフアミノ
酸ニッケル450g/λ、硼M40g/i、界面活性剤
20cc/uとし、めっき条件は温度48℃〜50℃、
pH4,0〜4.S、電流密度4〜6A/drfとする
。The liquid composition of sulfamic acid nickel plating was 450 g/λ of nickel sulfamino acid, 40 g/i of boron M, and 20 cc/u of surfactant, and the plating conditions were as follows: temperature: 48°C to 50°C;
pH 4,0-4. S, the current density is 4 to 6 A/drf.
上述のように、基板上にノズル母体となる一次めっき層
を形成したのち、この一次めっき屡の上に微細径のステ
ンレス鋼線を張設し次にこのステンレス鋼線を被覆する
ようにして一次めっき層の表面に感光441脂眉を塗布
し、次に所定箇所の感光4kJIli?層を露光・81
1像ののち除去して一次めっき層及びステンレス鋼線を
露出さセ、次にこの露出箇所に二次めっき層を形成して
一次めっき層と電着接合するとともにステンレス鋼線を
被覆し、しかるのちめっき層を基板から剥離するととも
にステンレス!岡本泉をめっき層から引き[友くように
したので、インク溜りなどを一体として製造でき、又鋼
線を引抜き加工するので、鋼線を腐食して除去するのに
比べて腐食後の処理が不要となり、この結果量産性の向
上、コストの低減が可能になるという効果を奏する。As mentioned above, after forming the primary plating layer that will become the nozzle base on the substrate, a fine-diameter stainless steel wire is stretched over the primary plating layer, and then the stainless steel wire is covered with the primary plating layer. Apply photosensitive 441 greasy eyebrows to the surface of the plating layer, and then apply photosensitive 4kJIli? on predetermined areas. Expose layer 81
After the first image, it is removed to expose the primary plating layer and the stainless steel wire, and then a secondary plating layer is formed on this exposed area and electrodeposition bonded to the primary plating layer, and the stainless steel wire is covered. Afterwards, the plating layer is peeled off from the substrate and stainless steel is created! Since Izumi Okamoto is drawn from the plating layer, ink reservoirs etc. can be manufactured as one piece, and since the steel wire is drawn, post-corrosion treatment is easier compared to corroding and removing the steel wire. As a result, mass productivity can be improved and costs can be reduced.
第1図、第2図及び第3図+a+ (blは本発明の製
造工程を示す図、第4図は同上のノズルの平面図、第5
図は第4図のX−x断面図である。
1・一基板、2・−−一次めっき層、3−鋼線、4・・
感光樹脂層、5−・露出部、6−・・二次めっき層
第1図
手続補正@(方式)
%式%
2、発明の名称
微量噴射用ノズルの製造方法
3、補正をする者
事件との関係 特許出願人
住所
名称 大洋工業株式会社
4、代理人
住所 大阪市天王寺区悲田院町8番22号日生天王寺ビ
ル 置 (06) 772−6006補正の内容
本願明細書第6頁第15行目から同頁筒16行目にかけ
ての「第4図は同上のノズルの平面図、第5図は第4図
のX−X断面図」の文を削除して「第4図(alは同上
のノズルの平面図、第4図(blは第4図+8)のx−
xUr面図」の文を挿入致します。Figures 1, 2, and 3 +a+ (bl is a diagram showing the manufacturing process of the present invention, Figure 4 is a plan view of the same nozzle, Figure 5
The figure is a sectional view taken along the line X-x in FIG. 4. 1. One substrate, 2. -- Primary plating layer, 3. Steel wire, 4.
Photosensitive resin layer, 5-・Exposed part, 6-・Secondary plating layer Figure 1 Procedure correction @ (method) % formula % 2. Name of the invention Method for manufacturing a micro-injection nozzle 3. Person making the correction Relationship Patent applicant address name Taiyo Kogyo Co., Ltd. 4, agent address Hinase Tennoji Building, 8-22 Hidenin-cho, Tennoji-ku, Osaka City (06) 772-6006 Contents of amendment From page 6, line 15 of the specification of the application The sentence ``Figure 4 is a plan view of the above nozzle, and Figure 5 is a sectional view taken along the line Plan view of Figure 4 (bl is Figure 4 + 8) x-
Insert the text "xUr surface drawing".
Claims (1)
たのち、この一次めっき層の上に微細径のステンレス鋼
線を張設し、次にこのステンレス鋼線を被覆するように
して一次めっき層の表面に感光樹脂を塗布し、次に所定
箇所の感光樹脂層を露光・現像ののち除去して一次めっ
き層及びステンレス鋼線を露出させ、次にこの露出箇所
に二次めっき層を形成して一次めっき層と電着接合する
とともにステンレス鋼線を被覆し、しかるのちめっき層
を基板から剥離するとともにステンレス鋼線をめっき層
から引き抜くことを特徴とする微量噴射用ノズルの製造
方法。(1) After forming a primary plating layer to serve as the nozzle base on the substrate, a fine-diameter stainless steel wire is stretched over the primary plating layer, and then the stainless steel wire is covered with the primary plating. A photosensitive resin is applied to the surface of the layer, then the photosensitive resin layer at a predetermined location is exposed and developed, and then removed to expose the primary plating layer and stainless steel wire, and then a secondary plating layer is formed on this exposed location. 1. A method for manufacturing a nozzle for micro-injection, which comprises electrodepositing the primary plating layer and coating the stainless steel wire, and then peeling off the plating layer from the substrate and pulling out the stainless steel wire from the plating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18010084A JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18010084A JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6157346A true JPS6157346A (en) | 1986-03-24 |
JPH0338111B2 JPH0338111B2 (en) | 1991-06-07 |
Family
ID=16077426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18010084A Granted JPS6157346A (en) | 1984-08-28 | 1984-08-28 | Manufacture of nozzle for injection of very small quantity of article |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6157346A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6303221B1 (en) | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
US7967422B2 (en) | 1998-10-16 | 2011-06-28 | Silverbrook Research Pty Ltd | Inkjet nozzle assembly having resistive element spaced apart from substrate |
-
1984
- 1984-08-28 JP JP18010084A patent/JPS6157346A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7967422B2 (en) | 1998-10-16 | 2011-06-28 | Silverbrook Research Pty Ltd | Inkjet nozzle assembly having resistive element spaced apart from substrate |
US6303221B1 (en) | 2000-12-07 | 2001-10-16 | E. I. Du Pont De Nemours And Company | Two-component pulp reinforcement |
Also Published As
Publication number | Publication date |
---|---|
JPH0338111B2 (en) | 1991-06-07 |
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