JPS614573A - Coating apparatus - Google Patents
Coating apparatusInfo
- Publication number
- JPS614573A JPS614573A JP12168884A JP12168884A JPS614573A JP S614573 A JPS614573 A JP S614573A JP 12168884 A JP12168884 A JP 12168884A JP 12168884 A JP12168884 A JP 12168884A JP S614573 A JPS614573 A JP S614573A
- Authority
- JP
- Japan
- Prior art keywords
- coated
- solvent
- control system
- nozzle
- rotating disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は溶剤を被塗布物に滴下し、被塗布物を回転させ
て溶剤を回転塗布する塗布装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a coating device that drips a solvent onto an object to be coated and rotates the object to apply the solvent by rotation.
従来、半導体基板などの被塗布物に滴下された感光性樹
脂などの溶剤の膜厚分布を均−船こする塗布装置として
、例えば特開昭56−87471号公報に示すように、
被塗布物上に閉空間領域を形成するように閉空間形成板
を配設し、溶剤の蒸発速度を制御している。Conventionally, as a coating device that evens out the film thickness distribution of a solvent such as a photosensitive resin dropped onto an object to be coated such as a semiconductor substrate, for example, as shown in JP-A-56-87471,
A closed space forming plate is disposed to form a closed space region on the object to be coated, and the evaporation rate of the solvent is controlled.
しかしながら、この装置は閉空間形成板と被塗布物との
間に被塗布物の回転によって起る風流や11i1+王の
変化によって溶剤の膜厚及び塗布むらが生じる。However, in this apparatus, the thickness of the solvent film and the coating become uneven due to changes in the wind flow caused by the rotation of the object to be applied between the closed space forming plate and the object to be applied and changes in 11i1+.
本発明の目的は、回転塗布時における被塗布物上での風
のまき起りを防止し、被塗布物上に塗布された溶剤の乾
燥状態を均一にすることにより、溶剤の膜厚の均−化及
びストライエーションの低減を図ることができる塗布装
置を提供することにあるλ
〔発明の概要〕
本発明は上記目的を達成するために、溶剤を被塗布物に
滴下し、被塗布物を回転させて溶剤を回転塗布する塗布
装置において、前記被塗布物の上方に設けられた回転円
板と、この回転円板を前記被塗布物と同期回転させる回
転円板制御系と、前記回転円板を被塗布物の上方及び退
避位置に移動させる回転円板移動制御系とを備えたこと
を特徴きする。The purpose of the present invention is to prevent wind from blowing up on the object to be coated during spin coating, and to uniformly dry the solvent applied to the object, thereby making the film thickness of the solvent uniform. [Summary of the Invention] In order to achieve the above-mentioned object, the present invention provides a coating device that can reduce striation and striation. A coating apparatus that rotates and applies a solvent by rotating a solvent, a rotating disk provided above the object to be coated, a rotating disk control system that rotates the rotating disk in synchronization with the object to be coated, and a rotating disk that rotates the rotating disk in synchronization with the object to be coated. A rotary disk movement control system that moves the rotary disk to above the object to be coated and to a retracted position.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
半導体基板などの被塗布物1を保持する吸着ヘッド2は
、吸着−\ツド回転制御系3により回転させられる。吸
着ヘッド2の上方には感光性樹脂などの溶剤4の滴下を
制御する溶剤制御系5を備えたノズル6が配設されてお
り、ノズル6はノズル移動制御系7によりガイド8に沿
・つて水平移動させられる。また吸着ヘッド2の上方に
は被塗布物1とギャップ9を保゛つて回転円板IOが配
設されており、回転円板10は回転円板移動制御系11
により水平移動させられると共に、前記吸着ヘッド回転
制御系3、と同期回転する回転円板回転制御系12によ
り回転させられる。A suction head 2 holding an object 1 to be coated, such as a semiconductor substrate, is rotated by a suction rotation control system 3. A nozzle 6 equipped with a solvent control system 5 that controls the dripping of a solvent 4 such as a photosensitive resin is arranged above the suction head 2, and the nozzle 6 is moved along a guide 8 by a nozzle movement control system 7. Can be moved horizontally. Further, a rotating disk IO is arranged above the suction head 2 while maintaining a gap 9 with the object 1 to be coated, and the rotating disk 10 is connected to a rotating disk movement control system 11.
It is horizontally moved by the suction head rotation control system 3 and rotated by the rotary disk rotation control system 12 which rotates in synchronization with the suction head rotation control system 3.
次に作用について説明する。始動前は、回転円板10は
吸着−\ノド2から離れた位置にあり、ノズル6は吸着
−\ラド2の上方に位置している。この状態で吸着ヘッ
ド2に被塗布物1を保持させ、被塗布物1上に溶剤制御
系51こより溶剤4をノズル6を通して滴下する。その
後、ノズル6はノズル移動制御系7により被塗布物1の
最外周外まで移動する。このノズル6の移動は、次に回
転円板10が被塗布物1の上方に配設させられるので、
被塗布物1上に余裕の空間を作るためである。Next, the effect will be explained. Before starting, the rotating disk 10 is located away from the suction-\rad 2, and the nozzle 6 is located above the suction-\rad 2. In this state, the suction head 2 holds the object 1 to be coated, and the solvent 4 is dripped onto the object 1 from the solvent control system 51 through the nozzle 6. Thereafter, the nozzle 6 is moved to the outermost periphery of the object 1 by the nozzle movement control system 7. This movement of the nozzle 6 is carried out because the rotating disk 10 is then placed above the object 1 to be coated.
This is to create an extra space above the object 1 to be coated.
次に回転円板移動制御系11により回転円板10を被塗
布物1の上方にギャップ9を保って配置する。その後、
吸着ヘッド回転制御系3により被塗布物1の回転を開始
すると同時に、回転円板回転制御系12により回転円板
10を被塗布物1の回転と同期回転させる。これにより
、被塗布物1上に浴剤4の薄膜を形成する。Next, the rotating disk movement control system 11 positions the rotating disk 10 above the object 1 with a gap 9 maintained therebetween. after that,
At the same time as the suction head rotation control system 3 starts rotating the object 1 to be coated, the rotating disk rotation control system 12 causes the rotating disk 10 to rotate in synchronization with the rotation of the object 1 to be coated. As a result, a thin film of the bath agent 4 is formed on the object 1 to be coated.
このように、被塗布物1の回転に同期して回転する回転
円板10を被塗布物1の上方に配置してなるので、回転
塗布時における被塗布物l上での風のまき起りが防止さ
れ、・溶剤4の乾燥状態を均一にすることができる。こ
れにより、溶剤4の膜厚が均一になり、またストライエ
ーションの発生 茅などがなくなることによ
り、歩留りが同上する。In this way, since the rotary disk 10 that rotates in synchronization with the rotation of the object 1 to be coated is arranged above the object 1 to be coated, wind is not generated on the object 1 to be coated during rotational coating. - The drying state of the solvent 4 can be made uniform. This makes the film thickness of the solvent 4 uniform and eliminates striations and thatch, thereby increasing the yield.
以上の説明から明らかなように、本発明によれば、被塗
布物の回転に同期して回転する回転円板を被塗布物の上
方に配置してなるので、回転塗布、時における風のまき
起りが防止され、溶剤の乾燥状態が均一化し、これによ
って溶剤の膜厚が均一(こなり、またストライエーショ
ンの発生がなくなり、歩留りが向上する。As is clear from the above description, according to the present invention, a rotary disk that rotates in synchronization with the rotation of the object to be coated is arranged above the object to be coated, so that rotational coating and wind blowing can be avoided. This prevents the drying of the solvent, which results in a uniform solvent film thickness (no curling or striations), and improves yield.
図は本発明になる塗布装置の一実施例を示す構成図であ
る。
1・・・被塗布物、 2・・・吸着ヘッド、3・
・・吸着ヘッド回転制御系、 4・・・溶剤、6・
・・ノズル、 9・・・ギャップ、10・・・
回転円板、 11・・・回転円板移動制御系、12
・・・回転円板回転制御系。The figure is a configuration diagram showing an embodiment of the coating device according to the present invention. 1...Object to be coated, 2...Suction head, 3.
... Suction head rotation control system, 4... Solvent, 6.
...Nozzle, 9...Gap, 10...
Rotating disk, 11...Rotating disk movement control system, 12
...Rotating disk rotation control system.
Claims (1)
を回転塗布する塗布装置において、前記被塗布物の上方
に設けられた回転円板と、この回転円板を前記被塗布物
と同期回転させる回転円板回転制御系と、前記回転円板
を被塗布物の上方及び退避位置に移動させる回転円板移
動制御系とを備えた塗布装置。A coating apparatus that drips a solvent onto an object to be coated and rotates the object to apply the solvent by rotation includes a rotating disk provided above the object to be coated, and a rotating disk that connects the rotating disk to the object to be coated. A coating device comprising: a rotating disk rotation control system that rotates synchronously; and a rotating disk movement control system that moves the rotating disk above an object to be coated and to a retracted position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12168884A JPS614573A (en) | 1984-06-15 | 1984-06-15 | Coating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12168884A JPS614573A (en) | 1984-06-15 | 1984-06-15 | Coating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS614573A true JPS614573A (en) | 1986-01-10 |
Family
ID=14817412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12168884A Pending JPS614573A (en) | 1984-06-15 | 1984-06-15 | Coating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS614573A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63248471A (en) * | 1987-04-03 | 1988-10-14 | Tokyo Electron Ltd | Coating device |
-
1984
- 1984-06-15 JP JP12168884A patent/JPS614573A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63248471A (en) * | 1987-04-03 | 1988-10-14 | Tokyo Electron Ltd | Coating device |
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