JPS61230351A - Hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To reduce the total cost of a circuit by forming film resistors for trimming a function onto both the surface and back of an insulating substrate while being divided and trimming the film resistors on both sides of either one of them. CONSTITUTION:A first film resistor 8 is shaped between a through-hole conductor 7 and a film conductor 6 formed on one surface of an insulating substrate 1, and a second film resistor 9 is shaped between the through-hole conductor 7 and a film conductor 6 formed onto the other surface of the insulating substrate 1. An electronic circuit block 2 is soldered so as to be connected to the film conductor 6 on the insulating substrate 1 on the side where the second film resistor 9 is shaped. Two kinds of hybrid integrated circuits in which the directions of extension of leads 5 to the insulating substrate 1 mutually differ are connected to a printed substrate by solder through the leads 5, the circuit incorporated to the printed substrate containing these hybrid integrated circuits is operated, and the film resistor 8 is trimmed while measuring the characteristics of the whole circuit.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a hybrid integrated circuit comprising a film resistor for functional trimming.

[Background of the invention]

Conventionally, as a trimming method for adjusting the circuit of an electronic device, a functional trimming method has been known in which a film resistor is trimmed using a laser beam or the like while the circuit is operating, as described in Japanese Patent Laid-Open No. 58-68905, for example. It is being

4 and 5 are perspective views illustrating conventional hybrid integrated circuits, in which 1 is an insulating substrate, 2 is an electronic circuit block,
3 is a membrane resistor for functional trimming, 4 is a semi-fixed resistor, 5 is a semi-fixed resistor.
is the lead.

In these figures, an electronic circuit block 2 such as an amplifier and an excavator is mounted on one side of an insulating substrate 1, and a membrane resistor 3 and a semi-fixed resistor 4 are mounted on the other side, which are not shown. Connected by a conductor pattern. Such a hybrid integrated circuit is soldered to a printed circuit board (not shown) via a plurality of leads 5 provided at both ends of an insulating substrate 1, but due to mounting problems at this time, the leads 5
As shown in FIG. 4, there is one that extends toward the surface on which the electronic circuit block 2 is provided, and one that extends toward the surface on which the film resistor 3 is provided, as shown in FIG.

In this way, after soldering the two types of hybrid integrated circuits with the leads 5 in opposite directions to the printed circuit board that is the parent board, 1. the circuit incorporated in the printed circuit board including the hybrid integrated circuit is operated. By trimming the film resistor 3 using a functional trimming device (not shown) while measuring the characteristics of the entire circuit, the characteristics of the printed circuit board or the electronic device in which the printed circuit board is incorporated are adjusted.

However, in the above-mentioned conventional example, the formation surfaces of the membrane resistors 3 with respect to the extending direction of the electrodes 5 are opposite to each other.
[In order to solder-connect a hybrid integrated circuit to a printed circuit board, two types of functional trimming devices are required to trim each film resistor 3, or if this is done with one device, an extremely complicated structure is required. This method requires a functional trimming device, which has the drawback of increasing the manufacturing cost of the entire circuit including the hybrid integrated circuit.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit that eliminates the drawbacks of the prior art described above and can reduce the total cost of the circuit.

[Summary of the invention]

In order to achieve this object, the present invention provides film resistors for functional trimming on both the front and back sides of an insulating substrate, and trims the film resistor on either side to extend the leads. The feature is that the circuit characteristics can be adjusted using the same functional trimming device regardless of the direction.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are cross-sectional views of a hybrid integrated circuit according to the present invention, in which 6 is a membrane conductor, 7 is a through-hole conductor, and 8.9 is a through-hole conductor.
is a film resistor, and parts corresponding to FIGS. 4 and 5 are given the same reference numerals.

1 and 2, film conductors 6 of a desired pattern are formed on both the front and back surfaces of the insulating substrate 1, and the insulating substrate 1
A through-hole conductor 7 is formed so as to conduct electricity between both the front and back sides. A first film resistor 8 is formed between the through-hole conductor 7 and the film conductor 6 formed on one surface of the insulating substrate 1.
A second film resistor 9 is formed between the film conductor 6 formed on the other surface, and a film conductor is further formed on the insulating substrate 1 on the side on which the second film resistor 9 is formed. An electronic circuit block 2 is soldered to be connected to 6.

Leads 5 are soldered to both ends of the insulating substrate 1 so as to be connected to the film conductors 6 on both the front and back surfaces.
In FIG. 1, it extends to the side where the second film resistor 9 is formed, and in FIG. 21, it extends to the side where the first film resistor 8 is formed.

It's out.

In this way, two types of hybrid integrated circuits, in which the extending directions of the leads 5 with respect to the insulating substrate 1 are different from each other, are soldered to a printed circuit board (not shown) via the leads 5, and then assembled into the printed circuit board containing these hybrid integrated circuits. The film resistor 8 or 9 is trimmed while operating the circuit and measuring the characteristics of the entire circuit. Such feature trimming is
In the hybrid integrated circuit having the structure shown in FIG.
In the hybrid integrated circuit having the structure shown in FIG. 2, it is only necessary to trim the second film resistor 9 provided on the opposite surface of the first film resistor 8. Therefore, one functional trimming device (FIG. (not shown) can be used to perform functional trimming of two types of hybrid integrated circuits.

FIG. 5 is a circuit diagram showing an example of an electronic circuit that can be made into a hybrid integrated circuit, and 2 is an electronic circuit block percentage such as an amplifier.
R4e B snow is a variable resistance, and these variable resistances R1,
By adjusting either one of the R snows, the output value relative to the input can be adjusted to a desired value. The hybrid integrated circuit shown in FIGS. 1 and 2 is a specific example of integrating such circuits, in which the first film resistor 8 corresponds to R1, the second film resistor 9 corresponds to R2, and Because of the fidget, number 1
Even when trimming the second film resistor 8, the second film resistor 9
Even when the electronic circuit block 2 is trimmed, the electrical characteristics of the electronic circuit block 2 can be adjusted in the same way.

〔Effect of the invention〕

As explained above, according to the present invention, the film resistor for functional trimming is provided separately on both the front and back surfaces of the insulating substrate, and the film resistor on either side is trimmed, so that the leads can be extended. Even if two types of hybrid integrated circuits with opposite directions are soldered to the same circuit board, these hybrid integrated circuits can be trimmed using the same type of functional trimming device, and therefore 2'! The total cost of the circuit can be lowered compared to the conventional technology which requires a category 11 or extremely complicated function trimming device.

[Brief explanation of drawings]

1 and 2 are cross-sectional views showing one embodiment of a hybrid integrated circuit according to the present invention, FIG. 3 is a circuit diagram showing an example of an electronic circuit that can be made into a hybrid integrated circuit, and FIGS. 4 and 5 1 is a perspective view showing an example of a conventional hybrid integrated circuit. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Electronic circuit block, 5... Lead, 6... Film conductor, 7...
・Through-hole conductor, 8.9...Membrane resistor. 3rd Ward) Prisoner

Claims (1)

[Claims] 1. A hybrid integrated circuit including at least an electronic circuit block, a membrane resistor, and a lead provided on an insulating substrate is connected to another circuit board via the lead, and the membrane resistor is trimmed while operating the circuit. In the device in which the electrical characteristics of the circuit are adjusted by doing so, the film resistor is dividedly provided on both the front and back surfaces of the insulating substrate, and by trimming one of these film resistors, A hybrid integrated circuit characterized by being able to adjust the electrical characteristics of the circuit.