JPS61222715A - Manufacture of resin molded body - Google Patents
Manufacture of resin molded bodyInfo
- Publication number
- JPS61222715A JPS61222715A JP60064477A JP6447785A JPS61222715A JP S61222715 A JPS61222715 A JP S61222715A JP 60064477 A JP60064477 A JP 60064477A JP 6447785 A JP6447785 A JP 6447785A JP S61222715 A JPS61222715 A JP S61222715A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- substrate
- board
- card
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims description 5
- 239000005001 laminate film Substances 0.000 abstract description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 15
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 15
- 230000000694 effects Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 238000004873 anchoring Methods 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂基体表面に基板を有してなる樹脂成形
体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a resin molded body having a substrate on the surface of a resin base.
以下、樹脂成形体と□してＩＣカードを例にとり説明す
る。ここでＩＣカードとは、従来の磁気ストライプ付の
キャッシュカード等に代わって用いられるものであり、
カードの基体内にメモリＩＣやＣＰＵその他の半導体片
を内蔵し、従来の磁気ストライプ付カードに比べて数桁
以上の大容量の記憶能力を持たせることができるほか、
任意の演算機能を持たせることができるものである。Hereinafter, an IC card will be described as an example of a resin molded body. Here, an IC card is used in place of a conventional cash card with a magnetic stripe.
The card has a memory IC, CPU, and other semiconductor pieces built into its base, allowing it to have a storage capacity several orders of magnitude higher than that of conventional cards with magnetic stripes.
It can be provided with any arithmetic function.
第３図はこのようなＩＣカードの断面構成図であり、図
において、６は塩化ビニール等の樹脂を□成形してなる
カード基体、２はこのカード基体６内に収納されたプリ
ント基板（以下ＰＣＢと記す）、１０はこのＰＣＢＺ上
に固着されたＩＣモジュールであり、これはメモリＩＣ
及びＣＰＵ等のＩＣチップ１．配線３．及び上記ＩＣチ
ップ１と配線３とを樹脂封止するプリコート部４からな
っている。以下、このＩＣモジュール１ｏとこれが固着
されたＰＣＢ２とをＩＣモジュール付ＰＣＢ２と記す。FIG. 3 is a cross-sectional configuration diagram of such an IC card. In the figure, 6 is a card base formed by molding a resin such as vinyl chloride, and 2 is a printed circuit board (hereinafter referred to as 10 is an IC module fixed on this PCBZ, which is a memory IC.
and IC chips such as CPU 1. Wiring 3. and a precoat section 4 for sealing the IC chip 1 and the wiring 3 with resin. Hereinafter, this IC module 1o and the PCB 2 to which it is fixed will be referred to as an IC module attached PCB 2.
５ａ、５ｂはカード基体６の両面に形成されたラミネー
トフィルム、７はカード読取り機との接点部である。5a and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with a card reader.
次に上記ＩＣカードの従来の製造方法を第４図に従って
説明する。まず第４図（ａ）で示すように、ＰＣＢ２上
にＩＣチップ等を実装し、これらをエポキシ樹脂等でプ
リコートしてＩＣモジュール１０を形成する。一方、第
４図（ｂ）に示すように、上記ＩＣモジュール付ＰＣＢ
２の収納される凹部６ａを有するカード基体６を射出成
形により形成する。そしてこのカード基体６の凹部６ａ
に上記ＩＣモジュール付ＰＣＢ２をはめ込み接着し、第
３図に示すようなＩＣカードを形成する。Next, a conventional method of manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 4(a), IC chips and the like are mounted on the PCB 2 and precoated with epoxy resin or the like to form the IC module 10. On the other hand, as shown in FIG. 4(b), the above-mentioned PCB with IC module
A card base 6 having a recess 6a in which two cards are accommodated is formed by injection molding. And the recess 6a of this card base 6
The above PCB with IC module 2 is fitted and bonded to form an IC card as shown in FIG. 3.
しかるに、上記のような従来のＩＣカードの製造方法で
は、ＩＣモジュール付ＰＣＢ２とカード基体６とを粘着
シートにより接着するようにしており、その接着強度は
低く、耐久性にも乏しい。However, in the conventional IC card manufacturing method as described above, the IC module attached PCB 2 and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability.
また両者を接着した際、その嵌合部分に隙間が生じると
、そこから水等が侵入して接着部分が剥離することがあ
り、カードの信頼性が低いという問題があった。さらに
、両者の嵌合部分で隙間が生じないように、また表面に
段差が生じないようにするためには、両者をそれぞれ高
精度に仕上げる必要があり、その製造は困難である。特
にＩＣモジュール１０のプリコート部４を所望の形状に
製造することは非常に困難であり、従って従来の製造方
法では精度の良いＩＣカードを得ることができないとい
う問題があった。Further, when the two are bonded together, if a gap is created in the fitting portion, water or the like may enter through the gap and the bonded portion may peel off, resulting in a problem that the reliability of the card is low. Furthermore, in order to prevent a gap from occurring at the fitting portion of the two and to prevent a step from forming on the surface, both must be finished with high precision, which is difficult to manufacture. In particular, it is very difficult to manufacture the precoat portion 4 of the IC module 10 into a desired shape, and therefore, there is a problem in that it is not possible to obtain highly accurate IC cards using conventional manufacturing methods.
この発明は、かかる点に鑑みてなされたもので、ＩＣカ
ード等の樹脂成形体の製造が従来゛に比し非常に容易に
なるとともに、製造された樹脂成形体の信頼性が著しく
向上し、しかも特別な工程を要することなくその表面に
模様を施すことのできる樹脂成形体の製造方法を提供す
ることを目的としている。This invention was made in view of the above points, and it not only makes manufacturing resin molded bodies such as IC cards much easier than before, but also significantly improves the reliability of the manufactured resin molded bodies. Moreover, it is an object of the present invention to provide a method for manufacturing a resin molded body, which allows a pattern to be applied to the surface of the resin molded body without requiring any special steps.
この発明に係る樹脂成形体の製造方法は、その平面が模
様を構成する単数又は複数の貫通孔を有する基板を金型
表面に設置し、該金型内に樹脂を射出して上記基板を該
樹脂により一体成形するものである。In the method for manufacturing a resin molded article according to the present invention, a substrate having one or more through holes whose plane forms a pattern is placed on the surface of a mold, and resin is injected into the mold to form the substrate. It is integrally molded from resin.
この発明においては、樹脂基体を射出成形する際、その
金型内に基板を載置しているので該基板は一体成形され
、樹脂基体と基板とを接着する工程が省略されるととも
に、従来のように両者の嵌合部の形状寸法を高精度に仕
上げる必要がなくなり、さらに基板の貫通孔に先議され
た樹脂のアンカー効果により両者の接着強度は大きくな
り、しかもその貫通孔の樹脂により基板表面に模様が構
成される。In this invention, when injection molding a resin substrate, the substrate is placed in the mold, so the substrate is integrally molded, and the step of bonding the resin substrate and the substrate is omitted, and the conventional As a result, it is no longer necessary to finish the shape and dimensions of the mating part of the two with high precision, and the adhesive strength between the two is increased due to the anchoring effect of the resin in the through hole of the board. The pattern is composed of
以下、本発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例による樹脂成形体の製造方法
を示す図であり、本実施例方法は、カード基体の一部に
プリント基板を有してなるＩＣカードの製造において、
カード基体を射出成形する際に、金型の表面にその平面
が識別用マーク及び文字を構成する複数の貫通孔を有す
るＩＣモジュール付ＰＣＢを設置しておき、該ＰＣＢを
樹脂により一体成形するものである。FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention, and the method of this embodiment is applicable to the production of an IC card having a printed circuit board as a part of the card base.
When injection molding a card base, a PCB with an IC module is installed on the surface of the mold, the plane of which has a plurality of through holes forming identification marks and characters, and the PCB is integrally molded with resin. It is.
ここで、本実施例の製造方法を実現するための装置につ
いて、第１図を用いて簡単に説明する。Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.
第１図中）において、１１．１２はそれぞれ凹部１１ａ
、１２ａが形成された上金型、下金型であり、該両金型
１１，１２を型合せしたとき、その両凹部１１ａ、１２
ａによりカード基体１３と同形状の空間が形成されるよ
うになっている。そして上記下金型１２には、ＩＣモジ
ュール付ＰＣＢ２の載置される個所にＰＣＢ吸着用の孔
１２ｂが設けられており、この吸着用孔１２ｂは真空ポ
ンプ（図示せず）に接続されている。なお、１４はカー
ド基体成形用の樹脂が注入される注入口である。In FIG. 1), 11 and 12 are respectively recessed portions 11a.
.
A space having the same shape as the card base 13 is formed by a. The lower mold 12 is provided with a PCB suction hole 12b at a location where the IC module attached PCB 2 is placed, and this suction hole 12b is connected to a vacuum pump (not shown). . Note that 14 is an injection port into which resin for card base molding is injected.
次に本実施例のＩＣカードの製造方法を第１図（ａ）〜
（ｅ）に従ってより詳細に説明する。Next, the method for manufacturing the IC card of this embodiment is shown in FIGS.
This will be explained in more detail according to (e).
まず、第１図（ａ）に示すように、その上にＩＣチップ
等が樹脂封脂されたＩＣモジュール付ＰＣＢ２を下金型
１２の所定位置に載置し、真空ポンプを作動させて吸着
用孔１２ｂによりＩＣモジュール付ＰＣＢ２を吸引固定
する。ここで上記ＰＣＢ２には、第２図で示すように識
別マーク用貫通孔２ａ、及び文字構成用の複数の貫通孔
２ｂが形成されている。この貫通孔２ａ、２ｂとしては
、射出成形の条件によっても異なるが、０．３ｍｍ以上
の径相当のものであればよい。この状態で、第１図（ｂ
）に示すように上金型１１と下金型１２とを型合甘し、
図示しないプランジャにより樹脂を注入口１４から型内
に射出して該樹脂によりＩＣモジュール付ＰＣＢ２を一
体成形する。このとき、上記樹脂はＰＣＢ２の貫通孔２
ａ、２ｂにも充満し、この樹脂によるアンカー効果によ
りカード基体１３とＰＣＢ２との接着強度は著しく大き
くなる。First, as shown in FIG. 1(a), the IC module-equipped PCB 2 on which the IC chip and the like are sealed with resin is placed in a predetermined position of the lower mold 12, and the vacuum pump is activated for suction. The PCB 2 with the IC module is fixed by suction through the hole 12b. Here, as shown in FIG. 2, the PCB 2 is formed with a through hole 2a for an identification mark and a plurality of through holes 2b for forming characters. The through-holes 2a, 2b may have a diameter of 0.3 mm or more, although they vary depending on the injection molding conditions. In this state, as shown in Figure 1 (b)
), the upper mold 11 and the lower mold 12 are molded together,
A plunger (not shown) injects resin into the mold from the injection port 14, and the PCB 2 with the IC module is integrally molded with the resin. At this time, the resin is applied to the through hole 2 of the PCB 2.
a and 2b, and the adhesive strength between the card base 13 and the PCB 2 is significantly increased due to the anchoring effect of this resin.
またこれと同時に、貫通孔２ａ、２ｂに充満した樹脂は
、第２図で示すように平面状模様を構成する。At the same time, the resin filling the through holes 2a and 2b forms a planar pattern as shown in FIG.
そして所定時間後に型を分離して上記一体成形されたカ
ード基体１３を取り出し、該カード基体１３の両面に第
１図（ｅ）に示すように化粧用のラミネートフィルム５
ａ、５ｂを貼付する。After a predetermined time, the mold is separated and the integrally molded card base 13 is taken out, and a decorative laminate film 5 is coated on both sides of the card base 13 as shown in FIG. 1(e).
Paste a and 5b.
このような本実施例によれば、ＩＣモジュール付ＰＣＢ
２を金型内にセットし、射出成形で１シヨツトでカード
化するようにしたので、従来の製造方法におけるＰＣＢ
とカード基板との接着工程を省略することができる。ま
た、このような一体成形によれば、ＩＣモジュール１０
に寸法誤差があってもこれを樹脂によりカバーでき、従
って従来のようにＩＣモジュール１０とカード基体１３
（金型）の各々の嵌合部の寸法を高精度にする必要は全
くなく、ただＩＣモジュール１０がカード基体１３の厚
み以内となるよう管理するだけでよい。特にＩＣモジュ
ール１０のプリコート部４の寸法に精度が不要なので、
その製造は従来に比し著しく容易となり、大幅なコスト
ダウンを図ることができる。According to this embodiment, the PCB with IC module
2 was set in a mold and made into a card in one shot by injection molding, so the PCB
It is possible to omit the step of adhering the card board and the card board. Moreover, according to such integral molding, the IC module 10
Even if there is a dimensional error in the IC module 10 and the card base 13, this can be covered by the resin.
There is no need to make the dimensions of each fitting part of the mold highly accurate; it is only necessary to manage the IC module 10 so that it is within the thickness of the card base 13. In particular, since precision is not required for the dimensions of the pre-coated portion 4 of the IC module 10,
Its manufacture is significantly easier than in the past, and costs can be significantly reduced.
また本実施例では、ＰＣＢ２に複数の貫通孔２ａ、２ｂ
を設け、その中にも樹脂が充填されるようにしたので、
そのアンカー効果によりＰＣＢ２とカード基体１３との
接着強度は従来に比し著しく大きくなり、カードの信頼
性も飛躍的に向上する。しかも上記貫通孔２ａ、２ｂに
樹脂が充填されることにより、基板の色と樹脂の色とを
変えておけば、第２図で示すように、ＰＣＢ表面に半永
久的に消えることのない識別用のマーク、文字が構成さ
れ、従来のように基板上に上記のようなマ −り９
文字等を印刷する必要もなく、このような点からもカー
ドの製造コストを低減することができる。Further, in this embodiment, the PCB 2 has a plurality of through holes 2a, 2b.
, and filled with resin,
Due to the anchor effect, the adhesive strength between the PCB 2 and the card base 13 is significantly greater than that in the past, and the reliability of the card is also dramatically improved. Moreover, by filling the through-holes 2a and 2b with resin, if the color of the board and the resin are changed, as shown in FIG. The above marks and letters are formed on the board as in the past.9
There is no need to print characters or the like, and from this point of view as well, the manufacturing cost of the card can be reduced.
さらに本実施例の場合、ＰＣＢ２とカード基体１３とを
一体成形するので、両者の熱膨張係数の差異により、成
形後の熱膨張収縮で各部に内部応力が発生し、“そり”
が生じることが考えられるが、ＰＣＢ２に複数の貫通孔
”ｌａ、’ｌｂを設けているので、上記応力が分散され
、“そり”の発生を防止することができる。Furthermore, in the case of this embodiment, since the PCB 2 and the card base 13 are integrally molded, internal stress is generated in each part due to thermal expansion and contraction after molding due to the difference in thermal expansion coefficient between the two, causing "warpage".
However, since the PCB 2 is provided with a plurality of through holes "la" and "lb", the stress is dispersed and the occurrence of "warpage" can be prevented.
なお、上記実施例ではカード基体の一部にＰＣＢを設け
るようにしたが、これは基体の片側全面に、又両側全面
にＰＣＢを設けるようにしても良く、上記実施例と同様
の効果が得られる。In the above embodiment, the PCB is provided on a part of the card base, but the PCB may be provided on one side or both sides of the base, and the same effect as in the above embodiment can be obtained. It will be done.
また、上記実施例では本発明をＩＣカードの製造方法に
通用した一合について説明したが、本発明は樹脂基体の
少なくとも一面に基体を有してなる樹脂成形体の製造方
法の全てに通用できるものである。Furthermore, in the above embodiments, the present invention was explained in one manner applicable to the method of manufacturing an IC card, but the present invention is applicable to all methods of manufacturing a resin molded body having a base on at least one surface of the resin base. It is something.
以上のように、本発明によれば、樹脂基体の少なくとも
一面に基極を有してなる樹脂成形体の製造方法において
、その平面がマーク、文字等の模様を構成する貫通孔を
有する基板を金型表面に設置し、この金型内に樹脂を射
出して上記基板を該樹脂により一体成形するようにした
ので、その製造は非常に容易になるとともに、基体と基
板との接着強度を著しく大きくでき、しかも特別な工程
を要することなく半永久的に消えない模様を基板上に構
成できる効果がある。As described above, according to the present invention, in the method of manufacturing a resin molded body having a base electrode on at least one surface of a resin base, a substrate having a through hole whose plane forms a pattern such as a mark or a character is used. The resin is placed on the surface of the mold, and the resin is injected into the mold to integrally mold the substrate with the resin, making manufacturing extremely easy and significantly increasing the adhesive strength between the base and the substrate. It has the effect of being able to be made large and to create a semi-permanent pattern on the substrate without requiring any special process.
第１図（ａｌないしくＣ）は本発明の一実施例によるＩ
Ｃカードの製造方法を説明するための図、第２図は該製
造方法により製造されたＩＣカードの一部拡大平面図、
第３図は従来のＩＣカードの断面構成図、第４図（ａ）
、 （ｂ）は従来のＩＣカードの製造方法を説明するた
めの図である。
２・・・プリント基板（ＰＣＢ） 、２ａ、２ｂ・・・
貫通孔、１０・・−ＩＣモジュール、１１・・・上金型
、１２・・・下金型、１３・・・カード基体。
なお図中同一符号は同−又は相当部分を示す。FIG. 1 (al to C) shows I according to an embodiment of the present invention.
A diagram for explaining the manufacturing method of the C card, FIG. 2 is a partially enlarged plan view of the IC card manufactured by the manufacturing method,
Figure 3 is a cross-sectional diagram of a conventional IC card, Figure 4 (a)
, (b) is a diagram for explaining a conventional IC card manufacturing method. 2...Printed circuit board (PCB), 2a, 2b...
Through hole, 10...-IC module, 11... Upper mold, 12... Lower mold, 13... Card base. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
脂成形体の製造方法であって、その平面が模様を構成す
る単数又は複数の貫通孔を有する基板を金型の表面に設
置し、該金型内に樹脂を射出して上記基板を該樹脂によ
り一体成形することを特徴とする樹脂成形体の製造方法
。(1) A method for producing a resin molded body having a substrate on at least one surface of a resin base, the substrate having one or more through holes whose plane forms a pattern is installed on the surface of a mold, A method for manufacturing a resin molded body, comprising injecting a resin into the mold and integrally molding the substrate with the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60064477A JPS61222715A (en) | 1985-03-28 | 1985-03-28 | Manufacture of resin molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60064477A JPS61222715A (en) | 1985-03-28 | 1985-03-28 | Manufacture of resin molded body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61222715A true JPS61222715A (en) | 1986-10-03 |
Family
ID=13259344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60064477A Pending JPS61222715A (en) | 1985-03-28 | 1985-03-28 | Manufacture of resin molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61222715A (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63154398A (en) * | 1986-12-19 | 1988-06-27 | 大日本印刷株式会社 | Manufacture of ic card |
| WO1989001873A1 (en) * | 1987-08-26 | 1989-03-09 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and method of producing the same |
| JPH0199892A (en) * | 1987-10-13 | 1989-04-18 | Dainippon Printing Co Ltd | Ic card and ic module for ic card |
| JPH01108098A (en) * | 1987-10-22 | 1989-04-25 | Nippon Eurotec Kk | Card |
| JPH0214193A (en) * | 1988-06-30 | 1990-01-18 | Nissha Printing Co Ltd | Ic card and manufacture thereof |
| JPH0255198A (en) * | 1988-08-19 | 1990-02-23 | Mitsubishi Electric Corp | Ic card |
| JPH0263897A (en) * | 1988-08-31 | 1990-03-05 | Nissha Printing Co Ltd | Preparation of ic card |
| JPH02139785U (en) * | 1989-04-26 | 1990-11-21 | ||
| JPH08332790A (en) * | 1995-10-09 | 1996-12-17 | Mitsubishi Plastics Ind Ltd | Manufacture of card |
| USRE36097E (en) * | 1991-11-14 | 1999-02-16 | Lg Semicon, Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
| KR100819295B1 (en) | 2005-04-22 | 2008-04-02 | 가부시키가이샤 덴소 | Electronic circuit device and manufacturing method of the same |
| US8727224B2 (en) | 2006-06-20 | 2014-05-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| USD943670S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| US11315002B2 (en) | 2017-09-07 | 2022-04-26 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
-
1985
- 1985-03-28 JP JP60064477A patent/JPS61222715A/en active Pending
Cited By (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63154398A (en) * | 1986-12-19 | 1988-06-27 | 大日本印刷株式会社 | Manufacture of ic card |
| US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
| WO1989001873A1 (en) * | 1987-08-26 | 1989-03-09 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and method of producing the same |
| JPH0199892A (en) * | 1987-10-13 | 1989-04-18 | Dainippon Printing Co Ltd | Ic card and ic module for ic card |
| JPH01108098A (en) * | 1987-10-22 | 1989-04-25 | Nippon Eurotec Kk | Card |
| JPH0214193A (en) * | 1988-06-30 | 1990-01-18 | Nissha Printing Co Ltd | Ic card and manufacture thereof |
| JPH0255198A (en) * | 1988-08-19 | 1990-02-23 | Mitsubishi Electric Corp | Ic card |
| JPH0263897A (en) * | 1988-08-31 | 1990-03-05 | Nissha Printing Co Ltd | Preparation of ic card |
| JPH02139785U (en) * | 1989-04-26 | 1990-11-21 | ||
| USRE36097E (en) * | 1991-11-14 | 1999-02-16 | Lg Semicon, Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
| USRE37413E1 (en) | 1991-11-14 | 2001-10-16 | Hyundai Electronics Industries Co., Ltd. | Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
| JPH08332790A (en) * | 1995-10-09 | 1996-12-17 | Mitsubishi Plastics Ind Ltd | Manufacture of card |
| KR100819295B1 (en) | 2005-04-22 | 2008-04-02 | 가부시키가이샤 덴소 | Electronic circuit device and manufacturing method of the same |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US7604765B2 (en) | 2005-04-22 | 2009-10-20 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US8727224B2 (en) | 2006-06-20 | 2014-05-20 | Innovatier, Inc. | Embedded electronic device and method for manufacturing an embedded electronic device |
| US11461608B2 (en) | 2016-07-27 | 2022-10-04 | Composecure, Llc | RFID device |
| US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
| US11247371B2 (en) | 2016-07-27 | 2022-02-15 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| US12079681B2 (en) | 2016-07-27 | 2024-09-03 | Composecure, Llc | RFID device |
| US11829826B2 (en) | 2016-07-27 | 2023-11-28 | Composecure, Llc | RFID device |
| US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
| JP2019531918A (en) * | 2016-07-27 | 2019-11-07 | コンポーズキュア，リミティド ライアビリティ カンパニー | Overmolded electronic component for transaction card and manufacturing method thereof |
| US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11669708B2 (en) | 2017-09-07 | 2023-06-06 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US11315002B2 (en) | 2017-09-07 | 2022-04-26 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11501128B2 (en) | 2017-09-07 | 2022-11-15 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
| US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| USD943669S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| US11301743B2 (en) | 2018-01-30 | 2022-04-12 | Composecure, Llc | Di capacitive embedded metal card |
| US11710024B2 (en) | 2018-01-30 | 2023-07-25 | Composecure, Llc | Di capacitive embedded metal card |
| USD944322S1 (en) | 2018-01-30 | 2022-02-22 | Composecure, Llc | Layer of a transaction card |
| USD944323S1 (en) | 2018-01-30 | 2022-02-22 | Composecure, Llc | Layer of a transaction card |
| USD943670S1 (en) | 2018-01-30 | 2022-02-15 | Composecure, Llc | Layer of a transaction card |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
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