【図面の簡単な説明】[Brief explanation of the drawing]
第１図は、この考案の第１実施例の斜視図、第
２図は、第１図に示す実施例を使用する状態を示
す平面図、第３図は、第２図の―線による断
面図、第４図は、第１図に示す実施例を使用する
別の状態を示す平面図、第５図は、第４図の―
線による断面図、第６図は、この考案の第２実
施例の斜視図、第７図から第１０図までは、第６
図に示す実施例を使用するときの、第２図から第
５図までに対応する図、第１１図は、この考案の
第３実施例を使用する状態を示す平面図、第１２
図は、第１１図の―線による断面図、第
１３図は、この考案の第４実施例を示す側面図、
第１４図は、この考案の第５実施例を展開したと
きの斜視図、第１５図は、第１４図に示す実施例
を組み立てたときの斜視図である。
２２……第１印面、２４……第２印面、２６…
…第１図形、２８……第２図形、３６，３８……
第１印面の側面、４０，４２……第２印面の側面
。
Fig. 1 is a perspective view of the first embodiment of this invention, Fig. 2 is a plan view showing the state in which the embodiment shown in Fig. 1 is used, and Fig. 3 is a cross section taken along the line - - in Fig. 4 is a plan view showing another state in which the embodiment shown in FIG. 1 is used, and FIG. 5 is a plan view showing another state in which the embodiment shown in FIG.
6 is a perspective view of the second embodiment of the invention, and FIGS. 7 to 10 are sectional views taken along lines, FIG.
11 is a plan view showing the state in which the third embodiment of this invention is used, and FIG. 12 is a diagram corresponding to FIGS.
The figure is a sectional view taken along the line - in FIG. 11, and FIG. 13 is a side view showing the fourth embodiment of this invention.
FIG. 14 is a perspective view of the fifth embodiment of this invention when it is developed, and FIG. 15 is a perspective view of the embodiment shown in FIG. 14 when assembled. 22...first stamp surface, 24...second stamp surface, 26...
...First figure, 28...Second figure, 36,38...
Side surface of the first stamp surface, 40, 42... Side surface of the second stamp surface.