JPS6077489A - Hybrid ic substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a hybrid IC board (hereinafter referred to as an HIC board) that is incorporated into a small electronic device or the like.

(b) Prior art In general, HIC boards are formed by attaching electronic component chips such as ICs and transistors to ceramic boards on which resistors and wiring patterns are printed.
If the substrate is formed, it will be very effective in reducing the size of the substrate. However, when mounting electronic component chips on both sides of a ceramic board, the soldering process is very slow and difficult due to the instability of the board when mounted and the fact that the heat source such as a furnace is oriented in one direction. Too bad. Therefore, at present, HIOIC substrates using only one side are used, and there remains a problem in terms of miniaturization of the substrate.

(C1 Purpose of the Invention This invention was proposed to eliminate the above problems 7-1.
The object of the present invention is to provide a HIC board that can be used on both sides and is configured to allow electronic components to be mounted on both sides, thereby reducing the size of the board.

(d) Structure of the Invention In this invention, there is a notch formed for the front surface and the back surface.
After mounting predetermined electronic component chips on each ceramic substrate, they are stacked one on top of the other, and the front and back circuit boards are electrically connected using insertion pins or conductive frames, and both substrates are bonded to form a double-sided structure. This is the configuration of the HIC board used.

(θ) Example Figure 1 shows a ceramic substrate P on which resistors and wiring patterns are printed on only one side, and electronic component chips T such as IC and transistors are mounted.・The force is divided into two: the left half of the ceramic substrate pA and the right half of the ceramic substrate pB.

However, in the circuit configuration, one electronic circuit is constructed by these two boards PAIPB. Such a ceramic substrate P is manufactured using a ceramic substrate original plate PC as shown in FIG.
It is possible to take multiple sheets from the same circuit, and the same circuit board is printed in large numbers and then cut out. By the way, the board p
c is manufactured through the following manufacturing process. After printing the wiring 7'+turn on the ceramic substrate without cutting and sintering it in a sintering furnace, a cream solder pattern is printed on the substrate.

Then, the electronic component chip is placed in a predetermined position, and a reflow soldering process is performed to mount the electronic component chip on the board. At this stage, use a circuit checker or the like to apply a probe between the power supply points of each board P to check the state of the circuit.

Ru. By this check, if only one of the substrates PAIPB is defective, one can be discarded and the other can be kept and used, thereby improving the yield. Ceramic substrate original plate p produced in this way
c is the force used to cut the board pA and the board pB, and then, as shown in Figure 3, the board PA and the board pB are superimposed on each other with their component mounting sides facing outward, and the force used to cut the board PA Insert the circuit pattern of (11) and the circuit backing on the base jfipB side into the bin 1 or the conductive frame 2.
Connect electrically by etc. After fitting into a through hole previously provided in the insertion bin 1 in a hole extending between both substrates PAr and PB, soldering is performed at both ends thereof. After the bent conductive frame 2 has a cross-section with a cross-section of a cross section and is bent from the side of the board, it is soldered onto the board. At the connection part paulownia, the circuits are connected to the board pA and the board PB, and both boards are bonded together.In this way, the HI with electronic components mounted on both sides is connected.
A C substrate pn is formed.

(F+ Effects of the Invention As described above, according to the present invention, a front board and a back board each having a wiring pattern formed on only one side and mounted with electronic components are manufactured by themselves, and these two The circuit patterns of both boards are electrically connected to the connection part paulownia by overlapping the boards, and both boards are glued together to form a double-sided HIC board.A small HIC board can be created with a simple manufacturing process.
It is possible to realize a substrate.

[Brief explanation of drawings]

FIG. 1 is a plan view of the IICIC portion of a ceramic substrate that is a source for forming an HIC substrate according to the present invention. FIG. 2 is a schematic plan view of a ceramic substrate original plate on which the ceramic substrate is formed. FIG. 1 is a schematic cross-sectional view showing a state of formation of an HIC substrate according to the invention. PAIPB...@eyelid ceramic substrate pH+...
HIC board, T...Electronic part crystal tube, 1...
- Insertion bottle, 2... Conductive frame. Figure 1 Potato Figure 2 Figure 3 P.

Claims (1)

[Claims] Two ceramic substrates each having a circuit pattern formed on only one side are provided corresponding to the electronic circuit that is divided into two parts, and both substrates are bonded together using connecting members such as insertion pins. A hybrid xa-based ffi characterized in that it is electrically connected to a double-sided substrate.