JPS6064503A - Microwave circuit - Google Patents
Microwave circuitInfo
- Publication number
- JPS6064503A JPS6064503A JP17343883A JP17343883A JPS6064503A JP S6064503 A JPS6064503 A JP S6064503A JP 17343883 A JP17343883 A JP 17343883A JP 17343883 A JP17343883 A JP 17343883A JP S6064503 A JPS6064503 A JP S6064503A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- microwave circuit
- heat sink
- circuit board
- conduction plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/30—Auxiliary devices for compensation of, or protection against, temperature or moisture effects ; for improving power handling capability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Non-Reversible Transmitting Devices (AREA)
- Microwave Amplifiers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
不発りＪは、マイクロ波領域において大出力動作をする
一′ｌ′７１１体素子を用いて構成されるマイクロ波回
路に関する。DETAILED DESCRIPTION OF THE INVENTION The industrial application field J relates to a microwave circuit constructed using monolithic elements that operate at high output in the microwave region.
従来例の＋１１４成とその問題点
大出力動作をする半導体素子を用いて構成されるマイク
ロ波回路にお緊て、設、１１組）°ハ１．１１に４．１
に考１（けすべき課周（０１つが放熱膜、１１である。The conventional +114 configuration and its problems are based on microwave circuits constructed using semiconductor elements that operate at high output.
Consideration 1 (1) is the heat dissipation film, and 11 is the heat dissipation film.
従来の代表的な構成法を第１図に示す。第１図は従来例
を示すマイクロ波間路のｊｉＪｉ成図であり、ａ図は上
面図、ｂ図は側面図である。A typical conventional construction method is shown in FIG. FIG. 1 is a diagram of a microwave path showing a conventional example, in which figure a is a top view and figure b is a side view.
大出力動作をする゛１′Ｊｆ７休Ｊ、了１は、素−ｒの
人力および出力に設けられた整合回路２．３との接わ”
Ｃを良好に保つために、半導体素子１の形状に心して、
半〕Ｑ体素子１の収４＝Ｊ而４と整合回路基板５．６の
」−而７．８とに段ｉρを設けている。゛1'Jf7 rest J, 1, which performs high output operation, is connected to the human power of element-r and the matching circuit 2.3 provided at the output.''
In order to maintain a good C, the shape of the semiconductor element 1 should be taken into consideration.
A stage iρ is provided between the input 4=J4 of the semi-Q body element 1 and the 7.8 of the matching circuit board 5.6.
寸だ半導体素子１の収イＸＪ］１１１４は、然伝ノＱ性
の良い金ＪＪ、！４人９が配されており、この金ＬＵｉ
板９ｔ−１放メ５ヒシ手段であるヒートシンク １ｏと
密イｌ＋成になっている。１１．１２はコネクタである
。1114 is a gold JJ with excellent Q properties, which is a classic semiconductor element 1! 4 people 9 are arranged, and this gold LUi
Plate 9t-1 is in close contact with heat sink 1o, which is the heat sink means. 11 and 12 are connectors.
ところで、半導体素子の熱損失が数１ソノトと大きな場
合、ヒートシンク１ｏの放熱・ｌ’ｌ能を１゛分に活用
するために、゛１′ノＱ体素子の熱損失をヒートシンク
全域に効率よく熱分散させる必ｌ乃、かある。By the way, when the heat loss of the semiconductor element is as large as several tens of tons, in order to utilize the heat dissipation and l'l ability of the heat sink 1o in 1', the heat loss of the Q body element of '1' is efficiently spread over the entire heat sink area. There is a need to disperse heat.
この目的に対し、金属板９の相ｆ１としてＪＩＪ常銅へ
゛アルミニウムが用いられる。しかし、銅は、軟度があ
るだめ−Ｊ削加工性が悪く１７Ｊ削加１−費が、：’：
・い欠／、’、（をイＪする。−カアルミニクムｔ、１
１刀削加１’、 ｔ、ｌ Ｊ）いが、銅に比べて熱伝導
率が約゛１′分と低い欠点がある。For this purpose, JIJ copper aluminum is used as the phase f1 of the metal plate 9. However, copper has poor machinability due to its softness and requires 17J machining cost.
- Miss /, ', (I J. - Caluminicum t, 1
However, it has the disadvantage that its thermal conductivity is about 1' lower than that of copper.
また、マイクロ波回路においては、アース配線に充分す
きる注意を払う必〃がある。マイクロ波回路においては
、図に示すようにマイクロストリップ線路を用いて整合
回路２．３が構成される。Furthermore, in microwave circuits, it is necessary to pay sufficient attention to the ground wiring. In the microwave circuit, a matching circuit 2.3 is constructed using a microstrip line as shown in the figure.
この種の整合回路を配するマイクロ波回路基板５．６の
裏面はアース而となっている。浮遊容昂などが生じない
様にこのマイクロ波回路基板５．６け、金属板９と密着
構成をとることが大切である。この目的に対し、マイク
ロ波回路基板を金属板にねじ市めする手段やハンダ付け
する手段が採用されている。加工性および４ＺＦｌの特
性を考慮するとねし止めの場合は金属板の材料としてア
ルミニウムがよく、ハング付けの場合は、銅でなければ
ならない。The back surface of the microwave circuit board 5.6 on which this type of matching circuit is arranged is grounded. It is important that the microwave circuit board 5 or 6 be in close contact with the metal plate 9 to prevent floating swelling. For this purpose, means for screwing or soldering the microwave circuit board to a metal plate have been adopted. Considering the workability and characteristics of 4ZFl, aluminum is the best material for the metal plate in the case of screw fastening, and copper should be used in the case of hanging.
以１−１のように、大出力動作をする半コ）ネ体素子を
用いて構成されるマイクロ波回路の構成においてｆ、Ｊ
、（（ｆ、）な問題と電気（ｆ、Ｊな問題を解決する必
１にＩがあるが、従来の構成法で、金ドパ板をアルミニ
ウム拐料とすると放熱特性が犠ヂ１になる。捷た銅４Ａ
ｒ’ｌにすると加工費、（Ａ判費が高く々る欠点があっ
た。As shown in 1-1 below, in the configuration of a microwave circuit constructed using semi-circular elements that operate at high output, f, J
, ((f,) problem and electrical (f, J problem) must be solved, but in the conventional construction method, if the gold dopant plate is made of aluminum, the heat dissipation characteristics will be sacrificed. Naru.Cold copper 4A
R'l had the disadvantage of high processing costs (A size costs).
発明の目的
零発りｊ ｌ−、ｊ： 、大出力動作をするマイクロ波
半導体ぶ子などの熱損失）６り晶の放熱を効率よく行な
うとともにアース配線をより完全にしたｆ′Ａｊ潔な改
良された構成のマイクロ波回１１名を１ノ１↓供するこ
とを目的とする。Purpose of the Invention: To reduce the heat loss of microwave semiconductor bulbs, etc. that operate at high output. The purpose is to provide 11 people with a microwave program with an improved configuration.
光ＩＪＩの構成
この目的に対し、本発明は、熱損失部品を収イ・ｊける
位１１°″１゛にこの熱損失部品の形状に対応したシボ
リ加工を施し、かつ、マイクｒＩ波回ｂ１ｈ基板ンーノ
・ングＩｉ’ｉｌ定する穴加工を施こした銅Ｍ１１から
なる然伝郷板を仲介として、マイクロ波回路基イハ熱損
失１９＜品を放熱手段であるヒートシンク１．に組）“
ｌるＩｆｌｉ成としている。Structure of the optical IJI For this purpose, the present invention applies a graining process corresponding to the shape of the heat loss component at 11°''1゜ to accommodate the heat loss component, and also increases the microphone rI wave frequency b1h. A microwave circuit board made of M11 copper with holes drilled to determine the heat loss of the microwave circuit board is used as an intermediary to assemble the microwave circuit board into a heat sink 1, which is a heat dissipation means.
It is said that there is a complete structure.
実施例の説り１ 以下、不発り：１を図面を参照して説ｆＪｌ’ｌする。Example explanation 1 Below, misfire: 1 will be explained with reference to the drawings.
第２図け、零発１．！ＩＩの一実施例を小すマイクロ波
回路の構成図である。図中、第１１７１とｌ１Ｉｊ一部
イＡ’ ？：１同−同号番号す。Figure 2, Zero shot 1. ! It is a block diagram of the microwave circuit which is a small example of II. In the figure, the 1171st and l1Ij part A'? :1 same-same number.
熱伝導板１３は、熱損失部品である半導体素子１を取伺
ける位１１ｇにマイクロ波回路基板５．６の」二面７．
８から半導体素子の形状に対応した段差を有するシボ１
月４加工が配され、かつマイクロ波回路基板５．６をノ
・ング固定する穴（第３図にて示す）が配されている。The heat conduction plate 13 is placed on two sides 7. of the microwave circuit board 5.6 at a distance 11g that can accommodate the semiconductor element 1, which is a heat loss component.
Grain 1 having a step corresponding to the shape of the semiconductor element from 8
A hole (shown in FIG. 3) for fixing the microwave circuit board 5.6 is also provided.
一方、ヒートシンク１０は、熱転ノ；゛−板のシボリ加
工に対応した箇所が切削加工されており、シボリ加工を
有する熱伝導板１３の下面のほぼ全面がヒートシンクと
密ｆｉ’ｉ゛するように構成されている。On the other hand, the heat sink 10 is machined at a portion corresponding to the heat transfer plate's embossed process, so that almost the entire lower surface of the heat conductive plate 13 having the embossed area is in close contact with the heat sink. It is composed of
特にシボリ加二［部１４とヒートシンクの９Ｊ削部との
’４ｕｌ原１１１９にＱま、シリコンブソース１５が充
」真さ）ｔている。In particular, the '4ul original 1119 between the shabby part 14 and the 9J part of the heat sink is filled with silicone source 15.
第３図は、第２図の熱伝ノ９板の構成図である。FIG. 3 is a configuration diagram of the heat transfer plate 9 of FIG. 2.
熱伝ノ９板１３には、シボ１月４加工の他に、半専体素
子収伺穴１６．１７およびマイクロ波回路基板をこの然
伝ｊｊ’ｉｆ板にノ・ンダ固定する穴１８ａ〜１８１が
配されている。マイクロ波回路基板は、染箇車面仝面Ｖ
銅箔づ；１シられており、この回路基板を熱伝導板に所
定の配置でもって密石させ、ハンダ固定穴１８ａ〜１８
１にハンダを流し込むことにより、回１俗基板を熱伝導
板にハンダ固定するものである。図中、矢印Ｂは、ハン
ダを流し込む方向を示している。In addition to the grain processing, the heat transfer plate 13 has semi-dedicated element receiving holes 16 and 17, and holes 18a for fixing the microwave circuit board to the heat transfer plate. 181 are arranged. The microwave circuit board is dyed on the surface of the vehicle.
The circuit board is sealed with copper foil in a predetermined position on the heat conductive plate, and the solder fixing holes 18a to 18 are sealed.
By pouring solder into 1, the 1st common board is fixed to the heat conductive plate with solder. In the figure, arrow B indicates the direction in which the solder is poured.
なお、熱損失部品は、’ｌ／、Ｊ９休累了に限定される
ものではなく、たとえば電力終端器、アイソレークサー
キュレータ、名利「カプラーでも同様に４’：ＩＩＩ＋
にできる。In addition, heat loss parts are not limited to 'l/, J9 idle accumulation, but are also applicable to power terminators, isolake circulators, and Nari couplers as well.
Can be done.
また、ヒートシンクと熱伝導板の間にシボリ加工部の逃
げ部をイｊする熱転ｊ９板をノ１１加挿入する）１１１
ｉ成でもよい。Also, insert a heat transfer plate between the heat sink and the heat conduction plate with the relief part of the textured part added (No. 11) 111
It may be an i-formation.
一ブｖ１月の効果
以」−１不発ｒｌ１１は、熱損失＋’ｊｌう品を収伺け
るイ１シｉｉ、□１゛（て前記熱４１’Ｊ失部品の形状
に対応したシボリさ、マイクロ波回路基板をハンダ固定
する穴を・配した熱転ｊｊ７板を用いて改良された村１
１成のマイクロ波回路を）Ｉｌｌ（Ｊ（するものであり
、
（１）熱ノロ失部品の生ずる熱は、然伝ノ１゛−板によ
ってヒートシンク全曲に効率よく熱分散されるため放熱
性能が高まる。Because of the effect of one month, -1 unexploded rl11 is the heat loss +'jl item that can be accommodated. Village 1 improved using a heat transfer jj7 board with holes for soldering the microwave circuit board
(1) The heat generated by the heat sink components is efficiently dispersed to the entire heat sink by the traditional 1-plate, so the heat dissipation performance is improved. It increases.
（２）マイクロ波回路基板と熱損失部品の１つである半
導体素子は、１枚の２９体である熱伝導板に取向けられ
ていることから、アース配線がより完全になり、回路特
性の経時変化がなくなる。(2) Since the microwave circuit board and the semiconductor element, which is one of the heat loss components, are placed on a single heat conductive plate, the ground wiring is more complete and the circuit characteristics are improved. No change over time.
（３）マイクロ波回路基板はハンダ固定、されているた
め基板の経時的な浮き上がりが解消され、回路特性の安
定化がはかられる。(3) Since the microwave circuit board is fixed with solder, lifting of the board over time is eliminated and circuit characteristics are stabilized.
（４）マイクロ波回路基板は部分ハンダ固定であるため
、最悪時の場合である基板取替作業が容易である。(4) Since the microwave circuit board is partially fixed with solder, it is easy to replace the board in the worst case.
（５） マイクロ波回路基板の配置にノ・ンダ固定六の
配列パターンが利用でき、組立作業が容易である等の効
果を奏する。(5) The array pattern of six fixed conductors can be used for arranging the microwave circuit board, and the assembly work is easy.
第１図ａ、ｂは従来例を示すマイクロ波回路の断
上面図、−面図、第２図は木発ＩＪ１の一実施例を示す
マイクロ波回路の断面図、第３図ａｔ／′ｉ同熱伝導板
の平面図、第３図すは第３図ａのＡ −Ａ’線断面図で
ある。
１・・・・・・半導体素子（熱損失部品）、５，６・川
・・マイクロ波回路基板、１ｏ・・・・・・ヒートシン
ク（放熱手段）、１３・・・・・・熱転ノ小板、１４・
・・・・・シボリ、１８ａ〜１８１・・・・・・ハンダ
固定穴。
代理人の氏名 弁理士 中 尾 敏 男 はが１名花１
図
１！２１１
第３図Figures 1a and b are a sectional top view and a -side view of a microwave circuit showing a conventional example, Figure 2 is a sectional view of a microwave circuit showing an embodiment of the Kokuhatsu IJ1, and Figure 3 at/'i FIG. 3 is a plan view of the heat conductive plate, and FIG. 3 is a sectional view taken along the line A-A' in FIG. 3a. 1...Semiconductor element (heat loss component), 5, 6...Microwave circuit board, 1o...Heat sink (heat dissipation means), 13...Heat transfer node Koita, 14・
... Shibori, 18a-181 ... Solder fixing hole. Name of agent: Patent attorney Toshi Nakao (1 name)
Figure 1!211 Figure 3
Claims (1)
位置に前記熱損失部品の形状に対応する所定のシボリと
、前記マイクロ波回路基板をハング固定する穴を配した
熱伝導板と、放熱手段とから構成されたマイクロ波回路
。 １２）熱伝ｊ品板は銅祠料からなる牛、１．γ１請求の
範囲第１項記載のマイクロ波回路。(1) A microwave circuit board, a heat conduction plate having a predetermined shank corresponding to the shape of the heat loss component at a position where the heat loss component is attached, a hole for hanging and fixing the microwave circuit board, and a heat dissipation means. A microwave circuit consisting of. 12) The heat transfer board is made of copper, 1. γ1 The microwave circuit according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17343883A JPS6064503A (en) | 1983-09-19 | 1983-09-19 | Microwave circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17343883A JPS6064503A (en) | 1983-09-19 | 1983-09-19 | Microwave circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6064503A true JPS6064503A (en) | 1985-04-13 |
Family
ID=15960469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17343883A Pending JPS6064503A (en) | 1983-09-19 | 1983-09-19 | Microwave circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6064503A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745381A (en) * | 1985-10-14 | 1988-05-17 | Nec Corporation | Microwave connector assembly capable of being readily connected to microwave circuit components |
| US5500556A (en) * | 1993-07-12 | 1996-03-19 | Nec Corporation | Packaging structure for microwave circuit |
| JPWO2009037995A1 (en) * | 2007-09-21 | 2011-01-06 | 日本電気株式会社 | High power amplifier, wireless transmitter, wireless transceiver, and high power amplifier mounting method |
-
1983
- 1983-09-19 JP JP17343883A patent/JPS6064503A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745381A (en) * | 1985-10-14 | 1988-05-17 | Nec Corporation | Microwave connector assembly capable of being readily connected to microwave circuit components |
| US5500556A (en) * | 1993-07-12 | 1996-03-19 | Nec Corporation | Packaging structure for microwave circuit |
| JPWO2009037995A1 (en) * | 2007-09-21 | 2011-01-06 | 日本電気株式会社 | High power amplifier, wireless transmitter, wireless transceiver, and high power amplifier mounting method |
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