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JPS6055254U - multilayer conductor assembly - Google Patents

multilayer conductor assembly

Info

Publication number
JPS6055254U
JPS6055254U JP14461383U JP14461383U JPS6055254U JP S6055254 U JPS6055254 U JP S6055254U JP 14461383 U JP14461383 U JP 14461383U JP 14461383 U JP14461383 U JP 14461383U JP S6055254 U JPS6055254 U JP S6055254U
Authority
JP
Japan
Prior art keywords
conductor assembly
multilayer conductor
holes
insulating film
approximately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14461383U
Other languages
Japanese (ja)
Inventor
村上 英宣
里見 国雄
Original Assignee
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノン株式会社 filed Critical キヤノン株式会社
Priority to JP14461383U priority Critical patent/JPS6055254U/en
Publication of JPS6055254U publication Critical patent/JPS6055254U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Manufacture Of Motors, Generators (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は2層導体板組立体の製造における接着工程を説
明するための図、第2図は第1図で説明した如くして得
られる2層導体板組立体に本考案を適用した場合のその
一部の拡大断面図、第3図は多層平面コイル組立体の製
造に於ける接着工程を説明するための図、第4図は第3
図で説明した如くして得られる多層平面コイル組立体に
本考案を適用した場合のその一部の拡大断面図である。 1:11・・・平板状電気的導体、2;12・・・絶縁
性接着剤、3;13・・・電気的絶縁性フィルム、3a
;13a・・・貫通孔。 ’4’        ffα 13af1(1 4
Fig. 1 is a diagram for explaining the adhesion process in manufacturing a two-layer conductor plate assembly, and Fig. 2 is a diagram when the present invention is applied to a two-layer conductor plate assembly obtained as explained in Fig. 1. FIG. 3 is a diagram for explaining the bonding process in manufacturing the multilayer planar coil assembly, and FIG.
FIG. 2 is an enlarged cross-sectional view of a part of the multilayer planar coil assembly obtained as explained in the figures, in which the present invention is applied. 1:11... Flat electrical conductor, 2; 12... Insulating adhesive, 3; 13... Electrical insulating film, 3a
; 13a... Through hole. '4' ffα 13af1 (1 4

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)複数の平板状電気的導体間に電気的絶縁性フィル
ムを介挿しつつこれらを絶縁性接着剤により接着して成
る多層導体組立体に於て、上記電気的絶縁性フィルムに
多数の微小な貫通孔を分散させて設けたことを特徴とす
る多層導体組立体。
(1) In a multilayer conductor assembly formed by inserting an electrically insulating film between a plurality of flat electrical conductors and adhering them with an insulating adhesive, the electrically insulating film has a large number of minute A multilayer conductor assembly characterized by having dispersed through holes.
(2)上記貫通孔の平均直径を大略50〜200μmの
範囲とした実用新案登録請求の範囲第(1)項に記載の
多層導体組立体。
(2) The multilayer conductor assembly according to claim (1), wherein the average diameter of the through holes is in the range of approximately 50 to 200 μm.
(3)上記貫通孔の個数を1mrn2当り大略10〜1
00個の範囲とした実用新案登録請求の範囲第(1)項
または同第(2)項に記載の多層導体組立体。
(3) The number of the above-mentioned through holes is approximately 10 to 1 per mrn2.
00. A multilayer conductor assembly according to claim 1 or 2 of the utility model registration claim.
JP14461383U 1983-09-19 1983-09-19 multilayer conductor assembly Pending JPS6055254U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14461383U JPS6055254U (en) 1983-09-19 1983-09-19 multilayer conductor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14461383U JPS6055254U (en) 1983-09-19 1983-09-19 multilayer conductor assembly

Publications (1)

Publication Number Publication Date
JPS6055254U true JPS6055254U (en) 1985-04-18

Family

ID=30322438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14461383U Pending JPS6055254U (en) 1983-09-19 1983-09-19 multilayer conductor assembly

Country Status (1)

Country Link
JP (1) JPS6055254U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5024752A (en) * 1973-06-14 1975-03-17
JPS57122645A (en) * 1981-01-21 1982-07-30 Mitsubishi Electric Corp Resin mold type motor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5024752A (en) * 1973-06-14 1975-03-17
JPS57122645A (en) * 1981-01-21 1982-07-30 Mitsubishi Electric Corp Resin mold type motor

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