JPS60231874A - Production of decorative material - Google Patents

Abstract

PURPOSE:To obtain a decorative material rich in a solid feeling, by forming a uniform layer of thermoplastic chips on a backing material, placing a transparent resin layer flowing at a lower temperature than the softening temperature of the above-mentioned chips on the above-mentioned layer, and flowing and permeating the resin layer to the interstices of the chips. CONSTITUTION:A layer having a uniform thickness of thermoplastic resin chips 4, e.g. PVC or acrylic resin, having >=20 mesh size is formed on a backing material 1 consisting of polyvinyl chloride, etc. and preheated. A transparent resin thin layer 6 flowing at a temperature preferably 15 deg.C or more lower than the softening temperature of the chips 4 is placed on the chip layer and heated at a temperature at which the resultant film flows to permeat the above-mentioned flowing resin into the interstices between the chips 4 and form the thin layer of the above-mentioned resin on the surface of the chip layer. The thickness of the above-mentioned thin film is preferably 50-300mum. An abrasion-resistant transparent film 11 is further placed thereon to give the finished product 13 rich in durability.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a decorative material suitable for flooring and wall materials, and more specifically to a decorative material having a novel pattern.It is an object of the present invention to ensure that the chip pattern is clear and three-dimensional even in the final product. Our goal is to manufacture decorative materials that are rich in taste.

Methods for manufacturing decorative materials such as chip pattern tiles have been known for a long time, and a method for manufacturing tiles is disclosed in Japanese Patent Publication FIB 49-85815, but this method lacks a three-dimensional effect, and the inventors (Patent application 1986-8)
No. 2259) uses a large amount of transparent resin, which is disadvantageous in terms of cost, and a method that provides excellent three-dimensional effect and is inexpensive is desired.

The present invention forms a uniformly thick layer of thermoplastic resin chips;
A thin layer of transparent resin that flows at a temperature lower than the softening temperature of the chip is placed on top of the layer, heated to such an extent that only the thin layer of transparent resin flows into the gap between the chips, and then the chip layer and the thin layer are heated. The gist of this invention is a method for manufacturing a decorative material characterized by pressure-integration.

Examples will be described in detail below with reference to the drawings. However, the configurations described in this specification are merely illustrative examples and are not intended to limit the scope of the present invention to them unless specifically stated.

FIG. 1 is a process diagram for manufacturing the decorative material of the present invention.

l is the backing material. The lining material is polychlorinated (P)
Even soft sheets such as V C), non-woven fabrics such as glass fiber, etc.
A thickness of 0.2 to 1.0 mm is suitable for scrim fiber materials such as chilli sand and composites thereof. On the backing material 1 pulled out from the roll 2 and placed on the conveyor 16
8, synthetic resin chips (hereinafter referred to as chips) 4 are scattered and formed into a uniform thickness of 2 to 5 U using a doctor blade 5.

The chip is made of PVC, acrylic resin, or polyurethane resin, and a plasticizer, filler, stabilizer, and coloring agent may be added as necessary. The size of the chip is preferably 20 mesh or more.

For example, the softening temperature of the chip is 170 to 22 in the case of PvC.
Although 0° C. is preferred, it can also be carried out at other temperatures. Note that the chips may be colored with a plurality of colors, and chips that are granulated after giving a motsule pattern or a marble pattern to the sheet may be used.

The obtained chip layer is preheated, and a transparent resin thin layer (hereinafter referred to as thin layer) 6 which starts flowing at a temperature preferably 15° C. or more lower than the softening temperature of the chips is overlaid from a roll 7 on the chip layer. , the chips are heated with a heating roll 8.9 in a temperature range in which the chips do not soften but the film flows due to heating to infiltrate the gap between the chips with a fluid resin, and a part of the thin layer-forming resin is coated on the surface of the chip layer. Smooth the surface of the chip layer.

For the thin layer, hot melt resins such as PVC, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl acetate copolymer, polyolefin, acrylic resin, and thermoplastic polyurethane are used, and differences in the composition of these resins are used. By appropriately utilizing differences in the amount of plasticizer, degree of polymerization, copolymer components, and type of resin, resin flow can be achieved at a temperature lower than the softening temperature of the chip, preferably at least 15°C lower. It's fine if it starts.

The thin layer has a thickness of 10 to 500 μm, more preferably 50 to 500 μm.
A thickness of 300 μm is preferred. Further, the present invention can be practiced even with a thickness greater than this.

Sheet 1 in which the thin layer and chip layer are in close contact with each other in this way
If desired, an abrasion-resistant transparent film +t is overlaid on the film 0, and heated and pressed together with press rolls I2 and 12' to form a finished product 13 of 1 to 4 stages and wound onto a roll. Note that the wear-resistant film is not limited to laminating transparent films prepared in advance, but may also be made by coating and drying paste, latex, emulsion, etc. In the manufacturing method of the present invention, the above-mentioned backing material, chips, Thin layers and wear-resistant films may be laminated and integrated by heating and pressing. Particularly when using chips larger than 10 mesh, it is desirable to use a flat press machine to obtain a more uniform and smooth surface.

FIG. 2 is a sectional view of a flooring material obtained according to the present invention.

1 is a backing material and 4 is a chip. The gap in the chip outer shell 14 is filled with the resin 15 that has flowed in from the thin layer 6 formed on the chip, so that a decorative material 13 with a three-dimensional effect can be obtained without damaging the shape of the chip outer shell. .

The resin for forming the transparent wear-resistant resin layer 11 on the surface, if desired, is preferably PVC1 thermoplastic polyurethane, film paste sol emulsion or latex of acrylic resin, or ultraviolet curable resin.

The flooring material obtained by the present invention has a thin layer that has melted and flowed and penetrated into the gaps between the chips, and is integrated without any loss of the original contour of the chips, and has a smooth surface and a transparent resin layer that is transparent. By looking at the chip pattern, the three-dimensional effect of the chip pattern was further improved, making it possible to provide excellent design at a low price.

Furthermore, durability can be improved by forming a transparent wear-resistant layer on the surface.

Examples will be described below.

Example 1 Chips (softening temperature: 170°C) having an average size of about 18 meshes were prepared from PvC of the following formulation A.

Parts are parts by weight.

Formulation A PVC (=740) 100 parts Plasticizer 25N Heavy calcium carbonate 500 Stabilizer lI Pigment Small amount A PvC backing sheet with a thickness of 05 fins is placed on a conveyor belt, and the above chips are placed on the backing sheet. Spray 3
It was formed into a layer with a thickness of 5 cm.

A layer of ethylene-vinyl acetate copolymer (softening temperature 84°C) with a thickness of 0.2 m and a transparent calendar film with a thickness of 0.8 ms which will serve as the surface wear-resistant layer of Formulation B were placed on the chip layer. The mixture was preheated at 160° C., and then heated and pressed at the same temperature using a press roll. A decorative sheet with a three-dimensional thickness and excellent three-dimensional effect was obtained.

Formulation B 100 parts of PVC Plasticizer 3ON Stabilizer 3 Processing aid 3' Example 2 Flat press on which chips of Formulation A with an average size of about 8 meshes were preliminarily placed with a PVC backing material 0.5 m thick. A layer with a thickness of 3.5 μm was dispersed on the bed of the machine and heated and pressed in the same manner as in Example 1 to obtain a decorative sheet with a total thickness of 81 NJ.

In both Examples 1 and 2, the ethylene-vinyl acetate copolymer film flows when heated and penetrates into the gaps between chips, while the shape of the chips maintains its sharp original shape without changing even the slightest, making decorative materials with excellent design at low cost. obtained.

[Brief explanation of drawings]

FIG. 1 is a manufacturing process diagram of the decorative material of the present invention, and FIG. 2 is a sectional view of the decorative material of the present invention. 4 is a synthetic resin chip, 6 is a transparent resin thin layer, and 11 is a wear-resistant resin layer. that's all

Claims (1)

[Claims] 1. Form a layer of thermoplastic resin chips with a uniform thickness, overlay a thin layer of transparent resin that flows at a temperature lower than the softening temperature of the chips, and only the thin layer of transparent resin flows into the gaps between the chips. A method for producing a decorative material, which comprises heating the chip layer and the thin layer to an extent that the material permeates, and then integrating the chip layer and the thin layer under heat and pressure.